JP7219006B2 - 透明導電性フィルム積層体および透明導電性フィルムの製造方法 - Google Patents

透明導電性フィルム積層体および透明導電性フィルムの製造方法 Download PDF

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Publication number
JP7219006B2
JP7219006B2 JP2018033488A JP2018033488A JP7219006B2 JP 7219006 B2 JP7219006 B2 JP 7219006B2 JP 2018033488 A JP2018033488 A JP 2018033488A JP 2018033488 A JP2018033488 A JP 2018033488A JP 7219006 B2 JP7219006 B2 JP 7219006B2
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Japan
Prior art keywords
transparent conductive
conductive film
resin
layer
transparent
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JP2018033488A
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English (en)
Japanese (ja)
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JP2019149012A (ja
Inventor
和也 酒井
圭祐 松本
豪彦 安藤
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to JP2018033488A priority Critical patent/JP7219006B2/ja
Priority to KR1020190019874A priority patent/KR20190103014A/ko
Priority to TW108105522A priority patent/TW201938383A/zh
Priority to CN201910146859.6A priority patent/CN110197739B/zh
Publication of JP2019149012A publication Critical patent/JP2019149012A/ja
Priority to JP2022126293A priority patent/JP2022169608A/ja
Application granted granted Critical
Publication of JP7219006B2 publication Critical patent/JP7219006B2/ja
Priority to KR1020240041268A priority patent/KR20240042397A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/02—Layer formed of wires, e.g. mesh
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/325—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polycycloolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
JP2018033488A 2018-02-27 2018-02-27 透明導電性フィルム積層体および透明導電性フィルムの製造方法 Active JP7219006B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2018033488A JP7219006B2 (ja) 2018-02-27 2018-02-27 透明導電性フィルム積層体および透明導電性フィルムの製造方法
KR1020190019874A KR20190103014A (ko) 2018-02-27 2019-02-20 투명 도전성 필름 적층체 및 투명 도전성 필름의 제조 방법
TW108105522A TW201938383A (zh) 2018-02-27 2019-02-20 透明導電性膜積層體及透明導電性膜之製造方法
CN201910146859.6A CN110197739B (zh) 2018-02-27 2019-02-27 透明导电性薄膜层叠体及透明导电性薄膜的制造方法
JP2022126293A JP2022169608A (ja) 2018-02-27 2022-08-08 透明導電性フィルム積層体および透明導電性フィルムの製造方法
KR1020240041268A KR20240042397A (ko) 2018-02-27 2024-03-26 투명 도전성 필름 적층체 및 투명 도전성 필름의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018033488A JP7219006B2 (ja) 2018-02-27 2018-02-27 透明導電性フィルム積層体および透明導電性フィルムの製造方法

Related Child Applications (1)

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JP2022126293A Division JP2022169608A (ja) 2018-02-27 2022-08-08 透明導電性フィルム積層体および透明導電性フィルムの製造方法

Publications (2)

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JP2019149012A JP2019149012A (ja) 2019-09-05
JP7219006B2 true JP7219006B2 (ja) 2023-02-07

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JP2018033488A Active JP7219006B2 (ja) 2018-02-27 2018-02-27 透明導電性フィルム積層体および透明導電性フィルムの製造方法
JP2022126293A Pending JP2022169608A (ja) 2018-02-27 2022-08-08 透明導電性フィルム積層体および透明導電性フィルムの製造方法

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JP2022126293A Pending JP2022169608A (ja) 2018-02-27 2022-08-08 透明導電性フィルム積層体および透明導電性フィルムの製造方法

Country Status (4)

Country Link
JP (2) JP7219006B2 (ko)
KR (2) KR20190103014A (ko)
CN (1) CN110197739B (ko)
TW (1) TW201938383A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11710581B2 (en) 2019-06-20 2023-07-25 Showa Denko K.K. Transparent conducting film laminate and processing method thereof
KR102495564B1 (ko) * 2019-10-18 2023-02-07 쇼와 덴코 가부시키가이샤 투명 도전 필름 적층체 및 그 가공 방법
JP7507031B2 (ja) * 2020-08-05 2024-06-27 日東電工株式会社 積層体、画像表示部材とその製造方法、および、モバイル電子機器とその製造方法
CN114327104A (zh) * 2020-09-29 2022-04-12 宸美（厦门）光电有限公司 接触区结构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003205567A (ja) 2002-01-11 2003-07-22 Nitto Denko Corp 透明導電性フィルム用表面保護フィルム及び透明導電性フィルム
JP2005036205A (ja) 2003-06-24 2005-02-10 Nitto Denko Corp 表面保護フィルム、透明導電性フィルム、及び表示装置
WO2014155982A1 (ja) 2013-03-27 2014-10-02 凸版印刷株式会社 タッチパネル
JP2014189660A (ja) 2013-03-27 2014-10-06 Lintec Corp 積層体、粘着ロール、および当該積層体を用いる粘着剤層含有積層構造体の製造方法
WO2015125811A1 (ja) 2014-02-18 2015-08-27 シャープ株式会社 積層フィルム及びフィルム貼り付け方法
WO2017204228A1 (ja) 2016-05-24 2017-11-30 富士フイルム株式会社 積層体ならびにこれを有する画像表示装置の前面板、画像表示装置、画像表示機能付きミラ－、抵抗膜式タッチパネルおよび静電容量式タッチパネル

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102108102B1 (ko) * 2012-12-10 2020-05-11 닛토덴코 가부시키가이샤 다이싱 테이프 일체형 접착 시트, 다이싱 테이프 일체형 접착 시트를 이용한 반도체 장치의 제조 방법 및 반도체 장치
JP6126500B2 (ja) * 2013-08-30 2017-05-10 日東電工株式会社 透明導電性フィルム用キャリアフィルム及び積層体
JP6835477B2 (ja) * 2015-04-30 2021-02-24 日東電工株式会社 透明導電性フィルム用キャリアフィルム及び積層体
JP2017039859A (ja) * 2015-08-20 2017-02-23 日東電工株式会社 セパレーター付表面保護フィルム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003205567A (ja) 2002-01-11 2003-07-22 Nitto Denko Corp 透明導電性フィルム用表面保護フィルム及び透明導電性フィルム
JP2005036205A (ja) 2003-06-24 2005-02-10 Nitto Denko Corp 表面保護フィルム、透明導電性フィルム、及び表示装置
WO2014155982A1 (ja) 2013-03-27 2014-10-02 凸版印刷株式会社 タッチパネル
JP2014189660A (ja) 2013-03-27 2014-10-06 Lintec Corp 積層体、粘着ロール、および当該積層体を用いる粘着剤層含有積層構造体の製造方法
WO2015125811A1 (ja) 2014-02-18 2015-08-27 シャープ株式会社 積層フィルム及びフィルム貼り付け方法
WO2017204228A1 (ja) 2016-05-24 2017-11-30 富士フイルム株式会社 積層体ならびにこれを有する画像表示装置の前面板、画像表示装置、画像表示機能付きミラ－、抵抗膜式タッチパネルおよび静電容量式タッチパネル

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Publication number Publication date
CN110197739A (zh) 2019-09-03
KR20240042397A (ko) 2024-04-02
CN110197739B (zh) 2022-04-26
TW201938383A (zh) 2019-10-01
JP2019149012A (ja) 2019-09-05
JP2022169608A (ja) 2022-11-09
KR20190103014A (ko) 2019-09-04

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