TW201724648A - 電子封裝件 - Google Patents
電子封裝件 Download PDFInfo
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- TW201724648A TW201724648A TW104143100A TW104143100A TW201724648A TW 201724648 A TW201724648 A TW 201724648A TW 104143100 A TW104143100 A TW 104143100A TW 104143100 A TW104143100 A TW 104143100A TW 201724648 A TW201724648 A TW 201724648A
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- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000005192 partition Methods 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 7
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims 1
- 230000005670 electromagnetic radiation Effects 0.000 abstract description 11
- 230000037361 pathway Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 32
- 238000004891 communication Methods 0.000 description 10
- 238000002955 isolation Methods 0.000 description 10
- 239000008393 encapsulating agent Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H01Q1/12—Supports; Mounting means
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- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
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- H05K1/0213—Electrical arrangements not otherwise provided for
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- H01L2223/66—High-frequency adaptations
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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Abstract
一種電子封裝件,係包括:基板、以及設於該基板上之天線板結構,且該天線板結構具有第一天線部、第二天線部、及位於該第一天線部與該第二天線部之間的隔離部,以令導通電流會分成兩條路徑流通,使電流電磁輻射發散而出,以形成高頻寬。
Description
本發明係有關一種電子封裝件,尤指一種具天線結構之電子封裝件。
隨著電子產業的蓬勃發展,電子產品也逐漸邁向多功能、高性能的趨勢。目前無線通訊技術已廣泛應用於各式各樣的消費性電子產品以利接收或發送各種無線訊號。為了滿足消費性電子產品的外觀設計需求,無線通訊模組之製造與設計係朝輕、薄、短、小之需求作開發,其中,平面天線(Patch Antenna)因具有體積小、重量輕與製造容易等特性而廣泛利用在手機(cell phone)、個人數位助理(Personal Digital Assistant,簡稱PDA)等電子產品之無線通訊模組中。
第1圖係習知無線通訊模組之立體示意圖。如第1圖所示,該無線通訊模組1係包括:一基板10、一電子元件11、封裝膠體12以及一天線結構13。該電子元件11係設於該基板10上且電性連接該基板10。該封裝膠體12覆蓋該電子元件11。該天線結構13係設於該封裝膠體12上,且該天線結構13具有一架設於該封裝膠體12上之支撐架
130、一自該支撐架130向上延伸之延伸部133、及一連接該延伸部133之天線部131。
惟,習知無線通訊模組1中,該天線部131係為完整矩形板,如第1’圖所示,故該天線部131之電磁輻射特性將以低頻寬(2.4GHz至5.8GHz)運作,而無法以高頻寬運作。
再者,因電磁輻射分散發出會影響其它電子元件運作,故常使該無線通訊模組1運作不易。
因此,如何克服上述習知技術之種種問題,實已成目前亟欲解決的課題。
鑑於上述習知技術之種種缺失,本發明係揭露一種電子封裝件,係包括:基板;以及天線板結構,係設於該基板上且具有第一天線部、第二天線部、及位於該第一天線部與該第二天線部之間的隔離部。
前述之電子封裝件中,該隔離部係為孔洞構造。
前述之電子封裝件中,該隔離部之材質不同於該第一與第二天線部之材質。
前述之電子封裝件中,該隔離部係環繞該第一天線部。
前述之電子封裝件中,該第二天線部係環繞該第一天線部。
前述之電子封裝件中,復包括環繞該天線板結構之屏蔽結構。例如,該屏蔽結構係為柱狀或牆狀。
前述之電子封裝件中,復包括電子元件,係結合該基板。
前述之電子封裝件中,復包括封裝層,係形成於該基板上。例如,該天線板結構係接觸地設於該封裝層上;於一實施例中,復包括屏蔽結構,係嵌埋於該封裝層中並環繞該天線板結構。例如,該屏蔽結構係為柱狀或牆狀。
由上可知,本發明之電子封裝件中,係藉由該第一天線部與該第二天線部之設計,以令導通電流會分成兩條路徑流通,使電流電磁輻射發散而出,以形成高頻寬。
再者,本發明之電子封裝件藉由該屏蔽結構作為電磁輻射隔離,以避免電磁輻射分散發出而影響其它電子元件運作之問題。
1‧‧‧無線通訊模組
10,20‧‧‧基板
11,21‧‧‧電子元件
12‧‧‧封裝膠體
13‧‧‧天線結構
130‧‧‧支撐架
131‧‧‧天線部
133,233,233’,234‧‧‧延伸部
2,3,4,5‧‧‧電子封裝件
20a‧‧‧第一表面
20b‧‧‧第二表面
200‧‧‧線路層
21a‧‧‧作用面
21b‧‧‧非作用面
210‧‧‧電極墊
22‧‧‧封裝層
22a‧‧‧側面
23,53‧‧‧天線板結構
230,530‧‧‧隔離部
231‧‧‧第一天線部
232‧‧‧第二天線部
32‧‧‧導電穿孔
34,34’,44,54‧‧‧屏蔽結構
55‧‧‧絕緣保護層
第1圖係為習知無線通訊模組之剖面示意圖;第1’圖係為第1圖之局部上視圖;第2圖係為本發明之電子封裝件之第一實施例的立體示意圖;第3A圖係為本發明之電子封裝件之第二實施例的剖面示意圖;第3B圖係為第3A圖的局部上視圖;第3C圖係為第3B圖之立體示意圖;第3C’圖係為第3C圖之另一實施例;第4圖係為第2圖之另一實施例的立體示意圖;第5圖係為本發明之電子封裝件之第三實施例的局部
上視示意圖;以及第5’圖係為第5圖之另一實施例的剖面示意圖。
以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如“上”、“第一”、“第二”、及“一”等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。
第2圖係為本發明之電子封裝件2之第一實施例之立體示意圖。
如第2圖所示,所述之電子封裝件2係為系統級封裝(System in package,簡稱SiP)之無線通訊模組,且該電子封裝件2係包括:一基板20、至少一電子元件21、一封裝層22以及一天線板結構23。
所述之基板20係為線路板或陶瓷板,且具有相對之第
一表面20a與第二表面20b,並於該基板20中設有複數線路層(圖略)。
所述之電子元件21係設於該基板20之第一表面20a上並電性連接該基板20之線路層。
於本實施例中,該電子元件21係為主動元件、被動元件、或其二者之組合。具體地,該主動元件係例如半導體晶片,該被動元件係例如電阻、電容及電感。
所述之封裝層22係形成於該基板20之第一表面20a上,以包覆該電子元件21。
於本實施例中,該電子元件21未露出該封裝層22,且形成該封裝層22之材質係為聚醯亞胺(polyimide,簡稱PI)、乾膜(dry film)、環氧樹脂(expoxy)或封裝膠體(molding compound)。
所述之天線板結構23係接觸地設於該基板20之第一表面20a上,且具有一第一天線部231、一第二天線部232、及位於該第一與第二天線部231,232之間的一隔離部230。
於本實施例中,該天線板結構23係為矩形金屬板,且該隔離部230係為孔洞構造(如溝槽)。
再者,該第二天線部232(或該隔離部230)係環繞該第一天線部231,例如,該第一天線部231呈矩形片狀,且該第二天線部232呈環狀,並令該第一與該第二天線部231,232相交於一側。於製作時,係於一金屬板上沿其三側邊形成一溝槽(即該隔離部230),以形成該第一與第二天線部231,232。
又,該天線板結構23具有一連接該電子元件21的延伸部233。例如,該延伸部233之一端係連接於該第一與該第二天線部231,232之相交側,而另一端連接至該電子元件21。
另外,該封裝層22未覆蓋該隔離部230、第一天線部231與第二天線部232,而僅覆蓋部分該延伸部233。
本發明之電子封裝件2藉由該第一天線部231與該第二天線部232之設計,以令導通電流會分成兩條路徑流通,使電流電磁輻射發散而出,以形成高頻寬。
第3A至3C圖係為本發明之電子封裝件3之第二實施例之示意圖。本實施例與第一實施例之差異在於新增屏蔽結構,其它結構大致相同,故以下不再贅述相同處。
如第3A圖所示,所述之電子封裝件3係包括:一基板20、一電子元件21、一封裝層22、一天線板結構23以及一屏蔽結構34。
所述之基板20係具有複數線路層200,其外露於該第一表面20a與第二表面20b。
所述之電子元件21係設於該基板20之第一表面20a上並電性連接該線路層200。
於本實施例中,該電子元件21係具有相對之作用面21a與非作用面21b,且該作用面21a具有複數電極墊210,以令該作用面21a結合至該基板20之第一表面20a上,使各該電極墊210電性連接該線路層200。
所述之封裝層22係形成於該基板20之第一表面20a
上,以包覆該電子元件21。
於本實施例中,該電子元件21之非作用面21b外露於該封裝層22,且於該封裝層22中形成有電性連接該線路層200之導電穿孔32以結合如銲球之導電元件(圖略),俾供堆疊其它如封裝件、基板或電路板之電子裝置(圖略)。
所述之天線板結構23係接觸地設於該封裝層22上,且具有外露該封裝層22表面之隔離部230(如第3B圖所示)。
於本實施例中,該天線板結構23之延伸部233’係具有另一段向下延伸之延伸部234,其經過該封裝層22而連接至該基板20(或線路層200),故該延伸部233’,234未連接至該電子元件21。例如,該延伸部234可位於該封裝層22中;或者該延伸部234可沿該封裝層22之外側表面22a延伸至該基板20。
所述之屏蔽結構34係環繞該天線板結構23,如第3B圖所示。
於本實施例中,該屏蔽結構34係由複數導電柱所組成,如第3C圖所示之實心柱體,其嵌埋於該封裝層22中,且該些導電柱之端面外露於該封裝層22。
再者,該屏蔽結構34’亦可為嵌埋於該封裝層22中之導電牆,如第3C’圖所示,且該些導電牆之頂面外露於該封裝層22。
又,於其它實施例中,例如,以第一實施例為例,該
電子封裝件4亦可形成屏蔽結構44,如第4圖所示,使該導電柱(或該導電牆)嵌埋於該基板20中,且該屏蔽結構44之表面外露於該基板20之第一表面20a。
本發明之電子封裝件3,4藉由該屏蔽結構34,34’,44環繞該天線板結構23之設計,以形成電磁輻射隔離(electromagnetic shield),故能避免電磁輻射分散發出而影響其它電子元件運作之問題。
第5及5’圖係為本發明之電子封裝件之第三實施例之示意圖。本實施例與第二實施例之差異在於天線板結構之改變,其它結構大致相同,故以下不再贅述相同處。
如第5圖所示之天線板結構53,該隔離部530之材質不同於該第一與第二天線部231,232之材質。例如,該第一與第二天線部231,232係為金屬體,且該隔離部530係為絕緣體。
或者,如第5’圖所示,該電子封裝件5復包括一絕緣保護層55,係設於該封裝層22上以覆蓋該電子元件21之非作用面21b、該天線板結構53與該屏蔽結構54。
於本實施例中,該屏蔽結構54係為空心柱體,即通孔(via)。
再者,該絕緣保護層55係填入該天線板結構53之孔洞(原隔離部230)以作為隔離部530。
綜上所述,本發明之電子封裝件中,主要藉由該第一天線部與該第二天線部之設計,以令導通電流會分成兩條路徑流通,使電流電磁輻射發散而出,以形成高頻寬。
再者,本發明之電子封裝件藉由該屏蔽結構作為電磁輻射隔離,以避免電磁輻射分散發出而影響其它電子元件運作之問題。
上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。
2‧‧‧電子封裝件
20‧‧‧基板
20a‧‧‧第一表面
20b‧‧‧第二表面
21‧‧‧電子元件
22‧‧‧封裝層
23‧‧‧天線板結構
230‧‧‧隔離部
231‧‧‧第一天線部
232‧‧‧第二天線部
233‧‧‧延伸部
Claims (12)
- 一種電子封裝件,係包括:基板;以及天線板結構,係設於該基板上且具有第一天線部、第二天線部、及位於該第一天線部與該第二天線部之間的隔離部。
- 如申請專利範圍第1項所述之電子封裝件,其中,該隔離部係為孔洞構造。
- 如申請專利範圍第1項所述之電子封裝件,其中,該隔離部之材質不同於該第一與第二天線部之材質。
- 如申請專利範圍第1項所述之電子封裝件,其中,該隔離部係環設於該第一天線部外圍。
- 如申請專利範圍第1項所述之電子封裝件,其中,該第二天線部係環設於該第一天線部外圍。
- 如申請專利範圍第1項所述之電子封裝件,復包括環設於該天線板結構周圍之屏蔽結構。
- 如申請專利範圍第6項所述之電子封裝件,其中,該屏蔽結構係為柱狀或牆狀。
- 如申請專利範圍第1項所述之電子封裝件,復包括設於該基板上之電子元件。
- 如申請專利範圍第1項所述之電子封裝件,復包括形成於該基板上之封裝層。
- 如申請專利範圍第9項所述之電子封裝件,其中,該天線板結構係接觸地設於該封裝層上。
- 如申請專利範圍第9項所述之電子封裝件,復包括屏蔽結構,係嵌埋於該封裝層中並環設於該天線板結構周圍。
- 如申請專利範圍第11項所述之電子封裝件,其中,該屏蔽結構係為柱狀或牆狀。
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DE102017200126A1 (de) * | 2017-01-05 | 2018-07-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung |
DE102017200127A1 (de) | 2017-01-05 | 2018-07-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Modulanordnung mit eingebetteten Komponenten und einer integrierten Antenne, Vorrichtung mit Modulanordnungen und Verfahren zur Herstellung |
KR102266626B1 (ko) * | 2017-07-17 | 2021-06-17 | 엘에스엠트론 주식회사 | 내장형 안테나를 갖는 무선통신칩, 무선통신칩용 내장형 안테나, 및 내장형 안테나를 갖는 무선통신칩의 제조 방법 |
US11245175B2 (en) | 2017-09-30 | 2022-02-08 | Qualcomm Incorporated | Antenna module configurations |
TWI668831B (zh) * | 2018-04-17 | 2019-08-11 | 矽品精密工業股份有限公司 | 電子裝置與電子封裝件 |
US11081453B2 (en) | 2018-07-03 | 2021-08-03 | Mediatek Inc. | Semiconductor package structure with antenna |
US10896880B2 (en) | 2018-11-28 | 2021-01-19 | Shiann-Tsong Tsai | Semiconductor package with in-package compartmental shielding and fabrication method thereof |
TWI744572B (zh) * | 2018-11-28 | 2021-11-01 | 蔡憲聰 | 具有封裝內隔室屏蔽的半導體封裝及其製作方法 |
US11211340B2 (en) | 2018-11-28 | 2021-12-28 | Shiann-Tsong Tsai | Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding |
US10923435B2 (en) | 2018-11-28 | 2021-02-16 | Shiann-Tsong Tsai | Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance |
KR20210009658A (ko) * | 2019-07-17 | 2021-01-27 | 동우 화인켐 주식회사 | 안테나 패키지 및 이를 포함하는 화상 표시 장치 |
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US9978688B2 (en) * | 2013-02-28 | 2018-05-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package having a waveguide antenna and manufacturing method thereof |
US9129954B2 (en) * | 2013-03-07 | 2015-09-08 | Advanced Semiconductor Engineering, Inc. | Semiconductor package including antenna layer and manufacturing method thereof |
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