TW202120403A - 立式批次處理爐組件 - Google Patents

立式批次處理爐組件 Download PDF

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TW202120403A
TW202120403A TW109125758A TW109125758A TW202120403A TW 202120403 A TW202120403 A TW 202120403A TW 109125758 A TW109125758 A TW 109125758A TW 109125758 A TW109125758 A TW 109125758A TW 202120403 A TW202120403 A TW 202120403A
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wafer
wafer boat
cassette
boat
furnace assembly
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傑羅恩 福祿特
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荷蘭商Ａｓｍ Ｉｐ私人控股有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
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    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
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    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/045—Storage devices mechanical in a circular arrangement, e.g. towers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F27B17/0016—Chamber type furnaces
    • F27B17/0025—Especially adapted for treating semiconductor wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D15/00—Handling or treating discharged material; Supports or receiving chambers therefor
    • F27D15/02—Cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/0084—Charging; Manipulation of SC or SC wafers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/12—Travelling or movable supports or containers for the charge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0297—Wafer cassette
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D2003/0034—Means for moving, conveying, transporting the charge in the furnace or in the charging facilities
    • F27D2003/0051—Means for moving, conveying, transporting the charge in the furnace or in the charging facilities comprising means to pick up the charge and put it down
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D2003/0085—Movement of the container or support of the charge in the furnace or in the charging facilities
    • F27D2003/0087—Rotation about a vertical axis

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Abstract

用於處理晶圓的立式批次處理爐組件，包括盒操縱空間、晶圓操縱空間以及分隔盒操縱空間和晶圓操縱空間的內壁。盒操縱空間設置有盒存放器，配置以存放複數個晶圓盒。盒操縱空間還設置有盒操縱器，配置以在盒存放器和晶圓傳送位置之間傳送晶圓盒。晶圓操縱空間設置有晶圓操縱器，配置以在晶圓舟和晶圓傳送位置中的晶圓盒之間傳送晶圓。內壁在晶圓傳送位置處附近設置有用於晶圓盒的晶圓傳送開口，晶圓被傳送至晶圓盒或從晶圓盒傳出。盒存放器包括直徑在1.1公尺至1.6公尺之間的盒存放轉盤。

Description

立式批次處理爐組件
本揭露總體上係有關於一種用於處理晶圓的立式批次處理爐組件(vertical batch furnace assembly)。
立式批次處理爐組件可以包括盒操縱空間，其設置有用於存放多個晶圓盒的盒存放器。盒存放器可以包括盒存放轉盤和相關的盒操縱器。盒操縱器可以將盒放置在相關盒存放轉盤的平台階(platform stage)上。盒存放轉盤中的平台階的數量以及可以存放在單個平台階上的晶圓盒的數量可以根據設計而變化。
提供本概述是為了以簡化形式介紹一些構思。在下面的本揭露的示例實施例的詳細描述中進一步詳細描述了這些構思。本概述既不旨在標識所要求保護的主題的關鍵特徵或必要特徵，也不旨在用於限制所要求保護的主題的範圍。
一個目的是提供一種具有改進的存放容量的立式批次處理爐組件。
為此，可以提供立式批次處理爐組件。更特別地，可以提供用於處理晶圓的立式批次處理爐組件。
立式批次處理爐組件可以包括盒操縱空間。盒操縱空間可以設置有盒存放器，其配置以存放設置有多個晶圓的多個晶圓盒。盒操縱空間可以設置有盒操縱器，其配置以在盒存放器和晶圓傳送位置之間傳送晶圓盒。立式批次處理爐組件可以包括晶圓操縱空間。晶圓操縱空間可以設置有晶圓操縱器，晶圓操縱器配置以在晶圓傳送位置中的晶圓盒和晶圓舟傳送位置中的晶圓舟之間傳送晶圓。立式批次處理爐組件可以包括分隔盒操縱空間和晶圓操縱空間的內壁。內壁在晶圓傳送位置處附近可以設置有用於晶圓盒的晶圓傳送開口，晶圓被傳送至晶圓盒或從晶圓盒傳出。盒存放器可以包括直徑在1.1公尺至1.6公尺之間的盒存放轉盤。
具有直徑在1.1公尺至1.6公尺之間的盒存放轉盤的優點在於，盒存放轉盤可以在工具的整個寬度上延伸，並且以此方式可以容納大量的盒(cassettes)。
為了概述本發明以及與現有技術相比所獲得的優點，在上文中已經描述了本發明的某些目的和優點。當然，應當理解，根據本發明的任何特定實施例，不一定可以實現所有這些目的或優點。因此，例如，本領域技術人員可以認識到，本發明可以以實現或最佳化本文所教導或提出的一個或一組優點的方式實施或執行，而不必實現本文可能教導或提出的其他目的或優點。
在附屬項中要求保護各種實施例，將參考附圖中示出的示例進一步闡明這些實施例。實施例可以組合或可以彼此分離地應用。
所有這些實施例都旨在落入本文揭露的本發明的範圍內。藉由參考附圖對某些實施例的以下詳細描述，這些和其他實施例對於本領域技術人員將變得顯而易見，本發明不限於所揭露的任何特定實施例。
在本申請中，相似或相應的特徵由相似或相應的附圖標記表示。各種實施例的描述不限於附圖中示出的示例，並且在詳細描述中使用的附圖標記和權利要求書不旨在限制實施例的描述，而是包括以藉由引用圖中所示的示例來闡明實施例。
儘管下面揭露了某些實施例和示例，但是本領域技術人員將理解，本發明涵蓋了本發明的具體揭露的實施例及/或用途及其明顯的修改和等同形式。因此，意圖是所揭露的本發明的範圍不應受到以下描述的特定揭露的實施例的限制。本文呈現的圖示並不意味著是任何特定材料、結構或設備的實際視圖，而僅僅是用於描述本揭露的實施例的理想化表示。
如本文所使用的，術語“晶圓”可以指可以使用的任何下面的一或多個材料，或者可以在其上形成器件、電路或膜的材料。
在最一般的術語中，本揭露提供了一種用於處理晶圓的立式批次處理爐組件10，其示例在第1圖到第4圖中示出。立式批次處理爐組件10可以包括盒操縱空間26。盒操縱空間26可以設置有盒存放器，盒存放器配置以存放設置有多個晶圓的多個晶圓盒16。盒操縱空間26可以設置有盒操縱器28，盒操縱器28配置以在盒存放器和晶圓傳送位置24之間傳送晶圓盒16。立式批次處理爐組件10可以包括晶圓操縱空間30。晶圓操縱空間30可以設置有晶圓操縱器32，晶圓操縱器32配置以在晶圓傳送位置24中的晶圓盒16和晶圓舟傳送位置34中的晶圓舟12之間傳送晶圓。
立式批次處理爐組件10可以包括內壁20，內壁20將盒操縱空間26和晶圓操縱空間30分隔。內壁20在晶圓傳送位置24處附近可以設置有用於晶圓盒16的晶圓傳送開口22，晶圓被傳送至晶圓盒16或從晶圓盒16傳出。盒存放器可以包括直徑在1.1公尺至1.6公尺之間的盒存放轉盤18。
在概述部分中已經描述了立式批次處理爐組件10的效果和優點，並且這些效果和優點藉由引用插入本文。
在一實施例中，盒存放轉盤18可以具有至少一平台階70。盒存放區可以具有每個平台階70上5個至8個晶圓盒16的存放容量。例如，盒存放轉盤18可以具有約1.1公尺至1.2公尺的直徑，以具有每個平台階70上5個晶圓盒19的存放容量。在另一個示例中，盒存放轉盤18可以具有約1.3公尺至1.5公尺的直徑，以具有每個平台階70上6個晶圓盒16的存放容量。或者如第7圖所示，盒存放轉盤18可以具有約1.4公尺至1.6公尺的直徑，以具有每個平台階70上約8個晶圓盒16的存放容量，其中示出了4個晶圓盒16。
在一實施例中，立式批次處理爐組件10可以設置有基本矩形的覆蓋區，此覆蓋區具有兩個相對的限定了立式批次處理爐組件10的寬度36的短邊，並且具有兩個相對的限定了立式批次處理爐組件10的長度38的長邊。立式批次處理爐組件10的寬度36可以是1.65公尺或更小。
藉由具有大體上矩形的覆蓋區，可以將多個立式批次處理爐組件10彼此相鄰地佈置，從而最佳地利用可用的地板面積。具有矩形覆蓋區的相鄰立式批次處理爐組件之間可以沒有未使用的空間。鑒於其他製造商/品牌的立式批次處理爐組件的互換性寬度，小於1.65公尺的寬度36是有利的。
在一實施例中，立式批次處理爐組件10可以更包括第一處理室56，用於處理容納在晶圓舟12中的晶圓。立式批次處理爐組件10還可以包括第二處理室58，用於處理容納在晶圓舟12中的晶圓。立式批次處理爐組件10還可更包括單個晶圓舟操縱裝置60。
晶圓舟操縱裝置60可以包括具有多個晶圓舟支撐表面74的一個可旋轉台72，每個晶圓舟支撐表面74配置以用於支撐晶圓舟12。旋轉台72可以由致動器圍繞基本豎直的中心軸線76旋轉。可旋轉台72可旋轉以將每個晶圓舟支撐表面74傳送到第一晶圓舟裝載/接收位置62，在此位置中，晶圓舟操縱裝置60配置以將晶圓舟12從可旋轉台72豎直地裝載到第一處理室56中，並從第一處理室56接收晶圓舟12至可旋轉台72上。可旋轉台72還可旋轉以將每個晶圓舟支撐表面74傳送到第二晶圓舟裝載/接收位置64，在此位置中，晶圓舟操縱裝置60配置以將晶圓舟12從可旋轉台72豎直地裝載到第二處理室58中，並從第二處理室58接收晶圓舟12至可旋轉台72上。晶圓舟操縱裝置60可以包括第一晶圓舟升降組件78，第一晶圓舟升降組件78配置以在第一晶圓舟裝載/接收位置62和第一處理室56之間傳送晶圓舟12。晶圓舟操縱裝置60還可以包括第二晶圓舟升降組件78'，第二晶圓舟升降組件78'配置以在第二晶圓舟裝載/接收位置64和第二處理室58之間傳送晶圓舟12。可旋轉台72可以進一步可旋轉以將每個晶圓舟支撐表面74傳送到冷卻位置80，在冷卻位置80中，晶圓舟操縱裝置60配置以冷卻晶圓舟12。可旋轉台72還可以可旋轉以將每個晶圓舟支撐表面74傳送到中間位置82。可以設置舟傳送機構84，以將處於中間位置82的晶圓舟支撐表面74上的晶圓舟12傳送到舟傳送位置34，反之亦然。
單個晶圓舟操縱裝置60因此可以配置以將晶圓舟12裝載到第一處理室56和第二處理室58兩者，並且從第一處理室56和第二處理室58兩者接收晶圓舟12。借助於這種配置，立式批次處理爐組件10可以利用晶圓舟操縱裝置60將晶圓舟12裝載到第一處理室56/從第一處理室56接收晶圓舟12，對於第二處理室58亦然。因此，立式批次處理爐組件10不需要第二晶圓舟操縱裝置60來將晶圓舟12裝載到第二處理室58/從第二處理室58接收晶圓舟12。不需要容納這樣的第二晶圓舟操縱裝置60的空間可以用於減小立式批次處理爐組件10的寬度36。
在一實施例中，立式批次處理爐組件10還可以包括至少一盒進出埠48。至少一盒進出埠48提供了進入立式批次處理爐組件10的入口和從立式批次處理爐組件10的出口，用於在立式批次處理爐組件10與外界之間交換晶圓盒16。至少一盒進出埠48可以設置在界定盒操縱空間26的壁84中。壁84可以在立式批次處理爐組件10的基本矩形覆蓋區的短邊處或附近。盒操縱器28可以配置以在盒存放器、晶圓傳送位置24和至少一盒進出埠48之間傳送晶圓盒16。
這樣的盒操縱器28可以操縱盒操縱空間26內的所有晶圓盒傳送。這可以提供傳送晶圓盒的有效率且成本有效的方式。
在一實施例中，盒操縱器28可以設置有盒操縱器臂50和升降機構52，升降機構52配置以到達盒存放器內不同的豎直高度處的晶圓盒16。
儘管上面已經部分地參考附圖描述了本發明的示例性實施例，但是應當理解，本發明不限於這些實施例。藉由研究附圖、揭露內容和所附申請專利範圍，本領域技術人員在實踐所要求保護的發明時可以理解和實現所揭露的實施例的變型。
貫穿本說明書對“一個實施例”或“一實施例”的引用意味著結合實施例描述的特定特徵、結構或特性被包括在本發明的至少一實施例中。因此，在本說明書中各處出現的短語“在一實施例中”或“在一實施例中”不一定都指的是同一實施例。
此外，應注意，上述各種實施例中的一或多個的特定特徵、結構或特性可以彼此獨立地使用，並且可以以任何合適的方式組合以形成新的、未詳細描述的實施例。在詳細描述和申請專利範圍中使用的附圖標記不限制實施例的描述，也不限制申請專利範圍。參考數字僅用於清楚示意。
10:立式批次處理爐組件 12:晶圓舟 16:晶圓盒 18:盒存放轉盤 20:內壁 22:晶圓傳送開口 24:晶圓傳送位置 26:盒操縱空間 28:盒操縱器 30:晶圓操縱空間 32:晶圓操縱器 34:晶圓舟傳送位置 36:寬度 38:長度 48:盒進出埠 50:盒操縱器臂 52:升降機構 56:第一處理室 58:第二處理室 60:晶圓舟操縱裝置 62:第一晶圓舟裝載/接收位置 64:第二晶圓舟裝載/接收位置 70:平台階 72:可旋轉台 74:晶圓舟支撐表面 76:中心軸線 78:晶圓舟升降組件 78':第二晶圓舟升降組件 80:冷卻位置 82:中間位置 84:晶圓舟傳送機構
儘管說明書以特別指出並明確要求保護被認為是本發明的實施例的申請專利範圍作為結尾，但是當結合附圖閱讀本揭露的實施例的某些示例時，可以容易地從本揭露的實施例的某些示例的描述中確定本揭露的實施例的優點，其中： 第1圖示出了立式批次處理爐組件的示例的示意性上視圖； 第2圖示出了第1圖的示例的沿第1圖、第3圖和第4圖中的線II的示意性剖面視圖； 第3圖示出了第1圖的示例的沿第2圖和第4圖中的線III的示意性剖面上視圖；和 第4圖示出了第1圖的示例的沿第1圖、第2圖和第3圖中的線IV的示意性剖面視圖。
10:立式批次處理爐組件
12:晶圓舟
16:晶圓盒
20:內壁
22:晶圓傳送開口
24:晶圓傳送位置
26:盒操縱空間
28:盒操縱器
30:晶圓操縱空間
32:晶圓操縱器
34:晶圓舟傳送位置
36:寬度
38:長度
48:盒進出埠
50:盒操縱器臂
52:升降機構
78:晶圓舟升降組件
78':第二晶圓舟升降組件
80:冷卻位置
82:中間位置
84:晶圓舟傳送機構

Claims (13)

  1. 一種用於處理晶圓的立式批次處理爐組件（10），包括： 一盒操縱空間（26），設置有一盒存放器和一盒操縱器（28），該盒存放器配置以存放設置有複數個晶圓的複數個晶圓盒（16），該盒操縱器（28）配置以在該盒存放器和一晶圓傳送位置（24）之間傳送該等晶圓盒（16）； 一晶圓操縱空間（30），設置有一晶圓操縱器（32），該晶圓操縱器（32）配置以在該晶圓傳送位置（24）中的一晶圓盒（16）和一晶圓舟傳送位置（34）中的一晶圓舟（12）之間傳送該等晶圓； 一內壁（20），將該盒操縱空間（26）和該晶圓操縱空間（30）分隔，並且在該晶圓傳送位置（24）附近設置有用於一晶圓盒（16）的一晶圓傳送開口（22），該等晶圓被傳送至該晶圓盒（16）或從該晶圓盒（16）傳出，其中，該盒存放器包括直徑在1.1公尺至1.6公尺之間的一盒存放轉盤（18）。
  2. 如請求項1之立式批次處理爐組件，更包括基本上矩形的一覆蓋區，該覆蓋區具有兩個相對的短邊及兩個相對的長邊，該等短邊限定該立式批次處理爐組件（10）的一寬度（36），該等長邊限定該立式批次處理爐組件（10）的一長度（38），其中該立式批次處理爐組件（10）的該寬度（36）為1.65公尺或更小。
  3. 如請求項1或2之立式批次處理爐組件，其中，該盒存放轉盤（18）具有至少一平台階（70），並且該盒存放轉盤（18）具有每個平台階（70）5個至8個晶圓盒（16）之間的一存放容量。
  4. 如請求項3之立式批次處理爐組件，其中，該盒存放轉盤（18）具有約為1.1公尺至1.2公尺的一直徑，並且該盒存放轉盤（18）具有每個平台階（70）5個晶圓盒（16）的一存放容量。
  5. 如請求項3之立式批次處理爐組件，其中，該盒存放轉盤（18）具有約為1.3公尺至1.5公尺的一直徑，並且該盒存放轉盤（18）具有每個平台階（70）6個晶圓盒（16）的一存放容量。
  6. 如請求項3之立式批次處理爐組件，其中，該盒存放轉盤（18）具有約為1.4公尺至1.6公尺的一直徑，並且該盒存放轉盤（18）具有每個平台階（70）約8個晶圓盒（16）的一存放容量。
  7. 如請求項1至6中任一項之立式批次處理爐組件，更包括： 一第一處理室（56），處理容納在一晶圓舟（12）中的複數個晶圓； 一第二處理室（58），處理容納在一晶圓舟（12）中的該等晶圓；以及 一單個晶圓舟搬運裝置（60），包括具有複數個晶圓舟支撐表面（74）的一個可旋轉台（72），每個該晶圓舟支撐表面（74）配置以支撐一晶圓舟（12），其中，該可旋轉台（72）可藉由一致動器圍繞基本豎直的一中心軸線（76）而旋轉，以將每個該晶圓舟支撐表面（74）傳送到： 一第一晶圓舟裝載/接收位置（62），在該第一晶圓舟裝載/接收位置（62）中，該晶圓舟操縱裝置（60）配置以將晶圓舟（12）從該可旋轉台（72）豎直地裝載到該第一處理室（56）中，並從該第一處理室（56）接收該晶圓舟（12）至該可旋轉台（72）上；以及 一第二晶圓舟裝載/接收位置（64），在該第二晶圓舟裝載/接收位置（64）中，該晶圓舟操縱裝置（60）配置以將該晶圓舟（12）從該可旋轉台（72）豎直地裝載到該第二處理室（58）中，並從該第二處理室（58）接收該晶圓舟（12）至該可旋轉台（72）上。
  8. 如請求項7之立式批次處理爐組件，其中，該晶圓舟操縱裝置（60）包括一第一晶圓舟升降組件（78），配置以在該第一晶圓舟裝載/接收位置（62）和該第一處理室（56）之間傳送一晶圓舟（12）。
  9. 如請求項7或8之立式批次處理爐組件，其中，該晶圓舟操縱裝置（60）包括一第二晶圓舟升降組件（78），配置以在該第二晶圓舟裝載/接收位置（64）和該第二處理室（58）之間傳送一晶圓舟（12）。
  10. 如請求項7至9中任一項之立式批次處理爐組件，其中，該可旋轉台（72）可旋轉以將每個該晶圓舟支撐表面（74）也傳送至： 一冷卻位置（80），在該冷卻位置（80）中，該晶圓舟操縱裝置（60）配置以冷卻該晶圓舟（12）。
  11. 如請求項7至10中任一項之立式批次處理爐組件，其中，該可旋轉台（72）可旋轉以將每個該晶圓舟支撐表面（74）也傳送到一中間晶圓舟位置（82），其中，該立式批次處理爐組件更包括一舟傳送機構（84），配置以將處於中間位置（82）的一晶圓舟支撐表面（74）上的一晶圓舟（12）傳送到該舟傳送位置（34），且反之亦然。
  12. 如請求項1至11中任一項之立式批次處理爐組件，更包括至少一盒進出埠（48），該至少一盒進出埠（48）設置在界定該盒操縱空間（26）的一壁（84）中，其中，該盒操縱器（28）配置以在該盒存放器、該晶圓傳送位置（24）和該至少一盒進出埠（48）之間傳送該等晶圓盒（16）。
  13. 如請求項1至12中任一項之立式批次處理爐組件，其中，該盒操縱器（28）具有一盒操縱器臂（50）和一升降機構（52），該升降機構（52）配置以到達該盒存放器內不同的豎直高度處的該等晶圓盒（16）。
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