TW201619029A - Holding apparatus, vacuum processing apparatus - Google Patents

Holding apparatus, vacuum processing apparatus Download PDF

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Publication number
TW201619029A
TW201619029A TW104112704A TW104112704A TW201619029A TW 201619029 A TW201619029 A TW 201619029A TW 104112704 A TW104112704 A TW 104112704A TW 104112704 A TW104112704 A TW 104112704A TW 201619029 A TW201619029 A TW 201619029A
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Taiwan
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holding
vacuum
adhesive pad
holding device
contact portion
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TW104112704A
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Chinese (zh)
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TWI602764B (en
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嶽良太
前平謙
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愛發科股份有限公司
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Liquid Crystal (AREA)

Abstract

The invention provides a holding device and a vacuum treatment device. A held object is subjected to vacuum treatment, while exhaust gas on an adhesive pad is not discharged to vacuum environment. The adhesive pad (17) is arranged in a vacuum device (15) of the holding device (11). When the held object (5) is kept in an adhesion state, a contact part (18) on the edge of the vacuum device (15) is pressed to enable inner space (25) of the vacuum device (15) to be separated from outer space (26). The inner space (25) of the vacuum device (15) is subjected to vacuum exhaust in advance via an exhaust vent (14) in the vacuum device (15). When vacuum treatment is carried out, the exhaust vent (14) is in a state with no gas passing through, so that the exhaust gas from the adhesive pad (17) is not discharged to the environment where vacuum treatment of the held object (5) is performed.

Description

保持裝置、真空處理裝置 Holding device, vacuum processing device

本發明係關於能將保持對象物利用黏著薄片來保持而在真空氛圍中移動之保持裝置,以及對藉由保持裝置所保持的保持對象物進行真空處理之真空處理裝置。 The present invention relates to a holding device capable of holding a holding object by an adhesive sheet and moving in a vacuum atmosphere, and a vacuum processing device for vacuum-treating the holding object held by the holding device.

在液晶顯示器(LCD)、電漿顯示器(PDP)等的平面顯示器之製造過程,係包含基板組裝製程、基板搬運製程,為了保持基板而使用黏著夾頭裝置的技術是已知的。 In the manufacturing process of a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP), a substrate assembly process and a substrate transfer process are included, and a technique of using an adhesive chuck device for holding a substrate is known.

例如日本特許第3882004號公報所記載的裝置,是將由基板搬運用機器人所移送的基板,以既定壓力按壓在保持板上所配置的黏著構件,利用黏著構件的黏著力來保持基板。又記載著,藉由將被黏著構件和基板包圍的凹部實施真空吸引,而能更強力地吸引保持。 For example, the device described in Japanese Patent No. 3882004 is a substrate on which a substrate transferred by a substrate transport robot is pressed against a holding plate at a predetermined pressure, and the substrate is held by the adhesive force of the adhesive member. It is also described that the concave portion surrounded by the adhering member and the substrate is vacuum-sucked, so that the holding can be more strongly attracted.

依據該裝置,是利用由變形膜所區隔的凹部和封閉空間的壓力差來使可動膜變形,以進行基板和黏著構件之剝離或黏著保持,此外,藉由具備通氣路及吸氣 源,也能在利用真空吸引來進行吸引保持或剝離時使氣體噴出。 According to the device, the movable film is deformed by the pressure difference between the concave portion and the closed space partitioned by the deformed film to perform peeling or adhesion holding of the substrate and the adhesive member, and further, by providing a ventilation path and inhaling The source can also eject the gas when suction suction or peeling is performed by vacuum suction.

然而,依據該公報所記載的吸附保持,如果 在尚未到達充分真空度的狀態下就進行黏著墊和基板的貼合,當黏著構件和基板貼合時會發生捲入空氣的問題,因為黏著力是取決於基板和黏著構件的接觸面積,若捲入空氣會使接觸面積變小,黏著力降低,可能導致基板落下。 However, according to the adsorption retention described in the publication, if When the adhesive pad and the substrate are bonded to each other without reaching a sufficient degree of vacuum, the problem of entrapment of air occurs when the adhesive member and the substrate are bonded, because the adhesive force depends on the contact area of the substrate and the adhesive member. Entrapment of air reduces the contact area and reduces the adhesion, which may cause the substrate to fall.

此外,在黏著墊和基板密合的部分,因為沒 有壓力差而未產生緊壓力,為了確保強緊壓力必須將黏著墊間的空間加大,可能因壓力而造成基板變形,又可能必須使裝置大型化。 In addition, in the part where the adhesive pad and the substrate are in close contact, because there is no There is a pressure difference without generating a tight pressure. In order to ensure a strong pressing pressure, the space between the adhesive pads must be increased, the substrate may be deformed due to pressure, and the device may have to be enlarged.

此外,在利用變形膜所區隔的凹部和封閉空 間產生壓力差,藉此將配置於變形膜之黏著墊往基板方向緊壓,依據變形膜和黏著墊的接合部之壓力分布,黏著墊的黏著表面可能發生變形而無法和基板形成強固的密合。 In addition, the recesses and closed spaces that are separated by the deformed film A pressure difference is generated therebetween, whereby the adhesive pad disposed on the deformed film is pressed toward the substrate. According to the pressure distribution of the joint between the deformed film and the adhesive pad, the adhesive surface of the adhesive pad may be deformed to form a strong dense bond with the substrate. Hehe.

此外,基板之與黏著構件貼合側為相反側的 基板表面(成膜面),會接觸基板搬運用機器人的構件而發生粒子(particle)。特別是有機EL顯示器之玻璃基板的成膜面上的粒子,會對元件特性造成不良影響。 In addition, the bonding side of the substrate and the adhesive member are opposite sides The surface of the substrate (film formation surface) contacts the member of the substrate transport robot to generate particles. In particular, particles on the film formation surface of the glass substrate of the organic EL display adversely affect the device characteristics.

日本特開2011-35301號公報所揭示的裝置, 是在支承板配置黏著墊,使由支承板之黏著墊配置側和板狀工件所包圍的吸附溝槽成為負壓,利用壓力按壓支承板而使黏著墊和板狀工件密合,又使配置有黏著墊之吸附溝槽回復大氣壓,使支承板之未配置黏著墊側的調壓室成為 負壓,讓壓力作用於支承板而從板狀工件將黏著墊剝離。 The device disclosed in Japanese Laid-Open Patent Publication No. 2011-35301, The adhesive pad is disposed on the support plate so that the adsorption groove surrounded by the adhesive pad arrangement side of the support plate and the plate-shaped workpiece becomes a negative pressure, and the pressure pad is pressed against the support plate to make the adhesive pad and the plate-like workpiece close to each other, and the configuration is further configured. The adsorption groove with the adhesive pad returns to the atmospheric pressure, so that the pressure regulating chamber on the side of the support plate on which the adhesive pad is not disposed becomes Negative pressure causes pressure to act on the support plate to peel the adhesive pad from the plate-like workpiece.

日本特許第4746579號公報所記載的裝置, 是利用負壓來吸附黏著劑薄片及基板,此外,藉由使用彈性多孔質薄片,不僅能利用負壓來吸附基板,還能降低基板的應力。然而,相對於彈性多孔質薄片的吸附面,因為多孔質的面積小,而使作用於基板之負壓降低,存在著無法拿起重型基板的問題。此外,使用彈性多孔質薄片的方法,並無法在真空中使用。 The device described in Japanese Patent No. 4746579, The adhesive sheet and the substrate are adsorbed by a negative pressure, and by using the elastic porous sheet, not only the negative pressure can be used to adsorb the substrate, but also the stress of the substrate can be reduced. However, with respect to the adsorption surface of the elastic porous sheet, since the area of the porous material is small, the negative pressure acting on the substrate is lowered, and there is a problem that the heavy substrate cannot be picked up. Further, the method of using an elastic porous sheet cannot be used in a vacuum.

[專利文獻1]日本特開2011-35301號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-35301

[專利文獻2]日本特許第3882004號公報 [Patent Document 2] Japanese Patent No. 3882004

[專利文獻3]日本特許第3917651號公報 [Patent Document 3] Japanese Patent No. 3917651

[專利文獻4]日本特許第4746579號公報 [Patent Document 4] Japanese Patent No. 4746579

本發明是為了解決上述習知技術的課題而開發完成的發明,係提供一種保持裝置,不與保持對象物之待真空處理的表面接觸,能確實將保持對象物予以保持而在真空氛圍中移動。 The present invention has been developed in order to solve the above problems of the prior art, and provides a holding device that does not contact the surface of the object to be vacuum-treated, and can surely hold the object to be held and move in a vacuum atmosphere. .

此外,還提供一種真空處理裝置,是藉由該保持裝置將保持對象物予以保持而進行真空處理。 Further, a vacuum processing apparatus is provided which performs vacuum processing by holding a holding object by the holding means.

一般而言,縱使在真空中也能將黏著構件和基板貼合,但在基板之與黏著構件貼合的部分為相反側之基板表面(成膜面),會與基板搬運用機器人的構件接觸,而可能產生粒子。 In general, even when the adhesive member and the substrate can be bonded together in a vacuum, the substrate surface (film formation surface) on the opposite side of the portion where the substrate is bonded to the adhesive member is in contact with the member of the substrate transfer robot. And may produce particles.

在成膜面以非接觸的方式來保持基板的情況,利用真空吸附、或利用基板本身重量而將黏著構件和基板予以黏著保持的方法是可考慮的,前者的情況在真空中並無法使用。 In the case where the substrate is held in a non-contact manner on the film formation surface, a method of adhering the adhesive member and the substrate by vacuum suction or by using the weight of the substrate itself is conceivable, and the former may not be used in a vacuum.

利用基板本身重量來按壓黏著墊的情況,只要將基板和黏著墊接觸的部分之面積縮小,就能使每單位面積的按壓力增加,而使黏著保持力變強,但在將基板懸吊保持的場合,基板和黏著部分之間的剝離力也會增加,而有基板落下之虞。 When the adhesive pad is pressed by the weight of the substrate itself, as long as the area of the portion where the substrate and the adhesive pad are in contact is reduced, the pressing force per unit area can be increased, and the adhesive holding force is enhanced, but the substrate is suspended and held. In this case, the peeling force between the substrate and the adhesive portion is also increased, and there is a flaw in the substrate falling.

相反的,若相對於基板將黏著部分的面積加大,則每單位面積的按壓力減少,基板和黏著墊之接觸面積會減少而使黏著保持力降低。在此情況也是,當將基板懸吊保持的情況,會有基板落下之虞。 Conversely, if the area of the adhesive portion is increased with respect to the substrate, the pressing force per unit area is reduced, and the contact area between the substrate and the adhesive pad is reduced to lower the adhesive holding force. Also in this case, when the substrate is suspended and held, there is a possibility that the substrate is dropped.

另一方面,當黏著墊的黏著力增強的情況,在將基板剝離時會對基板施加局部的應力而有發生破損之虞,或有使基板產生變形之虞。 On the other hand, when the adhesion of the adhesive pad is enhanced, local stress is applied to the substrate when the substrate is peeled off, and damage may occur or the substrate may be deformed.

本發明所採用的技術,是為了解決上述各問題而開發完成的,本發明的保持裝置,是用來讓設置於保持單元之黏著墊接觸保持對象物,利用前述黏著墊將前述保持對象物予以黏著保持而進行搬運;前述保持單元係具 有真空容器、接觸部、排氣孔以及移動裝置,該接觸部,是配置在前述真空容器的邊緣,其與前述保持對象物接觸而使前述真空容器的內部空間和前述真空容器的外部空間隔離;該排氣孔,是設置於前述真空容器,成為將前述內部空間的氣體藉由吸附用排氣裝置進行真空排氣的通路,該內部空間是藉由前述保持對象物和前述接觸部而與前述外部空間隔離;該移動裝置是用來使前述黏著墊移動;前述黏著墊配置於前述內部空間,前述移動裝置使前述黏著墊移動的方向、即移動方向係具有:相對於前述接觸部的表面中之與前述保持對象物接觸的部分所在的接觸平面為垂直方向之移動成分。 The technique used in the present invention has been developed to solve the above problems. The holding device of the present invention is for allowing an adhesive pad provided on a holding unit to contact an object to be held, and the holding object is used by the adhesive pad. Carrying and holding; the aforementioned holding unit a vacuum container, a contact portion, a vent hole, and a moving device, wherein the contact portion is disposed at an edge of the vacuum container, and is in contact with the holding object to isolate an inner space of the vacuum container from an outer space of the vacuum container The vent hole is provided in the vacuum container, and serves to evacuate a gas in the internal space by suction and exhaust means, and the internal space is formed by the object to be held and the contact portion. The external space is isolated; the moving device is configured to move the adhesive pad; the adhesive pad is disposed in the inner space, and the moving device moves the direction in which the adhesive pad moves, that is, the moving direction: a surface relative to the contact portion The contact plane in which the portion in contact with the object to be held is located is a moving component in the vertical direction.

本發明的保持裝置,係具有:複數個前述真空容器、以及配置於各前述真空容器之前述黏著墊;複數個前述黏著墊和配置在複數個前述真空容器的邊緣之前述接觸部,是與同一個前述保持對象物接觸。 The holding device of the present invention includes: a plurality of the vacuum containers; and the adhesive pad disposed in each of the vacuum containers; and the plurality of the adhesive pads and the contact portion disposed at an edge of the plurality of vacuum containers are the same One of the aforementioned holding objects is in contact.

本發明的保持裝置,係具有配置在同一個前述真空容器之前述內部空間的複數個前述黏著墊,複數個前述黏著墊和配置在前述真空容器的邊緣之前述接觸部,是與同一個前述保持對象物接觸。 The holding device of the present invention has a plurality of the adhesive pads disposed in the inner space of the same vacuum container, and the plurality of the adhesive pads and the contact portion disposed at the edge of the vacuum container are maintained in the same manner as the foregoing Object contact.

在本發明中,前述接觸部是採用具有柔軟性的環狀構件。 In the present invention, the contact portion is a ring-shaped member having flexibility.

在本發明中,前述接觸部配置在前述保持裝置之平坦表面上。 In the invention, the contact portion is disposed on a flat surface of the holding device.

在本發明中,是在前述保持裝置的表面設有溝槽,前 述接觸部設置在前述溝槽內。 In the present invention, a groove is provided on the surface of the aforementioned holding device, The contact portion is disposed in the aforementioned groove.

在本發明中,前述接觸部是由密合薄片所構成,該密合薄片是配置在前述真空容器上,且將成為貫通孔之薄片孔形成在前述真空容器的開口上。 In the present invention, the contact portion is formed of a pressure-sensitive adhesive sheet which is disposed on the vacuum container, and a sheet hole which is a through hole is formed in the opening of the vacuum container.

在本發明中,係具有旋轉機構,該旋轉機構是使前述黏著墊,相對於前述真空容器朝向遠離前述接觸部的方向一邊旋轉一邊移動。 In the present invention, there is provided a rotating mechanism that moves the adhesive pad while rotating in a direction away from the contact portion with respect to the vacuum container.

本發明之保持裝置,係具有使前述保持裝置連接於前述吸附用排氣裝置之裝卸裝置;前述裝卸裝置,是讓前述保持裝置與前述吸附用排氣裝置分離,而使前述保持裝置和前述吸附用排氣裝置可個別移動。 The holding device of the present invention includes a loading and unloading device that connects the holding device to the adsorption exhaust device, and the loading and unloading device separates the holding device from the adsorption exhaust device to cause the holding device and the adsorption device It can be moved individually with the exhaust device.

在本發明中,前述真空容器設定成,當其從前述吸附用排氣裝置分離時,不讓氣體通過前述排氣孔而流入前述真空容器內。 In the present invention, the vacuum container is set such that when it is separated from the adsorption exhaust device, gas is prevented from flowing into the vacuum container through the exhaust hole.

在本發明中,是藉由具有彈力的緩衝構件,對黏著在前述保持對象物上的前述黏著墊朝向離開前述保持對象物的方向施力。 In the present invention, the elastic pad that is adhered to the object to be held is biased in a direction away from the object to be held by a resilient cushioning member.

本發明之真空處理裝置,係具備上述任一個保持裝置、真空槽以及處理部;在該真空槽內配置前述保持裝置;該處理部,是配置在前述真空槽內,將藉由前述黏著墊予以黏著保持且處理表面朝下之前述保持對象物的前述處理表面在真空氛圍中進行處理。 The vacuum processing apparatus according to the present invention includes any one of the above holding devices, a vacuum chamber, and a processing unit; the holding device is disposed in the vacuum chamber; the processing unit is disposed in the vacuum chamber and is provided by the adhesive pad The aforementioned treated surface of the aforementioned object to be held which is adhered and treated with the treatment surface facing downward is treated in a vacuum atmosphere.

在本發明中,前述處理部是釋出用來形成薄膜的微粒子而在前述保持對象物表面形成薄膜的成膜裝置。 In the present invention, the processing unit is a film forming apparatus that releases fine particles for forming a thin film and forms a thin film on the surface of the holding target.

依據本發明,在將黏著墊按壓於保持對象物時,保持對象物被真空吸附住,因此黏著墊可確實地密合於保持對象物,而使黏著墊對於保持對象物之黏著保持力提高。 According to the present invention, when the adhesive pad is pressed against the object to be held, since the object to be held is vacuum-adsorbed, the adhesive pad can be surely adhered to the object to be held, and the adhesive holding force of the adhesive pad to the object to be held can be improved.

此外,因為是在真空中使黏著墊和保持對象物黏著,在互相黏著後之黏著墊的表面和保持對象物之間沒有氣體的存在。 Further, since the adhesive pad and the holding object are adhered in a vacuum, there is no gas existing between the surface of the adhesive pad adhered to each other and the object to be held.

此外,能將保持對象物之單側表面以非接觸的方式予以黏著保持而進行搬運,因此可防止不良品的發生。 Further, since the one-side surface of the object to be held can be adhered and held in a non-contact manner, it is possible to prevent the occurrence of defective products.

此外,黏著墊的黏著物質是屬於有機物質,會有釋出氣體從黏著墊釋出,藉由構成為利用復原力而使保持對象物往接觸部按壓及避免氣體從真空容器的排氣孔流入,在真空處理中,因為真空容器的內部空間是與外部空間隔離,可避免釋出氣體釋出到配置有真空處理中的處理對象物之處理室內。 In addition, the adhesive substance of the adhesive pad belongs to an organic substance, and the released gas is released from the adhesive pad, and is configured to press the holding object to the contact portion by the restoring force and prevent the gas from flowing from the vent hole of the vacuum container. In the vacuum processing, since the internal space of the vacuum container is isolated from the external space, the released gas can be prevented from being released into the processing chamber in which the object to be treated is disposed in the vacuum processing.

此外,由於是利用複數個保持單元來保持一個保持對象物,能使施加於保持對象物的力分散,而抑制保持對象物之龜裂、變形。 In addition, since a plurality of holding means are used to hold one object to be held, the force applied to the object to be held can be dispersed, and cracking and deformation of the object to be held can be suppressed.

5‧‧‧保持對象物 5‧‧‧ Keep objects

10‧‧‧真空處理裝置 10‧‧‧Vacuum treatment unit

11、11a、11b、11c‧‧‧保持裝置 11, 11a, 11b, 11c‧‧‧ Keeping device

13、13a‧‧‧保持單元 13, 13a‧‧‧Holding unit

14‧‧‧排氣孔 14‧‧‧ venting holes

15、65‧‧‧真空容器 15, 65‧‧‧vacuum containers

17‧‧‧黏著墊 17‧‧‧Adhesive pad

18、18a、18b、18c‧‧‧接觸部 18, 18a, 18b, 18c‧ ‧ contact

19‧‧‧開口 19‧‧‧ openings

21‧‧‧真空槽 21‧‧‧vacuum tank

25‧‧‧內部空間 25‧‧‧Internal space

26‧‧‧外部空間 26‧‧‧External space

38‧‧‧薄片孔 38‧‧‧Sheet hole

39‧‧‧密合薄片(接觸部) 39‧‧‧ Closed sheet (contact)

40‧‧‧裝卸裝置 40‧‧‧Handling device

59‧‧‧旋轉機構 59‧‧‧Rotating mechanism

圖1係顯示本發明的真空處理裝置。 Fig. 1 shows a vacuum processing apparatus of the present invention.

圖2(a)係顯示未保持保持對象物的狀態之本發明的第一例之保持裝置,圖2(b)係顯示複數個保持單元保持著保持對象物的狀態之第一例的保持裝置。 Fig. 2 (a) shows a holding device of a first example of the present invention in a state in which a holding object is not held, and Fig. 2 (b) shows a holding device of a first example in which a plurality of holding units hold a state in which an object is held. .

圖3(a)係顯示複數個黏著墊按壓於同一個保持對象物的狀態之第一例的保持裝置,圖3(b)係顯示保持對象物藉由複數個黏著墊予以黏著保持的狀態。 Fig. 3(a) shows a holding device of a first example in which a plurality of adhesive pads are pressed against the same holding object, and Fig. 3(b) shows a state in which the holding object is adhered and held by a plurality of adhesive pads.

圖4(a)係顯示未保持保持對象物的保持單元,圖4(b)係顯示保持有保持對象物之保持單元。 Fig. 4(a) shows a holding unit that does not hold the object to be held, and Fig. 4(b) shows a holding unit that holds the object to be held.

圖5(a)係顯示按壓於同一個保持對象物的狀態之黏著墊,圖5(b)係顯示保持對象物藉由黏著墊予以黏著保持的狀態。 Fig. 5(a) shows an adhesive pad that is pressed against the same holding object, and Fig. 5(b) shows a state in which the holding object is adhered and held by the adhesive pad.

圖6(a)係顯示將保持對象物懸吊的狀態,圖6(b)係顯示藉由移動板的旋轉和下降而使黏著墊離開保持對象物的狀態。 Fig. 6(a) shows a state in which the object to be held is suspended, and Fig. 6(b) shows a state in which the adhesive pad is separated from the object to be held by the rotation and lowering of the moving plate.

圖7(a)係顯示旋轉前的移動板,圖7(b)係顯示旋轉後的移動板。 Fig. 7(a) shows the moving plate before the rotation, and Fig. 7(b) shows the moving plate after the rotation.

圖8係用來說明第二例的保持裝置之圖(1)。 Fig. 8 is a view (1) for explaining the holding device of the second example.

圖9係用來說明第二例的保持裝置之圖(2)。 Fig. 9 is a view (2) for explaining the holding device of the second example.

圖10係用來說明第二例的保持裝置之圖(3)。 Fig. 10 is a view (3) for explaining the holding device of the second example.

圖11係用來說明第三例的保持裝置。 Figure 11 is a view for explaining the holding device of the third example.

圖12係用來說明第四例的保持裝置。 Figure 12 is a view for explaining the holding device of the fourth example.

圖13(a)~(c)係第二例~第四例的保持裝置之俯視圖。 13(a) to (c) are plan views of the holding devices of the second to fourth examples.

圖14係用來說明第五例的保持裝置。 Figure 14 is a view for explaining the holding device of the fifth example.

圖1的符號10表示本發明的真空處理裝置。 Reference numeral 10 of Fig. 1 denotes a vacuum processing apparatus of the present invention.

該真空處理裝置10具有真空槽21,該真空槽21和前製程的真空槽281之間、該真空槽21和後製程的真空槽282之間,分別藉由主閘閥291、292來連接。 The vacuum processing device 10 has a vacuum chamber 21 between the vacuum chamber 21 and the vacuum chamber 28 1 of the pre-process, between the vacuum chamber 21 and the vacuum chamber 28 2 of the post-process, respectively, by the main gate valves 29 1 , 29 2 Come connect.

在此,真空槽21被區隔成配置室22a、處理 室22b、分離室22c,配置室22a和處理室22b之間、處理室22b和分離室22c之間,分別藉由副閘閥27a、27b來連接。 Here, the vacuum chamber 21 is partitioned into the arrangement chamber 22a, and processed. The chamber 22b, the separation chamber 22c, the arrangement chamber 22a and the processing chamber 22b, and the processing chamber 22b and the separation chamber 22c are connected by sub-gate valves 27a and 27b, respectively.

首先,將主閘閥291、292和副閘閥27a、27b關閉,使各室22a~22c間、各真空槽21、281、282間隔離。 First, the main gate valves 29 1 and 29 2 and the sub gate valves 27a and 27b are closed, and the vacuum chambers 21, 28 1 and 28 2 are separated between the chambers 22a to 22c.

在前製程的真空槽281和配置室22a導入空 氣、氮氣而事先成為大氣壓。在開始進行真空處理裝置10的處理時,先將真空處理裝置10的真空槽21和前製程的真空槽281之間的主閘閥291開啟,將搬運機器人的手臂311上所載置之基板狀的保持對象物5從前製程的真空槽281內搬入配置室22a內。 Air and nitrogen are introduced into the vacuum chamber 28 1 and the arranging chamber 22a of the front process to be atmospheric pressure in advance. When the processing of the vacuum processing apparatus 10 is started, the main gate valve 29 1 between the vacuum chamber 21 of the vacuum processing apparatus 10 and the vacuum tank 28 1 of the front process is first opened, and the arm 31 1 of the transport robot is placed thereon. The substrate-shaped holding object 5 is carried into the arrangement chamber 22a from the vacuum chamber 28 1 of the front process.

在配置室22a的內部,在比手臂311更下方的 位置配置本發明的第一例之保持裝置11a。圖1的符號11b、11c分別表示從配置室22a移動到處理室22b和分離室22c之保持裝置。圖1所示的保持裝置11a~11c具有同樣的構造,在圖2(a)、(b)、圖3(a)、(b)中係顯示,代表相同構造的保持裝置11a~11c之保持裝置11。 In the inside of the arranging chamber 22a, the holding device 11a of the first example of the present invention is disposed at a position lower than the arm 31 1 . Reference numerals 11b and 11c of Fig. 1 respectively denote holding means for moving from the arrangement chamber 22a to the processing chamber 22b and the separation chamber 22c. The holding devices 11a to 11c shown in Fig. 1 have the same structure, and are shown in Figs. 2(a), (b), 3(a), and (b), and represent the holding devices 11a to 11c of the same configuration. Device 11.

以下說明第一例的保持裝置11,首先參照圖 2(a),保持裝置11係具有連結板41、固定於連結板41之一個至複數個的保持單元13。 The holding device 11 of the first example will be described below, first referring to the figure. 2 (a), the holding device 11 has a connecting plate 41 and one of the connecting plates 41 fixed to the plurality of holding units 13.

圖4(a)顯示一台的保持單元13的放大圖。保持單元13係具有真空容器15及接觸部18。接觸部18,在本例是將具有柔軟性的材料成形為環狀而構成,在形成真空容器15的開口19之邊緣上,配置成圍繞真空容器15的開口19。 Fig. 4(a) shows an enlarged view of one holding unit 13. The holding unit 13 has a vacuum container 15 and a contact portion 18. In the present example, the contact portion 18 is formed by forming a material having flexibility into a ring shape, and is disposed around the opening 19 of the vacuum container 15 at the edge of the opening 19 forming the vacuum container 15.

各保持單元13的真空容器15,朝向同一方向而分別固定於連結板41。 The vacuum containers 15 of the respective holding units 13 are fixed to the connecting plate 41 in the same direction.

在真空容器15的內部空間,在比真空容器15的開口19更靠底面側的位置配置黏著墊17。 In the internal space of the vacuum container 15, the adhesive pad 17 is arrange|positioned at the bottom surface side rather than the opening 19 of the vacuum container 15.

在各真空容器15的底面形成有貫通孔54。在貫通孔54插穿支承棒52,支承棒52的一端位於真空容器15的底面和邊緣之間的內部空間25,在該一端固定著支承板53,黏著墊17是固定在支承板53上。 A through hole 54 is formed in the bottom surface of each vacuum container 15. The support rod 52 is inserted through the through hole 54. One end of the support rod 52 is located in the inner space 25 between the bottom surface and the edge of the vacuum container 15, and the support plate 53 is fixed at one end, and the adhesive pad 17 is fixed to the support plate 53.

支承棒52的另一端位於真空容器15的外部空間26,在該另一端固定著移動板51。 The other end of the support rod 52 is located at the outer space 26 of the vacuum vessel 15, at which the moving plate 51 is fixed.

在貫通孔54的內部配置軸密封材57和軸承58。 A shaft seal member 57 and a bearing 58 are disposed inside the through hole 54.

支承棒52與軸密封材57密合,藉由軸密封材57使真空容器15的內部空間25和外部空間26氣密地隔離,此外,支承棒52是在貫通孔54的內部藉由軸承58予以保持。 The support rod 52 is in close contact with the shaft seal member 57, and the inner space 25 of the vacuum container 15 and the outer space 26 are hermetically separated by the shaft seal member 57. Further, the support rod 52 is inside the through hole 54 by the bearing 58. Keep it.

支承棒52構成為,在與軸密封材57和軸承 58接觸而使內側空間25和外側空間26隔離的狀態下,可沿著貫通孔54的長度方向移動,藉由使支承棒52沿著貫通孔54的長度方向往復移動,能使黏著墊17在真空容器15的內部空間25內移動到開口19側和底面側。 The support rod 52 is configured to be in contact with the shaft seal 57 and the bearing When the inner space 25 and the outer space 26 are separated by contact, the inner space 25 and the outer space 26 are separated from each other, and the support rod 52 can be reciprocated along the longitudinal direction of the through hole 54 so that the adhesive pad 17 can be placed. The inside of the internal space 25 of the vacuum vessel 15 is moved to the side of the opening 19 and the side of the bottom surface.

在外部空間26,在與連結板41隔著間隔的位 置設置成可相對於連結板41移動之按壓板44,是配置在面對移動板51的位置。 In the external space 26, at a position spaced apart from the web 41 The pressing plate 44 provided to be movable with respect to the coupling plate 41 is disposed at a position facing the moving plate 51.

在移動板51和按壓板44之間配置按壓構件45。 A pressing member 45 is disposed between the moving plate 51 and the pressing plate 44.

按壓構件45具有抵接板48及緩衝構件49,抵接板48是透過緩衝構件49來安裝於按壓板44。 The pressing member 45 has an abutting plate 48 and a cushioning member 49, and the abutting plate 48 is attached to the pressing plate 44 through the cushioning member 49.

在該真空處理裝置10,設有用來使黏著墊17 移動的移動裝置。圖2(a)、圖4(a)的符號47表示移動裝置所具有的馬達,藉由使該馬達47動作,利用移動裝置使按壓板44和真空容器15相對地移動而改變距離。 In the vacuum processing apparatus 10, there is provided an adhesive pad 17 Mobile mobile device. Reference numeral (a) and (a) of Fig. 4 (a) denote a motor included in the moving device. When the motor 47 is operated, the pressing plate 44 and the vacuum container 15 are relatively moved by the moving device to change the distance.

在開始進行保持對象物5的保持程序時,使 移動板51和抵接板48成為分離的狀態,藉由移動裝置使按壓板44往真空容器15所在的方向移動,當按壓板44和各真空容器15之間的距離縮小時,按壓構件45會往真空容器15側移動,首先會使移動板51和抵接板48接觸。 When the holding process of holding the object 5 is started, The moving plate 51 and the abutting plate 48 are separated from each other, and the pressing plate 44 is moved in the direction in which the vacuum container 15 is moved by the moving means. When the distance between the pressing plate 44 and each of the vacuum containers 15 is reduced, the pressing member 45 is pressed. Moving to the side of the vacuum container 15, the moving plate 51 and the abutting plate 48 are first brought into contact.

在移動板51和真空容器15的底面之間配置 有可壓縮變形的復原構件55。復原構件55是位於真空容器15的底面和移動板51之間,緩衝構件49和復原構件 55具有彈力,緩衝構件49和復原構件55是由彈性材料所構成,當被按壓時會朝壓縮方向變形,當按壓解除後會回復原來的形狀。 Between the moving plate 51 and the bottom surface of the vacuum container 15 There is a compressible deformable restoration member 55. The restoring member 55 is located between the bottom surface of the vacuum vessel 15 and the moving plate 51, the cushioning member 49 and the restoring member The 55 has an elastic force, and the cushioning member 49 and the restoring member 55 are made of an elastic material, and are deformed in the compression direction when pressed, and return to the original shape when the pressing is released.

當移動板51和抵接板48接觸後,若按壓板 44進一步往真空容器15所在的方向移動,移動板51會被抵接板48按壓,這時,緩衝構件49及復原構件55被按壓而朝壓縮方向變形,且使按壓板44和各真空容器15之間的距離縮短,結果使黏著墊17往開口19所在的方向移動。 When the moving plate 51 and the abutting plate 48 are in contact, if the pressing plate is pressed 44 is further moved in the direction in which the vacuum container 15 is moved, and the moving plate 51 is pressed by the abutting plate 48. At this time, the cushioning member 49 and the restoring member 55 are pressed to be deformed in the compression direction, and the pressing plate 44 and the respective vacuum containers 15 are pressed. The distance between the two is shortened, and as a result, the adhesive pad 17 is moved in the direction in which the opening 19 is located.

如此般,使移動板51靠近真空容器15,藉此 使黏著墊17往真空容器15的開口19側移動,相反地,若移動板51遠離真空容器15,黏著墊17會往與真空容器15的開口19相反的一側、亦即底面側移動。 In this manner, the moving plate 51 is brought close to the vacuum container 15, whereby The adhesive pad 17 is moved toward the opening 19 side of the vacuum container 15, and conversely, if the moving plate 51 is away from the vacuum container 15, the adhesive pad 17 moves to the side opposite to the opening 19 of the vacuum container 15, that is, the bottom side.

又與上述例相反地,也能構成為按壓板44是固定的,而使連結板41相對於按壓板44移動。 Contrary to the above example, the pressing plate 44 can be fixed, and the connecting plate 41 can be moved relative to the pressing plate 44.

在將複數個保持單元13設置在連結板41上 之保持裝置11,各保持單元13的接觸部18的表面位於同一平面上,若將該表面當作與保持對象物5接觸的接觸平面,複數個黏著墊17的表面成為與接觸平面平行的同一平面,此外,複數個移動板51所在的平面也成為與接觸平面平行的同一平面,複數個抵接板48所在的平面也成為與接觸平面平行的同一平面。 A plurality of holding units 13 are disposed on the web 41 In the holding device 11, the surface of the contact portion 18 of each holding unit 13 is located on the same plane. If the surface is regarded as a contact plane with the holding object 5, the surface of the plurality of adhesive pads 17 becomes the same as the contact plane. In addition, the plane in which the plurality of moving plates 51 are located also becomes the same plane parallel to the contact plane, and the plane in which the plurality of abutting plates 48 are located also becomes the same plane parallel to the contact plane.

因此,若藉由按壓板44將各保持單元13的 移動板51分別按壓,設置在各保持單元13之緩衝構件 49和復原構件55會產生壓縮變形,使各黏著墊17以表面位於同一平面上的方式分別往開口19的方向移動。 Therefore, if each of the holding units 13 is pressed by the pressing plate 44 The moving plates 51 are respectively pressed, and the cushioning members provided in the respective holding units 13 The restoring member 55 and the restoring member 55 are compressed and deformed so that the respective adhesive pads 17 move in the direction of the opening 19 so that the surfaces are on the same plane.

保持單元13具有上述般的構造,接著說明, 藉由具有一個至複數個的保持單元13之保持裝置11來保持保持對象物5的程序。 The holding unit 13 has the above-described configuration, and then, The program for holding the object 5 is held by the holding device 11 having one to a plurality of holding units 13.

首先,藉由保持裝置11a來配置保持對象物5。這時,接觸平面是水平的,圖1所示的手臂311上之一片保持對象物5,藉由銷等的裝置而從手臂311上移動到一台至複數台的保持單元13之接觸部18上,保持對象物5與接觸部18接觸而配置在真空容器15上。 First, the holding object 5 is placed by the holding device 11a. In this case, the contact plane is horizontal, the arm shown in Figure 1 of an object to be held 31 5 1, by means of pins or the like to move the arm 311 from the contact portion to a holding means 13 to a plurality of stations At 18, the object 5 is placed in contact with the contact portion 18 and placed on the vacuum container 15.

當保持對象物5移動到保持單元13上之後, 使手臂311返回前製程的真空槽281的內部,將前製程的真空槽281和配置室22a之間的主閘閥291關閉。 When holding the object 5 is moved to the holding unit after 13, the inside of the arm 311 returns to the previous process of the vacuum tank 281, the main valve between the former process of the vacuum chamber 281 and disposed chamber 22a 29 1 closed.

圖2(b)顯示在具有複數個保持單元13之保 持裝置11上配置一片保持對象物5的狀態,圖4(b)顯示該保持裝置11的一台保持單元13。 Figure 2(b) shows the protection of a plurality of holding units 13 One holding member 5 is placed on the holding device 11, and one holding unit 13 of the holding device 11 is shown in Fig. 4(b).

保持對象物5與接觸部18接觸的部分形成為環形,藉由使保持對象物5與接觸部18接觸而將內部空間25封閉。 The portion where the object 5 is in contact with the contact portion 18 is formed in a ring shape, and the internal space 25 is closed by bringing the holding object 5 into contact with the contact portion 18.

在各真空容器15的壁面或底面設有排氣孔 14。各真空容器15的排氣孔14是經由排氣配管43而分別連接於配置在真空槽21的外部之吸附用排氣裝置42。 Vent holes are provided in the wall surface or the bottom surface of each vacuum container 15 14. The exhaust holes 14 of the vacuum containers 15 are respectively connected to the adsorption exhaust device 42 disposed outside the vacuum chamber 21 via the exhaust pipe 43.

在保持對象物5載置於各保持單元13上之 前,配置室22a內成為大氣壓,在將保持對象物5載置於 各保持單元13上而使保持對象物5和各保持單元13的接觸部18接觸後,藉由吸附用排氣裝置42開始進行各真空容器15的內部空間25之真空排氣。 The holding object 5 is placed on each holding unit 13 Before, the inside of the arrangement chamber 22a becomes atmospheric pressure, and the object 5 to be held is placed. After the holding object 5 and the contact portion 18 of each holding unit 13 are brought into contact with each of the holding units 13, the vacuum exhausting of the internal space 25 of each vacuum container 15 is started by the adsorption exhaust device 42.

這時,真空容器15的外部空間26、即配置室 22a的內部氛圍處於大氣壓,接觸部18和真空容器15的邊緣之間是氣密的,此外,接觸部18具有柔軟性,因此保持對象物5和接觸部18之間會經由接觸而成為氣密,當真空容器15的內部空間25進行真空排氣時,位於外部空間26的氣體不會從外部空間26往內部空間25流入,若真空容器15的內部空間25成為真空氛圍,保持對象物5會藉由外部空間26的壓力而往接觸部18按壓,藉由真空容器15予以真空吸附,而將保持對象物5緊壓於接觸部18。 At this time, the outer space 26 of the vacuum container 15, that is, the arrangement room The internal atmosphere of 22a is at atmospheric pressure, and the contact portion 18 and the edge of the vacuum container 15 are airtight. Further, since the contact portion 18 has flexibility, the object 5 and the contact portion 18 are kept airtight by contact. When the internal space 25 of the vacuum container 15 is evacuated, the gas in the external space 26 does not flow from the external space 26 to the internal space 25. If the internal space 25 of the vacuum container 15 becomes a vacuum atmosphere, the object 5 will be held. The pressure is applied to the contact portion 18 by the pressure of the external space 26, and the vacuum container 15 vacuum-adsorbs the object 5 to be pressed against the contact portion 18.

接觸部18是由會受按壓力而變形的材料所構成,當保持對象物5緊壓於接觸部18時,保持對象物5和接觸部18之間會密合而成為氣密。 The contact portion 18 is made of a material that is deformed by the pressing force. When the holding object 5 is pressed against the contact portion 18, the holding object 5 and the contact portion 18 are in close contact with each other to be airtight.

在開始進行真空容器15的內部空間25的真 空排氣時,黏著墊17與保持對象物5分離而形成有間隙,藉由真空吸附而使保持對象物5緊壓於接觸部18之後,在繼續進行藉由吸附用排氣裝置42而將真空容器15的內部空間25實施真空排氣的狀態下,若使按壓板44和真空容器15相對地接近,抵接板48會與移動板51接觸,若變得更接近,緩衝構件49和復原構件55會產生壓縮變形並使黏著墊17往保持對象物5所在的方向移動, 而使黏著墊17的表面與保持對象物5的背面接觸。 At the beginning of the inner space 25 of the vacuum vessel 15 When the air is exhausted, the adhesive pad 17 is separated from the object to be held 5 to form a gap, and after the object to be held 5 is pressed against the contact portion 18 by vacuum suction, the suction device 42 is continued by suction. When the inner space 25 of the vacuum container 15 is evacuated, when the pressing plate 44 and the vacuum container 15 are relatively close to each other, the abutting plate 48 comes into contact with the moving plate 51, and if it becomes closer, the cushioning member 49 and the restoring The member 55 generates a compressive deformation and moves the adhesive pad 17 in the direction in which the object 5 is held. The surface of the adhesive pad 17 is brought into contact with the back surface of the object 5 to be held.

當接觸之後,若欲進一步使按壓板44往真空 容器15側移動,藉由黏著墊17,會使緩衝構件49和復原構件55產生壓縮變形並將保持對象物5朝離開接觸部18的方向按壓。 After the contact, if the pressure plate 44 is to be further vacuumed When the container 15 is moved, the cushion member 49 and the restoring member 55 are compressed and deformed by the adhesive pad 17, and the holding object 5 is pressed in a direction away from the contact portion 18.

這時,施加於保持對象物5的按壓力,藉由 調整緩衝構件49之壓縮變形的距離,成為比保持對象物5藉由真空吸附而按壓於接觸部18的真空吸附力更弱,使保持對象物5能維持與黏著墊17密合的狀態,因此直到黏著墊17與保持對象物5的接觸面積到達飽和為止,會藉由來自按壓板44的按壓力進行按壓,藉此使黏著墊17和保持對象物5強固地黏著。 At this time, the pressing force applied to the object 5 is held by The distance of the compression deformation of the cushioning member 49 is adjusted to be weaker than the vacuum suction force of the holding target 5 pressed against the contact portion 18 by vacuum suction, so that the holding object 5 can be kept in close contact with the adhesive pad 17, so that the holding object 5 can be kept in close contact with the adhesive pad 17, Until the contact area between the adhesive pad 17 and the holding object 5 reaches saturation, the pressure is pressed by the pressing force from the pressing plate 44, whereby the adhesive pad 17 and the holding object 5 are strongly adhered.

圖3(a)係顯示,複數個保持單元13的黏著 墊17按壓在一片保持對象物5,而在保持裝置11黏著保持著保持對象物5的狀態。圖5(a)係顯示這時的保持對象物5和一台保持單元13,緩衝構件49和復原構件55產生壓縮變形。 Figure 3 (a) shows the adhesion of a plurality of holding units 13 The pad 17 is pressed against the one object to be held 5, and the holding device 11 is adhered and held to hold the object 5. Fig. 5(a) shows the holding object 5 and one holding unit 13 at this time, and the cushioning member 49 and the restoring member 55 are subjected to compression deformation.

在黏著墊17的表面密合於保持對象物5的背 面的狀態下,移動板51和保持對象物5之間的距離,是依據黏著墊17的厚度、支承棒52的長度等之用來支承黏著墊17的構件的長度而決定,藉由按壓板44和保持對象物5使復原構件55產生壓縮變形。 The surface of the adhesive pad 17 is adhered to the back of the holding object 5 In the surface state, the distance between the moving plate 51 and the holding object 5 is determined according to the thickness of the adhesive pad 17, the length of the support bar 52, and the like for supporting the length of the member for supporting the adhesive pad 17, by pressing the plate 44 and the holding object 5 cause the restoration member 55 to undergo compression deformation.

從該狀態起,使按壓板44往離開真空容器15 的方向移動,當抵接板48和移動板51分離時,復原構件 55的復原力會施加於移動板51,而成為使移動板51離開真空容器15的方向的力。 From this state, the pressing plate 44 is moved away from the vacuum container 15 The direction of movement, when the abutment plate 48 and the moving plate 51 are separated, the restoration member The restoring force of 55 is applied to the moving plate 51, and becomes a force that causes the moving plate 51 to move away from the vacuum container 15.

在壓縮變形後的緩衝構件49和復原構件55, 會產生欲回復原來的長度之復原力,黏著墊17按壓於保持對象物5所產生的黏著墊17和保持對象物5之間的黏著力比復原構件55的復原力更強,黏著墊17不會從保持對象物5剝離,復原構件55無法伸長而仍舊維持壓縮變形。另一方面,緩衝構件49藉由其復原力而伸長,回到原來的長度。 The cushioning member 49 and the restoring member 55 after compression deformation, There is a restoring force to return to the original length, and the adhesive force between the adhesive pad 17 and the holding object 5 which the adhesive pad 17 presses against the holding object 5 is stronger than the restoring force of the restoration member 55, and the adhesive pad 17 does not The object to be held 5 is peeled off, and the restoration member 55 cannot be stretched and the compression deformation is maintained. On the other hand, the cushioning member 49 is extended by its restoring force to return to the original length.

圖3(b)、圖5(b)係顯示復原構件55被 壓縮變形,緩衝構件49回到原來長度的狀態。 3(b) and 5(b) show that the restoration member 55 is The compression deformation, the cushioning member 49 returns to the original length state.

這時,黏著墊17黏著於保持對象物5,藉由復原構件55的復原力將黏著墊17往真空容器15的底面側牽引,因此保持對象物5會藉由黏著墊17往真空容器15的底面側牽引,保持對象物5的背面之與接觸部18接觸的部分,緊壓於接觸部18而密合,一片保持對象物5成為,藉由各保持單元13的真空吸附力和復原構件55的復原力來按壓於接觸部18的狀態。 At this time, the adhesive pad 17 is adhered to the holding object 5, and the adhesive pad 17 is pulled toward the bottom surface side of the vacuum container 15 by the restoring force of the restoring member 55. Therefore, the object 5 is held by the adhesive pad 17 to the bottom surface of the vacuum container 15. The side traction, the portion of the back surface of the object 5 that is in contact with the contact portion 18 is pressed against the contact portion 18 to be in close contact with each other, and the one object to be held 5 is held by the vacuum suction force of each holding unit 13 and the restoring member 55. The state of restoring force is pressed against the contact portion 18.

不管抵接板48是否與移動板51分離,當各 保持單元13之黏著墊17的表面按壓且黏著於保持對象物5後,藉由連接於配置室22a之真空排氣裝置24a開始進行配置室22a內的真空排氣,使配置室22a的內部氛圍、即真空槽21的外部空間26的壓力逐漸降低。 Regardless of whether the abutment plate 48 is separated from the moving plate 51, each After the surface of the adhesive pad 17 of the holding unit 13 is pressed against the holding object 5, the vacuum exhausting device 24a connected to the arranging chamber 22a starts vacuum evacuation in the arranging chamber 22a, thereby setting the internal atmosphere of the arranging chamber 22a. That is, the pressure of the outer space 26 of the vacuum chamber 21 is gradually lowered.

若外部空間26的壓力降低到內部空間25的壓力以 下,真空容器15對於保持對象物5的真空吸附力消失。 If the pressure of the external space 26 is reduced to the pressure of the internal space 25 Next, the vacuum suction force of the vacuum container 15 with respect to the holding object 5 disappears.

黏著墊17和保持對象物5之間的黏著力比復 原構件55的復原力所形成的剝離力更大,因此保持對象物5可黏著於黏著墊17,而維持密合於接觸部18的狀態。 The adhesion between the adhesive pad 17 and the holding object 5 is complex Since the peeling force by the restoring force of the original member 55 is larger, the holding object 5 can be adhered to the adhesive pad 17 while maintaining the state of being in close contact with the contact portion 18.

一片保持對象物5是藉由複數個黏著墊17予以黏著保持,用來黏著保持一片保持對象物5之複數個黏著墊17的黏著力的合計值,是比各復原構件55的復原力的合計值加上被黏著保持的保持對象物5的重量所產生的重力的值更大。 The one holding object 5 is adhered and held by a plurality of adhesive pads 17, and the total value of the adhesive force for holding the plurality of adhesive pads 17 holding the object 5 is the total of the restoring force of each of the restoration members 55. The value plus the value of the gravity generated by the weight of the object 5 held by the adhesive is larger.

因此,縱使藉由複數個黏著墊17來懸吊保持對象物5,保持對象物5也不會從黏著墊17剝離而落下。 Therefore, even if the object 5 is suspended by the plurality of adhesive pads 17, the object 5 is not peeled off from the adhesive pad 17 and falls.

一台至複數台的保持單元13,是藉由連結板41而能一起移動,移動裝置具有用來使保持裝置11上下翻轉的翻轉機構(未圖示)。 The holding unit 13 of one to a plurality of units can be moved together by the connecting plate 41, and the moving device has a turning mechanism (not shown) for turning the holding device 11 upside down.

一台保持裝置11的各保持單元13,在將保持對象物5配置於上方而將保持對象物5予以黏著保持的狀態下,若使保持裝置11翻轉,保持對象物5變成位於各保持單元13的下方,而成為藉由保持裝置11進行懸吊的狀態。圖6(a)顯示此狀態。 In each of the holding units 13 of the holding device 11, when the holding object 5 is placed above and the holding object 5 is adhered and held, when the holding device 11 is turned over, the holding object 5 is placed in each holding unit 13 The lower side is in a state of being suspended by the holding device 11. Figure 6(a) shows this state.

如上述般,各保持單元13的真空容器15和吸附用排氣裝置42是透過排氣配管43來連接。在該排氣配管43的中途設有裝卸裝置40,在成為真空氛圍的配置室22a內,各保持單元13是藉由裝卸裝置40而從連接於 吸附用排氣裝置42之排氣配管43分離,成為可和吸附用排氣裝置42個別地移動。 As described above, the vacuum container 15 and the adsorption exhaust unit 42 of each holding unit 13 are connected through the exhaust pipe 43. A loading and unloading device 40 is provided in the middle of the exhaust pipe 43, and each of the holding units 13 is connected to the mounting chamber 22a in a vacuum atmosphere by the attaching and detaching device 40. The exhaust pipe 43 of the adsorption exhaust device 42 is separated, and is movable individually with the adsorption exhaust device 42.

保持對象物5藉由黏著墊17予以黏著保持 後,在藉由裝卸裝置40使保持裝置11從吸附用排氣裝置42分離之前後,為了使藉由吸附用排氣裝置42所進行的真空容器15之真空排氣動作停止,利用裝卸裝置40使保持裝置11從吸附用排氣裝置42側的排氣配管43分離。 這時,裝卸裝置40的至少一部分,仍舊安裝在與真空容器15連接的排氣配管43上。配置室22a的真空排氣繼續進行。 Keeping the object 5 adhered by the adhesive pad 17 After the holding device 11 is separated from the adsorption exhaust device 42 by the loading and unloading device 40, the vacuuming operation of the vacuum container 15 by the adsorption exhaust device 42 is stopped, and the loading and unloading device 40 is used. The holding device 11 is separated from the exhaust pipe 43 on the side of the adsorption exhaust unit 42. At this time, at least a part of the loading and unloading device 40 is still attached to the exhaust pipe 43 connected to the vacuum container 15. The vacuum evacuation of the disposition chamber 22a continues.

在此,從吸附用排氣裝置42使保持裝置11 分離之前、或分離之後,連接於真空容器15之排氣配管43,是藉由仍舊安裝在該排氣配管43之裝卸裝置40的至少一部分而封閉,使真空容器15的內部空間25與外部空間26隔離。從黏著墊17釋出而充滿真空容器15的內部空間25之氣體,無法通過排氣孔14而往真空容器15的外部流出。 Here, the holding device 11 is made from the adsorption exhaust device 42 Before or after the separation, the exhaust pipe 43 connected to the vacuum vessel 15 is closed by at least a part of the loading and unloading device 40 that is still attached to the exhaust pipe 43, so that the internal space 25 of the vacuum vessel 15 and the external space are closed. 26 isolation. The gas released from the adhesive pad 17 and filled in the internal space 25 of the vacuum container 15 cannot flow out through the vent hole 14 to the outside of the vacuum container 15.

又也能構成為,藉由與裝卸裝置40不同的構件,當真空容器15從吸附用排氣裝置42分離時,避免真空容器15內的氣體通過排氣孔14而流出。 Further, when the vacuum container 15 is separated from the adsorption exhaust unit 42 by a member different from the attaching and detaching device 40, the gas in the vacuum container 15 is prevented from flowing out through the exhaust hole 14.

在各真空容器15的開口19配置保持對象物 5,使其密合於接觸部18,因此各真空容器15的內部空間25是與外部空間26隔離。在真空容器15的內部空間25與外部空間26隔離的狀態下,保持對象物5能以藉由 保持裝置11懸吊的狀態在真空氛圍中移動。 The object to be held is placed in the opening 19 of each vacuum container 15 5, it is brought into close contact with the contact portion 18, so that the internal space 25 of each vacuum container 15 is isolated from the external space 26. In a state where the internal space 25 of the vacuum container 15 is separated from the external space 26, the object 5 can be held by The state in which the holding device 11 is suspended moves in a vacuum atmosphere.

將處理室22b的內部藉由真空排氣裝置24b 實施真空排氣而成為真空氛圍,將配置室22a和處理室22b之間的副閘閥27a開啟,使其與吸附用排氣裝置42分離,將懸吊著保持對象物5之保持裝置11a從配置室22a移動到處理室22b。將開啟的副閘閥27a關閉。 The inside of the processing chamber 22b is evacuated by a vacuum exhaust device 24b Vacuum evacuation is performed to form a vacuum atmosphere, and the sub-gate valve 27a between the arrangement chamber 22a and the processing chamber 22b is opened to be separated from the adsorption exhaust unit 42, and the holding device 11a that holds the object 5 is suspended. The chamber 22a moves to the processing chamber 22b. The open secondary gate valve 27a is closed.

在處理室22b的內部設有:將被懸吊的保持對象物5的表面在真空氛圍中進行處理之處理部23。 Inside the processing chamber 22b, a processing unit 23 that treats the surface of the suspended holding object 5 in a vacuum atmosphere is provided.

在該真空處理裝置10中,處理部23為成膜源,將構成薄膜的材料之微粒子(含有蒸氣)釋出,使釋出的微粒子到達被懸吊且面向下方之保持對象物5的表面,在保持對象物5的表面使薄膜成長。 In the vacuum processing apparatus 10, the processing unit 23 is a film formation source, and the fine particles (including vapor) of the material constituting the film are released, and the released fine particles reach the surface of the object 5 to be suspended and facing downward. The film is grown on the surface of the object 5 to be held.

符號11b表示保持裝置,其在處理室22b內移動而使被懸吊的保持對象物5位於處理部23上。 Reference numeral 11b denotes a holding device that moves in the processing chamber 22b to place the suspended holding object 5 on the processing unit 23.

處理部23是將微粒子朝上方釋出,保持對象物5之待真空處理的表面是朝向位於下方的處理部23。 The processing unit 23 releases the fine particles upward, and the surface to be vacuum-treated of the object 5 is oriented toward the processing unit 23 located below.

藉由來自處理部23之微粒子的釋出,使微粒子到達保持對象物5的表面而形成薄膜,亦即進行真空處理。 By the release of the fine particles from the processing unit 23, the fine particles reach the surface of the holding object 5 to form a film, that is, vacuum processing.

又保持裝置11b亦可為,不是讓保持對象物5在處理部23上靜止,而是在從處理部23釋出微粒子的狀態下,讓保持對象物5通過處理部23上,藉此將保持對象物5的表面實施真空處理。 Further, in the holding device 11b, the holding object 5 may be held by the processing unit 23 in a state where the holding object 5 is not stopped at the processing unit 23, but the holding object 5 is passed through the processing unit 23, thereby maintaining The surface of the object 5 is subjected to vacuum treatment.

接著,將分離室22c的內部藉由真空排氣裝置24c實施真空排氣而成為真空氛圍,當形成了既定膜厚 的薄膜而結束真空處理時,將處理室22b和分離室22c之間的副閘閥27b開啟,使保持著保持對象物5之保持裝置11b從處理室22b移動到分離室22c。移動後,將副閘閥27b關閉。 Next, the inside of the separation chamber 22c is evacuated by a vacuum exhaust device 24c to become a vacuum atmosphere, and a predetermined film thickness is formed. When the vacuum processing is completed, the sub-gate valve 27b between the processing chamber 22b and the separation chamber 22c is opened, and the holding device 11b holding the holding object 5 is moved from the processing chamber 22b to the separation chamber 22c. After the movement, the sub gate valve 27b is closed.

在分離室22c的內部配置有移動裝置之翻轉機構(未圖示)。 An inverting mechanism (not shown) of the moving device is disposed inside the separation chamber 22c.

處理室22b內的保持裝置11b移動到分離室 22c內移動之後,以黏著保持著保持對象物5的狀態進行旋轉,使保持對象物5成為配置於保持裝置11c上的狀態。在此狀態下,保持對象物5藉由保持裝置11c予以黏著保持。 The holding device 11b in the processing chamber 22b is moved to the separation chamber After the movement in the 22c, the object 5 is held in a state where the object 5 is held by the adhesion, and the object 5 is placed on the holding device 11c. In this state, the object to be held 5 is adhered and held by the holding device 11c.

接下來說明使保持對象物5從保持裝置11c 分離的程序。 Next, the holding object 5 is held from the holding device 11c. Separate program.

參照圖7(a)、(b),讓黏著墊17移動的移動裝置係具有旋轉機構59。 Referring to Figures 7(a) and 7(b), the moving device for moving the adhesive pad 17 has a rotating mechanism 59.

如圖7(a)所示般,旋轉機構59係具有二根 桿件59a、59b,二根桿件59a、59b的一端,在以移動板51的中央位置56為中心之旋轉對稱的位置,藉由螺釘52a、52b安裝成能在移動板51的表面旋轉。 As shown in Fig. 7(a), the rotating mechanism 59 has two The rods 59a, 59b and one end of the two rod members 59a, 59b are mounted to be rotatable on the surface of the moving plate 51 by screws 52a, 52b at a rotationally symmetrical position centering on the center position 56 of the moving plate 51.

桿件59a、59b是呈平行地配置,其另一端側 安裝在旋轉機構59所具有的旋轉裝置59c,當旋轉裝置59c動作時,會對桿件59a、59b施加使彼此朝相反方向移動的力。 The rod members 59a, 59b are arranged in parallel with the other end side The rotating device 59c included in the rotating mechanism 59 is attached, and when the rotating device 59c is operated, the levers 59a and 59b are biased to move in opposite directions.

該力是使移動板51之安裝著桿件59a、59b 的位置朝相反方向移動的力,亦即是使移動板51以中央位置56為中心而朝同一旋轉方向旋轉的旋轉力。 This force is such that the moving plate 51 is fitted with the lever members 59a, 59b. The force at which the position moves in the opposite direction, that is, the rotational force that causes the moving plate 51 to rotate in the same rotational direction about the center position 56.

支承棒52是與移動板51和黏著墊17的表面 垂直,支承棒52的中心軸線通過中央位置56,使移動板51旋轉的旋轉力成為使黏著墊17旋轉的旋轉力。 The support rod 52 is the surface of the moving plate 51 and the adhesive pad 17 Vertically, the central axis of the support rod 52 passes through the center position 56, and the rotational force that causes the moving plate 51 to rotate becomes a rotational force that causes the adhesive pad 17 to rotate.

在保持對象物5上也是施加有來自黏著墊17 的旋轉力,但接觸部18設定成在真空容器15的邊緣上無法移動,保持對象物5在藉由黏著墊17予以黏著保持的狀態下,利用復原構件55的復原力而藉由接觸部18按壓,利用接觸部18和保持對象物5之間的靜止摩擦力,使保持對象物5維持相對於接觸部18呈靜止的狀態。 Also applied to the object 5 is from the adhesive pad 17 The rotational force is set, but the contact portion 18 is set so as not to be movable on the edge of the vacuum container 15, and the holding object 5 is adhered and held by the adhesive pad 17, and the restoring force of the restoring member 55 is utilized by the contact portion 18. By pressing, the holding object 5 is maintained in a state of being stationary with respect to the contact portion 18 by the static frictional force between the contact portion 18 and the holding object 5.

在對黏著墊17施加旋轉力時,在黏著墊17 上,已有復原構件55之復原力所產生之使其往底面方向移動的剝離力施加,若在施加有該剝離力的狀態下施加旋轉力,黏著墊17和保持對象物5之間的黏著力會因旋轉力而減弱,使黏著墊17一邊相對於真空容器15及接觸部18旋轉、一邊往離開真空容器15的開口19及接觸部18的方向移動,而使黏著墊17相對於保持對象物5一邊旋轉一邊剝離(圖6(b))。 When a rotational force is applied to the adhesive pad 17, the adhesive pad 17 is applied. In the above, the peeling force of the restoring force of the restoring member 55 is moved to the bottom surface direction, and when the peeling force is applied, the adhesion between the adhesive pad 17 and the holding object 5 is applied. The force is weakened by the rotational force, and the adhesive pad 17 is moved in the direction away from the opening 19 of the vacuum container 15 and the contact portion 18 while rotating relative to the vacuum container 15 and the contact portion 18, so that the adhesive pad 17 is opposed to the holding object. The object 5 is peeled off while rotating (Fig. 6(b)).

移動板51和黏著墊17的旋轉量是相同的,圖7(a)、(b)的符號50是用來表示移動板51的旋轉量和方向的指標。 The amount of rotation of the moving plate 51 and the adhesive pad 17 is the same, and the reference numeral 50 in Figs. 7(a) and (b) is an index for indicating the amount and direction of rotation of the moving plate 51.

支承棒52,相對於使接觸部18和保持對象物5接觸的接觸平面是垂直的,如此般,藉由移動裝置施加 於黏著墊17的力可分成:相對於保持對象物5的表面(亦即接觸平面)為垂直方向的成分、在與該接觸平面平行的平面內旋轉的成分。 The support rod 52 is perpendicular to the contact plane that makes the contact portion 18 and the holding object 5 contact, and thus is applied by a moving device The force applied to the adhesive pad 17 can be divided into a component that is perpendicular to the surface (that is, the contact plane) of the holding object 5, and a component that rotates in a plane parallel to the contact plane.

當黏著墊17與保持對象物5分開時,成為可將保持對象物5從保持裝置11c分離。 When the adhesive pad 17 is separated from the holding object 5, the holding object 5 can be separated from the holding device 11c.

將圖1之分離室22c的內部實施真空排氣,當保持對象物5從接觸部18離開時,使真空容器15的內部空間25和分離室22c的內部氛圍連接,使充滿於真空容器15內之來自黏著墊17的釋出氣體往分離室22c內釋出,經由真空排氣而從分離室22c除去。 The inside of the separation chamber 22c of FIG. 1 is evacuated, and when the holding object 5 is separated from the contact portion 18, the internal space 25 of the vacuum container 15 and the internal atmosphere of the separation chamber 22c are connected to be filled in the vacuum container 15. The released gas from the adhesive pad 17 is released into the separation chamber 22c, and is removed from the separation chamber 22c via vacuum evacuation.

將與後製程的真空槽282之間的主閘閥292開啟,使手臂312從後製程的真空槽282插入分離室22c內,使從接觸部18離開的保持對象物5移動到手臂312,保持對象物5被載置於手臂312上而從分離室22c往後製程的真空槽282移動。 The main valve between 282,292 open and process after the vacuum chamber, so that the arm 312 from 282 is inserted into the separation chamber after the process of the vacuum chamber 22c, so that apart from the contact portion 18 holding the object 5 is moved to an arm 31 2 , the object 5 is placed on the arm 31 2 and moved from the separation chamber 22c to the vacuum chamber 28 2 of the subsequent process.

使保持對象物5分離後的保持裝置11c,通過未圖示的移動室返回配置室22a。配置室22a內的保持裝置11a,使連接於真空容器15的排氣配管43在裝卸裝置40的部分與吸附用排氣裝置42的排氣配管43連接,成為可進行真空排氣的狀態,與上述同樣的,在配置著保持對象物5後,將被懸吊的保持對象物5進行真空處理。 The holding device 11c that has separated the object to be held 5 is returned to the arrangement chamber 22a by a moving chamber (not shown). In the holding device 11a in the arranging chamber 22a, the exhaust pipe 43 connected to the vacuum container 15 is connected to the exhaust pipe 43 of the adsorption venting device 42 at the portion of the detaching device 40, and is evacuated. In the same manner as described above, after the object 5 is placed, the suspended object 5 is vacuum-treated.

又藉由相對於保持對象物5使黏著墊17一邊旋轉一邊離開,而將保持對象物5和黏著墊17剝離,剝離時之保持對象物5的撓曲不容易發生,此外,相較於不 使其旋轉而垂直剝離的情況,具有可抑制黏著墊17之黏著力降低的效果。 Further, by moving the adhesive pad 17 while rotating relative to the holding target 5, the holding object 5 and the adhesive pad 17 are peeled off, and the deflection of the holding object 5 during peeling is less likely to occur, and compared with When it is rotated and peeled off vertically, the effect of suppressing the adhesive force of the adhesive pad 17 can be suppressed.

接下來說明本發明的其他保持裝置。 Next, other holding devices of the present invention will be described.

圖8係顯示本發明的第二例之保持裝置112Fig. 8 is a view showing a holding device 11 2 of a second example of the present invention.

不同於第一例的保持裝置11,第二例的保持裝置112是構成為,在複數個真空容器15的上部設置連結板41a,藉由該連結板41a使複數個真空容器15一起移動。在連結板41a形成有複數個貫通孔35,複數個真空容器15和連結板41a配置成,使該貫通孔35和真空容器15的開口19連通。 Unlike the holding device 11 of the first example, the holding device 11 2 of the second example is configured such that a connecting plate 41a is provided on the upper portion of the plurality of vacuum containers 15, and the plurality of vacuum containers 15 are moved together by the connecting plate 41a. A plurality of through holes 35 are formed in the connecting plate 41a, and the plurality of vacuum containers 15 and the connecting plate 41a are disposed such that the through holes 35 communicate with the opening 19 of the vacuum container 15.

在第二例中,貫通孔35和開口19雖設定成直徑相同,而配置成使貫通孔35的全周和開口19的全周重疊,但只要至少使貫通孔35的一部分的位置和開口19的一部分的位置除了高度不同而互相重疊,使黏著墊17位於該重疊部分的內部或下方即可。 In the second example, the through hole 35 and the opening 19 are set to have the same diameter, and are arranged such that the entire circumference of the through hole 35 overlaps the entire circumference of the opening 19. However, at least a part of the through hole 35 and the opening 19 are provided. The positions of a part of the portions overlap each other except for the height, so that the adhesive pad 17 is located inside or below the overlapping portion.

真空容器15的上端部係包含:位於比連結板41a的表面更下方的情況、位於與連結板41a的表面相同高度的情況,保持裝置112的表面是平坦的,是由連結板41a的表面、或連結板41a的表面及真空容器15的上部表面所構成。 The upper end portion of the vacuum container 15 includes a case where it is located below the surface of the connecting plate 41a and is located at the same height as the surface of the connecting plate 41a. The surface of the holding device 11 2 is flat and is the surface of the connecting plate 41a. Or the surface of the connecting plate 41a and the upper surface of the vacuum container 15.

在保持裝置112的表面,以至少圍繞開口19和貫通孔35之除了高度方向之重疊部分的方式,形成有環狀的溝槽36;在溝槽36的內部,以圍繞開口19和貫通孔35的重疊部分的方式配置著具有柔軟性之圓形的接 觸部18a。 The surface 112 of the holding means, at least around the opening 19 and the through-hole 35 in addition to the overlapped portion of the height direction, there is formed an annular groove 36; openings 19 and the through hole 36 inside the trench, to surround A circular contact portion 18a having flexibility is disposed in a manner of overlapping portions of 35.

在連結板41a之溝槽36的外部側配置有銷插 通孔33,從比銷插通孔33下方的位置使細棒狀的銷32上昇,當銷32的上端突出到比接觸部18a的上端更上方時,成為可在銷32的上端配置保持對象物5的狀態。 A pin insertion is disposed on the outer side of the groove 36 of the web 41a. The through hole 33 lifts the thin rod-shaped pin 32 from a position below the pin insertion hole 33, and when the upper end of the pin 32 protrudes above the upper end of the contact portion 18a, the holding target can be placed at the upper end of the pin 32. The state of the object 5.

圖8係顯示此狀態的保持裝置112Fig. 8 shows the holding device 11 2 in this state.

接觸部18a的上端配置在比保持裝置112的表面更高的位置,在黏著墊17下降後,當銷32下降時,如圖9所示般,將保持對象物5載置於接觸部18a上。 The upper end of the contact portion 18a is disposed at a position higher than the surface of the holding device 11 2 , and after the adhesive pad 17 is lowered, when the pin 32 is lowered, as shown in FIG. 9, the holding object 5 is placed on the contact portion 18a. on.

接觸部18a上的保持對象物5是與接觸部18a接觸,其背面的一部分是以未接觸黏著墊17的狀態露出於真空容器15的內部空間25內。露出於內部空間25的部分成為可供黏著墊17的表面接觸。 The holding object 5 on the contact portion 18a is in contact with the contact portion 18a, and a part of the back surface thereof is exposed in the internal space 25 of the vacuum container 15 without being in contact with the adhesive pad 17. The portion exposed to the internal space 25 is brought into contact with the surface of the adhesive pad 17.

這時,外部空間26為大氣壓的氛圍,如第一例所說明,當藉由吸附用排氣裝置42開始進行各真空容器15之內部空間25的真空排氣時,真空容器15的內部空間25被減壓,當利用外部空間26和內部空間25的壓力差而將保持對象物5朝向真空容器15側吸引時,接觸部18a被按壓而往厚度變小的方向變形。 At this time, the external space 26 is an atmosphere of atmospheric pressure. As explained in the first example, when vacuum evacuation of the internal space 25 of each vacuum container 15 is started by the adsorption exhaust unit 42, the internal space 25 of the vacuum container 15 is When the holding object 5 is sucked toward the vacuum container 15 by the pressure difference between the external space 26 and the internal space 25, the contact portion 18a is pressed and deformed in a direction in which the thickness is reduced.

接觸部18a的柔軟性及厚度是設定成,當藉由吸附用排氣裝置42的真空排氣而使保持對象物5被按壓時,接觸部18a的厚度可變形成溝槽深度以下,如圖10所示般,被按壓的保持對象物5也會與保持裝置112的表面接觸。 The flexibility and thickness of the contact portion 18a are set such that when the holding object 5 is pressed by vacuum evacuation of the adsorption exhaust device 42, the thickness of the contact portion 18a can be changed to be less than the groove depth, as shown in the figure. As shown in FIG. 10, the pressed object 5 to be pressed is also in contact with the surface of the holding device 11 2 .

這時,保持對象物5之與保持裝置112的表面 接觸的部分之面積,是比與接觸部18a的接觸的部分之面積更大,相較於保持對象物5僅與接觸部18a接觸的情況,可抑制保持對象物5的變形。 At this time, the area of the portion of the object 5 that is in contact with the surface of the holding device 11 2 is larger than the area of the portion in contact with the contact portion 18a, and is only in contact with the contact portion 18a as compared with the object 5 to be held. The deformation of the object 5 can be suppressed.

使黏著墊17的表面上昇到保持裝置112的表 面高度以上的高度,當黏著墊17的表面與被吸附保持的保持對象物5之背面接觸而被按壓時,保持對象物5會藉由黏著墊17予以黏著保持。 When the surface of the adhesive pad 17 is raised to a height equal to or higher than the surface height of the holding device 11 2 , when the surface of the adhesive pad 17 is pressed against the back surface of the holding target 5 that is adsorbed and held, the object 5 is held by the adhesive. The pad 17 is adhered and held.

圖11的符號113表示本發明的第三例之保持 裝置,在該保持裝置113的表面沒有形成溝槽,在保持裝置113的表面上配置著具有柔軟性的接觸部18b。 Symbol 113 in FIG. 11 represents a third embodiment of the holding device of the present invention, the trench is not formed on the surface of the holding means 113, the contact portion 18b is disposed on a flexible surface of the holding means 113.

使保持對象物5與接觸部18b接觸而配置在接觸部18b上,若將內部空間25實施真空排氣,保持對象物5會被真空吸附而被保持在接觸部18b上。 The holding object 5 is placed in contact with the contact portion 18b and placed on the contact portion 18b. When the internal space 25 is evacuated, the holding object 5 is vacuum-absorbed and held on the contact portion 18b.

在該第三例的保持裝置113,連結板41b的構 造簡單而能降低成本。圖13(a)、(b)分別顯示未配置保持對象物5時之第二例的保持裝置112之俯視圖、第三例的保持裝置113之俯視圖。 In the holding device 11 3 of the third example, the structure of the connecting plate 41b is simple and the cost can be reduced. FIG 13 (a), (b) show a plan view is not arranged to maintain a second embodiment of the retaining device 5 of the object 112, a plan view of a third embodiment of the holding means 113 of.

接下來,圖12的符號114表示本發明的第四 例之保持裝置,圖13(c)為其俯視圖。 Next, reference numeral 12 represents a holding means 114 of the fourth embodiment of the present invention, FIG. 13 (c) a plan view thereof.

該保持裝置114,是取代第三例的保持裝置113之環狀的接觸部18b,使用密合薄片39作為接觸部而配置在保持單元13的表面。 The holding device 11 4 is an annular contact portion 18 b of the holding device 11 3 of the third example, and is disposed on the surface of the holding unit 13 using the contact sheet 39 as a contact portion.

在密合薄片39上,在開口19和貫通孔35的 重疊部分之上方位置形成有薄片孔38,薄片孔38和開口19、和貫通孔35分別局部地重疊,而使黏著墊17可在比密合薄片39的表面更低的位置、和密合薄片39的表面以上的位置之間移動。 On the closet sheet 39, at the opening 19 and the through hole 35 A sheet hole 38 is formed at a position above the overlapping portion, and the sheet hole 38 and the opening 19 and the through hole 35 are partially overlapped, respectively, so that the adhesive pad 17 can be positioned lower than the surface of the close-contact sheet 39, and the close-contact sheet Move between positions above the surface of 39.

以黏著墊17的表面比密合薄片39的表面更 低的方式使黏著墊17下降後,若在密合薄片39的表面配置保持對象物5,保持對象物5會與密合薄片39接觸,且保持對象物5之背面的一部分會透過開口19和貫通孔35和薄片孔38,而露出於內部空間25。 The surface of the adhesive pad 17 is more than the surface of the adhesive sheet 39 When the adhesive pad 17 is lowered in a low manner, when the holding object 5 is placed on the surface of the adhesive sheet 39, the holding object 5 comes into contact with the adhesive sheet 39, and a part of the back surface of the holding object 5 passes through the opening 19 and The through hole 35 and the sheet hole 38 are exposed to the internal space 25.

保持對象物5之露出於內部空間25的部分,是藉由用來形成薄片孔38之薄片孔38周圍的密合薄片39之環狀部分包圍,而使內部空間25成為封閉。 The portion of the object 5 that is exposed to the internal space 25 is surrounded by the annular portion of the adhesive sheet 39 around the sheet hole 38 for forming the sheet hole 38, and the internal space 25 is closed.

與上述各例同樣的,藉由實施內部空間25的 真空排氣,使保持對象物5藉由密合薄片39真空吸附,當黏著墊17上昇時,使黏著墊17的表面與保持對象物5背面接觸,保持對象物5是藉由黏著墊17予以黏著保持。 The same as the above examples, by implementing the internal space 25 Vacuum evacuation causes the holding object 5 to be vacuum-adsorbed by the adhesive sheet 39. When the adhesive pad 17 is raised, the surface of the adhesive pad 17 is brought into contact with the back surface of the holding object 5, and the object 5 is held by the adhesive pad 17. Stick to keep.

又,在密合薄片39上之與銷插通孔33連通 的位置形成有薄片側銷插通孔34,當銷32從其上端部位於連結板41c下方的狀態往上方移動時,可通過銷插通孔33和薄片側銷插通孔34,而使該上端部突出到比薄片側銷插通孔34更上方的位置。 Further, it is connected to the pin insertion hole 33 on the close-contact sheet 39. The sheet side pin insertion hole 34 is formed at a position, and when the pin 32 is moved upward from a state in which the upper end portion is located below the coupling plate 41c, the pin insertion hole 33 and the sheet side pin insertion hole 34 can be passed through The upper end portion protrudes to a position above the sheet side pin insertion hole 34.

以上第一~第四例的保持裝置111~114中,是 在一個真空容器15配置有一個黏著墊17而形成為一個保 持單元13,但在圖14所示的第五例的保持裝置115,則是在一個真空容器65配置有複數個黏著墊17而構成一個保持單元13a。 In the holding devices 11 1 to 11 4 of the above first to fourth examples, one of the vacuum containers 15 is provided with one adhesive pad 17 to be formed as one holding unit 13, but the holding device of the fifth example shown in FIG. 11 5 , a plurality of adhesive pads 17 are disposed in a vacuum container 65 to constitute a holding unit 13a.

在該第五例的保持裝置115,是在真空容器 65的邊緣上,以圍繞真空容器65之開口的方式配置環狀的接觸部18c。 Arranged in an annular manner a fifth embodiment of the retaining means 115, it is on the edge 65 of the vacuum vessel, the vacuum vessel 65 to surround the opening of the contact portion 18c.

在比真空容器65的邊緣更內側的部分之黏著墊17和黏著墊17之間,配置有豎設在真空容器65的底面上之複數個輔助棒61。 Between the adhesive pad 17 and the adhesive pad 17 on the inner side of the edge of the vacuum container 65, a plurality of auxiliary bars 61 vertically disposed on the bottom surface of the vacuum container 65 are disposed.

輔助棒61的側面互相分開,因此各黏著墊17 所在的氛圍互相連通,在真空容器65的內部形成有一個內部空間25。黏著墊17配置在該內部空間25。 The sides of the auxiliary rod 61 are separated from each other, so each of the adhesive pads 17 The atmosphere in which they are located communicates with each other, and an internal space 25 is formed inside the vacuum vessel 65. The adhesive pad 17 is disposed in the internal space 25.

若將比真空容器65的內周更大之一片保持對 象物5,以藉由真空容器65的邊緣和保持對象物5來夾住接觸部18c的方式載置於接觸部18c上時,保持對象物5成為位在真空容器65上。 If one piece larger than the inner circumference of the vacuum container 65 is kept When the object 5 is placed on the contact portion 18c by sandwiching the contact portion 18c with the edge of the vacuum container 65 and the holding object 5, the object 5 is held on the vacuum container 65.

在真空容器65之壁面或底面設有排氣孔14,內部空間25是透過排氣孔14和排氣配管43來與配置於真空槽21的外部之吸附用排氣裝置42連接。 A vent hole 14 is provided in the wall surface or the bottom surface of the vacuum container 65. The internal space 25 is connected to the adsorption venting device 42 disposed outside the vacuum chamber 21 through the vent hole 14 and the exhaust pipe 43.

在保持對象物5於真空容器65的邊緣上與接 觸部18c接觸的狀態下,若將真空容器65內實施真空排氣,保持對象物5會藉由真空容器65予以真空吸附,接觸部18c會被保持對象物5按壓而變形,使保持對象物5往下方些微移動。 Holding the object 5 on the edge of the vacuum container 65 When the inside of the vacuum chamber 65 is evacuated, the object to be held 5 is vacuum-sucked by the vacuum container 65, and the contact portion 18c is pressed by the holding object 5 to be deformed, and the object to be held is held. 5 Move slightly below.

這時,在比真空容器65的邊緣更內側的位 置,保持對象物5的背面與輔助棒61的前端接觸,藉由輔助棒61予以支承而防止發生撓曲。 At this time, the position is more inside than the edge of the vacuum container 65. The back surface of the object 5 is brought into contact with the front end of the auxiliary rod 61, and is supported by the auxiliary rod 61 to prevent deflection.

在黏著墊17與保持對象物5的背面密合的狀態,縱使真空吸附停止實施,仍能透過支承棒52和黏著墊17將保持對象物5予以黏著保持。 In a state in which the adhesive pad 17 is in close contact with the back surface of the object to be held 5, the holding object 5 can be adhered and held by the support rod 52 and the adhesive pad 17 even when the vacuum suction is stopped.

在剝離時,讓與同一保持對象物5接觸的黏 著墊17一邊旋轉一邊直線下降。 When peeling off, let the stick that is in contact with the same holding object 5 The pad 17 is linearly lowered while rotating.

在真空容器65的外周設有環狀的輔助板41d,保持對象物5的邊緣部分位在輔助板41d上。在輔助板41d設有銷插通孔33,在銷插通孔33的正下方配置著銷32,藉由銷32的上下移動,能使銷32的前端在銷插通孔33內上下移動。 An annular auxiliary plate 41d is provided on the outer circumference of the vacuum container 65, and the edge portion of the object 5 is held on the auxiliary plate 41d. The auxiliary insertion plate 41d is provided with a pin insertion hole 33, and a pin 32 is disposed directly under the pin insertion hole 33. By the vertical movement of the pin 32, the tip end of the pin 32 can be moved up and down in the pin insertion hole 33.

當黏著墊17從保持對象物5離開後,若使銷 32上昇,可將保持對象物5載置於銷32上。此外,當使載置著保持對象物5的銷32下降,可將保持對象物5配置在真空容器65的邊緣上。 When the adhesive pad 17 is separated from the holding object 5, if the pin is made When 32 is raised, the holding object 5 can be placed on the pin 32. Further, when the pin 32 on which the holding object 5 is placed is lowered, the holding object 5 can be placed on the edge of the vacuum container 65.

又黏著墊17的材質、構造及動作是和第四例 的保持裝置114相同,移動裝置之使黏著墊17移動的方向(亦即移動方向)係包含:相對於保持裝置115的表面中之與保持對象物5接觸的部分所在的接觸平面為垂直方向之移動成分。 The adhesive pad and the material, structure and operation of the holding means 17 and the fourth embodiment is the same as 114, the moving means moves the adhesive pad 17 direction (i.e. the direction of movement) system comprising: the holding device relative to the surface 115 of The contact plane where the portion in contact with the object 5 is held is a moving component in the vertical direction.

此外,也能將第五例之保持裝置115的環狀接 觸部18c變更為密合薄片39。 In addition, the fifth embodiment is also capable of holding means 115 of the annular contact portion 18c of the adhesion sheet 39 change.

5‧‧‧保持對象物 5‧‧‧ Keep objects

11‧‧‧保持裝置 11‧‧‧ Keeping device

13‧‧‧保持單元 13‧‧‧Holding unit

14‧‧‧排氣孔 14‧‧‧ venting holes

15‧‧‧真空容器 15‧‧‧Vacuum container

17‧‧‧黏著墊 17‧‧‧Adhesive pad

18‧‧‧接觸部 18‧‧‧Contacts

19‧‧‧開口 19‧‧‧ openings

25‧‧‧內部空間 25‧‧‧Internal space

26‧‧‧外部空間 26‧‧‧External space

41‧‧‧連結板 41‧‧‧Link board

43‧‧‧排氣配 43‧‧‧Exhaust distribution

44‧‧‧按壓板 44‧‧‧ Press plate

45‧‧‧按壓構件 45‧‧‧ Pressing members

47‧‧‧馬達 47‧‧‧Motor

48‧‧‧抵接板 48‧‧‧ Abutment plate

49‧‧‧緩衝構件 49‧‧‧ cushioning members

51‧‧‧移動板 51‧‧‧Mobile board

52‧‧‧支承棒 52‧‧‧Support rod

53‧‧‧支承板 53‧‧‧Support plate

54‧‧‧貫通孔 54‧‧‧through holes

55‧‧‧復原構件 55‧‧‧Restoring components

57‧‧‧軸密封材 57‧‧‧Axis sealing material

58‧‧‧軸承 58‧‧‧ bearing

59‧‧‧旋轉機構 59‧‧‧Rotating mechanism

59a、59b‧‧‧桿件 59a, 59b‧‧‧ rods

Claims (13)

一種保持裝置,是用來讓設置於保持單元之黏著墊接觸保持對象物,利用前述黏著墊將前述保持對象物予以黏著保持而進行搬運;前述保持單元係具有真空容器、接觸部、排氣孔以及移動裝置,該接觸部,是配置在前述真空容器的邊緣,其與前述保持對象物接觸而使前述真空容器的內部空間和前述真空容器的外部空間隔離;該排氣孔,是設置於前述真空容器,成為將前述內部空間的氣體藉由吸附用排氣裝置進行真空排氣的通路,該內部空間是藉由前述保持對象物和前述接觸部而與前述外部空間隔離;該移動裝置是用來使前述黏著墊移動,前述黏著墊配置於前述內部空間,前述移動裝置使前述黏著墊移動的方向、即移動方向係具有:相對於前述接觸部的表面中之與前述保持對象物接觸的部分所在的接觸平面為垂直方向之移動成分。 A holding device for causing an adhesive pad provided on a holding unit to contact an object to be held, and holding the holding object by the adhesive pad; the holding unit has a vacuum container, a contact portion, and a vent hole And a moving device, the contact portion is disposed at an edge of the vacuum container, and is in contact with the holding object to isolate an inner space of the vacuum container from an outer space of the vacuum container; the vent hole is disposed in the foregoing The vacuum container is a passage for evacuating the gas in the internal space by the adsorption exhaust device, and the internal space is isolated from the external space by the holding object and the contact portion; the moving device is used The adhesive pad is moved, and the adhesive pad is disposed in the internal space, and the moving device moves the direction in which the adhesive pad moves, that is, the moving direction, with respect to a portion of the surface of the contact portion that is in contact with the holding object. The contact plane in which it is located is a moving component in the vertical direction. 如申請專利範圍第1項所述之保持裝置,其中,係具有:複數個前述真空容器、以及配置於各前述真空容器之前述黏著墊;複數個前述黏著墊和配置在複數個前述真空容器的邊緣之前述接觸部,是與同一個前述保持對象物接觸。 The holding device according to claim 1, further comprising: a plurality of the vacuum containers; and the adhesive pad disposed in each of the vacuum containers; a plurality of the adhesive pads and a plurality of the vacuum containers disposed in the plurality of vacuum containers The aforementioned contact portion of the edge is in contact with the same holding object. 如申請專利範圍第1項所述之保持裝置,其中,係具有配置在同一個前述真空容器之前述內部空間的複數個前述黏著墊,複數個前述黏著墊和配置在前述真空 容器的邊緣之前述接觸部,是與同一個前述保持對象物接觸。 The holding device according to claim 1, wherein the plurality of the adhesive pads are disposed in the inner space of the same vacuum container, and the plurality of the adhesive pads are disposed in the vacuum The aforementioned contact portion of the edge of the container is in contact with the same holding object. 如申請專利範圍第1至3項中任一項所述之保持裝置,其中,前述接觸部是使用具有柔軟性的環狀構件。 The holding device according to any one of claims 1 to 3, wherein the contact portion is a flexible member. 如申請專利範圍第1至3項中任一項所述之保持裝置,其中,前述接觸部是配置在前述保持裝置之平坦表面上。 The holding device according to any one of claims 1 to 3, wherein the contact portion is disposed on a flat surface of the holding device. 如申請專利範圍第1至3項中任一項所述之保持裝置,其中,在前述保持裝置的表面設有溝槽,前述接觸部設置在前述溝槽內。 The holding device according to any one of claims 1 to 3, wherein a groove is provided on a surface of the holding device, and the contact portion is provided in the groove. 如申請專利範圍第1至3項中任一項所述之保持裝置,其中,前述接觸部是由密合薄片所構成,該密合薄片是配置在前述真空容器上,且將成為貫通孔之薄片孔形成在前述真空容器的開口上。 The holding device according to any one of claims 1 to 3, wherein the contact portion is formed of a contact sheet which is disposed on the vacuum container and which is to be a through hole. A sheet hole is formed in the opening of the aforementioned vacuum container. 如申請專利範圍第1至3項中任一項所述之保持裝置,其中,係具有旋轉機構,該旋轉機構是使前述黏著墊,相對於前述真空容器朝向遠離前述接觸部的方向一邊旋轉一邊移動。 The holding device according to any one of claims 1 to 3, further comprising: a rotating mechanism that rotates the adhesive pad with respect to a direction in which the vacuum container faces away from the contact portion mobile. 如申請專利範圍第1至3項中任一項所述之保持裝置,其中, 係具有使前述保持裝置連接於前述吸附用排氣裝置之裝卸裝置;前述裝卸裝置,是讓前述保持裝置與前述吸附用排氣裝置分離,而使前述保持裝置和前述吸附用排氣裝置可個別移動。 The holding device according to any one of claims 1 to 3, wherein And a loading and unloading device that connects the holding device to the adsorption exhaust device; the loading and unloading device separates the holding device from the adsorption exhaust device, and the holding device and the adsorption exhaust device are individually mobile. 如申請專利範圍第9項所述之保持裝置,其中,前述真空容器設定成,當其從前述吸附用排氣裝置分離時,不讓氣體通過前述排氣孔而流入前述真空容器內。 The holding device according to claim 9, wherein the vacuum container is set such that when it is separated from the adsorption exhaust device, gas is prevented from flowing into the vacuum container through the exhaust hole. 如申請專利範圍第1至3項中任一項所述之保持裝置,其中,是藉由具有彈力的緩衝構件,對黏著在前述保持對象物上的前述黏著墊朝向離開前述保持對象物的方向施力。 The holding device according to any one of claims 1 to 3, wherein the adhesive pad adhering to the object to be held faces away from the object to be held by a resilient cushioning member Force. 一種真空處理裝置,係具有:如申請專利範圍第1至3項中任一項所述之保持裝置、真空槽以及處理部;在該真空槽內配置前述保持裝置;該處理部,是配置在前述真空槽內,將藉由前述黏著墊予以黏著保持且處理表面朝下之前述保持對象物的前述處理表面在真空氛圍中進行處理。 A vacuum processing apparatus, comprising: a holding device, a vacuum chamber, and a processing unit according to any one of claims 1 to 3; wherein the holding device is disposed in the vacuum chamber; the processing portion is disposed in In the vacuum chamber, the treatment surface to be adhered and held by the adhesive pad and having the treatment surface facing downward is treated in a vacuum atmosphere. 如申請專利範圍第12項所述之真空處理裝置,其中,前述處理部是釋出用來形成薄膜的微粒子而在前述保持對象物表面形成薄膜的成膜裝置。 The vacuum processing apparatus according to claim 12, wherein the processing unit is a film forming apparatus that releases fine particles for forming a thin film and forms a thin film on the surface of the object to be held.
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