TW202330655A - 密封材用馬來醯亞胺樹脂混合物、馬來醯亞胺樹脂組成物及其硬化物 - Google Patents

密封材用馬來醯亞胺樹脂混合物、馬來醯亞胺樹脂組成物及其硬化物 Download PDF

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Publication number
TW202330655A
TW202330655A TW111139106A TW111139106A TW202330655A TW 202330655 A TW202330655 A TW 202330655A TW 111139106 A TW111139106 A TW 111139106A TW 111139106 A TW111139106 A TW 111139106A TW 202330655 A TW202330655 A TW 202330655A
Authority
TW
Taiwan
Prior art keywords
maleimide resin
resin mixture
maleimide
formula
resin composition
Prior art date
Application number
TW111139106A
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English (en)
Chinese (zh)
Inventor
長谷川篤彦
関允諭
窪木健一
Kazuma Inoue
Original Assignee
日商日本化藥股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本化藥股份有限公司 filed Critical 日商日本化藥股份有限公司
Publication of TW202330655A publication Critical patent/TW202330655A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111139106A 2021-10-15 2022-10-14 密封材用馬來醯亞胺樹脂混合物、馬來醯亞胺樹脂組成物及其硬化物 TW202330655A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021169332 2021-10-15
JP2021-169332 2021-10-15

Publications (1)

Publication Number Publication Date
TW202330655A true TW202330655A (zh) 2023-08-01

Family

ID=85987722

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111139106A TW202330655A (zh) 2021-10-15 2022-10-14 密封材用馬來醯亞胺樹脂混合物、馬來醯亞胺樹脂組成物及其硬化物

Country Status (5)

Country Link
JP (1) JP7281246B1 (https=)
KR (1) KR20240088722A (https=)
CN (1) CN118103430A (https=)
TW (1) TW202330655A (https=)
WO (1) WO2023063267A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025159016A1 (ja) * 2024-01-24 2025-07-31 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体
JP7776702B1 (ja) * 2024-02-28 2025-11-26 日本化薬株式会社 マレイミド樹脂固形物、マレイミド樹脂固形物の製造方法、マレイミド樹脂組成物およびその硬化物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2758109B2 (ja) 1992-08-31 1998-05-28 矢崎総業株式会社 ロック構造
JP5030297B2 (ja) 2007-05-18 2012-09-19 日本化薬株式会社 積層板用樹脂組成物、プリプレグ及び積層板
JP5812297B2 (ja) * 2010-12-27 2015-11-11 三菱瓦斯化学株式会社 熱硬化性樹脂組成物
CN103562309B (zh) * 2011-05-31 2016-05-18 三菱瓦斯化学株式会社 树脂组合物、预浸料和层压板
JP2018104683A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 封止成形材料用組成物及び電子部品装置
KR102325101B1 (ko) * 2017-12-29 2021-11-12 셍기 테크놀로지 코. 엘티디. 말레이미드 수지 조성물, 프리프레그, 적층판과 인쇄회로기판
JP7026887B2 (ja) * 2018-04-25 2022-03-01 三菱瓦斯化学株式会社 樹脂組成物、硬化物、単層樹脂シート、積層樹脂シート、プリプレグ、金属箔張積層板、プリント配線板、封止用材料、繊維強化複合材料及び接着剤
WO2020161926A1 (ja) * 2019-02-05 2020-08-13 株式会社プリンテック 樹脂組成物およびその製造方法
CN111621152A (zh) * 2019-02-28 2020-09-04 京瓷株式会社 元件密封用成型材料组合物及电子部件装置
KR20220157933A (ko) * 2020-03-25 2022-11-29 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판

Also Published As

Publication number Publication date
WO2023063267A1 (ja) 2023-04-20
JPWO2023063267A1 (https=) 2023-04-20
KR20240088722A (ko) 2024-06-20
JP7281246B1 (ja) 2023-05-25
CN118103430A (zh) 2024-05-28

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