TW201938383A - 透明導電性膜積層體及透明導電性膜之製造方法 - Google Patents
透明導電性膜積層體及透明導電性膜之製造方法 Download PDFInfo
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JP2018-033488 | 2018-02-27 | ||
JP2018033488A JP7219006B2 (ja) | 2018-02-27 | 2018-02-27 | 透明導電性フィルム積層体および透明導電性フィルムの製造方法 |
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TW201938383A true TW201938383A (zh) | 2019-10-01 |
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CN (1) | CN110197739B (ko) |
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WO2020255458A1 (ja) * | 2019-06-20 | 2020-12-24 | 昭和電工株式会社 | 透明導電フィルム積層体及びその加工方法 |
KR102495564B1 (ko) * | 2019-10-18 | 2023-02-07 | 쇼와 덴코 가부시키가이샤 | 투명 도전 필름 적층체 및 그 가공 방법 |
JP7507031B2 (ja) * | 2020-08-05 | 2024-06-27 | 日東電工株式会社 | 積層体、画像表示部材とその製造方法、および、モバイル電子機器とその製造方法 |
CN114327104A (zh) * | 2020-09-29 | 2022-04-12 | 宸美(厦门)光电有限公司 | 接触区结构 |
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JP4151821B2 (ja) * | 2002-01-11 | 2008-09-17 | 日東電工株式会社 | 透明導電性フィルム用表面保護フィルム及び透明導電性フィルム |
JP2005036205A (ja) * | 2003-06-24 | 2005-02-10 | Nitto Denko Corp | 表面保護フィルム、透明導電性フィルム、及び表示装置 |
KR102108102B1 (ko) * | 2012-12-10 | 2020-05-11 | 닛토덴코 가부시키가이샤 | 다이싱 테이프 일체형 접착 시트, 다이싱 테이프 일체형 접착 시트를 이용한 반도체 장치의 제조 방법 및 반도체 장치 |
JP2014189660A (ja) * | 2013-03-27 | 2014-10-06 | Lintec Corp | 積層体、粘着ロール、および当該積層体を用いる粘着剤層含有積層構造体の製造方法 |
WO2014155982A1 (ja) * | 2013-03-27 | 2014-10-02 | 凸版印刷株式会社 | タッチパネル |
JP6126500B2 (ja) * | 2013-08-30 | 2017-05-10 | 日東電工株式会社 | 透明導電性フィルム用キャリアフィルム及び積層体 |
JP6322278B2 (ja) * | 2014-02-18 | 2018-05-09 | シャープ株式会社 | 積層フィルム及びフィルム貼り付け方法 |
JP6835477B2 (ja) * | 2015-04-30 | 2021-02-24 | 日東電工株式会社 | 透明導電性フィルム用キャリアフィルム及び積層体 |
JP2017039859A (ja) * | 2015-08-20 | 2017-02-23 | 日東電工株式会社 | セパレーター付表面保護フィルム |
JP6751438B2 (ja) * | 2016-05-24 | 2020-09-02 | 富士フイルム株式会社 | 積層体ならびにこれを有する画像表示装置の前面板、画像表示装置、画像表示機能付きミラ−、抵抗膜式タッチパネルおよび静電容量式タッチパネル |
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JP7219006B2 (ja) | 2023-02-07 |
JP2019149012A (ja) | 2019-09-05 |
KR20240042397A (ko) | 2024-04-02 |
CN110197739A (zh) | 2019-09-03 |
CN110197739B (zh) | 2022-04-26 |
JP2022169608A (ja) | 2022-11-09 |
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