KR20240088722A - 봉지재용 말레이미드 수지 혼합물, 말레이미드 수지 조성물 및 그의 경화물 - Google Patents

봉지재용 말레이미드 수지 혼합물, 말레이미드 수지 조성물 및 그의 경화물 Download PDF

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Publication number
KR20240088722A
KR20240088722A KR1020247008991A KR20247008991A KR20240088722A KR 20240088722 A KR20240088722 A KR 20240088722A KR 1020247008991 A KR1020247008991 A KR 1020247008991A KR 20247008991 A KR20247008991 A KR 20247008991A KR 20240088722 A KR20240088722 A KR 20240088722A
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KR
South Korea
Prior art keywords
maleimide resin
maleimide
resin mixture
resin composition
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247008991A
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English (en)
Korean (ko)
Inventor
아츠히코 하세가와
마사토 세키
켄이치 구보키
카즈마 이노우에
Original Assignee
닛뽄 가야쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛뽄 가야쿠 가부시키가이샤 filed Critical 닛뽄 가야쿠 가부시키가이샤
Publication of KR20240088722A publication Critical patent/KR20240088722A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • H01L23/293—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020247008991A 2021-10-15 2022-10-07 봉지재용 말레이미드 수지 혼합물, 말레이미드 수지 조성물 및 그의 경화물 Pending KR20240088722A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021169332 2021-10-15
JPJP-P-2021-169332 2021-10-15
PCT/JP2022/037693 WO2023063267A1 (ja) 2021-10-15 2022-10-07 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物

Publications (1)

Publication Number Publication Date
KR20240088722A true KR20240088722A (ko) 2024-06-20

Family

ID=85987722

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247008991A Pending KR20240088722A (ko) 2021-10-15 2022-10-07 봉지재용 말레이미드 수지 혼합물, 말레이미드 수지 조성물 및 그의 경화물

Country Status (5)

Country Link
JP (1) JP7281246B1 (https=)
KR (1) KR20240088722A (https=)
CN (1) CN118103430A (https=)
TW (1) TW202330655A (https=)
WO (1) WO2023063267A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025159016A1 (ja) * 2024-01-24 2025-07-31 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体
JP7776702B1 (ja) * 2024-02-28 2025-11-26 日本化薬株式会社 マレイミド樹脂固形物、マレイミド樹脂固形物の製造方法、マレイミド樹脂組成物およびその硬化物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0686425A (ja) 1992-08-31 1994-03-25 Yazaki Corp ロック構造
JP2009001783A (ja) 2007-05-18 2009-01-08 Nippon Kayaku Co Ltd 積層板用樹脂組成物、プリプレグ及び積層板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5812297B2 (ja) * 2010-12-27 2015-11-11 三菱瓦斯化学株式会社 熱硬化性樹脂組成物
CN103562309B (zh) * 2011-05-31 2016-05-18 三菱瓦斯化学株式会社 树脂组合物、预浸料和层压板
JP2018104683A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 封止成形材料用組成物及び電子部品装置
KR102325101B1 (ko) * 2017-12-29 2021-11-12 셍기 테크놀로지 코. 엘티디. 말레이미드 수지 조성물, 프리프레그, 적층판과 인쇄회로기판
JP7026887B2 (ja) * 2018-04-25 2022-03-01 三菱瓦斯化学株式会社 樹脂組成物、硬化物、単層樹脂シート、積層樹脂シート、プリプレグ、金属箔張積層板、プリント配線板、封止用材料、繊維強化複合材料及び接着剤
WO2020161926A1 (ja) * 2019-02-05 2020-08-13 株式会社プリンテック 樹脂組成物およびその製造方法
CN111621152A (zh) * 2019-02-28 2020-09-04 京瓷株式会社 元件密封用成型材料组合物及电子部件装置
KR20220157933A (ko) * 2020-03-25 2022-11-29 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0686425A (ja) 1992-08-31 1994-03-25 Yazaki Corp ロック構造
JP2009001783A (ja) 2007-05-18 2009-01-08 Nippon Kayaku Co Ltd 積層板用樹脂組成物、プリプレグ及び積層板

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
「SiC 파워 모듈의 고내열 실장」, The TRC News, 2017년 6월호, 기사 No.201706-04, 가부시키가이샤 토레 리서치 센터

Also Published As

Publication number Publication date
TW202330655A (zh) 2023-08-01
WO2023063267A1 (ja) 2023-04-20
JPWO2023063267A1 (https=) 2023-04-20
JP7281246B1 (ja) 2023-05-25
CN118103430A (zh) 2024-05-28

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P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000