US20170181287A1 - Electronic package - Google Patents

Electronic package Download PDF

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Publication number
US20170181287A1
US20170181287A1 US15/064,016 US201615064016A US2017181287A1 US 20170181287 A1 US20170181287 A1 US 20170181287A1 US 201615064016 A US201615064016 A US 201615064016A US 2017181287 A1 US2017181287 A1 US 2017181287A1
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US
United States
Prior art keywords
electronic package
substrate
electronic
encapsulant
antenna board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/064,016
Other languages
English (en)
Inventor
Jyun-Yuan Jhang
Ming-Fan Tsai
Ho-Chuan Lin
Ying-Wei Lu
Guang-Hwa Ma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siliconware Precision Industries Co Ltd
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD. reassignment SILICONWARE PRECISION INDUSTRIES CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JHANG, JUN-YUAN, LIN, HO-CHUAN, LU, YING-WEI, MA, GUANG-HWA, TSAI, MING-FAN
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD. reassignment SILICONWARE PRECISION INDUSTRIES CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JHANG, JYUN-YUAN, LIN, HO-CHUAN, LU, YING-WEI, MA, GUANG-HWA, TSAI, MING-FAN
Publication of US20170181287A1 publication Critical patent/US20170181287A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors

Definitions

  • the present disclosure relates to electronic packages, and more particularly, to an electronic package having an antenna structure.
  • Wireless communication technologies have been widely applied in various kinds of consumer electronic products for receiving or transmitting various wireless signals.
  • wireless communication modules are becoming lighter, thinner, shorter and smaller.
  • patch antennas have been widely applied in wireless communication modules of electronic products such as cell phones and personal digital assistants (PDAs) due to their advantages of small size, light weight and easy fabrication.
  • FIG. 1 is a schematic cross-sectional view of a conventional wireless communication module.
  • the wireless communication module 1 has: a substrate 10 , an electronic element 11 disposed on and electrically connected to the substrate 10 , an encapsulant 12 encapsulating the electronic element 11 , and an antenna structure 13 disposed on the encapsulant 12 .
  • the antenna structure 13 has a support portion 130 disposed on the encapsulant 12 , an extending portion 133 extending upward from the support portion 130 , and an antenna portion 131 connected to the extending portion 133 .
  • the antenna portion 131 of the conventional wireless communication module 1 is an integral rectangular board, the antenna portion 131 operates only at a low bandwidth of 2.4 to 5.8 GHz and cannot operate at a high bandwidth.
  • electromagnetic radiation emitted from the antenna portion may adversely affect operation of other electronic elements and hence impair operation of the wireless communication module 1 .
  • an electronic package which comprises: a substrate; and an antenna board structure disposed on the substrate and having a first portion, a second portion and a partition portion between the first portion and the second portion.
  • the partition portion is configured with an opening.
  • the partition portion is made of a material different from those of the first portion and the second portion.
  • the partition portion is disposed around an outer periphery of the first portion.
  • the second portion is disposed around an outer periphery of the first portion.
  • the electronic package further comprises a shielding structure disposed around a periphery of the antenna board structure.
  • the shielding structure has a post shape or a wall shape.
  • the electronic package further comprises an electronic element disposed on the substrate.
  • the electronic package further comprises an encapsulant formed on the substrate.
  • the antenna board structure is disposed on and in contact with the encapsulant.
  • the electronic package further comprises a shielding structure embedded in the encapsulant and disposed around a periphery of the antenna board structure.
  • the shielding structure has a post shape or a wall shape.
  • the first portion and the second portion of the antenna board structure of the electronic package allow current to be split into two paths so as to spread electromagnetic radiation, thereby producing electromagnetic radiation with a high bandwidth.
  • the shielding structure of the electronic package prevents electromagnetic radiation from adversely affecting operation of other electronic elements.
  • FIG. 1 is a schematic cross-sectional view of a conventional wireless communication module
  • FIG. 1 ′ is a schematic partial upper view of FIG. 1 ;
  • FIG. 2 is a schematic perspective view of an electronic package according to a first embodiment of the present disclosure
  • FIG. 3A is a schematic cross-sectional view of an electronic package according to a second embodiment of the present disclosure.
  • FIG. 3B is a schematic partial upper view of FIG. 3A ;
  • FIG. 3C is a schematic perspective view of FIG. 3B ;
  • FIG. 3C ′ is a schematic perspective view showing another embodiment of FIG. 3C ;
  • FIG. 4 is a schematic perspective view showing another embodiment of FIG. 2 ;
  • FIG. 5 is a schematic partial upper view of an electronic package according to a third embodiment of the present disclosure.
  • FIG. 5 ′ is a schematic cross-sectional view showing another embodiment of FIG. 5 .
  • FIG. 2 is a schematic perspective view of an electronic package 2 according to a first embodiment of the present disclosure.
  • the electronic package 2 is a SiP (system in package) wireless communication module.
  • the electronic package 2 has a substrate 20 , at least an electronic element 21 disposed on the substrate 20 , an encapsulant 22 encapsulating the electronic element 21 , and an antenna board structure 23 disposed on the substrate 20 .
  • the substrate 20 is a circuit board or a ceramic board.
  • the substrate 20 has a first surface 20 a, a second surface 20 b opposite to the first surface 20 a, and a plurality of circuit layers (not shown) formed in the substrate 20 .
  • the electronic element 21 is disposed on the first surface 20 a of the substrate 20 and electrically connected to the circuit layers of the substrate 20 .
  • the electronic element 21 can be an active element such as a semiconductor chip, a passive element such as a resistor, a capacitor or an inductor, or a combination thereof.
  • the encapsulant 22 is formed on the first surface 20 a of the substrate 20 to encapsulate the electronic element 21 .
  • the electronic element 21 is not exposed from the encapsulant 22 , and the encapsulant 22 is made of polyimide, dry film, epoxy resin or molding compound.
  • the antenna board structure 23 is disposed in contact with the first surface 20 a of the substrate 20 .
  • the antenna board structure 23 has a first portion 231 , a second portion 232 and a partition portion 230 between the first portion 231 and the second portion 232 .
  • the antenna board structure 23 is a rectangular metal board and the partition portion 230 is configured as an opening, for example, a slot.
  • the second portion 232 (or the partition portion 230 ) is disposed around an outer periphery of the first portion 231 .
  • the first portion 231 has a rectangular plate shape
  • the second portion 232 has a ring shape
  • the first portion 231 and the second portion 232 meet at one side.
  • a slot i.e., the partition portion 230
  • the antenna board structure 23 has an extending portion 233 connected to the electronic element 21 .
  • the extending portion 233 has one end connected to the meeting side of the first portion 231 and the second portion 232 , and the other end connected to the electronic element 21 .
  • the extending portion 233 is partially covered by the encapsulant 22 , and the partition portion 230 , the first portion 231 and the second portion 232 are exposed from the encapsulant 22 .
  • the first portion 231 and the second portion 232 of the antenna board structure 23 of the electronic package 2 allow current to be split into two paths so as to spread electromagnetic radiation, thus producing electromagnetic radiation with a high bandwidth.
  • FIGS. 3A to 3C are schematic views of an electronic package 3 according to a second embodiment of the present disclosure.
  • a main difference of the second embodiment from the first embodiment is the addition of a shielding structure.
  • the electronic package 3 has a substrate 20 , an electronic element 21 , an encapsulant 22 , an antenna board structure 23 , and a shielding structure 34 .
  • the substrate 20 has a first surface 20 a, a second surface 20 b opposite to the first surface 20 a, and a plurality of circuit layers 200 exposed from the first surface 20 a and the second surface 20 b.
  • the electronic element 21 is disposed on the first surface 20 a of the substrate 20 and electrically connected to the circuit layers 200 .
  • the electronic element 21 has an active surface 21 a with a plurality of electrode pads 210 and an inactive surface 21 b opposite to the active surface 21 a, and the electronic element 21 is attached to the first surface 20 a of the substrate 20 via the active surface 21 a thereof so as to allow the electrode pads 210 of the electronic element 21 to be electrically connected to the circuit layers 200 .
  • the encapsulant 22 is formed on the first surface 20 a of the substrate 20 to encapsulate the electronic element 21 .
  • the inactive surface 21 b of the electronic element 21 is exposed from the encapsulant 22 .
  • a plurality of conductive through holes 32 are formed in the encapsulant 22 and electrically connected to the circuit layers 200 .
  • a plurality of conductive elements such as solder balls (not shown) can be electrically connected to the conductive through holes 32 for stacking of an electronic device such as a package, a substrate or a circuit board (not shown).
  • the antenna board structure 23 is disposed in contact with the encapsulant 22 and has a partition portion 230 exposed form the encapsulant 22 , as shown in FIG. 3B .
  • the extending portion 233 ′ of the antenna board structure 23 has an extending portion 234 that downwardly extends through the encapsulant 22 and is connected to the substrate 20 or the circuit layers 200 .
  • the extending portion 233 ′, 234 is not connected to the electronic element 21 .
  • the extending portion 234 is positioned in the encapsulant 22 .
  • the extending portion 234 extends to the substrate 20 along an outer side surface 22 a of the encapsulant 22 .
  • the shielding structure 34 is disposed around a periphery of the antenna board structure 23 , as shown in FIG. 3B .
  • the shielding structure 34 consists of a plurality of solid conductive posts.
  • the conductive posts are embedded in the encapsulant 22 and have one ends exposed from the encapsulant 22 .
  • the shielding structure 34 ′ consists of conductive walls, and the conductive walls are embedded in the encapsulant 22 and have a top surface exposed from the encapsulant 22 .
  • FIG. 4 shows a further embodiment continued from FIG. 2 .
  • the electronic package 4 further has a shielding structure 44 .
  • the shielding structure 44 consists of conductive posts or conductive walls, which are embedded in the substrate 20 and have a surface exposed from the first surface 20 a of the substrate 20 .
  • the shielding structure 34 , 34 ′, 44 of the electronic package 3 , 4 is disposed around a periphery of the antenna board structure 23 to prevent electromagnetic radiation from adversely affecting operation of other electronic elements.
  • FIGS. 5 and 5 ′ are schematic views of an electronic package according to a third embodiment of the present disclosure.
  • a main difference of the third embodiment from the second embodiment is the antenna board structure.
  • the material of the partition portion 530 is different from that of the first portion 231 and the second portion 232 .
  • the first portion 231 and the second portions 232 are made of a metal material and the partition portion 530 is made of an insulating material.
  • the electronic package 5 further has an insulating layer 55 formed on the encapsulant 22 for covering the inactive surface 21 b of the electronic element 21 , the antenna board structure 53 and the shielding structure 54 .
  • the shielding structure 54 consists of hollow conductive posts, i.e., vias, and the insulating layer 55 is filled in the opening of the antenna board structure 53 to form the partition portion 530 .
  • the first portion and the second portion of the antenna board structure of the electronic package allow current to be split into two paths so as to spread electromagnetic radiation, thus producing electromagnetic radiation with a high bandwidth.
  • the shielding structure of the electronic package prevents electromagnetic radiation from adversely affecting operation of other electronic elements.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Transceivers (AREA)
  • Details Of Aerials (AREA)
US15/064,016 2015-12-22 2016-03-08 Electronic package Abandoned US20170181287A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW104143100 2015-12-22
TW104143100A TW201724648A (zh) 2015-12-22 2015-12-22 電子封裝件

Publications (1)

Publication Number Publication Date
US20170181287A1 true US20170181287A1 (en) 2017-06-22

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US (1) US20170181287A1 (zh)
CN (1) CN106910735A (zh)
TW (1) TW201724648A (zh)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017200126A1 (de) * 2017-01-05 2018-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung
WO2019068009A1 (en) * 2017-09-30 2019-04-04 Qualcomm Incorporated ANTENNA MODULE CONFIGURATIONS
CN110391213A (zh) * 2018-04-17 2019-10-29 矽品精密工业股份有限公司 电子装置与电子封装件
EP3660897A1 (en) * 2018-11-28 2020-06-03 Chung-Che Tsai Semiconductor package with in-package compartmental shielding and fabrication method thereof
US10896880B2 (en) 2018-11-28 2021-01-19 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and fabrication method thereof
US20210021025A1 (en) * 2019-07-17 2021-01-21 Dongwoo Fine-Chem Co., Ltd. Antenna package and image display device including the same
US10923435B2 (en) 2018-11-28 2021-02-16 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance
US11081453B2 (en) * 2018-07-03 2021-08-03 Mediatek Inc. Semiconductor package structure with antenna
US11211340B2 (en) 2018-11-28 2021-12-28 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
US11394109B2 (en) 2017-01-05 2022-07-19 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Module arrangement comprising embedded components and an integrated antenna, device comprising module arrangements, and method for manufacturing
US20230090365A1 (en) * 2021-09-23 2023-03-23 Texas Instruments Incorporated Fan-out package with antenna

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KR102266626B1 (ko) * 2017-07-17 2021-06-17 엘에스엠트론 주식회사 내장형 안테나를 갖는 무선통신칩, 무선통신칩용 내장형 안테나, 및 내장형 안테나를 갖는 무선통신칩의 제조 방법
TWI640066B (zh) * 2017-11-03 2018-11-01 矽品精密工業股份有限公司 電子封裝件及其製法

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US9721920B2 (en) * 2012-10-19 2017-08-01 Infineon Technologies Ag Embedded chip packages and methods for manufacturing an embedded chip package
US9978688B2 (en) * 2013-02-28 2018-05-22 Advanced Semiconductor Engineering, Inc. Semiconductor package having a waveguide antenna and manufacturing method thereof
US9129954B2 (en) * 2013-03-07 2015-09-08 Advanced Semiconductor Engineering, Inc. Semiconductor package including antenna layer and manufacturing method thereof
CN104851878B (zh) * 2014-02-14 2018-02-23 日月光半导体制造股份有限公司 具有天线的半导体封装结构及其制造方法

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017200126A1 (de) * 2017-01-05 2018-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Modulanordnung mit integrierter Antenne und eingebetteten Komponenten sowie Verfahren zur Herstellung einer Modulanordnung
US11563266B2 (en) 2017-01-05 2023-01-24 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Module arrangement comprising an integrated antenna and embedded components and method for manufacturing a module arrangement
US11394109B2 (en) 2017-01-05 2022-07-19 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Module arrangement comprising embedded components and an integrated antenna, device comprising module arrangements, and method for manufacturing
CN111344898A (zh) * 2017-09-30 2020-06-26 高通股份有限公司 天线模块配置
US11245175B2 (en) 2017-09-30 2022-02-08 Qualcomm Incorporated Antenna module configurations
WO2019068009A1 (en) * 2017-09-30 2019-04-04 Qualcomm Incorporated ANTENNA MODULE CONFIGURATIONS
CN110391213A (zh) * 2018-04-17 2019-10-29 矽品精密工业股份有限公司 电子装置与电子封装件
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US11574881B2 (en) 2018-07-03 2023-02-07 Mediatek Inc. Semiconductor package structure with antenna
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US10847480B2 (en) 2018-11-28 2020-11-24 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and fabrication method thereof
US10896880B2 (en) 2018-11-28 2021-01-19 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and fabrication method thereof
US10923435B2 (en) 2018-11-28 2021-02-16 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and improved heat-dissipation performance
US11211340B2 (en) 2018-11-28 2021-12-28 Shiann-Tsong Tsai Semiconductor package with in-package compartmental shielding and active electro-magnetic compatibility shielding
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