CN112309935A - 立式批处理炉组件 - Google Patents

立式批处理炉组件 Download PDF

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CN112309935A
CN112309935A CN202010729606.4A CN202010729606A CN112309935A CN 112309935 A CN112309935 A CN 112309935A CN 202010729606 A CN202010729606 A CN 202010729606A CN 112309935 A CN112309935 A CN 112309935A
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J.弗卢特
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ASM IP Holding BV
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Abstract

用于处理晶片的立式批处理炉组件，其包括盒操纵空间、晶片操纵空间以及分隔盒操纵空间和晶片操纵空间的内壁。盒操纵空间设置有盒存放器，其配置为存放多个晶片盒。盒操纵空间还设置有盒操纵器，其配置为在盒存放器和晶片传送位置之间传送晶片盒。所述晶片操纵空间设置有晶片操纵器，其配置为在晶片舟和晶片传送位置中的晶片盒之间传送晶片。所述内壁在晶片传送位置处附近设置有用于晶片盒的晶片传送开口，晶片被传送至晶片盒或从晶片盒传出。盒存放器包括直径在1.1至1.6米之间的盒存放转盘。

Description

立式批处理炉组件
技术领域
本公开总体上涉及一种用于处理晶片的立式批处理炉组件。
背景技术
立式批处理炉组件可以包括盒操纵空间，其设置有用于存放多个晶片盒 的盒存放器。盒存放器可以包括盒存放转盘和相关的盒操纵器。盒操纵器可 以将盒放置在相关盒存放转盘的平台级上。盒存放转盘中的平台级的数量以 及可以存放在单个平台级上的晶片盒的数量可以根据设计而变化。
发明内容
提供本概述是为了以简化形式介绍一些构思。在下面的本公开的示例实 施例的详细描述中进一步详细描述了这些构思。本概述既不旨在标识所要求 保护的主题的关键特征或必要特征，也不旨在用于限制所要求保护的主题的 范围。
一个目的是提供一种具有改进的存放容量的立式批处理炉组件。
为此，可以提供立式批处理炉组件。更特别地，可以提供用于处理晶片 的立式批处理炉组件。
立式批处理炉组件可以包括盒操纵空间。盒操纵空间可以设置有盒存 放器，其配置为存放设置有多个晶片的多个晶片盒。盒操纵空间可以设置有 盒操纵器，其配置为在盒存放器和晶片传送位置之间传送晶片盒。立式批处 理炉组件可以包括晶片操纵空间。晶片操纵空间可以设置有晶片操纵器，该 晶片操纵器配置为在晶片传送位置中的晶片盒和晶片舟传送位置中的晶片 舟之间传送晶片。立式批处理炉组件可以包括分隔盒操纵空间和晶片操纵空 间的内壁。内壁在晶片传送位置处附近可以设置有用于晶片盒的晶片传送开口，晶片被传送至晶片盒或从晶片盒传出。盒存放器可以包括直径在1.1至 1.6米之间的盒存放转盘。
具有直径在1.1至1.6米之间的盒存放转盘的优点在于，盒存放转盘可 以在工具的整个宽度上延伸，并且以此方式可以容纳大量的盒。
为了概述本发明以及与现有技术相比所获得的优点，在上文中已经描述 了本发明的某些目的和优点。当然，应当理解，根据本发明的任何特定实施 例，不一定可以实现所有这些目的或优点。因此，例如，本领域技术人员可 以认识到，本发明可以以实现或优化本文所教导或提出的一个或一组优点的 方式实施或执行，而不必实现本文可能教导或提出的其他目的或优点。
在从属权利要求中要求保护各种实施例，将参考附图中示出的示例进一 步阐明这些实施例。实施例可以组合或可以彼此分离地应用。
所有这些实施例都旨在落入本文公开的本发明的范围内。通过参考附图 对某些实施例的以下详细描述，这些和其他实施例对于本领域技术人员将变 得显而易见，本发明不限于所公开的任何特定实施例。
附图说明
尽管说明书以特别指出并明确要求保护被认为是本发明的实施例的权 利要求作为结尾，但是当结合附图阅读本公开的实施例的某些示例时，可以 容易地从本公开的实施例的某些示例的描述中确定本公开的实施例的优点， 其中：
图1示出了立式批处理炉组件的示例的示意性俯视图；
图2示出了图1的示例的沿图1、3和4中的线II的示意性剖面视图；
图3示出了图1的示例的沿图2和4中的线III的示意性剖面俯视图； 和
图4示出了图1的示例的沿图1、2和3中的线IV的示意性剖面视图。
具体实施方式
在本申请中，相似或相应的特征由相似或相应的附图标记表示。各种实 施例的描述不限于附图中示出的示例，并且在详细描述中使用的附图标记和 权利要求书不旨在限制实施例的描述，而是包括以通过引用图中所示的示例 来阐明实施例。
尽管下面公开了某些实施例和示例，但是本领域技术人员将理解，本发 明涵盖了本发明的具体公开的实施例和/或用途及其明显的修改和等同形式。 因此，意图是所公开的本发明的范围不应受到以下描述的特定公开的实施例 的限制。本文呈现的图示并不意味着是任何特定材料、结构或设备的实际视 图，而仅仅是用于描述本公开的实施例的理想化表示。
如本文所使用的，术语“晶片”可以指可以使用的任何下面的一种或多种 材料，或者可以在其上形成器件、电路或膜的材料。
在最一般的术语中，本公开提供了一种用于处理晶片的立式批处理炉组 件10，其示例在图1-4中示出。立式批处理炉组件10可以包括盒操纵空间 26。盒操纵空间26可以设置有盒存放器，该盒存放器配置为存放设置有多 个晶片的多个晶片盒16。盒操纵空间26可以设置有盒操纵器28，该盒操纵 器28配置为在盒存放器和晶片传送位置24之间传送晶片盒16。立式批处理 炉组件10可以包括晶片操纵空间30。晶片操纵空间30可以设置有晶片操纵 器32，该晶片操纵器32配置为在晶片传送位置24中的晶片盒16和晶片舟 传送位置34中的晶片舟12之间传送晶片。
立式批处理炉组件10可以包括内壁20，内壁20将盒操纵空间26和晶 片操纵空间30分隔。内壁20在晶片传送位置24处附近可以设置有用于晶 片盒16的晶片传送开口22，晶片被传送至晶片盒16或从晶片盒16传出。 盒存放器可以包括直径在1.1至1.6米之间的盒存放转盘18。
在概述部分中已经描述了立式批处理炉组件10的效果和优点，并且这 些效果和优点通过引用插入本文。
在一实施例中，盒存放转盘18可以具有至少一个平台级70。盒存放区 可以具有每个平台级70上5至8个晶片盒16的存放容量。例如，盒存放转 盘18可以具有约1.1至1.2米的直径，以具有每个平台级70上5个晶片盒 19的存放容量。在另一个示例中，盒存放转盘18可以具有约1.3至1.5米的 直径，以具有每个平台级70上6个晶片盒16的存放容量。或者如图3所示， 盒存放转盘18可以具有约1.4至1.6米的直径，以具有每个平台级70上约8 个晶片盒16的存放容量，其中示出了4个晶片盒16。
在一实施例中，立式批处理炉组件10可以设置有基本矩形的覆盖区， 该覆盖区具有两个相对的限定了立式批处理炉组件10的宽度36的短边，并 且具有两个相对的限定了立式批处理炉组件10的长度38的长边。立式批处 理炉组件10的宽度36可以是1.65米或更小。
通过具有大体上矩形的覆盖区，可以将多个立式批处理炉组件10彼此 相邻地布置，从而最佳地利用可用的地板面积。具有矩形覆盖区的相邻立式 批处理炉组件之间可以没有未使用的空间。鉴于其他制造商/品牌的立式批处 理炉组件的互换性宽度，小于1.65米的宽度36是有利的。
在一实施例中，立式批处理炉组件10可以进一步包括第一处理室56， 用于处理容纳在晶片舟12中的晶片。立式批处理炉组件10还可以包括第二 处理室58，用于处理容纳在晶片舟12中的晶片。立式批处理炉组件10还可 进一步包括单个晶片舟操纵装置60。
晶片舟操纵装置60可以包括具有多个晶片舟支撑表面74的一个可旋转 台72，每个晶片舟支撑表面74配置为用于支撑晶片舟12。旋转台72可以 由致动器围绕基本竖直的中心轴线76旋转。可旋转台72可旋转以将每个晶 片舟支撑表面74传送到第一晶片舟装载/接收位置62，在该位置中，晶片舟 操纵装置60配置为将晶片舟12从可旋转台72竖直地装载到第一处理室56 中，并从第一处理室56接收晶片舟12至可旋转台72上。可旋转台72还可旋转以将每个晶片舟支撑表面74传送到第二晶片舟装载/接收位置64，在该 位置中，晶片舟操纵装置60配置为将晶片舟12从可旋转台72竖直地装载 到第二处理室58中，并从第二处理室58接收晶片舟12至可旋转台72上。 晶片舟操纵装置60可以包括第一晶片舟升降组件78，该第一晶片舟升降组 件78配置为在第一晶片舟装载/接收位置62和第一处理室56之间传送晶片 舟12。晶片舟操纵装置60还可以包括第二晶片舟升降组件78'，该第二晶片 舟升降组件78'配置为在第二晶片舟装载/接收位置64和第二处理室58之间 传送晶片舟12。可旋转台72可以进一步可旋转以将每个晶片舟支撑表面74 传送到冷却位置80，在该冷却位置80中，晶片舟操纵装置60配置为冷却晶 片舟12。可旋转台72还可以可旋转以将每个晶片舟支撑表面74传送到中间 位置82。可以设置舟传送机构84，以将处于中间位置82的晶片舟支撑表面 74上的晶片舟12传送到舟传送位置34，反之亦然。
单个晶片舟操纵装置60因此可以配置为将晶片舟12装载到第一处理室 56和第二处理室58两者，并且从第一处理室56和第二处理室58两者接收 晶片舟12。借助于这种配置，立式批处理炉组件10可以利用晶片舟操纵装 置60将晶片舟12装载到第一处理室56/从第一处理室56接收晶片舟12，对 于第二处理室58亦然。因此，立式批处理炉组件10不需要第二晶片舟操纵 装置60来将晶片舟12装载到第二处理室58/从第二处理室58接收晶片舟12。 不需要容纳这样的第二晶片舟操纵装置60的空间可以用于减小立式批处理 炉组件10的宽度36。
在一实施例中，立式批处理炉组件10还可以包括至少一个盒进出端口 48。至少一个盒进出端口48提供了进入立式批处理炉组件10的入口和从立 式批处理炉组件10的出口，用于在立式批处理炉组件10与外界之间交换晶 片盒16。至少一个盒进出端口48可以设置在界定盒操纵空间26的壁84中。 所述壁84可以在立式批处理炉组件10的基本矩形覆盖区的短边处或附近。 盒操纵器28可以配置为在盒存放器、晶片传送位置24和至少一个盒进出端 口48之间传送晶片盒16。
这样的盒操纵器28可以操纵盒操纵空间26内的所有晶片盒传送。这可 以提供传送晶片盒的有效率且成本有效的方式。
在一实施例中，盒操纵器28可以设置有盒操纵器臂50和升降机构52， 该升降机构52配置为到达盒存放器内不同的竖直高度处的晶片盒16。
尽管上面已经部分地参考附图描述了本发明的示例性实施例，但是应当 理解，本发明不限于这些实施例。通过研究附图、公开内容和所附权利要求， 本领域技术人员在实践所要求保护的发明时可以理解和实现所公开的实施 例的变型。
贯穿本说明书对“一个实施例”或“一实施例”的引用意味着结合该实施 例描述的特定特征、结构或特性被包括在本发明的至少一实施例中。因此， 在本说明书中各处出现的短语“在一个实施例中”或“在一实施例中”不一定都 指的是同一实施例。
此外，应注意，上述各种实施例中的一个或多个的特定特征、结构或特 性可以彼此独立地使用，并且可以以任何合适的方式组合以形成新的、未详 细描述的实施例。在详细描述和权利要求中使用的附图标记不限制实施例的 描述，也不限制权利要求。参考数字仅用于清楚示意。
附图标记
10–立式批处理炉组件
12–晶片舟
16–晶片盒
18–盒存放转盘
20–内壁
22–晶片传送开口
24–晶片传送位置
26–盒操纵空间
28–盒操纵器
30–晶片操纵空间
32–晶片操纵器
34–晶片舟传送位置
36–(立式批处理炉组件的)宽度
38–(立式批处理炉组件的)长度
48–盒进出端口
50–盒操纵器臂
52–升降机构
56–第一处理室
58–第二处理室
60–晶片舟操纵装置
62–第一晶片舟装载/接收位置
64–第二晶片舟装载/接收位置
70–平台级
72–可旋转台
74–晶片舟支撑表面
76–中心轴线
78和78'–晶片舟升降组件
80–冷却位置
82–中间位置
84–晶片舟传送机构

Claims (13)

1.一种用于处理晶片的立式批处理炉组件(10)，包括：
盒操纵空间(26)，设置有盒存放器和盒操纵器(28)，所述盒存放器配置为存放设置有多个晶片的多个晶片盒(16)，所述盒操纵器(28)配置为在盒存放器和晶片传送位置(24)之间传送晶片盒(16)；
晶片操纵空间(30)，设置有晶片操纵器(32)，所述晶片操纵器(32)配置为在晶片传送位置(24)中的晶片盒(16)和晶片舟传送位置(34)中的晶片舟(12)之间传送晶片；
内壁(20)，其将盒操纵空间(26)和晶片操纵空间(30)分隔，并且在晶片传送位置(24)附近设置有用于晶片盒(16)的晶片传送开口(22)，晶片被传送至晶片盒(16)或从晶片盒(16)传出，其中，所述盒存放器包括直径在1.1至1.6米之间的盒存放转盘(18)。
2.根据权利要求1所述的立式批处理炉组件，其设置有基本上矩形的覆盖区，所述覆盖区具有两个相对的短边限定所述立式批处理炉组件(10)的宽度(36)，并且具有两个相对的长边限定所述立式批处理炉组件(10)的长度(38)，其中所述立式批处理炉组件(10)的宽度(36)为1.65米或更小。
3.根据权利要求1或2所述的立式批处理炉组件，其中，所述盒存放转盘(18)具有至少一个平台级(70)，并且具有每个平台级(70)上5至8个晶片盒(16)之间的存放容量。
4.根据权利要求3所述的立式批处理炉组件，其中，所述盒存放转盘(18)的直径约为1.1至1.2米，并且每个平台级(70)的存放容量为5个晶片盒(16)。
5.根据权利要求3所述的立式批处理炉组件，其中，所述盒存放转盘(18)的直径约为1.3至1.5米，并且每个平台级(70)的存放容量为6个晶片盒(16)。
6.根据权利要求3所述的立式批处理炉组件，其中，所述盒存放转盘(18)的直径约为1.4至1.6米，并且每个平台级(70)的存放容量为约8个晶片盒(16)。
7.根据前述权利要求中的任一项所述的立式批处理炉组件，还包括：
第一处理室(56)，用于处理容纳在晶片舟(12)中的晶片；
第二处理室(58)，用于处理容纳在晶片舟(12)中的晶片；以及
单个晶片舟搬运装置(60)，包括具有多个晶片舟支撑表面(74)的一个可旋转台(72)，每个晶片舟支撑表面(74)配置为用于支撑晶片舟(12)，其中，所述可旋转台(72)可通过致动器围绕基本竖直的中心轴线(76)旋转以将每个晶片舟支撑表面(74)传送到：
第一晶片舟装载/接收位置(62)，在该位置中晶片舟操纵装置(60)配置为将晶片舟(12)从可旋转台(72)竖直地装载到第一处理室(56)中并从第一处理室(56)接收晶片舟(12)至可旋转台(72)上；和
第二晶片舟装载/接收位置(64)，在该位置中晶片舟操纵装置(60)配置为将晶片舟(12)从可旋转台(72)竖直地装载到第二处理室(58)中并从第二处理室(58)接收晶片舟(12)至可旋转台(72)上。
8.根据权利要求7所述的立式批处理炉组件，其中，所述晶片舟操纵装置(60)包括第一晶片舟升降组件(78)，其配置为在所述第一晶片舟装载/接收位置(62)和第一处理室(56)之间传送晶片舟(12)。
9.根据权利要求7或8所述的立式批处理炉组件，其中，所述晶片舟操纵装置(60)包括第二晶片舟升降组件(78)，其配置为在所述第二晶片舟装载/接收位置(64)和第二处理室(58)之间传送晶片舟(12)。
10.根据权利要求7至9中任一项所述的立式批处理炉组件，其中，所述可旋转台(72)可旋转以将每个晶片舟支撑表面(74)也传送至：
冷却位置(80)，在该位置中晶片舟操纵装置(60)配置为冷却晶片舟(12)。
11.根据权利要求7至10中任一项所述的立式批处理炉组件，其中，所述可旋转台(72)可旋转以将每个晶片舟支撑表面(74)也传送到中间晶片舟位置(82)，其中，所述立式批处理炉组件还包括舟传送机构(84)，其配置为将处于中间位置(82)的晶片舟支撑表面(74)上的晶片舟(12)传送到舟传送位置(34)，反之亦然。
12.根据前述权利要求中的任一项所述的立式批处理炉组件，还包括至少一个盒进出端口(48)，所述至少一个盒进出端口(48)设置在界定所述盒操纵空间(26)的壁(84)中，其中，所述盒操纵器(28)配置为在盒存放器、晶片传送位置(24)和至少一个盒进出端口(48)之间传送晶片盒(16)。
13.根据前述权利要求中的任一项所述的立式批处理炉组件，其中，所述盒操纵器(28)设置有盒操纵器臂(50)和升降机构(52)，所述升降机构(52)配置为到达盒存放器内不同的竖直高度处的晶片盒(16)。
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