TW202210937A - 光罩盒潔淨設備 - Google Patents

光罩盒潔淨設備 Download PDF

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TW202210937A
TW202210937A TW109129902A TW109129902A TW202210937A TW 202210937 A TW202210937 A TW 202210937A TW 109129902 A TW109129902 A TW 109129902A TW 109129902 A TW109129902 A TW 109129902A TW 202210937 A TW202210937 A TW 202210937A
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mask box
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莊家和
薛新民
邱銘乾
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家登精密工業股份有限公司
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Priority to CN202011073236.XA priority patent/CN114101213B/zh
Priority to JP2020179134A priority patent/JP7142070B2/ja
Priority to US17/088,605 priority patent/US20220062955A1/en
Priority to KR1020200153021A priority patent/KR102595874B1/ko
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Abstract

一種光罩盒潔淨設備,其包含:一腔體、一氣體噴射單元、一微塵計數單元及一控制單元,腔體具有一腔室、連通腔室的一進氣口及一出氣口,氣體噴射單元設置於腔室,氣體噴射單元經由進氣口連通一進氣裝置,用以對腔室噴射氣體,微塵計數單元連通出氣口,微塵計數單元接收由出氣口排出的氣體,並計算排出的氣體的微塵數量,控制單元訊號連接微塵計數單元,於微塵計數單元計算排出的氣體的微塵數量低於設定的一閾值,控制單元發出一訊號。本發明的光罩盒潔淨設備可在清潔的過程中精準且即時地偵測清潔中的光罩盒是否已達到足夠潔淨。

Description

光罩盒潔淨設備
本發明係關於一種清潔設備,更特別的是關於一種可偵測及計算微塵量的光罩盒潔淨設備。
在半導體領域的先進微影製程中,特別是EUV(極紫外光)微影製程,對製程環境的潔淨度要求極高。若有塵粒(particle)汙染光罩,則會造成微影製程的缺陷。為達到潔淨度與保護光罩的需求,一般使用光罩盒以阻攔外界的塵粒。因此光罩盒本身的潔淨度便很重要。一般的清潔做法是導入潔淨的氣體以吹撫光罩盒,掃除其中的塵粒。但目前市面上的光罩盒清洗機(特指針對光罩內盒的清洗機)都無法有效確認清洗後的光罩盒是否夠潔淨,倘若無法確認清洗後的光罩盒乾淨與否,一旦載入光罩,光罩盒便成為污染光罩的汙染源。
一個作法是將光罩盒清潔完畢後再度檢查確認,若仍有未清洗乾淨的部分則返回清洗機重新清潔;此種作法相當沒有效率。若要在一次清潔的流程中確保光罩盒被徹底地洗淨,則必須加長每個光罩盒的清潔的時間,此種作法亦相當地耗能耗時,且對本來就很乾淨的光罩盒而言無疑是種時間與能源的浪費。
因此,為解決習知的光罩盒清潔的種種問題,本發明提出一種可偵測及計算微塵量的光罩盒潔淨設備。
為達上述目的及其他目的,本發明提出一種光罩盒潔淨設備,其包含:一腔體,具有一腔室、連通該腔室的一進氣口及一出氣口;一氣體噴射單元,設置於該腔室,該氣體噴射單元經由該進氣口連通一進氣裝置,用以對該腔室噴射氣體;一微塵計數單元,連通該出氣口,該微塵計數單元接收由該出氣口排出的氣體,並計算該排出氣體的微塵數量;以及一控制單元,訊號連接該微塵計數單元,於該微塵計數單元計算排出的氣體的微塵數量低於設定的一閾值,該控制單元發出一訊號。
於本發明之一實施例中,該控制單元與該進氣裝置訊號連接,當該進氣裝置接收到該訊號時,該進氣裝置停止對該腔室輸送氣體。
於本發明之一實施例中,該控制單元與該氣體噴射單元訊號連接,當該氣體噴射單元接收到該訊號時,該氣體噴射單元停止對該腔室噴射氣體。
於本發明之一實施例中,該氣體噴射單元為萬向風刀噴嘴。
於本發明之一實施例中,更包括一提示裝置,該提示裝置與該控制單元訊號連接,當該提示裝置接收到該訊號,該提示裝置發出一提示。
於本發明之一實施例中,更包括一過濾裝置,該過濾裝置設置於該氣體噴射單元及該進氣裝置之間。
於本發明之一實施例中,更包括一承載裝置,該承載裝置設置於該腔室,用以承載一光罩盒。
於本發明之一實施例中,該承載裝置與該光罩盒接觸的部分為耐磨材質。
於本發明之一實施例中,更包括一固定裝置,該固定裝置設置於該腔室,用以固定一光罩盒。
於本發明之一實施例中,該固定裝置與該光罩盒接觸的部分為耐磨材質。
藉此,本發明的光罩盒潔淨設備可在清潔的過程中同時精準且即時地偵測清潔中的光罩盒是否已達到足夠潔淨,並決定是否該停止該光罩盒的清潔流程。利用本發明的光罩盒潔淨設備,無須在第一次清潔後再檢驗、重新返回清潔流程,故可有效減少清潔流程與清潔時間並降低成本;並且也可避免長時間的過度清潔而造成氣體與能量的浪費。
為充分瞭解本發明,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明。本領域技術人員可由本說明書所公開的內容瞭解本發明的目的、特徵及功效。須注意的是,本發明可透過其他不同的具體實施例加以施行或應用,本說明書中的各項細節亦可基於不同觀點與應用,在不悖離本發明的精神下進行各種修飾與變更。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的申請專利範圍。說明如後:
如圖1所示,本發明實施例之光罩盒潔淨設備100,其包含:一腔體1、一氣體噴射單元2、一微塵計數單元4及一控制單元5。
腔體1具有一腔室11、連通腔室11的一進氣口12及一出氣口13,以允許清潔用氣體自進氣口12進入腔室11並自出氣口13離開。腔室11主要用來容納待清潔的光罩及氣體噴射單元2。
氣體噴射單元2設置於腔室11,氣體噴射單元2經由進氣口12連通一進氣裝置3,用以對腔室11噴射清潔用氣體以吹除光罩表面的塵粒。進氣裝置3例如是個氣體泵,沿一管路單方向朝進氣口12輸送氣體。在本實施例中,如圖1及圖2所示,氣體噴射單元2至少包括側噴射件21、下噴射件22及上噴射件23。側噴射件21、下噴射件22及上噴射件23連通進氣口12,用以將進氣口12輸送的氣體從光罩的旁側、下側及上側朝光罩噴洗。側噴射件21、下噴射件22及上噴射件23各自包含複數個噴氣嘴,以均勻地噴射氣流;並且側噴射件21、下噴射件22及上噴射件23可為可程式控制的萬向風刀噴嘴,經由控制單元5決定各噴嘴的擺動角度。
微塵計數單元4連通出氣口13,腔室11清掃過光罩的廢氣由出氣口13排出並進入微塵計數單元4。微塵計數單元4接收由出氣口13排出的挾帶塵粒的氣體,並計算其中的微塵數量。微塵計數單元4例如是空氣粒子計數器,其利用光的散射原理進行塵粒計數,可偵測單位體積內塵埃粒子數和粒徑分布。微塵計數單元4可調整選用的光波波長來偵測具有特定範圍粒徑的塵粒。當腔室11排出的氣流不停通過出氣口13並進入微塵計數單元4,微塵計數單元4可連續計算偵測範圍內的微塵數量,或每隔一段時間取樣調查偵測範圍內的微塵數量。
控制單元5訊號連接微塵計數單元4,於微塵計數單元4計算腔室11排出的氣體的微塵數量低於設定的一閾值,控制單元5發出一停止訊號d。控制單元5可以是一控制電路或控制晶片。該閾值可以是一標準絕對數值,也可以是與進氣口12進氣的氣體塵粒數比較的相對數值。另外,也可以依據測得的塵粒粒徑大小給予加權值,判斷是否達到該閾值。或者,各粒徑範圍的塵粒皆低於對應的閾值才觸發控制單元5發出停止訊號d;又或者,只針對特定粒徑範圍的塵粒低於閾值即觸發控制單元5發出停止訊號d,且本發明不限於此。
在一個例子中,光罩盒潔淨設備100更包括前述的進氣裝置3。控制單元5與進氣裝置3訊號連接,當進氣裝置3接收到控制單元5發送的停止訊號d,進氣裝置3停止對腔室11輸送氣體。
在另一個例子中,控制單元5與氣體噴射構件2訊號連接。控制單元5發出的停止訊號d可送達至氣體噴射單元2,當氣體噴射單元2接收到停止訊號d時,氣體噴射單元2停止對腔室11噴射氣體。即,關閉各噴嘴,或切斷與進氣裝置3的連通狀態。
在另外一個例子中,光罩盒潔淨設備100更包括一提示裝置6,提示裝置6與控制單元5訊號連接,當提示裝置6接收到控制單元5發送的停止訊號d,提示裝置6發出一停止提示t以提醒操作人員。提示裝置6例如為一個顯示螢幕,顯示「清潔完畢」的提示訊息告知操作人員,讓操作人員手動地關閉進氣裝置3或氣體噴射單元2以取出清潔完成的光罩盒。提示裝置6也可以為一個蜂鳴或語音裝置,收到停止訊號d後轉換為提示音以提示操作人員。且本發明不限於此。
藉由設置於出氣口13的微塵計數單元4,本發明的光罩盒潔淨設備100可在清潔的過程中同時精準且即時地偵測清潔中的光罩盒是否已達到足夠潔淨,並決定是否該停止該光罩盒的清潔流程。利用本發明的光罩盒潔淨設備100,無須在第一次清潔後再檢驗、重新返回清潔流程,故可有效減少清潔流程與清潔時間並降低成本;並且也可避免長時間的過度清潔而造成氣體與能量的浪費。
進一步地,如圖1所示,在本實施例中,光罩盒潔淨設備100更包括一過濾裝置7,設置於氣體噴射單元2及進氣裝置3之間。過濾裝置7可為緻密的濾網,設置於進氣口12之前(或進入氣體噴射單元2之前),讓氣體在通過進氣裝置3後再一次提升潔淨度,以免進氣裝置3的塵粒從源頭汙染腔室11。
進一步地,在本實施例中,光罩盒潔淨設備100更包括一承載裝置8及一固定裝置9。承載裝置8及固定裝置9設置於腔室11,承載裝置8用以承載一光罩盒的座體P1,固定裝置9用以固定一光罩盒的上蓋P2。
承載裝置8可為複數支撐件,設置於欲放置光罩盒的區域的四個角落,以最小的接觸面積支承光罩盒的座體P1。固定裝置9可為複數夾持臂,從腔室11的上方夾持光罩盒的上蓋P2。然而本發明不限於此,光罩盒潔淨設備100可僅具有承載裝置8或固定裝置9其中一個,承載裝置8或固定裝置9承載整個光罩盒或固定夾持整個光罩盒。
進一步地,在本實施例中,腔體1、承載裝置8及固定裝置9的大小與數目皆可自由變更,以相容市面上各種光罩盒或其他載具,以因應不同的產品需求。
在本實施例中,承載裝置8及固定裝置9分別與光罩盒的座體P1、上蓋P2接觸的部分為耐磨材質,可選用自以下材料:聚氯乙烯(Polyvinyl Chloride,PVC)、聚甲基丙烯酸甲酯(poly(methyl methacrylate),PMMA)、聚苯乙烯(Polystyrene,PS)、聚醯胺(Polyamide,PA)、聚乙烯(Polyethylene,PE)、聚四氟乙烯(Polytetrafluoroethylene,PTFE)、聚丙烯(PolyproPylene,PP)、丙烯腈-丁二烯-苯乙烯共聚物(Acrylonitrile Butadiene Styrene,ABS)、酚醛樹脂(Phenol formaldehyde resin,PF)、尿素甲醛樹脂(Urea-formaldehyde UF)、三聚氰胺樹脂(Melamine-formaldehyde resin,MF)、不飽和聚酯、環氧樹脂、聚氨酯(Polyurethane,PU)、聚碳酸酯(Polycarbonate,PC)、聚對苯二甲酸丁酯(Polybutylene terephthalate,PBT)、尼隆66(Nylon 66)、尼隆6(Nylon 6)、聚縮醛(Polyoxymethylene,POM)、聚苯硫醚(Polyphenylene sulfide,PPS)、聚醚醚酮(Polyetheretherketone,PEEK)、聚醯胺醯亞胺(Polyamide-imide,PAI)、聚醚醯亞胺(Polyetherimide,PEI)、聚醚亞胺(Polyimide,PI)及其混合物所組成之群組。而其中,這些接觸部位之材料以聚醚醚酮(PEEK)為佳。
本發明在上文中已以實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以申請專利範圍所界定者為準。
100:光罩盒潔淨設備 1:腔體 11:腔室 12:進氣口 13:出氣口 2:氣體噴射單元 21:側噴射件 22:下噴射件 23:上噴射件 3:進氣裝置 4:微塵計數單元 5:控制單元 6:提示裝置 7:過濾裝置 8:承載裝置 9:固定裝置 d:停止訊號 P1:座體 P2:上蓋 t:停止提示
圖1係為根據本發明實施例之光罩盒潔淨設備之示意圖。 圖2係為根據本發明實施例之氣體噴射單元之示意圖。 圖3係為根據本發明實施例之電子訊號連接關係之示意圖。
100:光罩盒潔淨設備
1:腔體
11:腔室
12:進氣口
13:出氣口
2:氣體噴射單元
21:側噴射件
22:下噴射件
23:上噴射件
3:進氣裝置
4:微塵計數單元
5:控制單元
6:提示裝置
7:過濾裝置
8:承載裝置
9:固定裝置
P1:座體
P2:上蓋

Claims (10)

  1. 一種光罩盒潔淨設備,其包含: 一腔體,具有一腔室、連通該腔室的一進氣口及一出氣口; 一氣體噴射單元,設置於該腔室,該氣體噴射單元經由該進氣口連通一進氣裝置,用以對該腔室噴射氣體; 一微塵計數單元,連通該出氣口,該微塵計數單元接收由該出氣口排出的氣體,並計算排出的氣體的微塵數量;以及 一控制單元,訊號連接該微塵計數單元,於該微塵計數單元計算排出的氣體的微塵數量低於設定的一閾值,該控制單元發出一訊號。
  2. 如請求項1所述之光罩盒潔淨設備,其中,該控制單元與該進氣裝置訊號連接,當該進氣裝置接收到該訊號時,該進氣裝置停止對該腔室輸送氣體。
  3. 如請求項1或2所述之光罩盒潔淨設備,其中,該控制單元與該氣體噴射單元訊號連接,當該氣體噴射單元接收到該訊號時,該氣體噴射單元停止對該腔室噴射氣體。
  4. 如請求項3所述之光罩盒潔淨設備,更包括一提示裝置,該提示裝置與該控制單元訊號連接,當該提示裝置接收到該訊號,該提示裝置發出一提示。
  5. 如請求項1所述之光罩盒潔淨設備,其中該氣體噴射單元為萬向風刀噴嘴。
  6. 如請求項1所述之光罩盒潔淨設備,更包括一過濾裝置,該過濾裝置設置於該氣體噴射單元及該進氣裝置之間。
  7. 如請求項1所述之光罩盒潔淨設備,更包括一承載裝置,該承載裝置設置於該腔室,用以承載一光罩盒。
  8. 如請求項7所述之光罩盒潔淨設備,其中該承載裝置與該光罩盒接觸的部分為耐磨材質。
  9. 如請求項1所述之光罩盒潔淨設備,更包括一固定裝置,該固定裝置設置於該腔室,用以固定一光罩盒。
  10. 如請求項9所述之光罩盒潔淨設備,其中該固定裝置與該光罩盒接觸的部分為耐磨材質。
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Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59195645A (ja) * 1983-04-21 1984-11-06 Nec Corp 露光マスク洗浄装置
JPH05181262A (ja) * 1991-12-27 1993-07-23 Nippon Steel Corp マスク洗浄方法及び装置
JPH11212249A (ja) * 1998-01-23 1999-08-06 Mitsubishi Electric Corp フォトマスクの洗浄装置
TW533503B (en) * 2000-09-14 2003-05-21 Nec Electronics Corp Processing apparatus having particle counter and cleaning device, cleaning method, cleanliness diagnosis method and semiconductor fabricating apparatus using the same
JP2002334829A (ja) 2001-05-10 2002-11-22 Yoshiharu Yamamoto 洗浄乾燥装置
US6638366B2 (en) * 2001-05-15 2003-10-28 Northrop Grumman Corporation Automated spray cleaning apparatus for semiconductor wafers
JP4754196B2 (ja) * 2003-08-25 2011-08-24 東京エレクトロン株式会社 減圧処理室内の部材清浄化方法および基板処理装置
KR100578132B1 (ko) * 2003-11-03 2006-05-10 삼성전자주식회사 레티클 박스 클리너
US7464581B2 (en) * 2004-03-29 2008-12-16 Tokyo Electron Limited Vacuum apparatus including a particle monitoring unit, particle monitoring method and program, and window member for use in the particle monitoring
JP4544459B2 (ja) 2004-11-30 2010-09-15 東京エレクトロン株式会社 パーティクル検出方法及びパーティクル検出プログラム
JP4407557B2 (ja) 2005-03-30 2010-02-03 栗田工業株式会社 硫酸リサイクル型洗浄方法および硫酸リサイクル型洗浄システム
JP4853178B2 (ja) * 2006-08-24 2012-01-11 大日本印刷株式会社 収納ケースの洗浄方法
US8034409B2 (en) * 2006-12-20 2011-10-11 Lam Research Corporation Methods, apparatuses, and systems for fabricating three dimensional integrated circuits
FR2930675B1 (fr) * 2008-04-24 2010-08-20 Alcatel Lucent Station de mesure de la contamination en particules d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs et procede de mesure correspondant
JP5273245B2 (ja) * 2009-05-12 2013-08-28 村田機械株式会社 パージ装置およびパージ方法
JP2010264341A (ja) 2009-05-12 2010-11-25 Fujitsu Ltd 塵埃収集装置及び塵埃分析方法
CN102194730B (zh) * 2010-03-15 2015-08-05 三星电子株式会社 衬底转移容器、气体净化监视工具及具有其的半导体制造设备
WO2013001482A1 (en) * 2011-06-28 2013-01-03 Dynamic Micro Systems Semiconductor stocker systems and methods.
JP2013144274A (ja) 2012-01-13 2013-07-25 Sharp Corp 液滴量測定方法、粒度分布測定方法および液滴吐出装置
JP5720954B2 (ja) * 2012-03-06 2015-05-20 株式会社ダイフク 天井搬送車の清掃装置
US9138785B2 (en) * 2012-07-05 2015-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for enhanced cleaning and inspection
JP6107305B2 (ja) * 2013-03-27 2017-04-05 大日本印刷株式会社 ケースの洗浄方法およびケースの洗浄装置
WO2015054749A1 (en) * 2013-10-16 2015-04-23 Xtralis Technologies Ltd Aspirated particle detection with various flow modifications
JP6448491B2 (ja) 2015-07-13 2019-01-09 東芝メモリ株式会社 パーティクル測定用マスク
JP2017183472A (ja) * 2016-03-30 2017-10-05 東芝メモリ株式会社 チャンバ洗浄装置およびチャンバ洗浄方法
CN105964621B (zh) * 2016-05-30 2018-05-29 上海华力微电子有限公司 一种除尘系统及除尘方法
TWI634383B (zh) * 2017-01-26 2018-09-01 家登精密工業股份有限公司 光罩盒
US20180311707A1 (en) * 2017-05-01 2018-11-01 Lam Research Corporation In situ clean using high vapor pressure aerosols
JP2018196511A (ja) * 2017-05-23 2018-12-13 東芝ライフスタイル株式会社 電気掃除装置
CN108144921B (zh) * 2017-12-23 2021-04-02 苏州市海魄洁净环境工程有限公司 一种可存储过滤气体的风淋室
JP7074514B2 (ja) * 2018-03-15 2022-05-24 株式会社Screenホールディングス 基板処理装置および基板処理方法
JP7051592B2 (ja) * 2018-06-05 2022-04-11 株式会社ニューフレアテクノロジー クリーニング装置
US11766703B2 (en) * 2018-08-15 2023-09-26 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for wafer cleaning
KR102596033B1 (ko) * 2020-11-16 2023-11-01 (주)에스티아이 포드 세정공정

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