TW201805108A - 切削裝置 - Google Patents
切削裝置 Download PDFInfo
- Publication number
- TW201805108A TW201805108A TW106112634A TW106112634A TW201805108A TW 201805108 A TW201805108 A TW 201805108A TW 106112634 A TW106112634 A TW 106112634A TW 106112634 A TW106112634 A TW 106112634A TW 201805108 A TW201805108 A TW 201805108A
- Authority
- TW
- Taiwan
- Prior art keywords
- cutting
- workpiece
- cutter
- chips
- cover
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 160
- 238000011084 recovery Methods 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 5
- 238000004064 recycling Methods 0.000 claims description 4
- 238000003860 storage Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 238000011109 contamination Methods 0.000 description 7
- 238000012423 maintenance Methods 0.000 description 7
- 238000005406 washing Methods 0.000 description 5
- 238000005507 spraying Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
- B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1845—Means for removing cut-out material or waste by non mechanical means
- B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/007—Control means comprising cameras, vision or image processing systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/018—Holding the work by suction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/22—Safety devices specially adapted for cutting machines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- Forests & Forestry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Milling Processes (AREA)
Abstract
在乾狀態下進行切削之時,降低被加工物之污染,同時謀求維修作業之效率化。
切削裝置(1)具備保持被加工物(W)之挾盤台(21),和切削被保持於挾盤台之被加工物的切削刀(51),和在使切削刀之下部突出之狀態下覆蓋切削刀之外圍的刀具蓋(55)。藉由以被安裝於刀具蓋之切削屑回收手段(56),吸引通過筒體(66)而隨著切削刀之旋轉而連動轉動之切削屑,邊從被加工物上排出切削屑邊進行被加工物之乾切割。
Description
本發明係關於具備有切削刀之刀具蓋的切削裝置。
在表面形成IC等之裝置的半導體晶圓,或以樹脂密封複數裝置晶片之封裝體基板等之被加工物,藉由切削裝置之圓環狀之切削刀被切削而被分割成各個晶片。通常,切削裝置之切削刀之外圍藉由刀具蓋被覆蓋,在刀具蓋設置有噴射切削水之噴嘴。在該種之切削裝置中,於切削被加工物之時,對切削刀或被加工物供給切削水,冷卻在被加工物之加工點產生之摩擦熱,同時洗淨被加工物之表面(例如,參照專利文獻1)。
[專利文獻1]日本特開2015-145046號公報
然而,被加工物之中,具有如吸收水分之樹脂或燒結前之生陶磁等般之厭水物。如此之被加工物需要在不供給切削水而維持乾的狀態下以切削刀來切削。但是,當藉由切削刀在該狀態下切削被加工物時,切削屑(污染)藉由切削刀之旋轉飛散至後方而向寬範圍擴散。因此,除在被加工物之上面附著切削屑而成為污染原因之外,有在裝置各部附著切削屑而使得維修作業變得困難。
本發明係鑒於如此之間題點而創作出,其目的在於提供可以在乾狀態下切削之時降低被加工物之污染,同時謀求維修作業之效率化的切削裝置。
當藉由本發明時,為一種切削裝置,具備:挾盤台,其係保持被加工物;切削刀,其係切削被保持於該挾盤台之被加工物;及刀具蓋,其係被配設成覆蓋該切削刀之外圍,在底部具有該切削刀之前端突出之開口,該刀具蓋具有切削屑回收手段,其被配設在隨著切削刀之旋轉在被加工物之切削產生之切削屑飛散之側,該切削削回收手段包含:筒體,其係一端側被連結於該刀具蓋之具有切削屑排出用開口部之側壁;和吸引源,其係被連接於該筒體之另一端側,邊藉由作動該吸引源,使隨著該切削刀之旋轉而連動轉動之切削屑,通過該筒體而從被加工物上排出,邊進行被加工物之乾切割。
若藉由該構成,當藉由切削刀對被加工物進
行乾切割時,被加工物上之切削屑被吸入刀具蓋之內側,切削屑隨著切削刀之旋轉而連動轉動。刀具蓋之內側的切削屑藉由吸引源之吸引力從刀具蓋之內側通過筒體而被排出。因在切削加工中,切削屑變得難以飛散,故切削屑朝向被加工物之上面或裝置各部之附著被抑制,可以降低被加工物之污染,同時謀求維修作業之效率化。
理想上,本發明之切削裝置在該刀具蓋之該底部,於該開口和該切削屑排出用開口部之間,朝向該切削屑排出用開口部之方向具備氣體流入口,於切削加工時,從該開口滲漏的切削屑與周圍之氣體,一起從該氣體流入口朝向該切削屑排出用開口部被吸引。
若藉由本發明時,藉由吸引源從刀具蓋之內側排出與切削刀連動轉動之切削屑,依此可以在乾狀態下切削之時降低被加工物之污染,同時謀求維修作業之效率化。
1‧‧‧切削裝置
21‧‧‧挾盤台
50‧‧‧切削手段
51‧‧‧切削刀
55‧‧‧刀具蓋
56‧‧‧切削屑回收手段
61‧‧‧刀具蓋之收容空間
62‧‧‧刀具蓋之開口
63‧‧‧切削屑排出用開口部
64‧‧‧刀具蓋之氣體流入口
66‧‧‧筒體
67‧‧‧吸引源
90‧‧‧切削屑
圖1為本實施型態之切削裝置之斜視圖。
圖2為本實施型態之刀具蓋之斜視圖。
圖3為本實施型態之刀具蓋之部分剖面圖。
圖4為表示比較例之刀具蓋之收容空間和切削刀之關
係的剖面圖。
圖5為說明本實施型態之切削裝置所引起之切削動作的剖面圖。
以下,參照附件圖面針對本發明之型態的切削裝置進行說明。圖1為本實施型態之切削裝置1之斜視圖。另外,切削裝置若為具備本實施型態之刀具蓋的構成即可,並不限定於圖1所示之構成。
如圖1所示般,切削裝置1被構成以切削刀51乾切割保持於挾盤台21之被加工物W,同時回收在切削加工時產生之切削屑。被加工物W之表面藉由格子狀之分割預定線L被區劃成複數區域。再者,被加工物W在經由切割膠帶T被支撐於環形框F之狀態下被搬入至切削裝置1。另外,被加工物W若為在不供給切削水之乾狀態下被切削加工之材料即可,即使將吸收例如水分之樹脂或燒結前之生陶磁成形板狀物當作被加工物W亦可。
在切削裝置1之殼體10之上面,形成在X軸方向延伸之矩形狀之開口,該開口藉由能夠與挾盤台21同時移動之移動板22及蛇腹狀之防水蓋23覆蓋。在防水蓋23之下方,設置有使挾盤台21在X軸方向移動之滾珠螺桿式之移動機構(無圖示)。再者,在挾盤台21之表面形成吸引保持被加工物W之保持面24,在挾盤台21之周圍設置有挾持被加工物W之周圍之環形框F之複數挾具部25。
挾盤台21在裝置中央之收授位置和面臨切削刀51之加工位置之間往復移動。圖1表示挾盤台21在收授位置待機的狀態。在殼體10,與該收授位置鄰接的一個角部下降一層,在下降之處,以能夠升降之方式設置載置台27。在載置台27載置收容被加工物W之卡匣C。藉由在載置卡匣C之狀態下載置台27升降,在高度方向,調整被加工物W之引出位置及推入位置。
在載置台27之後方,設置有與Y軸方向平行之一對定心導件31,和在一對定心導件31和卡匣C之間使被加工物W取出放入之推拉機構32。藉由一對定心導件31,引導推拉機構32所引起之被加工物W之取出放入,同時定位被加工物W之X軸方向。再者,藉由推拉機構32,加工前之被加工物W從卡匣C被拉出至一對定心導件31之外,加工完之被加工物W從一對定心導件31被推入至卡匣C。
在一對定心導件31之附近,設置有在定心導件31和挾盤台21之間,搬運被加工物W之第1搬運臂35。藉由第1搬運臂35之旋轉,以L字狀之臂部36之前端之搬運墊37,搬運被加工物W。再者,在收授位置之挾盤台21之後方,設置旋轉洗淨機構41。在旋轉洗淨機構41,朝向旋轉中之旋轉台42噴射洗淨水而洗淨被加工物W之後,以噴吹乾燥氣體取代洗淨水,乾燥被加工物W。
在殼體10上,設置支撐具備切削刀51之切削手段50的支撐台15。切削手段50係在被支撐台15支撐之主軸之前端安裝切削刀51而被構成。切削刀51例如以黏合劑
固定金剛石研磨粒而被成形圓板狀。再者,在切削手段50連結使切削刀51在Y軸方向及Z軸方向移動之移動機構(無圖示)。在切削手段50,設置有箱型之刀具蓋55,其係在使切削刀51之下端側突出之狀態下,覆蓋切削刀51之外周。
在支撐台15之側面16,設置有在挾盤台21和旋轉洗淨機構41之間,搬運被加工物W之第2搬運臂45。藉由第2搬運臂45之進退移動,以從支撐台15之側面16沿著斜前方之臂部46之前端的搬運墊47,搬運被加工物W。再者,在支撐台15,設置在挾盤台21之移動路徑之上方橫斷之懸臂支撐部19,在懸臂支撐部19支撐攝影被加工物W之攝影部48。攝影部48所引起之攝影畫像,被利用於切削手段50和挾盤台21之校準。再者,在支撐台15上,載置顯示加工條件等之螢幕49。
在如此之切削裝置1中,因被加工物W以厭水之材質所形成,故在不噴射切削水之乾狀態下,藉由切削刀51切削被加工物W。在此,一般在乾狀態進行切削之情況下,因邊噴射切削水邊進行切削之情況般,切削屑不被切削水沖洗,故隨著被加工物W之加工片數增加,切削屑容易充滿裝置內。因此,除了在裝置內漂移之切削屑附著於被加工物W之上面而成為污染原因之外,堆積於裝置各部而造成操作者之維修作業繁雜。
於是,在本實施型態之切削裝置1中,在刀具蓋55之內側,切削屑隨著切削刀51之旋轉而連動轉動,藉
由設置在刀具蓋55之切削屑回收手段56,從刀具蓋55回收切削屑。藉由切削屑回收手段56,從刀具蓋55排出切削屑,不會隨著被加工物W之加工片數之增加,而在裝置內充滿切削屑。依此,切削屑朝向被加工物W之上面或裝置各部的切削屑附著被抑制,能夠在乾狀態進行切削之時,降低被加工物之污染,同時謀求維修作業之效率化。
以下,參照圖2及圖3,針對本實施型態之刀具蓋進行說明。圖2為本實施型態之刀具蓋裝置之斜視圖。圖3為本實施型態之刀具蓋之部分剖面圖。
如圖2及圖3所示般,刀具蓋55被形成覆蓋切削刀51之外圍,在於被加工物W之切削時,切削屑隨著切削刀51之旋轉飛散之側(後側)具備切削屑回收手段56。在刀具蓋55之內側,形成切削刀51之收容空間61,在刀具蓋55之底部,形成有使切削刀51之前端突出之開口62。即是,刀具蓋55被形成除了切削刀51之下部外,全體性地覆蓋切削刀51之外周及兩側方。
在刀具蓋55之後側之側壁,形成朝向切削屑回收手段56排出進入收容空間61內之切削屑的切削屑排出用開口部63。並且,在刀具蓋55之底部,在開口62和切削屑排出用開口部63之間,形成朝向切削屑排出用開口部63之方向流入氣體的氣體流入口64(參照圖3B)。切削屑回收手段56在具有切削屑排出用開口部63之側壁連結筒體66之一端側,在筒體66之另一端側連接有旋風式之吸引源67。另外,吸引源67並不限於旋風式,若為通過筒體66而
能夠從刀具蓋55吸引切削屑之構成即可。
於切削加工時,切削刀51與吸引源67作動同時旋轉,藉由切削刀51之旋轉飛散之切削屑通過開口62而被引入至收容空間61。如上述般,因藉由刀具蓋55,切削刀51全體性地被覆蓋,故藉由切削刀51之旋轉,在收容空間61內產生氣流。切削屑被捲入至該氣流,隨著切削刀51之旋轉而連動轉動之切削屑,通過筒體66而被吸引至吸引源67。依此,邊從被加工物W上排出研削屑邊藉由切削刀51,乾切割被加工物W。
再者,因在刀具蓋55之底部,除了開口62,又形成氣體流入口64,故不被吸入開口62之切削屑被吸入至氣體流入口64。於切削加工時,從開口62滲漏之切削屑與周圍之氣體,一起從氣體流入口64被吸引,依此在開口62和氣體流入口64之兩處吸引切削屑而減少被切削屑之殘留。依此,即使藉由切削刀51,在乾狀態,切削被加工物W,切削屑亦不會朝向寬範圍飛散,可抑制被加工物W之上面或切削屑朝向裝置各部附著。
在此,參照圖4,一面與比較例做比較,一面針對本實施型態之刀具蓋之收容空間和切削刀之關係進行說明。圖4為表示比較例之刀具蓋之收容空間和切削刀之關係的圖示。另外,圖4A表示比較例1之刀具蓋,圖4B表示比較例2之刀具蓋。
如圖4A所示般,比較例1之刀具蓋71係沿著切削刀72之外徑形狀而形成收容空間73,刀具蓋71之內面和
切削刀72之外面的間隙變窄。雖然在刀具蓋71之收容空間73內,藉由切削刀72之旋轉,產生氣流,但是由於收容空間73相對於切削刀72過窄,故切削屑90難以從刀具蓋71之底部之開口74進入至收容空間73。因此,於被加工物W之切削加工時產生之切削屑90難以進入刀具蓋71,通過刀具蓋71之下方飛散至後方。
如圖4B所示般,比較例2之刀具蓋81相對於切削刀82之外徑形狀,寬廣地形成收容空間83,刀具蓋81之內面和切削刀82之外面的間隙變寬。因相對於切削刀82,收容空間83太寬,故在刀具蓋81之收容空間83內,不會藉由切削刀82之旋轉產生氣流,切削屑90不會被捲入氣流,因此切削屑90難以進入刀具蓋81。因此,於被加工物W之切削加工時產生之切削屑90難以進入刀具蓋81,通過刀具蓋71之下方飛散至後方。
在圖4A所示之比較例1之刀具蓋71中,切削屑90難以進入至收容空間73,在圖4B所示之比較例2之刀具蓋81中,切削屑90難以從收容空間83被吸引。本案發明者們係一面變更刀具蓋和切削刀之尺寸,一面確認切削屑之吸引狀態,發現由於切削屑隨著切削刀51之旋轉而連動轉動,使得切削屑90良好地被吸引。於是,在本實施型態中,調整刀具蓋55之內面和切削刀51之外面之間隙,以使切削屑90隨著切削刀51之旋轉而連動轉動(參照圖5B)。
如此一來,乾切割用之刀具蓋55是與具備噴嘴之一般的刀具蓋不同,刀具蓋55之內面和切削刀51之外
面的間隙變得重要。另外,因一般之刀具蓋在切削刀之側方定位噴射切削水之噴嘴,故切削刀之側方露出於外部。因此,在一般之刀具蓋中,無法藉由切削刀之旋轉產生氣流,無法如本實施之刀具蓋55般隨著切削刀51之旋轉使切削屑連動轉動。
接著,參照圖5,針對本實施之切削動作進行說明。圖5為本實施型態之切削裝置所引起之切削動作的說明圖。另外,以下所示之切削動作表示一例,能夠適當變更。
如圖5A所示般,當挾盤台21吸引保持被加工物W時,挾盤台21接近切削刀51。此時,切削刀51高速旋轉,同時吸引源67作動而刀具蓋55內被調整成負壓。在被加工物W之徑向外側,切削刀51被定位在分割預定線L(參照圖1),切削刀51被降至能夠切入被加工物W之深度。相對於該切削刀51,挾盤台21在X軸方向切削進給,依此被加工物W藉由切削刀51沿著分割預定線L被切入。
如圖5B所示般,被加工物W藉由高速旋轉之切削刀51被切入時,切削屑90從被加工物W和切削刀51之加工點產生。此時,藉由切削刀51之旋轉,在刀具蓋55之收容空間61,產生氣流,切削屑90從刀具蓋55之開口62進入至收容空間61內,以使被捲入沿著切削刀51之旋轉方向之氣流。收容空間61內之切削屑90與切削刀51連動轉動,連動轉動之切削屑90從收容空間61通過筒體66而被吸入至吸引源67。
再者,在刀具蓋55,於較開口62後側形成氣體流入口64,在刀具蓋55之開口62殘留之切削屑90與周圍之氣體同時通過氣體流入口64而被吸引至吸引源67。如此一來,切削屑90藉由刀具蓋55從被加工物W上被排出,並且被加工物W藉由切削刀51被乾切割。因在切削加工中,切削屑難飛散,故即使藉由切削刀51對被加工物W重複實施切削,裝置內亦不會充滿切削屑,抑制切削屑90附著於被加工物W或裝置各部。
如上述般,本實施型態之切削裝置1係當藉由切削刀51對被加工物W進行乾切割時,被加工物W上之切削屑90被吸入刀具蓋55之內側,隨著切削刀51之旋轉,切削屑90連動轉動。刀具蓋55之內側的切削屑90藉由吸引源67之吸引力從刀具蓋55之內側通過筒體66而被排出。依此,因在切削加工中,切削屑90變得難以飛散,故切削屑朝向被加工物W之上面或裝置各部之附著被抑制,可以降低被加工物W之污染,同時謀求維修作業之效率化。
另外,本發明並不限定於上述實施型態,能夠做各種變更而實施。在上述實施型態中,針對在附件圖面表示的大小或形狀並不限定於此,能夠在發揮本發明之效果的範圍內適當變更。其他,只要不脫離本發明之目的之範圍,能夠適當變更而加以實施。
例如,在上述實施型態中,雖然構成在刀具蓋55形成略圓板狀之收容空間61,但是並不限定於該構成。刀具蓋55若形成覆蓋除了切削刀51之下部之外的外
圍,切削屑90能夠隨著切削刀51之旋轉而連動轉動時,即使構成任何亦可。
再者,在上述實施型態中,雖然構成在刀具蓋55形成取入在開口62殘留之切削屑90之氣體流入口64,但是並不限定於該構成。即使在刀具蓋55不形成氣體流入口64亦可。
再者,在上述實施型態中,雖然被連結於刀具蓋55之筒體66之角度並不特別限定,但是以相對於挾盤台21之保持面24,形成在傾斜方向,以使沿著切削屑90之捲起方向為佳。
再者,在上述實施型態中,雖然構成藉由旋風式之吸引源67吸引切削屑90,但是並不限定於該構成。即使使用通常之吸引泵或噴射器作為吸引源亦可。
如上述說明般,本發明具有不使切削屑附著於裝置及被加工物,可以切削被加工物這樣的效果,尤其,有利於切削生陶磁等之被加工物之切削裝置。
21‧‧‧挾盤台
51‧‧‧切削刀
55‧‧‧刀具蓋
56‧‧‧切削屑回收手段
61‧‧‧刀具蓋之收容空間
62‧‧‧刀具蓋之開口
64‧‧‧刀具蓋之氣體流入口
66‧‧‧筒體
67‧‧‧吸引源
90‧‧‧切削屑
W‧‧‧被加工物
Claims (2)
- 一種切削裝置,具備:挾盤載置台,其係保持被加工物;切削刀,其係切削被保持於該挾盤台之被加工物;及刀具蓋,其係被配設成覆蓋該切削刀之外圍,在底部具有該切削刀之前端突出之開口,該刀具蓋具有切削屑回收手段,其被配設在隨著切削刀之旋轉在被加工物之切削產生之切削屑飛散之側,該切削屑回收手段包含:筒體,其係一端側被連結於該刀具蓋之具有切削屑排出用開口部的側壁;和吸引源,其係被連接於該筒體之另一端側,邊藉由作動該吸引源,使隨著該切削刀之旋轉而連動轉動之切削屑,通過該筒體而從被加工物上排出,邊進行被加工物之乾切割。
- 如請求項1所載之切削裝置,其中在該刀具蓋之該底部,於該開口和該切削屑排出用開口部之間,朝向該切削屑排出用開口部之方向具備氣體流入口,於切削加工時,從該開口滲漏之切削屑與周圍之氣體,同時從該氣體流入口朝向切削屑排出用開口部被吸引。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016108243A JP2017213628A (ja) | 2016-05-31 | 2016-05-31 | 切削装置 |
JP2016-108243 | 2016-05-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201805108A true TW201805108A (zh) | 2018-02-16 |
Family
ID=60269493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106112634A TW201805108A (zh) | 2016-05-31 | 2017-04-14 | 切削裝置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20170341254A1 (zh) |
JP (1) | JP2017213628A (zh) |
KR (1) | KR20170135686A (zh) |
CN (1) | CN107452606A (zh) |
DE (1) | DE102017209189A1 (zh) |
TW (1) | TW201805108A (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020110855A (ja) * | 2019-01-09 | 2020-07-27 | 株式会社ディスコ | 被加工物の加工方法 |
JP2022184119A (ja) * | 2021-05-31 | 2022-12-13 | 株式会社ディスコ | シート貼着装置 |
JP2023022523A (ja) * | 2021-08-03 | 2023-02-15 | 株式会社ディスコ | 切削装置 |
CN116551065B (zh) * | 2023-03-13 | 2024-02-06 | 东莞市赛仑特实业有限公司 | 一种微型齿轮加工装置 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4022182A (en) * | 1976-01-12 | 1977-05-10 | Lenkevich Steve T | Dust and water confinement unit for portable circular saw |
US4063478A (en) * | 1976-10-20 | 1977-12-20 | Diebold Incorporated | Saw enclosure construction |
DE2744463C2 (de) * | 1977-10-03 | 1987-01-29 | Hilti Ag, Schaan | Saugvorsatz, insbesondere zum Einsatz mit Bohrgeräten |
GB2037655B (en) * | 1978-12-13 | 1982-10-06 | Rogers W H | Tooling jig |
US4619081A (en) * | 1985-02-28 | 1986-10-28 | General Signal Corporation | Combined nozzle with air foil |
US4779327A (en) * | 1987-09-08 | 1988-10-25 | Vander Maas Laddie J | Drill press supported platform for pin router |
GB9225441D0 (en) * | 1992-12-04 | 1993-01-27 | Black & Decker Inc | A saw |
US5327649A (en) * | 1993-02-11 | 1994-07-12 | Skinner Christopher L | Circular saw with dust collector |
GB9408403D0 (en) * | 1994-04-28 | 1994-06-22 | Hodgson Philip | Dust extractor |
US5987698A (en) * | 1997-02-07 | 1999-11-23 | Mdi Labs, Inc. | Apparatus for use in cutting operations |
KR100225909B1 (ko) * | 1997-05-29 | 1999-10-15 | 윤종용 | 웨이퍼 소잉 장치 |
US6615698B2 (en) * | 2001-05-30 | 2003-09-09 | Custom Craft Co. | Dual-end blinds trimming machine |
JP4700225B2 (ja) * | 2001-06-01 | 2011-06-15 | 株式会社ディスコ | 半導体ウエーハの切削方法 |
US20070096359A1 (en) * | 2003-07-08 | 2007-05-03 | Torfs Jan C | Method for surface marking a molded article |
US7328512B2 (en) * | 2004-09-14 | 2008-02-12 | Martin Charles B | Self-contained vacuum saw |
US7044843B1 (en) * | 2005-05-09 | 2006-05-16 | Kun Yi Lin | Sander device having vacuuming structure |
US20070096539A1 (en) * | 2005-11-01 | 2007-05-03 | Atlantic Concrete Cutting Inc. | Apparatus and method for cutting asphalt, concrete and other materials |
DE102006028203B4 (de) * | 2006-06-20 | 2009-04-09 | Leitz Gmbh & Co. Kg | Werkzeugmaschine mit einer Absaughaube |
US8061344B2 (en) * | 2006-09-11 | 2011-11-22 | Teraspan Networks Inc. | Slab saw with dust collector and method of dry-cutting pavement |
US8449356B1 (en) * | 2007-11-14 | 2013-05-28 | Utac Thai Limited | High pressure cooling nozzle for semiconductor package |
US8393939B2 (en) * | 2009-03-31 | 2013-03-12 | Saint-Gobain Abrasives, Inc. | Dust collection for an abrasive tool |
JP5563928B2 (ja) * | 2010-08-25 | 2014-07-30 | リコーマイクロエレクトロニクス株式会社 | 切断方法及び切断装置 |
US7971611B1 (en) * | 2010-10-18 | 2011-07-05 | Wells William W | Combination dust extractor and support plate for table mounted routers |
US8650997B1 (en) * | 2011-12-30 | 2014-02-18 | John Simon | Machine for cutting of masonry, wood and other materials |
US9452502B1 (en) * | 2013-06-26 | 2016-09-27 | The Boeing Company | Method and apparatus for reworking apertures in a workpiece with chip collection |
JP6255238B2 (ja) * | 2013-12-27 | 2017-12-27 | 株式会社ディスコ | 切削装置 |
JP6257360B2 (ja) | 2014-02-04 | 2018-01-10 | 株式会社ディスコ | ブレードカバー装置 |
JP6312554B2 (ja) * | 2014-08-13 | 2018-04-18 | 株式会社ディスコ | パッケージ基板の加工方法 |
JP6587911B2 (ja) * | 2015-11-16 | 2019-10-09 | 株式会社ディスコ | ウエーハの分割方法 |
-
2016
- 2016-05-31 JP JP2016108243A patent/JP2017213628A/ja active Pending
-
2017
- 2017-04-14 TW TW106112634A patent/TW201805108A/zh unknown
- 2017-05-17 KR KR1020170060958A patent/KR20170135686A/ko not_active Application Discontinuation
- 2017-05-22 CN CN201710363608.4A patent/CN107452606A/zh active Pending
- 2017-05-24 US US15/603,644 patent/US20170341254A1/en not_active Abandoned
- 2017-05-31 DE DE102017209189.4A patent/DE102017209189A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US20170341254A1 (en) | 2017-11-30 |
CN107452606A (zh) | 2017-12-08 |
DE102017209189A1 (de) | 2017-11-30 |
JP2017213628A (ja) | 2017-12-07 |
KR20170135686A (ko) | 2017-12-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6101140B2 (ja) | 切削装置 | |
TW201805108A (zh) | 切削裝置 | |
JP5669461B2 (ja) | スピンナ洗浄装置 | |
TWI660823B (zh) | Cutting device | |
JP2012223855A (ja) | 加工装置 | |
JP2011108979A (ja) | 被加工物の切削方法 | |
TWI830833B (zh) | 切削裝置 | |
JP7071783B2 (ja) | 切削装置 | |
JP6973931B2 (ja) | 切削装置 | |
JP6847525B2 (ja) | 切削装置 | |
JP2014079833A (ja) | 切削装置 | |
JP5984565B2 (ja) | 加工装置の排気ダクトアセンブリ | |
JP2020032477A (ja) | 処理装置 | |
JP7282458B2 (ja) | 保持テーブル及び加工装置 | |
JP5839887B2 (ja) | 加工装置 | |
JP2012151270A (ja) | スピンナー洗浄装置 | |
JP5800666B2 (ja) | 加工装置 | |
CN106997864B (zh) | 卡盘工作台 | |
JP6987450B2 (ja) | 切削装置 | |
JP2014034068A (ja) | 加工装置 | |
JP5968185B2 (ja) | 加工装置 | |
TW202412084A (zh) | 修整工具之固定方法及修整工具 | |
JP2022029691A (ja) | 洗浄機構および加工装置 | |
TW202117826A (zh) | 切割裝置 | |
JP2023077113A (ja) | 切削ブレードのドレッシング方法 |