CN118103430A - 密封材用马来酰亚胺树脂混合物、马来酰亚胺树脂组合物及其硬化物 - Google Patents

密封材用马来酰亚胺树脂混合物、马来酰亚胺树脂组合物及其硬化物 Download PDF

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Publication number
CN118103430A
CN118103430A CN202280069008.6A CN202280069008A CN118103430A CN 118103430 A CN118103430 A CN 118103430A CN 202280069008 A CN202280069008 A CN 202280069008A CN 118103430 A CN118103430 A CN 118103430A
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CN
China
Prior art keywords
maleimide resin
sealing material
maleimide
resin composition
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280069008.6A
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English (en)
Chinese (zh)
Inventor
长谷川笃彦
关允谕
窪木健一
井上一真
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Publication of CN118103430A publication Critical patent/CN118103430A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202280069008.6A 2021-10-15 2022-10-07 密封材用马来酰亚胺树脂混合物、马来酰亚胺树脂组合物及其硬化物 Pending CN118103430A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021169332 2021-10-15
JP2021-169332 2021-10-15
PCT/JP2022/037693 WO2023063267A1 (ja) 2021-10-15 2022-10-07 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物

Publications (1)

Publication Number Publication Date
CN118103430A true CN118103430A (zh) 2024-05-28

Family

ID=85987722

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280069008.6A Pending CN118103430A (zh) 2021-10-15 2022-10-07 密封材用马来酰亚胺树脂混合物、马来酰亚胺树脂组合物及其硬化物

Country Status (5)

Country Link
JP (1) JP7281246B1 (https=)
KR (1) KR20240088722A (https=)
CN (1) CN118103430A (https=)
TW (1) TW202330655A (https=)
WO (1) WO2023063267A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025159016A1 (ja) * 2024-01-24 2025-07-31 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体
JP7776702B1 (ja) * 2024-02-28 2025-11-26 日本化薬株式会社 マレイミド樹脂固形物、マレイミド樹脂固形物の製造方法、マレイミド樹脂組成物およびその硬化物

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009001783A (ja) * 2007-05-18 2009-01-08 Nippon Kayaku Co Ltd 積層板用樹脂組成物、プリプレグ及び積層板
CN103298854A (zh) * 2010-12-27 2013-09-11 三菱瓦斯化学株式会社 热固性树脂组合物
JP2018104683A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 封止成形材料用組成物及び電子部品装置
WO2019127391A1 (zh) * 2017-12-29 2019-07-04 广东生益科技股份有限公司 马来酰亚胺树脂组合物、预浸料、层压板和印刷电路板
CN111621152A (zh) * 2019-02-28 2020-09-04 京瓷株式会社 元件密封用成型材料组合物及电子部件装置
CN113348195A (zh) * 2019-02-05 2021-09-03 普林科技有限公司 树脂组合物及其制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2758109B2 (ja) 1992-08-31 1998-05-28 矢崎総業株式会社 ロック構造
CN103562309B (zh) * 2011-05-31 2016-05-18 三菱瓦斯化学株式会社 树脂组合物、预浸料和层压板
JP7026887B2 (ja) * 2018-04-25 2022-03-01 三菱瓦斯化学株式会社 樹脂組成物、硬化物、単層樹脂シート、積層樹脂シート、プリプレグ、金属箔張積層板、プリント配線板、封止用材料、繊維強化複合材料及び接着剤
KR20220157933A (ko) * 2020-03-25 2022-11-29 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009001783A (ja) * 2007-05-18 2009-01-08 Nippon Kayaku Co Ltd 積層板用樹脂組成物、プリプレグ及び積層板
CN103298854A (zh) * 2010-12-27 2013-09-11 三菱瓦斯化学株式会社 热固性树脂组合物
JP2018104683A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 封止成形材料用組成物及び電子部品装置
WO2019127391A1 (zh) * 2017-12-29 2019-07-04 广东生益科技股份有限公司 马来酰亚胺树脂组合物、预浸料、层压板和印刷电路板
CN113348195A (zh) * 2019-02-05 2021-09-03 普林科技有限公司 树脂组合物及其制造方法
CN111621152A (zh) * 2019-02-28 2020-09-04 京瓷株式会社 元件密封用成型材料组合物及电子部件装置

Also Published As

Publication number Publication date
TW202330655A (zh) 2023-08-01
WO2023063267A1 (ja) 2023-04-20
JPWO2023063267A1 (https=) 2023-04-20
KR20240088722A (ko) 2024-06-20
JP7281246B1 (ja) 2023-05-25

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Application publication date: 20240528