CN110391213A - 电子装置与电子封装件 - Google Patents

电子装置与电子封装件 Download PDF

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CN110391213A
CN110391213A CN201810399262.8A CN201810399262A CN110391213A CN 110391213 A CN110391213 A CN 110391213A CN 201810399262 A CN201810399262 A CN 201810399262A CN 110391213 A CN110391213 A CN 110391213A
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electronic
antenna
packing piece
antenna structure
electronic packing
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CN110391213B (zh
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方柏翔
陈冠达
赖佳助
卢盈维
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Siliconware Precision Industries Co Ltd
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Siliconware Precision Industries Co Ltd
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Abstract

一种电子装置与电子封装件，包括：承载结构、设于该承载结构上的第一电子元件、形成于该承载结构上的第一绝缘层、结合该第一绝缘层并电性连接该第一电子元件的第一天线结构、以及嵌埋于该承载结构中的第二天线结构，使该电子封装件能在有限的空间下提供更多的天线功能，以增进电子产品的讯号品质及讯号传输速率。本发明还提供结合有该电子封装件的电子装置以应用于具天线功能的电子产品。

Description

电子装置与电子封装件
技术领域
本发明关于一种电子封装件，特别是关于一种具有天线结构的电子封装件与电子装置。
背景技术
目前无线通讯技术已广泛应用于各式消费性电子产品(如手机、平板电脑等)，以利接收或发送各种无线讯号。为满足消费性电子产品的便于携带性及上网便利性(如观看多媒体内容)，无线通讯模块的制造与设计朝轻、薄、短、小的需求作开发，其中，平面天线(Patch Antenna)因具有体积小、重量轻与制造容易等特性而广泛利用在电子产品的无线通讯模块中。
此外，因应目前的多媒体内容因画质的提升而造成其档案资料量变得更大，故无线传输的频宽也需变大，因而产生第五代的无线传输(5G)，且5G因传输频率较高，其相关无线通讯模块的尺寸的要求也较高。
图1为悉知无线通讯模块的立体示意图。如图1所示，该无线通讯模块1包括：一基板10、设于该基板10上的多个电子元件11、一天线结构12以及封装材13。该基板10为电路板并呈矩形体。该电子元件11设于该基板10上且电性连接该基板10。该天线结构12为平面型且具有一天线本体120与一导线121，该天线本体120借由该导线121电性连接该电子元件11。该封装材13覆盖该电子元件11与该部分导线121。
然而，5G系统因讯号品质与传输速度要求，而需更多天线配置，以提升讯号的品质与传输速度，但悉知无线通讯模块1中，该天线结构12为平面型，且该基板10的长宽尺寸均为固定，因而限制该天线结构12的功能，致使该无线通讯模块1难以达到5G系统的天线运作的需求。
因此，如何克服上述悉知技术的问题，实已成目前亟欲解决的课题。
发明内容
鉴于上述悉知技术的缺失，本发明提供一种电子装置与电子封装件，以增进电子产品的讯号品质及讯号传输速率。
本发明的电子封装件，包括：承载结构，其具有相对的第一侧与第二侧；至少一第一电子元件，其设于该承载结构的第一侧及/或第二侧上；第一绝缘层，其结合于该承载结构的第二侧上；第一天线结构，其结合于该第一绝缘层并电性连接该第一电子元件；以及第二天线结构，其结合于该承载结构上。
前述的电子封装件中，该承载结构具有线路层，以电性连接该第一电子元件与该第一天线结构。
前述的电子封装件中，该第一天线结构包含相互分离且相对应配置于该第一绝缘层二侧的第一天线层与第二天线层。例如，该第一天线层与该第二天线层以耦合方式传输讯号。
前述的电子封装件中，该第二天线结构为嵌埋于该承载结构中的导电结构。
前述的电子封装件中，该第二天线结构包含有与该第一天线结构接地的第一导电层。
前述的电子封装件中，该第二天线结构包含有外露于该承载结构的第一侧的多个电性接点。例如，该多个电性接点作为该第二天线结构的讯号输入埠与接地埠，且任二者的间的距离为该第二天线结构的讯号频率的1/4至1/10波长。
前述的电子封装件中，该第二天线结构复借由第二绝缘层结合于该承载结构的第一侧上。例如，该第一电子元件设于该承载结构的第一侧上，且该第二绝缘层包覆该第一电子元件，使该第二天线结构屏蔽该第一电子元件。
前述的电子封装件中，该第一天线结构适用于第一频率波段，且该第二天线结构适用于第二频率波段，当第一天线结构用于第一频率波段时，该第二天线结构作为第一天线结构的接地。
本发明提供一种电子装置，包括：线路板；前述的电子封装件，其结合至该线路板上；以及第二电子元件，其设该线路板上且电性连接该第二天线结构。
前述的电子装置中，还包括设于该线路板上且提供该电子封装件与该第二电子元件电性耦合的多个导电结构。例如该第二天线结构包含有外露于该承载结构的第一侧的多个电性接点，且该多个导电结构电性连接该多个电性接点。
前述的电子装置中，还包括设于该线路板上且电性连接该电子封装件的连接器。
由上可知，本发明的电子装置及其电子封装件中，主要借由该第一天线结构及第二天线结构的立体迭层的设计，使该多频的电子封装件能在有限的空间下提供更多的天线功能，以增进采用该电子装置的电子产品的讯号品质及讯号传输速率，故相较于悉知技术，该电子装置能有效达到5G系统的天线运作的需求。
附图说明
图1为悉知半导体通讯模块的剖面示意图；
图2为本发明的电子封装件的第一实施例的剖面示意图；
图3为本发明的电子封装件的第二实施例的剖面示意图；以及
图4为本发明的电子装置的立体示意图。
符号说明
1 无线通讯模块 10 基板
11 电子元件 12 天线结构
120 天线本体 121 导线
13 封装材 2,3 电子封装件
20 承载结构 20a 第一侧
20b 第二侧 200 线路层
201 介电材 21 第一电子元件
210 导电凸块 22 第一绝缘层
22a 第一表面 22b 第二表面
23 第一天线结构 23a 第一天线层
23b 第二天线层 24,34 第二天线结构
24a,24b 电性接点 240 第一导电层
241 布线层 340 第二导电层
341 导体 35 第二绝缘层
4 电子装置 40 线路板
40a 顶面 40c 侧面
41 第二电子元件 42 连接器
43a,43b 导电结构 430 导线
t 距离。
具体实施方式
以下借由特定的具体实施例说明本发明的实施方式，熟悉此技艺的人士可由本说明书所揭示的内容轻易地了解本发明的其他优点及功效。
须知，本说明书所附图式所绘示的结构、比例、大小等，均仅用以配合说明书所揭示的内容，以供熟悉此技艺的人士的了解与阅读，并非用以限定本发明可实施的限定条件，故不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本发明所能产生的功效及所能达成的目的下，均应仍落在本发明所揭示的技术内容得能涵盖的范围内。同时，本说明书中所引用的如「上」、「第一」、「第二」及「一」等用语，也仅为便于叙述的明了，而非用以限定本发明可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当也视为本发明可实施的范畴。
图2为本发明的电子封装件2的第一实施例的剖面示意图。如图2所示，所述的电子封装件2包括：一承载结构20、至少一第一电子元件21、一第一绝缘层22、第一天线结构23以及第二天线结构24。
所述的承载结构20具有相对的第一侧20a与第二侧20b。
于本实施例中，该承载结构20例如为具有核心层与线路结构的封装基板(substrate)或无核心层(coreless)的线路结构，该承载结构20包含有介电材201及形成于介电材201上的至少一线路层200，该线路层200例如为扇出(fan out)型重布线路层(redistribution layer，简称RDL)。
所述的第一电子元件21设于该承载结构20的第一侧20a上，也可依需求将该第一电子元件21设于该第二侧20b上或同时配置于该第一侧20a与该第二侧20b上。
于本实施例中，该第一电子元件21为主动元件、被动元件或其二者组合等，其中，该主动元件例如为半导体晶片，且该被动元件例如为电阻、电容及电感。例如，该第一电子元件21为具毫米波(㎜Wave)功能的半导体晶片，并借由多个如焊锡材料的导电凸块210以覆晶方式设于该线路层200上并电性连接该线路层200；或者，该第一电子元件21可借由多个焊线(图略)以打线方式电性连接该线路层200；抑或，该第一电子元件21可直接接触该线路层200。然而，有关该第一电子元件21电性连接该第一承载结构20的方式不限于上述。
所述的第一绝缘层22形成于该承载结构20的第二侧20b上。
于本实施例中，该第一绝缘层22具有相对的第一表面22a与第二表面22b，并以该第二表面22b结合该承载结构20的第二侧20b，其中，形成该第一绝缘层22的材质为聚酰亚胺(polyimide，简称PI)、干膜(dry film)、环氧树脂(epoxy)或封装材(molding compound)等，但并不限于上述。
所述的第一天线结构23结合该第一绝缘层22并电性连接该第一电子元件21。
于本实施例中，该第一天线结构23包含相互分离且相对应配置于该第一绝缘层22二侧的一第一天线层23a与一第二天线层23b，该第一天线层23a设于该第一绝缘层22的第一表面22a上，且该第二天线层23b位于该第一绝缘层22的第二表面22b上以接触该承载结构20的第二侧20b并电性连接该线路层200，其中，该第一天线层23a的布设位置对应该第二天线层23b的布设位置。具体地，可借由溅镀(sputtering)、蒸镀(vaporing)、电镀、无电电镀、化镀或贴膜(foiling)等方式制作厚度轻薄的天线层。例如，于该第一绝缘层22(或该承载结构20)上形成图案化导电材，以作为第一天线层23a或第二天线层23b。
此外，该第一天线层23a与该第二天线层23b以耦合方式传输讯号。具体地，该第一天线层23a与该第二天线层23b可由交变电压、交变电流或辐射变化产生辐射能量，且该辐射能量为电磁场，以令该第一天线层23a与该第二天线层23b能相互电磁耦合，使天线讯号能于该第一天线层23a与该第二天线层23b之间传递。
所述的第二天线结构24结合于该承载结构20上，其包含一可作为天线或可接地该第一天线结构23的第一导电层240、至少一电性连接该第一导电层240的布线层241、及多个电性接点24a,24b。
于本实施例中，该第二天线结构24为嵌埋于该承载结构20中的导电结构。
此外，该第一导电层240于该承载结构20的布设面积大于该第二天线层23b结合该承载结构20的布设面积。具体地，该第一导电层240可为至少一完整、网状或任意图案的金属薄片(foil)；或者，该第一导电层240可为图案化的导电材，使该第二天线结构24与该线路层200可以相同布线制程一并制作。
又，该多个电性接点24a,24b外露于该承载结构20的第一侧20a，且该多个电性接点24a,24b可作为讯号埠(I/O)或接地埠(I/O)。例如，两该电性接点24a,24b之间的距离t为1/4波长(λ)至1/10波长，其中，该距离t所采用的波长为该第二天线结构24的讯号频率(如Sub-6GHz)的波长。
图3为本发明的电子封装件3的第二实施例的剖面示意图。本实施例与第一实施例的差异在于第二天线结构34的布设，其它配置大致相同，故以下不再赘述相同处。
所述的第二天线结构34复包含一第二导电层340，其借由一第二绝缘层35结合于该承载结构20的第一侧20a上。
于本实施例中，形成该第二绝缘层35的材质为聚酰亚胺(PI)、干膜、环氧树脂或封装材等，但并不限于上述。具体地，可透过双面模压制程一并形成该第二绝缘层35与该第一绝缘层22，使该第二绝缘层35包覆该第一电子元件21。应可理解地，该第二绝缘层35与该第一绝缘层22可为相同或不同材质，也可同时或不同时制作。
此外，该第二导电层340可选择作为天线，或同时提供该第一电子元件21屏蔽作用(例如，该第二导电层340接触该第一电子元件21)。具体地，该第二导电层340可为至少一完整、网状或任意图案的金属薄片；或者，该第二导电层340可为图案化的导电材。
又，该多个电性接点24a,24b可借由多个导体341电性连接该第二导电层340，使该第二天线结构34于天线作用时作为接地。例如，该导体341为柱状或凸块状，其包含焊锡材料、金属材或其它导电材，且该第二绝缘层35可包覆该导体341。
因此，本发明的第一与第二实施例的电子封装件2,3中，该第一天线结构23适用于第一频率波段(如28或39GHz)，且该第二天线结构24,34适用于第二频率波段(Sub-6GHz)，并于该第一天线结构23进行第一频率波段的运作时，该第一电子元件21借由该线路层200的传输以处理该第一天线结构23的天线讯号，且该第二天线结构24,34作为该第一天线结构24,34的接地(如由该第一导电层240、该布线层241及该多个电性接点24a,24b构成的接地路径)。
此外，本发明的电子封装件2,3可利用该第一导电层240防止外部环境对该第一电子元件21的串音干扰(cross talking)、噪音干涉(noise interfering)及辐射干扰(radiation interference)等问题。较佳者，该第一导电层240可由多层金属薄片所制成，以强化屏蔽功能。
图4为本发明的电子装置4的立体示意图。所述的电子装置4包括：一线路板40、前述的电子封装件2,3、一第二电子元件41以及一连接器42。
所述的线路板40为电路板(PCB)，其为电子产品的主板，如手机基板。
所述的电子封装件2,3的外观轮廓大致呈板状，其可作为电子产品的天线基板，并以其承载结构20的第一侧20a朝该线路板40的侧面而接合至该线路板40的侧面40c上，以令该第一天线结构23传递或接收第一频率波段(如28GHz或39GHz)的天线讯号。
所述的第二电子元件41设于该线路板40的顶面40a上并配置于该电子封装件2,3的前方，且该第二电子元件41借由该线路板40的导电结构43a,43b电性连接该第二天线结构24,34的电性接点24a,24b或第二导电层340，以令该第二天线结构24,34传递或接收第二频率波段(Sub-6GHz)的天线讯号。
于本实施例中，该第二电子元件41为封装模块、主动元件、被动元件或其组合等，其中，该封装模块例如为包含晶片及封装材，且该主动元件例如为半导体晶片，而该被动元件例如为电阻、电容及电感。例如，该第二电子元件41为封装模块，其包含射频晶片，如PAMid、PA或traceiver等型式，以处理该第二天线结构24,34的天线讯号。
此外，该多个导电结构43a,43b可例如为弹勾、单针弹簧接脚(Pogo pin)等金属连接机构，并借由作为射频讯号线及接地线的导线430电性连接该第二电子元件41。
所述的连接器42配置于该线路板40的顶面40a上并电性连接该电子封装件2,3的线路层200。
于本实施例中，该连接器42为该电子封装件2,3的电性接脚，其内包含电源、接地、控制讯号及中频讯号等接脚。
因此，本发明的电子装置4中，该电子封装件2,3具有用于不同的操作频率的第一天线结构23及第二天线结构24,34，以于该第二天线结构24,34进行第二频率波段的运作时，该第二电子元件41用于处理该第二天线结构24,34的天线讯号。
综上所述，本发明的电子装置4及电子封装件2,3借由第一天线结构23及第二天线结构24,34的立体迭层的设计，使多频的电子封装件2,3能在有限的空间下提供更多的天线功能，以增进采用该电子装置4的电子产品(如手机的行动装置)的讯号品质及讯号传输速率，故相较于悉知技术，该电子装置4能有效达到5G系统的天线运作的需求。
上述实施例仅用以例示性说明本发明的原理及其功效，而非用于限制本发明。任何熟习此项技艺的人士均可在不违背本发明的精神及范畴下，对上述实施例进行修改，且前述各实施例的内容可再相互组合应用。因此本发明的权利保护范围，应如权利要求书所列。

Claims (15)

1.一种电子封装件，其特征为，该电子封装件包括：
承载结构，其具有相对的第一侧与第二侧；
至少一第一电子元件，其设于该承载结构的第一侧及/或第二侧上；
第一绝缘层，其结合于该承载结构的第二侧上；
第一天线结构，其结合于该第一绝缘层并电性连接该第一电子元件；以及
第二天线结构，其结合于该承载结构上。
2.根据权利要求1所述的电子封装件，其特征为，该承载结构具有线路层，以电性连接该第一电子元件与该第一天线结构。
3.根据权利要求1所述的电子封装件，其特征为，该第一天线结构包含相互分离且相对应配置于该第一绝缘层二侧的第一天线层与第二天线层。
4.根据权利要求3所述的电子封装件，其特征为，该第一天线层与该第二天线层以耦合方式传输讯号。
5.根据权利要求1所述的电子封装件，其特征为，该第二天线结构为嵌埋于该承载结构中的导电结构。
6.根据权利要求1所述的电子封装件，其特征为，该第二天线结构包含有与该第一天线结构接地的第一导电层。
7.根据权利要求1所述的电子封装件，其特征为，该第二天线结构包含有外露于该承载结构的第一侧的多个电性接点。
8.根据权利要求7所述的电子封装件，其特征为，该多个电性接点作为该第二天线结构的讯号输入埠与接地埠，且任二者之间的距离为该第二天线结构的讯号频率的1/4至1/10波长。
9.根据权利要求1所述的电子封装件，其特征为，该第二天线结构复借由第二绝缘层结合于该承载结构的第一侧上。
10.根据权利要求9所述的电子封装件，其特征为，该第一电子元件设于该承载结构的第一侧上，且该第二绝缘层包覆该第一电子元件，使该第二天线结构屏蔽该第一电子元件。
11.根据权利要求1所述的电子封装件，其特征为，该第一天线结构适用于第一频率波段，且该第二天线结构适用于第二频率波段，当第一天线结构用于第一频率波段时，该第二天线结构作为第一天线结构的接地。
12.一种电子装置，其特征为，该电子装置包括：
线路板；
根据权利要求1至11的其中一者所述的电子封装件，其结合至该线路板上；以及
第二电子元件，其设于该线路板上且电性连接该第二天线结构。
13.根据权利要求12所述的电子装置，其特征为，该电子装置还包括设于该线路板上且提供该电子封装件与该第二电子元件电性耦合的多个导电结构。
14.根据权利要求13所述的电子装置，其特征为，该第二天线结构包含有外露于该承载结构的第一侧的多个电性接点，且该多个导电结构电性连接该多个电性接点。
15.根据权利要求12所述的电子装置，其特征为，该电子装置还包括设于该线路板上且电性连接该电子封装件的连接器。
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