CN114101213A - 光掩模盒洁净设备 - Google Patents
光掩模盒洁净设备 Download PDFInfo
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- 238000004140 cleaning Methods 0.000 title claims abstract description 51
- 238000002347 injection Methods 0.000 claims abstract description 39
- 239000007924 injection Substances 0.000 claims abstract description 39
- 239000000428 dust Substances 0.000 claims abstract description 38
- 239000002245 particle Substances 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 7
- 238000005299 abrasion Methods 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- 239000007789 gas Substances 0.000 abstract description 71
- 238000000034 method Methods 0.000 abstract description 15
- 239000000567 combustion gas Substances 0.000 abstract 3
- 238000005507 spraying Methods 0.000 abstract 1
- -1 PA) Polymers 0.000 description 11
- 229920001707 polybutylene terephthalate Polymers 0.000 description 5
- 239000004697 Polyetherimide Substances 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 4
- 229920001601 polyetherimide Polymers 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 230000001960 triggered effect Effects 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
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- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
- B01D46/10—Particle separators, e.g. dust precipitators, using filter plates, sheets or pads having plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B01D—SEPARATION
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- B01D46/42—Auxiliary equipment or operation thereof
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- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/02—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area using chambers or hoods covering the area
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/08—Cleaning containers, e.g. tanks
- B08B9/093—Cleaning containers, e.g. tanks by the force of jets or sprays
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/02—Investigating particle size or size distribution
- G01N15/0205—Investigating particle size or size distribution by optical means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/06—Investigating concentration of particle suspensions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/06—Investigating concentration of particle suspensions
- G01N15/075—Investigating concentration of particle suspensions by optical means
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- H01L21/67389—Closed carriers characterised by atmosphere control
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- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Environmental & Geological Engineering (AREA)
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- Mechanical Engineering (AREA)
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Abstract
本发明公开一种光掩模盒洁净设备,其包含:腔体、气体喷射单元、微尘计数单元及控制单元,腔体具有腔室、连通腔室的进气口及出气口,气体喷射单元设置于腔室,气体喷射单元经由进气口连通进气装置,用以对腔室喷射气体,微尘计数单元连通出气口,微尘计数单元接收由出气口排出的气体,并计算排出的气体的微尘数量,控制单元信号连接微尘计数单元,当微尘计数单元计算排出的气体的微尘数量低于设定的阈值,控制单元发出信号。本发明的光掩模盒洁净设备可在清洁的过程中精准且实时地侦测清洁中的光掩模盒是否已达到足够洁净。
Description
技术领域
本发明涉及一种清洁设备,更特别的是涉及一种可侦测及计算微尘量的光掩模盒洁净设备。
背景技术
在半导体领域的先进微影制程中,特别是EUV(极紫外光)微影制程,对制程环境的洁净度要求极高。若有尘粒(particle)污染光掩模,则会造成微影制程的缺陷。为达到洁净度与保护光掩模的需求,一般使用光掩模盒以阻拦外界的尘粒。因此光掩模盒本身的洁净度便很重要。一般的清洁做法是导入洁净的气体以吹抚光掩模盒,扫除其中的尘粒。但目前市面上的光掩模盒清洗机(特指针对光掩模内盒的清洗机)都无法有效确认清洗后的光掩模盒是否够洁净,倘若无法确认清洗后的光掩模盒干净与否,一旦加载光掩模,光掩模盒便成为污染光掩模的污染源。
一个作法是将光掩模盒清洁完毕后再度检查确认,若仍有未清洗干净的部分则返回清洗机重新清洁;此种作法相当没有效率。若要在一次清洁的流程中确保光掩模盒被彻底地洗净,则必须加长每个光掩模盒的清洁的时间,此种作法也相当地耗能耗时,且对本来就很干净的光掩模盒而言无疑是种时间与能源的浪费。
发明内容
本发明的目的在于解决公知光掩模盒清洁的种种问题,提出一种可侦测及计算微尘量的光掩模盒洁净设备。
为达上述目的及其他目的,本发明提出一种光掩模盒洁净设备,其包含:腔体,具有腔室、连通该腔室的进气口及出气口;气体喷射单元,设置于该腔室,该气体喷射单元经由该进气口连通进气装置,用以对该腔室喷射气体;微尘计数单元,连通该出气口,该微尘计数单元接收由该出气口排出的气体,并计算该排出气体的微尘数量;以及控制单元,信号连接该微尘计数单元,当该微尘计数单元计算排出的气体的微尘数量低于设定的阈值,该控制单元发出信号。
可选地,该控制单元与该进气装置信号连接,当该进气装置接收到该信号时,该进气装置停止对该腔室输送气体。
可选地,该控制单元与该气体喷射单元信号连接,当该气体喷射单元接收到该信号时,该气体喷射单元停止对该腔室喷射气体。
可选地,该气体喷射单元为万向风刀喷嘴。
可选地,还包括提示装置,该提示装置与该控制单元信号连接,当该提示装置接收到该信号,该提示装置发出提示。
可选地,还包括过滤装置,该过滤装置设置于该气体喷射单元及该进气装置之间。
可选地,还包括承载装置,该承载装置设置于该腔室,用以承载光掩模盒。
可选地,该承载装置与该光掩模盒接触的部分为耐磨材质。
可选地,还包括固定装置,该固定装置设置于该腔室,用以固定光掩模盒。
可选地,该固定装置与该光掩模盒接触的部分为耐磨材质。
借此,本发明的光掩模盒洁净设备可在清洁的过程中同时精准且实时地侦测清洁中的光掩模盒是否已达到足够洁净,并决定是否该停止该光掩模盒的清洁流程。利用本发明的光掩模盒洁净设备,无须在第一次清洁后再检验、重新返回清洁流程,故可有效减少清洁流程与清洁时间并降低成本;并且也可避免长时间的过度清洁而造成气体与能量的浪费。
为使能更进一步了解本发明的特征及技术内容,请参阅以下有关发明的详细说明与附图,但是此说明与附图仅用来说明本发明,而非对本发明的权利范围作任何的限制。
附图说明
图1为本发明实施例的光掩模盒洁净设备的示意图。
图2为本发明实施例的气体喷射单元的示意图。
图3为本发明实施例的电子信号连接关系的示意图。
附图标记:
100光掩模盒洁净设备
1腔体
11腔室
12进气口
13出气口
2气体喷射单元
21侧喷射件
22下喷射件
23上喷射件
3进气装置
4微尘计数单元
5控制单元
6提示装置
7过滤装置
8承载装置
9固定装置
d停止信号
P1座体
P2上盖
t停止提示
具体实施方式
为了充分了解本发明,通过下述具体的实施例,并配合所附的附图,对本发明做一详细说明。本领域技术人员可由本说明书所公开的内容了解本发明的目的、特征及功效。须注意的是,本发明可通过其他不同的具体实施例加以施行或应用,本说明书中的各项细节也可基于不同观点与应用,在不悖离本发明的精神下进行各种修饰与变更。另外,本发明所附的附图仅为简单示意说明,并非依实际尺寸的描绘。以下的实施方式将进一步详细说明本发明的相关技术内容,但所公开的内容并非用以限制本发明的权利要求。说明如后:
如图1所示,本发明实施例的光掩模盒洁净设备100,其包含:腔体1、气体喷射单元2、微尘计数单元4及控制单元5。
腔体1具有腔室11、连通腔室11的进气口12及出气口13,以允许清洁用气体自进气口12进入腔室11并自出气口13离开。腔室11主要用来容纳待清洁的光掩模及气体喷射单元2。
气体喷射单元2设置于腔室11,气体喷射单元2经由进气口12连通进气装置3,用以对腔室11喷射清洁用气体以吹除光掩模表面的尘粒。进气装置3例如是个气体泵,沿管路单方向朝进气口12输送气体。在本实施例中,如图1及图2所示,气体喷射单元2至少包括侧喷射件21、下喷射件22及上喷射件23。侧喷射件21、下喷射件22及上喷射件23连通进气口12,用以将进气口12输送的气体从光掩模盒的旁侧、下侧及上侧朝光掩模盒喷洗。侧喷射件21、下喷射件22及上喷射件23各自包含多个喷气嘴,以均匀地喷射气流;并且侧喷射件21、下喷射件22及上喷射件23可为可程控的万向风刀喷嘴,经由控制单元5决定各喷嘴的摆动角度。
微尘计数单元4连通出气口13,腔室11清扫过光掩模盒的废气由出气口13排出并进入微尘计数单元4。微尘计数单元4接收由出气口13排出的挟带尘粒的气体,并计算其中的微尘数量。微尘计数单元4例如是空气粒子计数器,其利用光的散射原理进行尘粒计数,可侦测单位体积内尘埃粒子数和粒径分布。微尘计数单元4可调整选用的光波波长来侦测具有特定范围粒径的尘粒。当腔室11排出的气流不停通过出气口13并进入微尘计数单元4,微尘计数单元4可连续计算侦测范围内的微尘数量,或每隔一段时间取样调查侦测范围内的微尘数量。
控制单元5信号连接微尘计数单元4,当微尘计数单元4计算腔室11排出的气体的微尘数量低于设定的阈值,控制单元5发出停止信号d。控制单元5可以是控制电路或控制芯片。该阈值可以是标准绝对数值,也可以是与进气口12进气的气体尘粒数比较的相对数值。另外,也可以依据测得的尘粒粒径大小给予加权值,判断是否达到该阈值。或者,各粒径范围的尘粒皆低于对应的阈值才触发控制单元5发出停止信号d;又或者,只针对特定粒径范围的尘粒低于阈值即触发控制单元5发出停止信号d,且本发明不限于此。
在一个例子中,光掩模盒洁净设备100更包括前述的进气装置3。如图3所示,控制单元5与进气装置3信号连接,当进气装置3接收到控制单元5发送的停止信号d,进气装置3停止对腔室11输送气体。
在另一个例子中,控制单元5与气体喷射单元2信号连接。控制单元5发出的停止信号d可送达至气体喷射单元2,当气体喷射单元2接收到停止信号d时,气体喷射单元2停止对腔室11喷射气体。即,关闭各喷嘴,或切断与进气装置3的连通状态。
在另外一个例子中,光掩模盒洁净设备100更包括提示装置6,提示装置6与控制单元5信号连接,当提示装置6接收到控制单元5发送的停止信号d,提示装置6发出停止提示t以提醒操作人员。提示装置6例如为一个显示屏幕,显示“清洁完毕”的提示讯息告知操作人员,让操作人员手动地关闭进气装置3或气体喷射单元2以取出清洁完成的光掩模盒。提示装置6也可以为一个蜂鸣或语音装置,收到停止信号d后转换为提示音以提示操作人员。且本发明不限于此。
借由设置于出气口13的微尘计数单元4,本发明的光掩模盒洁净设备100可在清洁的过程中同时精准且实时地侦测清洁中的光掩模盒是否已达到足够洁净,并决定是否该停止该光掩模盒的清洁流程。利用本发明的光掩模盒洁净设备100,无须在第一次清洁后再检验、重新返回清洁流程,故可有效减少清洁流程与清洁时间并降低成本;并且也可避免长时间的过度清洁而造成气体与能量的浪费。
进一步地,如图1所示,在本实施例中,光掩模盒洁净设备100更包括过滤装置7,设置于气体喷射单元2及进气装置3之间。过滤装置7可为致密的滤网,设置于进气口12之前(或进入气体喷射单元2之前),让气体在通过进气装置3后再一次提升洁净度,以免进气装置3的尘粒从源头污染腔室11。
进一步地,在本实施例中,光掩模盒洁净设备100更包括承载装置8及固定装置9。承载装置8及固定装置9设置于腔室11,承载装置8用以承载光掩模盒的座体P1,固定装置9用以固定光掩模盒的上盖P2。
承载装置8可为多个支撑件,设置于欲放置光掩模盒的区域的四个角落,以最小的接触面积支承光掩模盒的座体P1。固定装置9可为多个夹持臂,从腔室11的上方夹持光掩模盒的上盖P2。然而本发明不限于此,光掩模盒洁净设备100可仅具有承载装置8或固定装置9其中一个,承载装置8或固定装置9承载整个光掩模盒或固定夹持整个光掩模盒。
进一步地,在本实施例中,腔体1、承载装置8及固定装置9的大小与数目皆可自由变更,以兼容市面上各种光掩模盒或其他载具,以因应不同的产品需求。
在本实施例中,承载装置8及固定装置9分别与光掩模盒的座体P1、上盖P2接触的部分为耐磨材质,可选用自以下材料:聚氯乙烯(Polyvinyl Chloride,PVC)、聚甲基丙烯酸甲酯(poly(methyl methacrylate),PMMA)、聚苯乙烯(Polystyrene,PS)、聚酰胺(Polyamide,PA)、聚乙烯(Polyethylene,PE)、聚四氟乙烯(Polytetrafluoroethylene,PTFE)、聚丙烯(PolyproPylene,PP)、丙烯腈-丁二烯-苯乙烯共聚物(AcrylonitrileButadiene Styrene,ABS)、酚醛树脂(Phenol formaldehyde resin,PF)、尿素甲醛树脂(Urea-formaldehyde UF)、三聚氰胺树脂(Melamine-formaldehyde resin,MF)、不饱和聚酯、环氧树脂、聚氨酯(Polyurethane,PU)、聚碳酸酯(Polycarbonate,PC)、聚对苯二甲酸丁酯(Polybutylene terephthalate,PBT)、尼隆66(Nylon 66)、尼隆6(Nylon 6)、聚缩醛(Polyoxymethylene,POM)、聚苯硫醚(Polyphenylene sulfide,PPS)、聚醚醚酮(Polyetheretherketone,PEEK)、聚酰胺酰亚胺(Polyamide-imide,PAI)、聚醚酰亚胺(Polyetherimide,PEI)、聚醚亚胺(Polyimide,PI)及其混合物所组成的群组。而其中,这些接触部位的材料以聚醚醚酮(PEEK)为佳。
本发明在上文中已以较佳实施例揭露,然而本领域技术人员应理解的是,所述实施例仅用于描绘本发明,而不应解读为限制本发明的范围。应注意的是,凡是与所述实施例等效的变化与置换,均应设定为涵盖在本发明的范围内。因此,本发明的保护范围当以权利要求所界定的内容为准。
Claims (10)
1.一种光掩模盒洁净设备,其特征在于,所述光掩模盒洁净设备包括:
腔体,具有腔室、连通所述腔室的进气口及出气口;
气体喷射单元,设置于所述腔室,所述气体喷射单元经由所述进气口连通进气装置,用以对所述腔室喷射气体;
微尘计数单元,连通所述出气口,所述微尘计数单元接收由所述出气口排出的气体,并计算排出的气体的微尘数量;以及
控制单元,信号连接所述微尘计数单元,当所述微尘计数单元计算排出的气体的微尘数量低于设定的阈值,所述控制单元发出信号。
2.根据权利要求1所述的光掩模盒洁净设备,其特征在于,所述控制单元与所述进气装置信号连接,当所述进气装置接收到所述信号时,所述进气装置停止对所述腔室输送气体。
3.根据权利要求1或2所述的光掩模盒洁净设备,其特征在于,所述控制单元与所述气体喷射单元信号连接,当所述气体喷射单元接收到所述信号时,所述气体喷射单元停止对所述腔室喷射气体。
4.根据权利要求3所述的光掩模盒洁净设备,其特征在于,还包括提示装置,所述提示装置与所述控制单元信号连接,当所述提示装置接收到所述信号,所述提示装置发出提示。
5.根据权利要求1所述的光掩模盒洁净设备,其特征在于,所述气体喷射单元为万向风刀喷嘴。
6.根据权利要求1所述的光掩模盒洁净设备,其特征在于,还包括过滤装置,所述过滤装置设置于所述气体喷射单元及所述进气装置之间。
7.根据权利要求1所述的光掩模盒洁净设备,其特征在于,还包括承载装置,所述承载装置设置于所述腔室,用以承载光掩模盒。
8.根据权利要求7所述的光掩模盒洁净设备,其特征在于,所述承载装置与所述光掩模盒接触的部分为耐磨材质。
9.根据权利要求1所述的光掩模盒洁净设备,其特征在于,还包括固定装置,所述固定装置设置于所述腔室,用以固定光掩模盒。
10.根据权利要求9所述的光掩模盒洁净设备,其特征在于,所述固定装置与所述光掩模盒接触的部分为耐磨材质。
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