JP6312554B2 - パッケージ基板の加工方法 - Google Patents
パッケージ基板の加工方法 Download PDFInfo
- Publication number
- JP6312554B2 JP6312554B2 JP2014164716A JP2014164716A JP6312554B2 JP 6312554 B2 JP6312554 B2 JP 6312554B2 JP 2014164716 A JP2014164716 A JP 2014164716A JP 2014164716 A JP2014164716 A JP 2014164716A JP 6312554 B2 JP6312554 B2 JP 6312554B2
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- Prior art keywords
- package substrate
- suction
- water
- chuck table
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims description 152
- 238000003672 processing method Methods 0.000 title claims description 16
- 238000005520 cutting process Methods 0.000 claims description 100
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 99
- 238000000034 method Methods 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 21
- 238000011084 recovery Methods 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 3
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000005429 filling process Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000007664 blowing Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000008400 supply water Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Led Device Packages (AREA)
Description
12 チャックテーブル
23 吸引源
41 吸引面
42 凹部
44 進入溝
45、46 吸引孔
71 切削ブレード
74 切削水ノズル(水供給手段)
81 分割予定ライン
82 凸部
83 金属板
89 バリ
A1 デバイス領域
A2 余剰領域
W パッケージ基板
Claims (3)
- 表面に凸部を有し該凸部が分割予定ラインによって区画されるパッケージ基板を加工装置の切削ブレードで該分割予定ラインに沿って切削してチップを生成するパッケージ基板の加工方法であって、
該加工装置は、該パッケージ基板を吸引保持する吸引面を有するチャックテーブルと、少なくとも該パッケージ基板の上面に水を供給して覆う水供給手段と、を備えていて、
該チャックテーブルは、該吸引面に該凸部を収容する凹部と、該分割予定ラインに対応して該切削ブレードが進入する進入溝と、該進入溝で区画された領域でチップを吸引保持可能にする複数の吸引孔と、を備えていて、
該チャックテーブルの該吸引面に該水供給手段で該水を供給させ、該パッケージ基板の表面と該吸引面との間に該水を満たした後に該吸引孔を該吸引源に連通させ該水を吸引させ該水を吸引すると共に該凹部に該凸部を収容させ該吸引面で該パッケージ基板の表面を吸引保持する保持工程と、
該保持工程で吸引保持した該パッケージ基板の裏面から該切削ブレードを切込ませ該分割予定ラインに沿って切削送りして切削し該チップに分割する分割工程と、
該分割工程で分割された該チップに該水供給手段で該水を供給し、少なくとも隣接する該チップの間を該水で満たす水充填工程と、
該水充填工程で少なくとも隣接する該チップの間を該水で満たした状態で、該チャックテーブルの吸引を噴射に切換え該吸引面から流体を噴射させ該チップを該吸引面から離間させて該チップを回収するチップ回収工程と、
からなるパッケージ基板の加工方法。 - 該パッケージ基板は、該凸部を囲繞して形成される余剰領域を備え、
該チャックテーブルの該吸引孔は、該余剰領域の吸引を可能に配設していて、
該保持工程と該水充填工程との間で、
該凸部と該余剰領域との境を該切削ブレードで切削し、該凸部を該凹部で吸引保持させ該余剰領域を該チャックテーブルから離間させる余剰領域除去工程を実施して構成される請求項1記載のパッケージ基板の加工方法。 - 該パッケージ基板は、裏面側に金属板が配設されており、
該保持工程は、該パッケージ基板の裏面側から該切削ブレードで切り込まれるように、該パッケージ基板の表面を吸引保持する請求項1又は請求項2記載のパッケージ基板の加工方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014164716A JP6312554B2 (ja) | 2014-08-13 | 2014-08-13 | パッケージ基板の加工方法 |
TW104120322A TWI647865B (zh) | 2014-08-13 | 2015-06-24 | Processing method of package substrate |
KR1020150106354A KR102204848B1 (ko) | 2014-08-13 | 2015-07-28 | 패키지 기판의 가공 방법 |
CN201510486460.4A CN105374710B (zh) | 2014-08-13 | 2015-08-10 | 封装基板的加工方法 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2014164716A JP6312554B2 (ja) | 2014-08-13 | 2014-08-13 | パッケージ基板の加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016040808A JP2016040808A (ja) | 2016-03-24 |
JP6312554B2 true JP6312554B2 (ja) | 2018-04-18 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014164716A Active JP6312554B2 (ja) | 2014-08-13 | 2014-08-13 | パッケージ基板の加工方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6312554B2 (ja) |
KR (1) | KR102204848B1 (ja) |
CN (1) | CN105374710B (ja) |
TW (1) | TWI647865B (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112091811B (zh) * | 2016-03-31 | 2022-09-06 | Hoya株式会社 | 载体及使用该载体的基板的制造方法 |
JP2017213628A (ja) * | 2016-05-31 | 2017-12-07 | 株式会社ディスコ | 切削装置 |
CN106670940A (zh) * | 2016-12-12 | 2017-05-17 | 江门市楚材科技有限公司 | 一种工件及抛光设备双重定位的抛光加工生产线 |
KR101931306B1 (ko) * | 2016-12-20 | 2019-03-13 | (주) 엔지온 | 판재 절단 장치 및 방법 |
JP6920063B2 (ja) * | 2017-01-11 | 2021-08-18 | 株式会社ディスコ | 板状ワークの保持方法 |
JP6896326B2 (ja) * | 2017-03-06 | 2021-06-30 | 株式会社ディスコ | 加工装置 |
JP6785735B2 (ja) * | 2017-09-07 | 2020-11-18 | Towa株式会社 | 切断装置及び半導体パッケージの搬送方法 |
CN111418051B (zh) * | 2017-11-10 | 2024-01-12 | 应用材料公司 | 用于双面处理的图案化夹盘 |
JP7102157B2 (ja) * | 2018-02-08 | 2022-07-19 | Towa株式会社 | 切断装置及び切断品の製造方法 |
CN111742402A (zh) * | 2018-02-20 | 2020-10-02 | 应用材料公司 | 用于双面处理的图案化真空吸盘 |
JP7328507B2 (ja) * | 2019-04-25 | 2023-08-17 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5803797A (en) * | 1996-11-26 | 1998-09-08 | Micron Technology, Inc. | Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck |
SG132495A1 (en) * | 1998-03-13 | 2007-06-28 | Towa Corp | Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
JP5436917B2 (ja) * | 2009-04-23 | 2014-03-05 | 株式会社ディスコ | レーザー加工装置 |
JP5511325B2 (ja) * | 2009-11-18 | 2014-06-04 | 株式会社ディスコ | 切削装置 |
JP5468886B2 (ja) * | 2009-12-02 | 2014-04-09 | アピックヤマダ株式会社 | 切断装置及び切断方法 |
JP5613585B2 (ja) | 2011-02-17 | 2014-10-29 | 株式会社ディスコ | 発光素子パッケージ基板の分割方法及び支持ジグ |
JP2013175511A (ja) | 2012-02-23 | 2013-09-05 | Nhk Spring Co Ltd | 鉄ベース回路基板 |
JP5952059B2 (ja) * | 2012-04-04 | 2016-07-13 | 東京エレクトロン株式会社 | 基板処理装置および基板保持方法 |
JP5975703B2 (ja) * | 2012-04-09 | 2016-08-23 | 株式会社ディスコ | 切削装置 |
JP2014103354A (ja) | 2012-11-22 | 2014-06-05 | Denki Kagaku Kogyo Kk | 回路基板、ledモジュール、及び回路基板の製造方法 |
-
2014
- 2014-08-13 JP JP2014164716A patent/JP6312554B2/ja active Active
-
2015
- 2015-06-24 TW TW104120322A patent/TWI647865B/zh active
- 2015-07-28 KR KR1020150106354A patent/KR102204848B1/ko active IP Right Grant
- 2015-08-10 CN CN201510486460.4A patent/CN105374710B/zh active Active
Also Published As
Publication number | Publication date |
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TW201607082A (zh) | 2016-02-16 |
KR20160020352A (ko) | 2016-02-23 |
JP2016040808A (ja) | 2016-03-24 |
CN105374710A (zh) | 2016-03-02 |
TWI647865B (zh) | 2019-01-11 |
CN105374710B (zh) | 2019-09-06 |
KR102204848B1 (ko) | 2021-01-18 |
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