JPWO2023063267A1 - - Google Patents

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Publication number
JPWO2023063267A1
JPWO2023063267A1 JP2022580898A JP2022580898A JPWO2023063267A1 JP WO2023063267 A1 JPWO2023063267 A1 JP WO2023063267A1 JP 2022580898 A JP2022580898 A JP 2022580898A JP 2022580898 A JP2022580898 A JP 2022580898A JP WO2023063267 A1 JPWO2023063267 A1 JP WO2023063267A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022580898A
Other languages
Japanese (ja)
Other versions
JPWO2023063267A5 (https=
JP7281246B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023063267A1 publication Critical patent/JPWO2023063267A1/ja
Application granted granted Critical
Publication of JP7281246B1 publication Critical patent/JP7281246B1/ja
Publication of JPWO2023063267A5 publication Critical patent/JPWO2023063267A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022580898A 2021-10-15 2022-10-07 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物 Active JP7281246B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021169332 2021-10-15
JP2021169332 2021-10-15
PCT/JP2022/037693 WO2023063267A1 (ja) 2021-10-15 2022-10-07 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物

Publications (3)

Publication Number Publication Date
JPWO2023063267A1 true JPWO2023063267A1 (https=) 2023-04-20
JP7281246B1 JP7281246B1 (ja) 2023-05-25
JPWO2023063267A5 JPWO2023063267A5 (https=) 2023-09-21

Family

ID=85987722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022580898A Active JP7281246B1 (ja) 2021-10-15 2022-10-07 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物

Country Status (5)

Country Link
JP (1) JP7281246B1 (https=)
KR (1) KR20240088722A (https=)
CN (1) CN118103430A (https=)
TW (1) TW202330655A (https=)
WO (1) WO2023063267A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025159016A1 (ja) * 2024-01-24 2025-07-31 デクセリアルズ株式会社 異方性導電接着剤、及び接続構造体
WO2025182963A1 (ja) * 2024-02-28 2025-09-04 日本化薬株式会社 マレイミド樹脂固形物、マレイミド樹脂固形物の製造方法、マレイミド樹脂組成物およびその硬化物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2758109B2 (ja) 1992-08-31 1998-05-28 矢崎総業株式会社 ロック構造
JP5030297B2 (ja) * 2007-05-18 2012-09-19 日本化薬株式会社 積層板用樹脂組成物、プリプレグ及び積層板
JP5812297B2 (ja) * 2010-12-27 2015-11-11 三菱瓦斯化学株式会社 熱硬化性樹脂組成物
EP2716709B1 (en) * 2011-05-31 2019-09-11 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg and laminate
JP2018104683A (ja) * 2016-12-22 2018-07-05 京セラ株式会社 封止成形材料用組成物及び電子部品装置
WO2019127391A1 (zh) * 2017-12-29 2019-07-04 广东生益科技股份有限公司 马来酰亚胺树脂组合物、预浸料、层压板和印刷电路板
JP7026887B2 (ja) * 2018-04-25 2022-03-01 三菱瓦斯化学株式会社 樹脂組成物、硬化物、単層樹脂シート、積層樹脂シート、プリプレグ、金属箔張積層板、プリント配線板、封止用材料、繊維強化複合材料及び接着剤
JP6946578B2 (ja) * 2019-02-05 2021-10-06 株式会社プリンテック 樹脂組成物およびその製造方法
CN111621152A (zh) * 2019-02-28 2020-09-04 京瓷株式会社 元件密封用成型材料组合物及电子部件装置
CN115335433B (zh) * 2020-03-25 2024-08-09 三菱瓦斯化学株式会社 树脂组合物、预浸料、树脂片、层叠板、覆金属箔层叠板、及印刷电路板

Also Published As

Publication number Publication date
CN118103430A (zh) 2024-05-28
WO2023063267A1 (ja) 2023-04-20
TW202330655A (zh) 2023-08-01
KR20240088722A (ko) 2024-06-20
JP7281246B1 (ja) 2023-05-25

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