JP7281246B1 - 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物 - Google Patents

封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物 Download PDF

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Publication number
JP7281246B1
JP7281246B1 JP2022580898A JP2022580898A JP7281246B1 JP 7281246 B1 JP7281246 B1 JP 7281246B1 JP 2022580898 A JP2022580898 A JP 2022580898A JP 2022580898 A JP2022580898 A JP 2022580898A JP 7281246 B1 JP7281246 B1 JP 7281246B1
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Prior art keywords
maleimide resin
maleimide
resin composition
sealing material
resin mixture
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JP2022580898A
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Japanese (ja)
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JPWO2023063267A5 (https=
JPWO2023063267A1 (https=
Inventor
篤彦 長谷川
允諭 関
健一 窪木
一真 井上
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Nippon Kayaku Co Ltd
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Nippon Kayaku Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022580898A 2021-10-15 2022-10-07 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物 Active JP7281246B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021169332 2021-10-15
JP2021169332 2021-10-15
PCT/JP2022/037693 WO2023063267A1 (ja) 2021-10-15 2022-10-07 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物

Publications (3)

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JPWO2023063267A1 JPWO2023063267A1 (https=) 2023-04-20
JP7281246B1 true JP7281246B1 (ja) 2023-05-25
JPWO2023063267A5 JPWO2023063267A5 (https=) 2023-09-21

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JP2022580898A Active JP7281246B1 (ja) 2021-10-15 2022-10-07 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物

Country Status (5)

Country Link
JP (1) JP7281246B1 (https=)
KR (1) KR20240088722A (https=)
CN (1) CN118103430A (https=)
TW (1) TW202330655A (https=)
WO (1) WO2023063267A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025159016A1 (ja) * 2024-01-24 2025-07-31 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体
JP7776702B1 (ja) * 2024-02-28 2025-11-26 日本化薬株式会社 マレイミド樹脂固形物、マレイミド樹脂固形物の製造方法、マレイミド樹脂組成物およびその硬化物

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009001783A (ja) * 2007-05-18 2009-01-08 Nippon Kayaku Co Ltd 積層板用樹脂組成物、プリプレグ及び積層板
WO2012090578A1 (ja) * 2010-12-27 2012-07-05 三菱瓦斯化学株式会社 熱硬化性樹脂組成物
WO2012165423A1 (ja) * 2011-05-31 2012-12-06 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び積層板
JP2018104683A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 封止成形材料用組成物及び電子部品装置
JP2019189761A (ja) * 2018-04-25 2019-10-31 三菱瓦斯化学株式会社 樹脂組成物、硬化物、単層樹脂シート、積層樹脂シート、プリプレグ、金属箔張積層板、プリント配線板、封止用材料、繊維強化複合材料及び接着剤
WO2020161926A1 (ja) * 2019-02-05 2020-08-13 株式会社プリンテック 樹脂組成物およびその製造方法
JP2020145424A (ja) * 2019-02-28 2020-09-10 京セラ株式会社 炭化ケイ素、酸化ガリウム、窒化ガリウム及びダイヤモンド素子封止用成形材料組成物、並びに電子部品装置
WO2021192680A1 (ja) * 2020-03-25 2021-09-30 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート、積層板、金属箔張積層板、及びプリント配線板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2758109B2 (ja) 1992-08-31 1998-05-28 矢崎総業株式会社 ロック構造
KR102325101B1 (ko) * 2017-12-29 2021-11-12 셍기 테크놀로지 코. 엘티디. 말레이미드 수지 조성물, 프리프레그, 적층판과 인쇄회로기판

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009001783A (ja) * 2007-05-18 2009-01-08 Nippon Kayaku Co Ltd 積層板用樹脂組成物、プリプレグ及び積層板
WO2012090578A1 (ja) * 2010-12-27 2012-07-05 三菱瓦斯化学株式会社 熱硬化性樹脂組成物
WO2012165423A1 (ja) * 2011-05-31 2012-12-06 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ及び積層板
JP2018104683A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 封止成形材料用組成物及び電子部品装置
JP2019189761A (ja) * 2018-04-25 2019-10-31 三菱瓦斯化学株式会社 樹脂組成物、硬化物、単層樹脂シート、積層樹脂シート、プリプレグ、金属箔張積層板、プリント配線板、封止用材料、繊維強化複合材料及び接着剤
WO2020161926A1 (ja) * 2019-02-05 2020-08-13 株式会社プリンテック 樹脂組成物およびその製造方法
JP2020145424A (ja) * 2019-02-28 2020-09-10 京セラ株式会社 炭化ケイ素、酸化ガリウム、窒化ガリウム及びダイヤモンド素子封止用成形材料組成物、並びに電子部品装置
WO2021192680A1 (ja) * 2020-03-25 2021-09-30 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、樹脂シート、積層板、金属箔張積層板、及びプリント配線板

Also Published As

Publication number Publication date
TW202330655A (zh) 2023-08-01
WO2023063267A1 (ja) 2023-04-20
JPWO2023063267A1 (https=) 2023-04-20
KR20240088722A (ko) 2024-06-20
CN118103430A (zh) 2024-05-28

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