JPWO2023063267A1 - - Google Patents
Info
- Publication number
- JPWO2023063267A1 JPWO2023063267A1 JP2022580898A JP2022580898A JPWO2023063267A1 JP WO2023063267 A1 JPWO2023063267 A1 JP WO2023063267A1 JP 2022580898 A JP2022580898 A JP 2022580898A JP 2022580898 A JP2022580898 A JP 2022580898A JP WO2023063267 A1 JPWO2023063267 A1 JP WO2023063267A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021169332 | 2021-10-15 | ||
| JP2021169332 | 2021-10-15 | ||
| PCT/JP2022/037693 WO2023063267A1 (ja) | 2021-10-15 | 2022-10-07 | 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023063267A1 true JPWO2023063267A1 (https=) | 2023-04-20 |
| JP7281246B1 JP7281246B1 (ja) | 2023-05-25 |
| JPWO2023063267A5 JPWO2023063267A5 (https=) | 2023-09-21 |
Family
ID=85987722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022580898A Active JP7281246B1 (ja) | 2021-10-15 | 2022-10-07 | 封止材用マレイミド樹脂混合物、マレイミド樹脂組成物およびその硬化物 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7281246B1 (https=) |
| KR (1) | KR20240088722A (https=) |
| CN (1) | CN118103430A (https=) |
| TW (1) | TW202330655A (https=) |
| WO (1) | WO2023063267A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025159016A1 (ja) * | 2024-01-24 | 2025-07-31 | デクセリアルズ株式会社 | 異方性導電接着剤、及び接続構造体 |
| JP7776702B1 (ja) * | 2024-02-28 | 2025-11-26 | 日本化薬株式会社 | マレイミド樹脂固形物、マレイミド樹脂固形物の製造方法、マレイミド樹脂組成物およびその硬化物 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2758109B2 (ja) | 1992-08-31 | 1998-05-28 | 矢崎総業株式会社 | ロック構造 |
| JP5030297B2 (ja) | 2007-05-18 | 2012-09-19 | 日本化薬株式会社 | 積層板用樹脂組成物、プリプレグ及び積層板 |
| JP5812297B2 (ja) * | 2010-12-27 | 2015-11-11 | 三菱瓦斯化学株式会社 | 熱硬化性樹脂組成物 |
| CN103562309B (zh) * | 2011-05-31 | 2016-05-18 | 三菱瓦斯化学株式会社 | 树脂组合物、预浸料和层压板 |
| JP2018104683A (ja) * | 2016-12-22 | 2018-07-05 | 京セラ株式会社 | 封止成形材料用組成物及び電子部品装置 |
| KR102325101B1 (ko) * | 2017-12-29 | 2021-11-12 | 셍기 테크놀로지 코. 엘티디. | 말레이미드 수지 조성물, 프리프레그, 적층판과 인쇄회로기판 |
| JP7026887B2 (ja) * | 2018-04-25 | 2022-03-01 | 三菱瓦斯化学株式会社 | 樹脂組成物、硬化物、単層樹脂シート、積層樹脂シート、プリプレグ、金属箔張積層板、プリント配線板、封止用材料、繊維強化複合材料及び接着剤 |
| WO2020161926A1 (ja) * | 2019-02-05 | 2020-08-13 | 株式会社プリンテック | 樹脂組成物およびその製造方法 |
| CN111621152A (zh) * | 2019-02-28 | 2020-09-04 | 京瓷株式会社 | 元件密封用成型材料组合物及电子部件装置 |
| KR20220157933A (ko) * | 2020-03-25 | 2022-11-29 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 프리프레그, 수지 시트, 적층판, 금속박 피복 적층판, 및 프린트 배선판 |
-
2022
- 2022-10-07 CN CN202280069008.6A patent/CN118103430A/zh active Pending
- 2022-10-07 WO PCT/JP2022/037693 patent/WO2023063267A1/ja not_active Ceased
- 2022-10-07 KR KR1020247008991A patent/KR20240088722A/ko active Pending
- 2022-10-07 JP JP2022580898A patent/JP7281246B1/ja active Active
- 2022-10-14 TW TW111139106A patent/TW202330655A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202330655A (zh) | 2023-08-01 |
| WO2023063267A1 (ja) | 2023-04-20 |
| KR20240088722A (ko) | 2024-06-20 |
| JP7281246B1 (ja) | 2023-05-25 |
| CN118103430A (zh) | 2024-05-28 |
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