TW201818490A - Spacer, wafer stack package, movable sucking structure and wafer moving method using the same - Google Patents

Abstract

A wafer stack package including at least two spacers and at least one wafer. Each spacer includes an inner part and an outer part. The inner part has a plurality of through holes. The outer part surrounds the inner part. The wafer is located between the two spacers. In addition, the present disclosure also provides a movable sucking structure and a wafer moving method for using the wafer stack package so that the wafer can be moved via the spacer.

Description

Gasket, wafer stack structure, adsorption mobile device and wafer moving method

The invention relates to a gasket, a wafer stack structure, an adsorption mobile device and a wafer moving method using the same, in particular to a gasket, a wafer stack structure, an adsorption mobile device and a wafer for wafer inspection Move method.

After the wafer is cut into wafers, the wafers need to be processed by Wafer Fabrication and then via the Wafer Probe to find the unqualified grains on the wafer. According to the results of the needle test, the qualified crystals are classified. Among them, before the wafer is subjected to the needle test process, the processed wafer needs to be moved to the wafer chuck for inspection.

Traditionally, the wafer is moved to the wafer chuck by manual manual method, but the manual stability is low, and the wafer surface is easily accessible when the wafer is taken, thereby increasing the probability of damage and contamination of the wafer, and The manual method is also prone to cause the wafer to be brittle or to break the wafer due to excessive force or instability. It is understandable that the problem caused by the above-mentioned human factors will be aggravated when taking a thinner wafer.

In view of the above, the present invention provides a spacer, a wafer stack structure, an adsorption type mobile device, and a wafer moving method using the same, so that the wafer can be moved by a spacer, so that the wafer is in the process of moving. It is properly protected to solve the aforementioned problems inherent in manual handling of wafers.

A spacer according to the present invention is suitable for protecting a wafer. The gasket includes an inner ring portion and an outer ring portion. The inner ring portion has a plurality of through holes. The outer ring portion surrounds the inner ring portion.

A wafer stack structure according to the present invention includes at least one spacer and at least one wafer as described above. At least one wafer is located on one side of at least one of the pads.

An adsorption type mobile device according to the present invention is for moving the aforementioned wafer stack structure. The adsorption mobile device includes a suction cup and a moving mechanism. The suction cup has a suction surface and a plurality of air holes. The attraction mask has an inner circle area and an outer circle area. The outer ring area surrounds the inner ring area. The vent is located in the inner ring area and the outer ring area. The suction cup is connected to the air hole through a vacuum generator to selectively suck the air holes of at least one of the inner ring area and the outer ring area. The moving mechanism is coupled to the suction cup for moving the suction cup.

A method for moving a wafer according to the present invention includes: providing a wafer stack structure as described above; providing an adsorption type mobile device as described above, wherein the inner ring area and the outer ring area of the suction cup are respectively Corresponding to the inner ring portion and the outer ring portion of the gasket; moving at least one wafer to a detecting stage. The step of moving at least one wafer to the detection stage comprises: pumping at least the air holes of the inner ring area of the suction cup to adsorb at least one wafer through the through holes of the gasket covering the at least one wafer; At least one wafer is moved to the detection stage together with the gasket covering the at least one wafer; the air holes in the outer circumference of the suction cup are evacuated, and the air holes in the inner circumference of the suction cup are stopped to make the suction cup Only the outer ring portion of the gasket is adsorbed; and the gasket adsorbed to the suction cup is removed from the detection stage.

In the gasket, the wafer stack structure, the adsorption type moving device and the wafer moving method using the same, the design of selectively extracting the air holes of the inner and outer rings by the suction cup and the through hole of the gasket inner ring The design of the suction cup can take the wafer through the gasket. For example, when the air hole of the inner ring of the suction cup is evacuated, the suction cup can be sucked up by the spacer and the wafer can be moved under the protection of the gasket; when only the air holes of the outer ring of the suction cup are performed When pumping, the suction cup can individually suck the gasket. In this way, the wafer is properly protected during the movement process, which can effectively reduce the probability of damage to the wafer, and does not cause the problems conventionally caused by manual handling.

The above description of the disclosure and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention, and to provide further explanation of the scope of the invention.

The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.

In addition, the embodiments of the present invention are disclosed in the following drawings, and for the sake of clarity, the details of the invention are described in the following description. However, it should be understood that these practical details are not intended to limit the invention. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner for the purpose of simplifying the drawings, and even details such as textures, fine protrusions, and the like on some of the elements are omitted. Also, the hatching is omitted in the drawing to keep the drawing clean and tidy, which is stated first.

Furthermore, unless otherwise defined, all terms used herein, including technical and scientific terms, have their ordinary meaning, and their meaning is understood by those skilled in the art. Furthermore, the definition of the above vocabulary should be interpreted in the present specification as having the same meaning as the technical field related to the present invention. Unless specifically defined, these terms are not to be construed as too idealistic or formal.

First, referring to FIG. 1 to FIG. 2, FIG. 1 is a schematic diagram of an adsorption type mobile device and a wafer stack structure according to an embodiment of the present invention, and FIG. 2 is an attraction of the adsorption type mobile device of FIG. A schematic plan view of the face. This embodiment provides an adsorption mobile device 1 that can be used to move a wafer stack structure 2.

Specifically, the adsorption type mobile device 1 includes a suction cup 50 and a moving mechanism 60. The suction cup 50 has a suction surface 50a and a plurality of air holes 50s. The attraction face 50a has an inner race zone 510 and an outer race zone 520, and the outer race zone 520 surrounds the inner race zone 510. The air holes 50s are distributed in the inner ring area 510 and the outer ring area 520, that is, a part of the air holes 50s are located in the inner ring area 510, and another part of the air holes 50s are located in the outer ring area 520. In addition, in the present embodiment, the suction cup 50 can be externally connected to a vacuum generator (not shown), and the vacuum generator can selectively connect the air holes 50s via the air passages (not shown) connecting the air holes 50s in the suction cup 50. To selectively evacuate the air holes 50s of at least one of the inner ring region 510 and the outer ring region 520. That is, on the suction surface 50a of the suction cup 50, the air suction hole 50s of the inner ring region 510, the air hole 50s of the outer ring region 520, or the air holes 50s of the two regions can be selected to generate the vacuum suction force. In addition, in the present embodiment and other embodiments, the material hardness constituting the inner ring region 510 is larger than the material hardness constituting the outer ring region 520. For example, the material of the inner ring region 510 may be, but not limited to, ceramic or porous stone, and the material of the outer ring region 520 may be, but not limited to, a material that is softer than the inner ring region 510. The moving mechanism 60 is coupled to the suction cup 50 and can be used to move the suction cup 50 to a specific position.

However, it should be noted that the present invention is not limited to the size and number of the air holes 50s, and the user can adjust according to actual needs, thereby adjusting the distribution of the vacuum attractive force on the attraction surface 50a. Moreover, the mobile mechanism 60 and its design are not intended to limit the invention. In addition, the present invention is not limited to the mechanism for pumping the air holes 50s and the manner of controlling the air suction to the air holes 50s. For example, in this embodiment or other embodiments, the suction cup is connected to a single vacuum generator, but the suction cup is The air valve can be used to selectively control the air holes of the inner ring area and the outer ring area to communicate with the vacuum generator; or the suction cup can communicate with the plurality of vacuum generators, and the plurality of vacuum generators can respectively communicate the inner ring area and the outer ring area The stomata of the area.

Next, the wafer stack structure 2 will be further described. In this embodiment, the wafer stack structure 2 is placed on a first carrier 40a. Specifically, from the perspective of FIG. 1 , the wafer stack structure 2 includes a first buffer pad 31 , a first tray 21 , a first spacer 11 , a wafer 91 , and a first step from bottom to top. The second spacer 12, a second tray 22 and a second cushion 32. The wafer 91 is interposed between the first spacer 11 and the second spacer 12 to jointly form a stacking unit 3. The stacking unit 3 is located between the first tray 21 and the second tray 22, and it can be said that the first tray 21 and the second tray 22 are located outside the first gasket 11 and the second gasket 12, respectively. The first cushioning pad 31 and the second cushioning pad 32 are respectively located on the side of the first tray 21 and the second tray 22 opposite to the stacking unit 3, and the first cushioning pad 31 and the second cushioning pad 32 are respectively located at the first side. The tray 21 and the outside of the second tray 22.

In addition, in the embodiment, both the first spacer 11 and the second spacer 12 have substantially the same structure, and both the first tray 21 and the second tray 22 have substantially the same structure, and the first cushion 31 is provided. It is substantially the same structure as both of the second cushions 32. The first spacer 11 and the second spacer 12 are in the form of a sheet, and may be, but not limited to, made of plastic or paper. The first tray 21 and the second tray 22 may be, but not limited to, a plastic material such as polyethylene terephthalate (PET) or the like. The first cushion pad 31 and the second cushion pad 32 may be, but not limited to, a material having a buffering effect, such as a sponge, a rubber, or the like, which can absorb the impact force of the outside on the wafer stack structure 2 .

3A-3B, FIGS. 3A and 3B are schematic plan views of the gasket of FIG. 1. 3A is a first spacer 11 including an inner ring portion 110 and an outer ring portion 120. The outer ring portion 120 surrounds the inner ring portion 110, and the inner ring portion 110 has a plurality of through holes 10s surrounding the central region of the inner ring portion 110. In this embodiment, the through holes 10s are arranged in a plurality of concentric circles. However, the present invention is not limited to the number and arrangement of the through holes 10s. For example, in other embodiments, the through holes 10 may be only four. However, it still surrounds the central area of the inner ring portion 110. 3B is the second spacer 12, and the second spacer 12 and the first spacer 11 have substantially the same structure, so please do not repeat them.

In addition, referring to FIG. 2 and FIG. 3A, when the suction cup 50 is aligned with the first spacer 11, the inner ring area 510 of the suction cup 50 may correspond to the inner ring portion 110 of the first spacer 11, and the outer ring area 520 may correspond. The outer ring portion 120 of the first spacer 11 is provided. More specifically, the air holes 50s of the inner ring region 510 of the suction cup 50 correspond to the inner ring portion 110 of the first spacer 11, and the air holes 50s of the outer ring portion 520 correspond to the outer ring portion 120 of the first spacer 11. Of course, since the second spacer 12 has the same structure as the first spacer 11, the corresponding relationship between the suction cup 50 and the first spacer 11 should be similar when the suction cup 50 is aligned with the second spacer 12. That is, the air holes 50s of the inner ring region 510 of the suction cup 50 correspond to the inner ring portion 110 of the second spacer 12, and the air holes 50s of the outer ring portion 520 correspond to the outer ring portion 120 of the second spacer 12.

In addition, it is to be noted that the present invention is not limited to the number of components of the wafer stack structure 2 in the foregoing embodiment. For example, in other embodiments, the wafer stack structure may include a plurality of stacked units 3, in which case the number of trays and cushions may be adaptively increased.

Next, a method and a step of applying the adsorption type mobile device 1 to move the wafer stack structure 2 to detect the wafer will be further described. Referring to FIGS. 4-12, FIG. 4 is a schematic diagram showing the use of an adsorption type mobile device and a wafer stack structure according to an embodiment of the present invention. In addition, it should be noted that, in addition to the components as described above, a detection stage 70 and a second carrier 40b are additionally included. In this embodiment, the detection stage 70 can be matched with another vacuum generator (not shown), so that when the wafer 91 is placed on the detection stage 70, the vacuum generator can generate a suction airflow. The wafer 91 is fixed to the inspection stage 70. The second carrier 40b has substantially the same structure as the first carrier 40a described above. In addition, the second carrier 40 is used to place the detected wafer and the adjacent protection component for later operation. Therefore, the second carrier 40 may also be referred to as a waiting area.

First, as shown in FIGS. 4-8, the wafer 91 is moved to a detection stage 70. In detail, as can be seen from FIG. 4, the inner ring region 510 of the suction cup 50 and the air hole 50s of at least one of the outer ring regions 520 or the air holes 50s of both simultaneously generate a vacuum attraction force to suck up the second cushion 32. Then, the moving mechanism 60 carries the suction cup 50 to which the second cushion 32 is adsorbed to the second carrier 40b. When the suction cup 50 brings the adsorbed second cushion 32 to the second carrier 40b, the vacuum attraction is stopped to reserve the second cushion 32 in the second carrier 40b.

Next, as shown in FIG. 5, similarly to the manner of FIG. 4, the inner ring region 510 of the suction cup 50 and the air hole 50s of at least one of the outer ring regions 520 or the air holes 50s of both simultaneously generate a vacuum attraction force to suck the second tray 22. It is taken to the second carrier 40b. When the suction cup 50 brings the adsorbed second tray 22 to the second carrier 40b, the vacuum suction force is stopped to reserve the second tray 22 on the second cushion 32 in the second carrier 40b.

Next, a preliminary alignment of the undetected wafer 91 is performed. Specifically, as shown in FIG. 6, the air holes 50s of the inner ring region 510 and the outer ring region 520 of the suction cup 50 or the air holes 50s of only the outer ring region 520 generate a vacuum attractive force to attract the second gasket covering the wafer 91. 12. Specifically, the air vent 50s of the outer ring region 520 of the suction cup 50 corresponds to the outer ring portion 120 of the second shims 12, so that the suction cup 50 can suck the second shims 12. Here, the second spacer 12 is lifted by the suction cup 50 and maintained in the air so that the wafer 91 is no longer covered by the second spacer 12 and exposed to the outside. In this case, a detecting mechanism (not shown), such as an alignment camera, can be used to detect a notch (not shown) on the wafer 91 to the wafer 91. Conduct a preliminary match. After the wafer 91 is aligned, the chuck 50 places the second spacer 12 back onto the wafer 91.

Next, as shown in FIG. 7, at least the inner ring region 510 of the suction cup 50 or the inner ring region 510 of the suction cup 50 and the air hole 50s of the outer ring region 520 simultaneously generate a vacuum attraction force, in this case, the suction surface 50a of the suction cup 50. When the second spacer 12 is touched, the vacuum suction force of the suction cup 50 can attract the wafer 91 on the other side of the second spacer 12 via the through hole 10s of the second spacer 12, so that the suction cup 50 can be separated by the second spacer. 12, the wafer 91 is sucked up together. Next, the suction pad 50 moves the sucked second spacer 12 together with the wafer 91 to the detection stage 70. Wherein, before the second spacer 12 and the wafer 91 are close to the detection stage 70 but the wafer 91 is not flatly attached to the detection stage 70, the vacuum attractive force of the suction cup 50 is first reduced to allow the detection stage 70 to be generated. The vacuum attractive force can gradually attract the wafer 91 to the detection stage 70.

Next, as shown in FIG. 8, after the wafer 91 is adsorbed and fixed on the detecting stage 70, the suction cup 50 can maintain the adsorption of the second gasket 12 by the air holes 50s of the outer ring region 520, and the second gasket 12 can be picked up. The second carrier 40b is moved, and the wafer 91 can then be subjected to subsequent pre-test preparation and inspection processes. Wherein, when the suction cup 50 brings the adsorbed second spacer 12 to the second carrier 40b, the vacuum attraction is stopped to reserve the second spacer 12 on the second tray 22 in the second carrier 40b.

Next, as shown in FIGS. 9-10, after the wafer 91 is detected, the wafer 91 is removed from the detection stage 70. Specifically, the air holes 50s of both the inner ring region 510 and the outer ring region 520 of the suction cup 50 or only the air holes 50s of the outer ring region 520 generate a vacuum attractive force to attract the first spacer 11 covering the first tray 21. Since the air holes 50s of the outer ring region 520 of the suction cup 50 correspond to the outer ring portion 120 of the first spacer 11, the suction cup 50 can suck up the first spacer 11 and bring it over the wafer 91. During the process, the chuck 50 will approach the wafer 91 with the first spacer 11 before the inspection stage 70 cancels the adsorption of the wafer 91. Then, at least the inner ring region 510 of the suction cup 50 or the inner ring region 510 of the suction cup 50 and the air hole 50s of the outer ring region 520 simultaneously generate a vacuum attractive force, in which case the suction cup 50 is brought with the first spacer 11 When the wafer 91 is touched, the vacuum suction force of the suction cup 50 can attract the wafer 91 on the other side of the first spacer 12 via the through hole 10s of the first spacer 11, and the detection stage 70 stops adsorbing the wafer 91, so that the suction cup The wafer 91 can be sucked up together via the first spacer 11. Next, the suction cup 50 moves the first spacer 11 and the wafer 91 which are sucked together away from the detection stage 70 and is placed on the second carrier 40b, that is, the first spacer 11 and the wafer 91 are placed in the second The second spacer 12 in the carrier 40b is such that the wafer 91 is located between the first spacer 11 and the second spacer 12.

Finally, as shown in FIGS. 11-12, the suction cup 50 sequentially brings the first tray 21 and the first cushion 31 to the second carrier 40b in a manner similar to the above-described FIGS. 4-5.

The wafer stack structure 2 is moved by the above methods and steps, and finally the wafer stack structure in the second carrier 40b is changed from bottom to top into a second buffer pad 32, a second tray 22, a second spacer 12, The detected wafer 91, the first spacer 11, the first tray 21, and the first cushion 31 are provided. That is, the arrangement order of the wafer stack structure 2 in the first carrier 40a in FIG. 1 is exactly opposite. That is to say, after the wafer stack structure passes through the foregoing detection process, the stacking manner of the wafer 91 can be properly protected.

Further, as is apparent from the foregoing steps, the design of the air vent 50s of the inner and outer rings can be selected by the suction cup 50, and the inner ring of the spacers 11, 12 has a design of the through hole 10s. The suction cup 50 can be separated by the spacer 11. Or 12 ways to get the wafer. For example, when the air vent 50s of the inner ring of the suction cup 50 is evacuated, the suction cup 50 can be sucked up by the spacer 11 or 12, so that the wafer 91 can be protected by the spacer 11 or 12. When the air vent 50s of the outer ring of the suction cup 50 is evacuated, the suction cup 50 can individually suck the shims 11 or 12. In this way, the wafer 91 is properly protected during the movement process, which can effectively reduce the probability of damaging the wafer 91, and does not cause the problems conventionally caused by manual handling.

In addition, since the material of the inner ring region 510 of the suction cup 50 is hard, it is ensured that at least a certain degree of flatness is maintained in the portion of the inner ring region 510 during the process in which the wafer 91 and the spacer 11 or 12 are adsorbed and moved by the suction cup 50.

However, it should be noted that the present invention is not limited to the size of the vacuum attraction generated by the suction cup. Ideally, the suction cup can lift the target, but the attraction does not cause the target to be distorted. For example, when the gasket and the wafer are sucked up by the suction cup, the suction holes of the suction cup generate a suction airflow sufficient to lift the gasket and the wafer without causing distortion or even cracking of the gasket and the wafer.

In addition, the present invention is also not designed in such a manner that the size of the through holes and the pores is such that at least the suctioned gasket is sucked or the gasket is twisted and deformed during the process of attracting the airflow.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.

1‧‧‧Adsorption mobile device

2‧‧‧ Wafer stack structure

3‧‧‧Stacking unit

10s‧‧‧through hole

11‧‧‧First gasket

12‧‧‧Second gasket

21‧‧‧First tray

22‧‧‧Second tray

31‧‧‧First cushion

32‧‧‧Second cushion

40a‧‧‧First Vehicle

40b‧‧‧second vehicle

50‧‧‧Sucker

50a‧‧‧Attraction

50s‧‧‧ stomata

60‧‧‧Mobile agencies

70‧‧‧Detection stage

91‧‧‧ wafer

110‧‧‧ Inner Circle

120‧‧‧Outer Circle

510‧‧‧ inner circle

520‧‧‧Outer area

FIG. 1 is a schematic diagram of an adsorption mobile device and a wafer stack structure according to an embodiment of the invention. 2 is a plan view showing the suction surface of the adsorption type mobile device of FIG. 1. 3A and 3B are plan views of the gasket of Fig. 1. 4 to 12 are schematic diagrams showing the use of an adsorption type mobile device and a wafer stack structure according to an embodiment of the present invention.

Claims (13)

A spacer adapted to protect a wafer, comprising: an inner ring portion having a plurality of through holes; and an outer ring portion surrounding the inner ring portion. The gasket of claim 1, wherein the through holes surround a central region of the inner ring portion. A wafer stack structure comprising: at least one spacer as claimed in claim 1; at least one wafer on a side of the at least one spacer. The wafer stack structure of claim 3, wherein the number of the at least one spacer is two, and the at least one wafer is located between the spacers. The wafer stack structure of claim 4 further comprises at least two trays respectively located outside the spacers. The wafer stack structure of claim 5 further includes two buffer pads respectively located outside the at least two trays. An adsorption mobile device for moving a wafer stack structure, the adsorption mobile device comprising: a suction cup having a suction surface and a plurality of air holes, the attraction mask having an inner ring region and an outer ring region, the outer a circle surrounding the inner ring zone, the air holes are located in the inner ring zone and the outer ring zone, and the suction cup is connected to the air holes by using a vacuum generator to selectively select at least the inner ring zone and the outer ring zone The air holes of one of the zones are evacuated; and a moving mechanism is coupled to the suction cup for moving the suction cup. The adsorption type mobile device of claim 7, wherein a material hardness of the inner ring region of the suction cup is higher than a material hardness of the outer ring portion. A wafer moving method, comprising: providing a wafer stack structure according to claim 3; providing the adsorption type moving device according to claim 7, wherein the inner ring area and the outer ring area of the suction cup Respecting the inner ring portion and the outer ring portion of the at least one spacer respectively; moving the at least one wafer to a detecting stage, the step comprising: pumping at least the air holes of the inner ring region of the suction cup Adsorbing the at least one wafer through the through holes covering the at least one spacer on the at least one wafer; and the at least one wafer and the at least one spacer covering the at least one wafer And moving to the detecting stage; pumping the air holes of the outer ring area of the suction cup, and stopping pumping the air holes of the inner ring area of the suction cup, so that the suction cup only adsorbs the at least one The outer ring portion of the gasket; and the at least one gasket adsorbed to the suction cup is removed from the detection stage. The method of moving a wafer according to claim 9, wherein the step of removing the at least one spacer adsorbed on the chuck from the detecting stage further comprises: moving the at least one spacer adsorbed on the chuck to a waiting And stopping the evacuation of the air holes of the outer ring region of the suction cup to stop adsorbing the at least one spacer to leave the at least one spacer in the waiting area. The wafer moving method of claim 10, wherein the number of the at least one spacer in the wafer stack structure is two, and the step of moving the at least one wafer to the detection stage further comprises: Disposing the at least one wafer out of the detecting stage, the step comprising: pumping the air holes of the outer ring area of the suction cup to adsorb another one of the pads; covering the other one of the pads adsorbed by the suction cup Detecting the at least one wafer on the loading stage; evacuating the air holes of the inner ring area of the suction cup to adsorb the through holes of another of the spacers covering the at least one wafer At least one wafer; and another pad that is to be adsorbed is moved together with the at least one wafer to the waiting area. The wafer moving method of claim 11, wherein the step of moving the adsorbed another spacer to the waiting area together with the at least one wafer further comprises: stopping the inner ring region of the chuck The air holes are evacuated to stop adsorbing the other spacer on the chuck and the at least one wafer to be stacked on the spacer of the waiting area. The wafer moving method of claim 9, wherein the step of moving the at least one wafer to the detecting stage further comprises: pumping the air holes on the outer ring area of the suction cup to adsorb and cover The at least one spacer on the at least one wafer; lifting the adsorbed at least one spacer to expose the at least one wafer; providing a detecting mechanism to detect the at least one wafer to determine the at least one wafer And the at least one gasket to be lifted back onto the at least one wafer.