TW202040744A - 局部加熱之多區域基材支撐座 - Google Patents

局部加熱之多區域基材支撐座 Download PDF

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Publication number
TW202040744A
TW202040744A TW109107577A TW109107577A TW202040744A TW 202040744 A TW202040744 A TW 202040744A TW 109107577 A TW109107577 A TW 109107577A TW 109107577 A TW109107577 A TW 109107577A TW 202040744 A TW202040744 A TW 202040744A
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TW
Taiwan
Prior art keywords
electrodes
electrostatic
electrostatic clamp
heating elements
clamp according
Prior art date
Application number
TW109107577A
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English (en)
Chinese (zh)
Inventor
麥可Ｓ 寇克斯
Original Assignee
美商應用材料股份有限公司
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW202040744A publication Critical patent/TW202040744A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Induction Heating (AREA)
  • Resistance Heating (AREA)
  • Control Of Resistance Heating (AREA)
TW109107577A 2013-08-06 2014-08-05 局部加熱之多區域基材支撐座 TW202040744A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361862866P 2013-08-06 2013-08-06
US61/862,866 2013-08-06

Publications (1)

Publication Number Publication Date
TW202040744A true TW202040744A (zh) 2020-11-01

Family

ID=52448462

Family Applications (3)

Application Number Title Priority Date Filing Date
TW109107577A TW202040744A (zh) 2013-08-06 2014-08-05 局部加熱之多區域基材支撐座
TW107101624A TWI688038B (zh) 2013-08-06 2014-08-05 局部加熱之多區域基材支撐座
TW103126784A TWI641074B (zh) 2013-08-06 2014-08-05 局部加熱之多區域基材支撐座

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW107101624A TWI688038B (zh) 2013-08-06 2014-08-05 局部加熱之多區域基材支撐座
TW103126784A TWI641074B (zh) 2013-08-06 2014-08-05 局部加熱之多區域基材支撐座

Country Status (6)

Country Link
US (3) US9472434B2 (https=)
JP (2) JP6441927B2 (https=)
KR (2) KR101905158B1 (https=)
CN (1) CN105408993A (https=)
TW (3) TW202040744A (https=)
WO (1) WO2015020813A1 (https=)

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US20150043123A1 (en) 2015-02-12
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US9472434B2 (en) 2016-10-18
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