TWI826308B - Transfer device for keeping position of wafer or die by positive pressure and method for the same - Google Patents

Abstract

A transfer method for keeping position of wafer or die by positive pressure includes: (a)sucking a wafer or dies by a negative pressure of a sucker; (b) moving a retaining device to a bottom of the sucker and blowing the wafer or the dies upward by a positive pressure of the retaining device; (c) closing the negative pressure by the sucker and moving the sucker and the retaining device synchronously above a substrate; (d) sucking the wafer or the dies by the negative pressure of the sucker; and closing the positive pressure by the retaining device and separating the retaining device from the sucker; (e)moving the sucker downward until the wafer or the dies contact the substrate; and (f) closing the negative by the sucker and separating the sucker from the wafer or the dies, and binding the wafer or the dies on the substrate. As such, the single sucker can suck and move the wafer or the dies, while the positive pressure of the retaining device can keep the position of the wafer or the positions of the dies on the sucker, thereby avoiding the deviation of the position accuracy of the wafer or the dies on the substrate.

Description

Transfer device and method for maintaining the position of wafers or die using positive pressure

The present invention relates to a transfer device and method, in particular to a transfer device and method that utilizes positive pressure to maintain the position of a wafer or die.

In the semiconductor manufacturing process, wafers or die usually need to be transported to the substrate by a transfer device. Two conventional transfer devices and methods will be introduced below.

The first transfer device includes a first suction cup and a second suction cup. The first transfer method includes the following steps: the first suction cup generates negative pressure and sucks the top surface of a wafer or a plurality of dies by the negative pressure; the first suction cup moves above the second suction cup; the first suction cup moves toward Move downward until the bottom surface of the wafer or the dies contacts the second suction cup; the second suction cup generates negative pressure and sucks the bottom surface of the wafer or the dies through the negative pressure; the first suction cup turns off the negative pressure, And the first suction cup is separated from the wafer or the dies; the second suction cup moves above a substrate; the second suction cup moves downward until the top surface of the wafer or the dies contacts the substrate; and the second suction cup is closed negative pressure, and the second suction cup is separated from the wafer or the die, so that the wafer or the die is bonded to the substrate.

However, when the first suction cup transfers the wafer or the die to the second suction cup, the accuracy of the position of the wafer or the die shifts, causing the wafer or the die to be placed on the substrate. The precision offset of the position.

Furthermore, due to the deviation in the accuracy of the position of these die, some die may not be completely aligned with the through hole of the second suction cup, causing the second suction cup's ability to absorb some die to be greatly weakened, so that the second suction cup becomes During the movement, some grains will break away from the second suction cup and fall downward.

The second transfer device includes a first suction cup, a carrying platform and a second suction cup. The second transfer method includes the following steps: the first suction cup generates negative pressure and sucks the top surface of a wafer or a plurality of dies through the negative pressure; the first suction cup moves above the stage; the first suction cup moves downward Move until the bottom surface of the wafer or the dies contacts the stage; the first suction cup turns off the negative pressure, and the first suction cup separates from the wafer or the dies; the stage moves to below the second suction cup; the second suction cup Move downward until the top surface of the wafer or the dies contacts the second suction cup; the second suction cup generates negative pressure and sucks the top surface of the wafer or the dies by the negative pressure; the second suction cup moves to above a substrate; the second suction cup moves downward until the bottom surface of the wafer or the dies contacts the substrate; and the second suction cup turns off the negative pressure, and the second suction cup separates from the wafer or the dies, causing the wafer to Or the grains are bonded to the substrate.

However, during the process in which the first suction cup transfers the wafer or the die to the carrier and the stage transfers the wafer or the die to the second suction cup, the accuracy of the position of the wafer or the die Shift, which causes a shift in the accuracy of where a wafer or such die is placed on a substrate.

Furthermore, due to the deviation in the accuracy of the position of the die, some die may not be completely aligned with the through hole of the second suction cup, causing some die to break away from the second suction cup during the movement of the second suction cup. Fall down.

The main purpose of the present invention is to provide a transfer device and method that uses positive pressure to maintain the position of a wafer or die, which can avoid precision deviation of the position of the wafer or die placed on the substrate.

Another object of the present invention is to provide a transfer device and method that utilizes positive pressure to maintain the position of a wafer or die, which can prevent the die from detaching from the suction cup and falling downward.

In order to achieve the aforementioned object, the present invention provides a transfer device that uses positive pressure to maintain the position of a wafer or die, including a suction cup and a holding device. The suction cup selectively generates a negative pressure, and sucks the top surface of a wafer or a plurality of dies by the negative pressure. The holding device is disposed at the bottom of the suction cup, selectively generates a positive pressure, and blows the bottom surface of the wafer or the dies upward by the positive pressure.

In some embodiments, the suction cup includes a body, an upper cover and an exhaust pipe. The body is provided with a plurality of through holes. The upper cover is disposed on the top of the body and forms a first chamber. The through holes are connected with the first chamber. The exhaust pipe communicates with the first chamber, and the exhaust pipe is provided on the upper cover and communicates with the first chamber; wherein, the exhaust pipe discharges the air inside the first chamber and the through holes outward to generate the The negative pressure causes the body to suck the top surface of the wafer or the dies through the negative pressure.

In some embodiments, the holding device includes a lower cover and an air inlet pipe. The lower cover is disposed at the bottom of the body and forms a second chamber. The air inlet pipe is disposed on the lower cover and communicates with the second chamber. The air inlet pipe guides external air into the second chamber to generate the positive pressure, so that the lower cover blows upward the bottom surface of the wafer or the dies through the positive pressure.

In some embodiments, the transfer device further includes a clamping mechanism that clamps the top around the body and the bottom around the lower cover.

In some embodiments, the holding device further includes a sealing member, the sealing member is circumferentially disposed in a gap between the surrounding bottom of the body and the surrounding top of the lower cover.

In order to achieve the aforementioned objectives, the present invention provides a transfer method that utilizes positive pressure to maintain the position of a wafer or die, including the following steps: (a) a suction cup generates a negative pressure, and uses the negative pressure to suck a wafer or the top surface of a plurality of dies; (b) a holding device moves to the bottom of the suction cup, generates a positive pressure, and blows the wafer or the bottom surface of the dies upward through the positive pressure; (c) the The suction cup turns off the negative pressure, and the suction cup moves to above a substrate synchronously with the holding device; (d) the suction cup generates the negative pressure, and sucks the top surface of the wafer or the dies through the negative pressure; and the holding device turns off the positive pressure, and the holding device detaches from the suction cup; (e) the suction cup moves downward until the bottom surface of the wafer or the dies contacts the substrate; and (f) the suction cup closes The negative pressure causes the suction cup to separate from the wafer or the die, so that the wafer or the die is bonded to the substrate.

In some embodiments, step (a) further includes: an exhaust pipe of the suction cup discharges the air inside a first chamber of a body of the suction cup and a plurality of through holes of the body outward to generate the The negative pressure causes the body to suck the top surface of the wafer or the dies through the negative pressure.

In some embodiments, step (b) further includes: moving a lower cover of the retaining device to the bottom of the body; and an air inlet pipe of the retaining device guiding external air into a second portion of the lower cover of the retaining device. The positive pressure is generated inside the chamber, so that the lower cover blows upward the bottom surface of the wafer or the dies through the positive pressure.

In some embodiments, step (b) further includes: a clamping mechanism clamps the top around the body and the bottom around the lower cover; wherein step (c) further includes: stopping the exhaust pipe to move the lower cover. The air inside the first chamber and the through holes is discharged outward to close the negative pressure; an upper cover moves upward to separate from the body; the body, the holding device and the clamping mechanism move synchronously to above the substrate; And the upper cover moves to the top of the body; wherein step (d) further includes: the exhaust pipe exhausts the air inside the first chamber and the through holes to generate the negative pressure, so that the body The wafer or the dies are sucked by the negative pressure; the air inlet pipe stops guiding external air into the second chamber to close the positive pressure; the clamping mechanism is separated from the body and the upper cover; and the holding The device moves downward to disengage the suction cup.

In some embodiments, step (b) further includes: a sealing member of the retaining device is circumferentially disposed in a gap between the surrounding bottom of the body and the surrounding top of the lower cover along a circumferential direction.

The effect of the present invention is that during the transfer of the wafer or the die from the suction cup to the substrate, the present invention can suck and move the wafer or the die with a single suction cup, and at the same time, the wafer or the die is generated by the holding device. The positive pressure keeps the position of the wafer or the die on the suction cup fixed, and there is no need to hand it over to another suction cup or continuously hand it over to the carrier and another suction cup, effectively reducing the number of handovers and preventing the wafer or The accuracy of the placement of the dies on the substrate shifts.

Furthermore, because the positions of the die on the suction cup are fixed, the die can remain aligned with the through holes, and the force of the suction cup to absorb the die remains unchanged, and the die will not move at all. It breaks away from the suction cup and falls downward.

The following is a more detailed description of the embodiments of the present invention with reference to drawings and component symbols, so that those skilled in the art can implement them after reading this specification.

Figure 1 is an exploded perspective view of the device of the present invention, and Figure 2 is a cross-sectional view of the device of the present invention. As shown in FIGS. 1 and 2 , the present invention provides a transfer device that uses positive pressure to maintain the position of a wafer or die, including a suction cup 10 , a holding device 20 and a clamping mechanism 30 . The suction cup 10 includes a body 11, an upper cover 12 and an exhaust pipe 13. The body 11 is provided with a plurality of through holes 111. The upper cover 12 is disposed on the top of the body 11 and forms a first chamber 121. The through holes 111 are connected to the first chamber 121. A chamber 121 communicates with the first chamber 121 , and the exhaust pipe 13 is provided on the upper cover 12 and communicates with the first chamber 121 . The holding device 20 includes a lower cover 21, an air inlet pipe 22 and a seal 23. The lower cover 21 is disposed at the bottom of the body 11 and forms a second chamber 211. The air inlet pipe 22 is disposed on the lower cover 21 and is connected with the second chamber 211. The chambers 211 communicate with each other, and the sealing member 23 is disposed in a gap between the bottom around the body 11 and the top around the lower cover 21 along a circumferential direction. The clamping mechanism 30 includes two first clamping parts 31 and two second clamping parts 32. The first clamping parts 31 respectively clamp the tops of both sides of the body 11, and the second clamping parts 32 respectively Clamp the bottom on both sides of the lower cover 21.

As shown in Figure 1, in a preferred embodiment, the shape of the suction cup 10 is a rectangle. In some embodiments, the suction cup 10 is circular in shape. However, the shape of the suction cup 10 is not limited to this.

In some embodiments, the suction cup 10 may be made of rubber, metal, plastic or porous ceramics, but is not limited thereto.

In some embodiments, the seal 23 may be an O-ring or a rubber gasket, but is not limited thereto.

Figure 3 is a flow chart of the method of the present invention. Figure 4 is a schematic diagram of step S100 of the method of the present invention. Figures 5A to 5D are schematic diagrams of step S200 of the method of the present invention. Figures 6A to 6D are schematic diagrams of the method of the present invention. 7A to 7E are schematic diagrams of step S400 of the method of the present invention. Figures 8A and 8B are schematic diagrams of step S500 of the method of the present invention. Figures 9A and 9B are schematic diagrams of step S500 of the method of the present invention. Schematic diagram of the S600. The present invention provides a transfer method that utilizes positive pressure to maintain the position of wafers or die, which includes the following steps:

In step S100 , as shown in FIGS. 3 and 4 , the suction cup 10 generates a negative pressure 14 and sucks the top surfaces of a plurality of die 40 through the negative pressure 14 . More specifically, step S100 further includes: the exhaust pipe 13 discharges the air inside the first chamber 121 and the through holes 111 to generate a negative pressure 14, so that the body 11 absorbs the air through the negative pressure 14. The top surface of die 40.

Step S200 , as shown in FIG. 3 and FIG. 5A to FIG. 5D , the holding device 20 moves to the bottom of the suction cup 10 , generates a positive pressure 24 , and blows the bottom surfaces of the die 40 upward through the positive pressure 24 . In more detail, step S200 further includes: step S210, as shown in Figure 5A, the holding device 20 moves to the bottom of the suction cup 10; step S220, as shown in Figure 5B, the holding device 20 moves upward, so that the lower cover 21 moves to the bottom of the body 11, and the sealing member 23 is circumferentially provided in the gap between the bottom around the body 11 and the top around the lower cover 21; step S230, as shown in FIG. 5C, the first The clamping members 31 clamp the tops on both sides of the body 11 respectively, and the second clamping members 32 clamp the bottoms on both sides of the lower cover 21 respectively; and step S240, as shown in FIG. 5D , the air inlet pipe 22 External air is introduced into the second chamber 211 to generate positive pressure 24 , so that the lower cover 21 blows the bottom surfaces of the dies 40 upward through the positive pressure 24 .

Step S300 , as shown in FIG. 3 and FIG. 6A to FIG. 6D , the suction cup 10 turns off the negative pressure 14 , and the suction cup 10 and the holding device 20 move synchronously to above a substrate 50 . Specifically, step S300 further includes: step S310. As shown in FIG. 6A , the exhaust pipe 13 stops discharging the air inside the first chamber 121 and the through holes 111 to close the negative pressure 14; step S320 , as shown in Figure 6B, the upper cover 12 moves upward to separate from the body 11; step S330, as shown in Figure 6C, the body 11, the holding device 20 and the clamping mechanism 30 move synchronously to the top of the substrate 50; and step S340, as shown in Figure 6C As shown in 6D, the upper cover 12 moves to the top of the body 11.

Step S400, as shown in FIG. 3 and FIG. 7A to FIG. 7E , the suction cup 10 generates negative pressure 14 and sucks the top surfaces of the die 40 through the negative pressure 14; and the holding device 20 turns off the positive pressure 24, and holds the device 20 detach from the suction cup 10. To be more clear, step S400 further includes: step S410. As shown in FIG. 7A , the exhaust pipe 13 discharges the air inside the first chamber 121 and the through holes 111 to the outside to generate a negative pressure 14, so that the body 11. The dies 40 are sucked in by the negative pressure 14; Step S420, as shown in Figure 7B, the air inlet pipe 22 stops guiding external air into the second chamber 211 to close the positive pressure 24; Step S430, as shown in Figure 7C As shown in FIG. 7D and 7E , the first clamping members 31 move upward to separate from the body 11 , and the second clamping members 32 move downward to separate from the upper cover 12 ; Step S440 , as shown in FIG. 7D and FIG. 7E , the holding device 20 moves toward Move down to disengage the suction cup 10.

In step S500 , as shown in FIG. 3 , FIG. 8A and FIG. 8B , the suction cup 10 moves downward until the bottom surfaces of the die 40 contact the substrate 50 .

Step S600 , as shown in FIG. 3 , FIG. 9A and FIG. 9B , the suction cup 10 turns off the negative pressure 14 , and the suction cup 10 separates from the die 40 , so that the die 40 is bonded to the substrate 50 . Specifically, step S600 further includes: step S610. As shown in FIG. 9A , the exhaust pipe 13 stops discharging the air inside the first chamber 121 and the through holes 111 to close the negative pressure 14; and S620, as shown in FIG. 9B, the suction cup 10 moves upward to break away from the die 40, so that the die 40 is combined with the substrate 50.

In some embodiments, the object transferred by the transfer device and method of the present invention may also be a wafer (not shown).

To sum up, during the period when the wafer or the die 40 is transferred from the suction cup 10 to the substrate 50, the present invention can suck and move the wafer or the die 40 through the single suction cup 10, while simultaneously using the holding device to The positive pressure 24 generated by 20 keeps the position of the wafer or the dies 40 on the suction cup 10 fixed, and there is no need to hand over to another suction cup or continuously hand over to one stage and another suction cup, effectively reducing the number of handovers. , to avoid accuracy deviation in the position of the wafer or the dies 40 placed on the substrate 50 .

Furthermore, because the positions of the die 40 on the suction cup 10 are fixed, the die 40 can remain aligned with the through holes 111, and the force of the suction cup 10 to absorb the die 40 remains unchanged. The crystal grain 40 will not break away from the suction cup 10 and fall downward at all.

In addition, the main body 11 and the upper cover 12 are detachable, which reduces the weight of the suction cup 10 when moving.

In addition, the clamping mechanism 30 can fix the main body 11 and the lower cover 21 to prevent the main body 11 from being affected by the movement of the upper cover 12, and can also assist the main body 11 and the lower cover 21 to move synchronously.

It is worth mentioning that the seal 23 can prevent the air in the second chamber 211 from leaking outward through the gap and prevent the pressure of the positive pressure 24 from dropping.

The above are only used to explain the preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Therefore, any modifications or changes related to the present invention are made under the same spirit of the invention. , should still be included in the scope of protection intended by the present invention.

10:Suction cup 11:Ontology 111:Through hole 12: Upper cover 121:First chamber 13:Exhaust pipe 14: Negative pressure 20: Holding device 21:Lower cover 211:Second chamber 22:Intake pipe 23:Seals 24: Positive pressure 30: Clamping mechanism 31: First clamping piece 32: Second clamping piece 40:Grain 50:Substrate S100~S600: steps S210~S240: steps S310~S340: steps S410~S440: steps S610, S620: steps

Figure 1 is an exploded perspective view of the device of the present invention. Figure 2 is a cross-sectional view of the device of the present invention. Figure 3 is a flow chart of the method of the present invention. Figure 4 is a schematic diagram of step S100 of the method of the present invention. 5A to 5D are schematic diagrams of step S200 of the method of the present invention. 6A to 6D are schematic diagrams of step S300 of the method of the present invention. 7A to 7E are schematic diagrams of step S400 of the method of the present invention. 8A and 8B are schematic diagrams of step S500 of the method of the present invention. 9A and 9B are schematic diagrams of step S600 of the method of the present invention.

S100~S600: steps

Claims (10)

A transfer device that uses positive pressure to maintain the position of wafers or dies, including: a suction cup that selectively generates a negative pressure and uses the negative pressure to suck the top surface of a wafer or a plurality of dies; and A holding device is disposed at the bottom of the suction cup, selectively generates a positive pressure, and blows the bottom surface of the wafer or the dies upward through the positive pressure. The transfer device of claim 1, wherein the suction cup includes a body, an upper cover and an exhaust pipe. The body is provided with a plurality of through holes. The upper cover is disposed on the top of the body and forms a first chamber. , the through holes communicate with the first chamber, the exhaust pipe is provided on the upper cover and communicates with the first chamber; wherein, the exhaust pipe connects the inside of the first chamber and the inside of the through holes The air is discharged outward to generate the negative pressure, so that the body sucks the top surface of the wafer or the dies through the negative pressure. The transfer device according to claim 2, wherein the holding device includes a lower cover and an air inlet pipe. The lower cover is disposed at the bottom of the body and forms a second chamber. The air inlet pipe is disposed under the lower body. The cover is in communication with the second chamber; wherein, the air inlet pipe guides external air into the interior of the second chamber to generate the positive pressure, so that the lower cover blows the wafer or the like upwards through the positive pressure. The bottom surface of the grain. The transfer device according to claim 3, further comprising a clamping mechanism that clamps the top around the body and the bottom around the lower cover. The transfer device as claimed in claim 3 or 4, wherein the holding device further includes a sealing member that is disposed along a circumferential direction between the bottom around the body and the top around the lower cover. In a gap between. A transfer method that uses positive pressure to maintain the position of wafers or dies, including the following steps: (a) A suction cup generates a negative pressure, and uses the negative pressure to suck the top surface of a wafer or a plurality of dies; (b) A holding device moves to the bottom of the suction cup, generates a positive pressure, and blows the bottom surface of the wafer or the dies upward through the positive pressure; (c) The suction cup turns off the negative pressure, and the suction cup and the holding device move synchronously to above a substrate; (d) The suction cup generates the negative pressure and sucks the top surface of the wafer or the dies through the negative pressure; and the holding device turns off the positive pressure, and the holding device separates from the suction cup; (e) the holding device The suction cup moves downward until the bottom surface of the wafer or the dies contacts the substrate; and (f) the suction cup turns off the negative pressure, and the suction cup separates from the wafer or the dies, so that the wafer Or the crystal grains are bonded to the substrate. The transfer method according to claim 6, wherein step (a) further includes: an exhaust pipe of the suction cup connects the inside of a first chamber of a body of the suction cup and the inside of a plurality of through holes of the body. The air is discharged outward to generate the negative pressure, so that the body sucks the top surface of the wafer or the dies through the negative pressure. The transfer method according to claim 7, wherein step (b) further includes: moving a lower cover of a holding device to the bottom of the body; and an air inlet pipe of the holding device guiding external air into the holding device The positive pressure is generated inside a second chamber of the lower cover, so that the lower cover blows upward the bottom surface of the wafer or the dies through the positive pressure. The transfer method according to claim 8, wherein step (b) further includes: a clamping mechanism clamps the top around the body and the bottom around the lower cover; wherein step (c) further includes: The exhaust pipe stops discharging the air inside the first chamber and the through holes outward to close the negative pressure; an upper cover moves upward to separate from the body; the body, the holding device and the clamping mechanism are synchronized Move to above the base plate; and the upper cover moves to the top of the body; wherein step (d) further includes: the exhaust pipe exhausts the air inside the first chamber and the through holes to generate The negative pressure causes the body to suck the wafer or the dies through the negative pressure; the air inlet pipe stops guiding external air into the second chamber to close the positive pressure; the clamping mechanism is separated from the body and the upper cover; and the holding device moves downward to disengage from the suction cup. The transfer method according to claim 8 or 9, wherein step (b) further includes: a seal of the holding device is arranged around the bottom around the body and the lower cover along a circumferential direction. in the gap between the tops.

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