TW201715570A - 使用膏狀晶粒附著材料的在引線上黏貼的晶片 - Google Patents

使用膏狀晶粒附著材料的在引線上黏貼的晶片 Download PDF

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TW201715570A
TW201715570A TW105122050A TW105122050A TW201715570A TW 201715570 A TW201715570 A TW 201715570A TW 105122050 A TW105122050 A TW 105122050A TW 105122050 A TW105122050 A TW 105122050A TW 201715570 A TW201715570 A TW 201715570A
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die
semiconductor
semiconductor die
paste layer
lead frame
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TW105122050A
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TWI728983B (zh
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賴格 秦
帕費特 弗歐哈盧漢
尹賴 富
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賽普拉斯半導體公司
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Abstract

根據多樣的具體態樣，提供的是用於封裝半導體裝置的系統和方法。本揭示討論半導體晶粒，其具有頂側和配置在引線框上的底側。然後施加黏著膏以將半導體晶粒附著於引線框，使得黏著膏將晶粒固定於部分的引線框。黏著膏可以直接施加在晶粒和引線框之間，或者可以搭配框帶來施加。

Description

使用膏狀晶粒附著材料的在引線上黏貼的晶片
本發明有關於系統、方法和/或其組合和次組合，其使用黏著膏而將半導體晶粒結合到引線框來製造半導體封裝。
優先權
本申請根據要求於2015年8月13日提交的美國臨時申請案第10-2016-0006584號的優先權及權益，其整體內容在此處通過引用被併入到本文中。
於半導體封裝的領域，晶粒附著膜(die attach film，DAF)有時用於將完成的半導體晶粒附著於基板或引線框。雖然DAF容易使用和施加，不過它們可以具有特定的缺點。舉例來說，DAF無法承受打線接合的高溫，並且進一步容易在DAF和引線框介面層之間發生脫層異常，這可以造成最終產品的問題和/或額外的製造成本。附帶而言，DAF本身是昂貴的，並且使用它們則增加半導體的製造成本。據此，需要的改善是不遭受相同的製造品質和異常或成本等問題。
本發明的一態樣揭示一種半導體封裝，其包括：半導體晶粒，其具有頂側和底側；引線框，其配置在該半導體晶粒底下；膏層，其 配置在該半導體晶粒之部分的該底側上，使得該膏層將該半導體晶粒固定於部分的該引線框；以及包封物，其包住該半導體晶粒、該引線框、該膏層。
本發明的另一態樣揭示一種封裝半導體裝置的方法，其包括：提供半導體晶粒，其具有頂側和底側；提供引線框，其配置在該半導體晶粒底下；施加膏層到該半導體晶粒之部分的該底側；使用該膏層而將該半導體晶粒定位在該引線框上；以及固化該膏層以將該半導體晶粒接合於該引線框。
1~48‧‧‧引線腳
100‧‧‧半導體封裝
102‧‧‧半導體晶粒
104‧‧‧引線框
106‧‧‧晶粒附著膜(DAF)
108‧‧‧框帶
110‧‧‧封裝引線
200‧‧‧半導體封裝
202‧‧‧半導體晶粒
204‧‧‧DAF
206‧‧‧帶層
208‧‧‧引線框
300‧‧‧半導體封裝
302‧‧‧半導體晶粒
304‧‧‧引線框
306‧‧‧黏著膏
308‧‧‧框帶
310‧‧‧封裝引線
400‧‧‧半導體封裝
402‧‧‧半導體晶粒
404‧‧‧黏著膏
406‧‧‧帶層
408‧‧‧引線框
410‧‧‧包封物或密封物
500‧‧‧半導體封裝
502‧‧‧半導體晶粒
504‧‧‧引線框
506‧‧‧黏著膏
508‧‧‧框帶
510‧‧‧封裝引線
600‧‧‧封裝晶粒的方法
602~612‧‧‧封裝晶粒的方法階段
在此併入伴隨的圖式，其形成本揭示的部分說明書。
圖1是根據本揭示多樣的具體態樣之半導體封裝的範例性布局。
圖2是根據本揭示多樣的具體態樣之半導體封裝的範例性截面圖。
圖3是根據本揭示多樣的具體態樣之半導體封裝的範例性布局。
圖4是根據本揭示多樣的具體態樣之半導體封裝的範例性截面圖。
圖5是根據本揭示多樣的具體態樣之半導體封裝的範例性布局。
圖6是示範根據本揭示多樣的具體態樣而製造半導體封裝的方法之流程圖。
於圖式，相同的參考數字一般而言是指相同或類似的元件。附帶且一般而言，參考數字之最左邊的位數識別出該參考數字所首次出現的圖。
在此提供的是系統、方法和/或其組合和次組合，其使用黏著膏而將半導體晶粒結合到引線框來製造半導體封裝。
圖1是顯示根據本揭示多樣的具體態樣之半導體封裝100的示意圖。半導體封裝100包括半導體晶粒102，其使用晶粒附著膜(DAF)106和框帶108而附著於引線框104。引線框104可以用於將封裝引線110連接到半導體晶粒102之適合的導體。根據多樣的具體態樣，DAF 106舉例來說可以在上游晶圓層級的層合過程期間就預先施加。圖1將DAF 106顯示成小於晶粒102。這是要幫助解釋圖式。實務上，DAF 106可以覆蓋整個晶粒102；DAF 106的邊緣可以與晶粒102一樣寬廣。雖然圖1顯示總共有48根引線腳110，不過應了解這祇是為了解釋，並且或可使用任何數目、式樣或形狀的引線腳而仍落在本揭示的範圍和精神裡。
圖1所示的DAF 106可以由黏著層所組成，其在預先層合過程期間配置到晶圓底部(亦即背側)上。根據某些具體態樣，預先層合過程或可在晶圓切鋸過程之前發生。DAF可以包括樹脂做的黏著劑，其配置在例如聚乙烯基膜、聚烯烴膜或聚對苯二甲酸乙酯(PET)膜等膜上。於圖1，DAF用於將晶粒102附著於引線框104的襯墊。以此方式，DAF 106可以用於形成晶片在引線上(chip on lead，COL)的封裝100。
圖2是半導體封裝200之諸多方面的截面圖。舉例來說，圖 2或可顯示根據多樣的具體態樣之圖1半導體封裝100沿著帶108某一長度之軸的截面圖。如圖2所示，半導體封裝200包括晶粒202和引線框208。晶粒202可以是半導體晶粒，其包含許多邏輯閘和/或類比半導體裝置。
如圖2所示，晶粒202使用DAF 204而附著於引線框208，該DAF 204附著於晶粒202的底側和帶層206。根據多樣的具體態樣，帶層206可以類似於上面關於圖1所述的框帶108層。DAF 204可以包括樹脂做的黏著劑，並且配置在例如聚乙烯基膜、聚烯烴膜或聚對苯二甲酸乙酯(PET)膜的膜上。
雖然在某些方面有效，不過使用例如DAF 204的晶粒附著膜可能會在半導體封裝過程期間造成麻煩。舉例來說，在某些製程，可以想要使用高溫的打線接合。然而，許多DAF所具有的最大溫度乃小於所需的打線接合溫度。附帶而言，即使當在不使用高溫方法的製程期間，DAF仍可能苦於脫層。當製程期間發生出氣時便發生脫層，這舉例來說造成DAF 204和帶206之間分離。這對於晶粒202和引線框208之間接合的整合性而言是有問題的。附帶而言，晶圓切鋸期間可以發生問題。在晶圓切鋸期間，必須鋸穿層合晶粒(例如晶粒202)的諸層(其是脆硬的材料，例如矽)和DAF的諸層(其是軟而有彈性的)二者。這可以導致DAF(例如DAF 204)毛邊。DAF毛邊是DAF黏著劑在切鋸晶粒邊緣之底部和側面的殘餘物或鬚狀物。這些黏著性DAF毛邊導致多樣的製程和多重品質問題及挑戰。舉例來說，毛邊可以使相鄰的晶粒「黏」(stick)在一起，這可以導致在製程期間把相鄰的晶粒連同目標晶粒一起被拾取。當處理極小的晶粒(例如小於2毫米)時，其在切鋸晶圓的晶粒行列之間具有小(例如60微米和更小)的窄鋸道，可以特別 盛行這問題。這問題也可以導致晶粒龜裂、晶粒破斷或晶粒碎片--特別是對於薄而大(例如大於8毫米)的晶粒而言。所有這些問題導致製造成本增加。較好的方法會是以不受到DAF 204材料所遭受之相同缺點的材料來取代DAF 204。
圖3是顯示根據本揭示多樣的具體態樣之半導體封裝300的示意圖。半導體封裝300包括半導體晶粒302，其使用黏著膏306和框帶308而附著於引線框304。根據多樣的具體態樣，引線框304可以包括適合晶粒302的任何引線框或無引線封裝，例如雙平無引線(dual-flat no-lead，DFN)封裝或四平無引線(quad-flat no-lead，QFN)封裝。
於某些具體態樣，用於連接晶粒302和帶308之黏著膏306的份量乃控制成使得它提供對框帶308的最大覆蓋度而不溢流出框帶308的邊緣。於其他具體態樣，黏著膏306所用的份量單純決定成使得它將不溢流出框帶308。於某些具體態樣，框帶308也可以用於生成晶粒附著槳而用來將晶粒302接合於引線框304。
雖然圖3顯示的封裝300具有三個長度的框帶308，不過這單純是示範可以使用多重長度或形狀的框帶308。根據其他具體態樣，或可使用更多或更少之長度或形狀的框帶308。舉例來說，於某些具體態樣，僅採用單一長度和形狀的框帶308。這在下面關於圖5做更詳細的討論。
引線框304可以用於將封裝引線310連接到半導體晶粒302之適合的導體。雖然圖3顯示總共有48根引線腳310，不過應了解這祇是為了解釋，並且或可使用任何數目、式樣或形狀的引線腳而仍落在本揭示的範圍和精神裡。
圖3所示的黏著膏306可以包括任何適合的黏著膏或液態黏著材料。舉例來說，根據某些具體態樣，黏著膏306包括膏狀黏著劑，其是電絕緣的或是導電或導熱的，此視特定的應用而定。舉例來說，如果想要有電絕緣的黏著劑306，則可以使用完全基於聚合物的黏著膏。類似而言，當想要有導熱或導電的黏著膏306時，可以使用熱或導熱的黏著膏。於圖3，黏著膏306用於將晶粒302附著於引線框304的襯墊。以此方式，則黏著膏可以用於形成晶片在引線上(COL)的封裝300。
圖4是半導體封裝400之諸多方面的截面圖。舉例來說，圖4或可顯示圖3的半導體封裝300沿著帶308之長度的截面。如圖4所示，半導體封裝400包括晶粒402和引線框408。晶粒402可以是半導體晶粒，其包含許多邏輯閘和/或類比半導體裝置。引線框408可以包括任何適合的半導體封裝基板，例如引線框襯墊或類似者。
如圖4所示，晶粒402使用黏著膏404而附著於引線框408，而黏著膏404附著於晶粒402的一側和帶層406。根據多樣的具體態樣，帶層406可以類似於上面關於圖3所述的框帶308層。黏著膏404可以包括樹脂做的黏著劑，並且配置在例如聚乙烯基膜、聚烯烴膜或聚對苯二甲酸乙酯(PET)膜的膜上。可以施加包封物或密封物410以密封半導體封裝，包括晶粒402、膏層404、帶406、引線框408。
雖然圖3所描述和顯示的封裝300具有三個長度的框帶308，不過這單純是示範可以使用多重長度的框帶308。根據其他具體態樣，或可使用更多或更少之長度或形狀的框帶308。事實上，全然不同的引線框形狀和尺寸可以搭配揭示的主題來使用。圖5顯示一個此種替代選擇例。
圖5是顯示根據本揭示多樣的具體態樣之半導體封裝500的示意圖。半導體封裝500包括半導體晶粒502，其使用黏著膏506和框帶508而附著於引線框504。於某些具體態樣，用於連接晶粒502和帶508之黏著膏506的份量乃控制成使得它提供對框帶508的最大覆蓋度而不溢流出框帶508的邊緣。於其他具體態樣，黏著膏506所用的份量單純決定成使得它將不溢流出框帶308。
相較於圖3，圖5所顯示的封裝500具有僅單一長度的框帶508。引線框504可以用於將封裝引線510連接到半導體晶粒502之適合的導體。雖然圖5顯示總共有48根引線腳510，不過應了解這祇是為了解釋，並且或可使用任何數目、式樣或形狀的引線腳而仍落在本揭示的範圍和精神裡。
圖5所示的黏著膏506可以包括任何適合的黏著膏材料。舉例來說，根據某些具體態樣，黏著膏506包括膏狀黏著劑，其是電絕緣的或是導電或導熱的，此視特定的應用而定。舉例來說，如果想要有電絕緣的黏著劑506，則可以使用整個基於聚合物的黏著膏。類似而言，當想要有導熱或導電的黏著膏506時，可以使用熱或導熱的黏著膏。於圖5，黏著膏506用於將晶粒502附著於引線框504的襯墊。以此方式，黏著膏可以用於形成COL封裝500。
圖6是顯示根據本揭示多樣的具體態樣而封裝晶粒(例如晶粒302)之方法600的流程圖。為了幫助解釋，雖然方法600也將參考圖3來描述，但是應了解方法600不限於圖3所示的特定具體態樣。根據方法600，在階段602，將晶粒302做適合的定位而使它能夠讓黏著膏306來對它 施加。
在階段604，決定黏著膏306施加到晶粒302的適合份量。根據某些具體態樣，可以想要的是依多樣的因素而定來變化黏著膏306的份量。舉例來說，黏著膏306的種類(例如基於聚合物的或是填充有銀的)可以影響須要施加到晶粒302之黏著膏306的份量和圖案(形狀)。類似而言，晶粒302的特定幾何形態也或可影響黏著膏306所需的份量。於某些具體態樣，黏著膏306施加到晶粒302的份量可以決定成為將提供最大覆蓋度而舉例來說不溢流出框帶308之邊緣的份量。
在階段606，將決定份量的黏著膏306施加到晶粒302。根據某些具體態樣，黏著膏306或可施加在晶粒302上的多重位置。舉例來說，黏著膏306可以施加在晶粒302上要配置框帶308的點。於此種具體態樣，黏著膏306可以施加成使得它不溢流出帶308的邊緣。於某些具體態樣，也可能的是黏著膏306僅施加在單一位置。
在階段608，晶粒302使用黏著膏306而附著於引線框304。舉例來說，晶粒302或可附著於引線框襯墊。於某些具體態樣，將晶粒302附著於引線框304可以包括將框帶308配置在黏著膏306和引線框304之間。在階段610，將黏著膏306熟化(例如藉由將特殊波長的光施加到黏著膏來為之)而適合於所採用之黏著膏的特殊類型。在階段612，可以根據適合的方法而完成封裝晶粒302的過程。
要體會【實施方式】一節而非【發明內容】和【摘要】(如果有的話)打算用於解讀申請專利範圍。【發明內容】和【摘要】(如果有的話)可以列出如(多個)發明人所思及之本發明的一或更多個但非全部的範例 性具體態樣，因此不打算以任何方式來限制本發明或所附的申請專利範圍。
雖然本發明已經為了範例性領域和應用而在此參考範例性具體態樣來描述，不過應了解本發明不限於此。可能有其他的具體態樣和修改，而它們是在本發明的範圍和精神裡。舉例來說而不限制此段落的一般性，具體態樣不限於圖中所示範和/或在此所描述的軟體、硬體、韌體和/或實體。進一步而言，具體態樣(不論在此是否有明確描述)對於超過在此所述之範例的領域和應用來說具有顯著的實用性。
已經在功能性方塊的輔助下而在此描述了具體態樣，該等方塊示範指定之功能及其關係的實施例。這些功能性方塊的邊界已經為了方便敘述而在此做任意的界定。可以界定替代選擇的邊界，祇要適合的進行指定的功能和關係(或其等同者)即可。並且，替代性具體態樣可以使用異於在此所述的次序來進行功能性方塊、步驟、操作、方法……。
在此對於「一具體態樣」、「具體態樣」、「範例性具體態樣」或類似用語的參照是指所述的具體態樣可以包括特殊的特色、結構或特徵，但是每一個具體態樣可以未必都包括特殊的特色、結構或特徵。再者，此等用語未必是指同一具體態樣。進一步而言，當特殊的特色、結構或特徵配合具體態樣來描述時，熟於(多個)相關技藝的人士會知道將此種特色、結構或特徵併入其他的具體態樣裡，而不論在此是否有明確提及或描述。
本發明的廣度和範圍不應由上述任何範例性具體態樣所限制，而應僅依據以下的申請專利範圍及其等同者來界定。
400‧‧‧半導體封裝
402‧‧‧半導體晶粒
404‧‧‧黏著膏
406‧‧‧帶層
408‧‧‧引線框
410‧‧‧包封物或密封物

Claims (20)

  1. 一種半導體封裝，其包括：半導體晶粒，其具有頂側和底側；引線框，其配置在該半導體晶粒底下；膏層，其配置在該半導體晶粒之部分的該底側上，使得該膏層將該半導體晶粒固定於部分的該引線框；以及包封物，其包住該半導體晶粒、該引線框以及該膏層。
  2. 如申請專利範圍第1項的半導體封裝，其中該膏層是不連續的，使得該膏層留下部分的該半導體晶粒未被該膏層所覆蓋。
  3. 如申請專利範圍第1項的半導體封裝，其進一步包括：晶粒附著槳(die attach paddle)，其包括配置在該半導體晶粒和該引線框之間的帶層。
  4. 如申請專利範圍第3項的半導體封裝，其中該帶層包括多個帶條，其配置在該半導體晶粒和該引線框之間。
  5. 如申請專利範圍第3項的半導體封裝，其中該膏層配置在該半導體晶粒和該帶層之間。
  6. 如申請專利範圍第5項的半導體封裝，其中該膏層僅配置在部分的該帶層上。
  7. 如申請專利範圍第1項的半導體封裝，其中該膏層包括非導電膏。
  8. 如申請專利範圍第1項的半導體封裝，其進一步包括配置在該半導體晶粒和該引線框之間的襯墊。
  9. 如申請專利範圍第8項的半導體封裝，其中至少部分的該膏層配置 在該半導體晶粒和該襯墊之間。
  10. 如申請專利範圍第1項的半導體封裝，其中該膏層建構成承受打線接合溫度而不脫層。
  11. 一種封裝半導體裝置的方法，其包括：提供半導體晶粒，其具有頂側和底側；提供引線框，其配置在該半導體晶粒底下；施加膏層到該半導體晶粒之部分的該底側；使用該膏層而將該半導體晶粒定位在該引線框上；以及固化該膏層以將該半導體晶粒接合於該引線框。
  12. 如申請專利範圍第11項的方法，其中施加該膏層包括：配置該膏層，使得它是不連續的並且留下部分的該半導體晶粒未被該膏層所覆蓋。
  13. 如申請專利範圍第11項的方法，其進一步包括：藉由將帶層配置在該半導體晶粒和該引線框之間，而形成晶粒附著槳。
  14. 如申請專利範圍第13項的方法，其中該帶層包括多個帶條，其配置在該半導體晶粒和該引線框之間。
  15. 如申請專利範圍第13項的方法，其中該膏層配置在該半導體晶粒和該帶層之間。
  16. 如申請專利範圍第15項的方法，其中該膏層僅配置在部分的該帶層上。
  17. 如申請專利範圍第11項的方法，其中該膏層包括非導電膏。
  18. 如申請專利範圍第11項的方法，其進一步包括：將襯墊配置在該半導體晶粒和該引線框之間。
  19. 如申請專利範圍第18項的方法，其中至少部分的該膏層配置在該半導體晶粒和該襯墊之間。
  20. 如申請專利範圍第11項的方法，其中該膏層建構成承受打線接合溫度而不脫層。
TW105122050A 2015-08-13 2016-07-13 使用膏狀晶粒附著材料的在引線上黏貼的晶片以及封裝半導體裝置的方法 TWI728983B (zh)

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TWI728983B (zh) 2021-06-01
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US20170047272A1 (en) 2017-02-16
CN107430983A (zh) 2017-12-01

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