JP6199578B2 - Channel member, vacuum suction device and cooling device using the same, and method for manufacturing channel member - Google Patents

Description

  The present invention relates to a flow path member used for adsorbing or cooling an object when processing the object such as a semiconductor wafer or a glass substrate in a manufacturing process of a semiconductor integrated circuit or a liquid crystal display device, for example. The present invention relates to a vacuum suction device, a cooling device, and a method of manufacturing a flow path member.

  Conventionally, semiconductor integrated circuits and liquid crystal display devices are manufactured by processing objects such as semiconductor wafers and glass substrates. In this manufacturing process, a flow path member is used to adsorb or cool an object when the object is processed.

  For example, Patent Document 1 discloses a base body (base portion) and a flow path (suction) formed along the main surface direction of the main body inside the main body and through which a fluid (gas) flows in order to adsorb an object (wafer). A flow path member (substrate holding device) including an exhaust path) is described.

  In such a flow path member, when the flow path is formed between the first substrate and the second substrate while joining the first substrate and the second substrate to form a base, the fluid flowing through the flow path Since the pressure is repeatedly applied to the boundary between the first substrate and the second substrate, the first substrate and the second substrate may peel off. The flow path member is deformed when stress is applied because the rigidity of the flow path member is reduced in the region where the separation occurs (peeling region) compared to the state where the first substrate and the second substrate are joined and the thickness is increased. And distortion may occur. As a result, the position accuracy of the object is lowered, and as a result, the processing accuracy of the object is likely to be lowered. Therefore, there is a demand for a flow path member with improved processing accuracy of the object.

JP 2002-343853 A

  An object of this invention is to provide the flow-path member which responds to the request | requirement which raises the processing precision of a target object, the vacuum suction apparatus and cooling device using the same, and the manufacturing method of a flow-path member.

The flow path member according to an aspect of the present invention is located between the first substrate and the second substrate and the base having the first substrate and the second substrate bonded to one main surface of the first substrate. The flow path has a longitudinal direction along the main surface direction of the base body and flows between the first substrate and the second substrate, and has a longitudinal direction along the main surface direction of the base body. Yes to Ru and a dummy channel. The flow path and the dummy flow path are located across a portion where the first substrate and the second substrate are joined. The dummy flow path has a space at least in part.

  A vacuum suction apparatus according to an aspect of the present invention includes a suction unit having the above-described flow path member that vacuum-sucks the object, and between the suction region and the target object via the suction hole and the flow path. And an exhaust means for exhausting the fluid.

  The cooling device in one form of this invention is equipped with the cooling means which has the flow-path member mentioned above which cools the said target object, and the fluid supply means which supplies the said fluid which cools the said target object to the said flow path.

In one embodiment of the present invention, the flow path member manufacturing method forms a groove having a longitudinal direction along the corresponding one principal surface direction on at least one of the one principal surface of the first substrate and the one principal surface of the second substrate. However, a dummy groove portion having a longitudinal direction along the corresponding one principal surface direction is formed on at least one of the one principal surface of the first substrate and the one principal surface of the second substrate so as not to overlap the groove portion. a step of the dummy passage, so as to have a space at least partially, and a step that match against one main surface and one main surface of the second substrate of the first substrate via a bonding agent Prepare.

  According to the flow path member in one embodiment of the present invention, when the separation between the first substrate and the second substrate reaches the dummy flow path where the fluid does not flow, the progress of the separation is suppressed. Expansion of the peeling area | region with 2 board | substrates can be suppressed. Therefore, it is possible to suppress a decrease in the rigidity of the flow path member and increase the processing accuracy of the object.

  According to the vacuum suction device in one aspect of the present invention, since the above-described flow path member is provided, it is possible to suppress a decrease in rigidity of the flow path member and increase the processing accuracy of the object.

  According to the cooling device in one embodiment of the present invention, since the flow path member described above is provided, it is possible to suppress a decrease in rigidity of the flow path member and to increase the processing accuracy of the object.

  According to the method for manufacturing a flow path member in one aspect of the present invention, the flow path member that suppresses the expansion of the separation region between the first substrate and the second substrate by the dummy flow path and has excellent processing accuracy of the object is manufactured. can do.

(A) is a perspective view which shows the flow-path member in one Embodiment of this invention, (b) is a perspective view which shows the 1st board | substrate with which the flow-path member of Fig.1 (a) is provided, (c) FIG. 3 is a perspective view showing a second substrate provided in the flow path member of FIG. (A) is a top view of the flow path member of FIG. 1 (a), (b) is a top view of the 2nd board | substrate of FIG.1 (c). (A) is sectional drawing along the thickness direction of the flow-path member which adsorb | sucked the target object in the AA line of Fig.2 (a), (b) is the flow-path member of Fig.1 (a). FIG. 4C is a cross-sectional view orthogonal to the longitudinal direction of the dummy flow path included in FIG. 5C, and FIG. 5C is a cross-sectional view of a portion different from (b) orthogonal to the longitudinal direction of the dummy flow path. (A) thru | or (d) is sectional drawing of the part corresponded to Fig.3 (a) explaining the manufacturing method of the flow-path member of Fig.1 (a). (A) is sectional drawing orthogonal to the longitudinal direction of the dummy flow path with which the flow-path member in other embodiment of this invention is equipped, (b) is equipped with the flow-path member in other embodiment of this invention. It is sectional drawing orthogonal to the longitudinal direction of a dummy flow path, (c) is sectional drawing orthogonal to the longitudinal direction of the dummy flow path with which the flow-path member in other embodiment of this invention is provided.

  Hereinafter, a channel member according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3.

The flow path member 1 of the present embodiment is used as a vacuum chuck (suction means) for vacuum-sucking an object 2 such as a semiconductor wafer in various apparatuses such as an exposure apparatus and an inspection apparatus used in a semiconductor integrated circuit manufacturing process. Is. The object 2 adsorbed on the flow path member 1 is subjected to various treatments in various apparatuses. For example, the exposure apparatus includes a flow path member 1 that adsorbs the object 2 and a light source that irradiates and exposes the object 2 adsorbed on the flow path member 1. A wiring pattern can be formed.

  As shown in FIGS. 1 to 3, the flow path member 1 has a base 3, a flow path 4 positioned inside the base 3, a dummy flow path 5 positioned inside the base 3, and a thickness of the base 3. A through hole 6 penetrating in the direction, a suction hole 7 connected to the flow path 4, and a dummy hole 8 connected to the dummy flow path 5 are provided.

  The base 3 forms the main part of the flow path member 1 and supports the object 2. The base 3 includes a first substrate 9, a second substrate 10 bonded to one main surface of the first substrate 9, and a bonding agent 11 interposed between the first substrate 9 and the second substrate 10. The substrate 3 of the present embodiment has a disk shape.

  The first substrate 9 has a suction area 12 for vacuum suction of the object 2 while a first suction hole 7a described later is opened, and sucks the object 2. The first substrate 9 is made of ceramics and includes, for example, a ceramic sintered body such as a silicon carbide sintered body, an alumina sintered body, or a silicon nitride sintered body. The first substrate 9 may include only this ceramic sintered body, or may further include a ceramic film deposited on the surface of the ceramic sintered body. The ceramic film is preferably made of the same material as the ceramic sintered body. When the ceramic sintered body is a silicon carbide sintered body, the ceramic film is preferably a silicon carbide film. The first substrate 9 of the present embodiment has a disk shape. The thickness of the first substrate 9 is, for example, 1 mm or more and 10 mm or less. The width (diameter) of the first substrate 9 is, for example, not less than 200 mm and not more than 500 mm.

  The adsorption region 12 of the base 3 has an annular portion 13 corresponding to the shape of the object 2, a bottom surface 14 positioned inside the annular portion 13, and a plurality of protrusions 15 protruding from the bottom surface 14. The object 2 is supported by the annular portion 13 and the protrusion 15. At this time, since the space 16 between the object 2 and the adsorption region 12 is sealed by the annular portion 13, the fluid (gas) in the space 16 is exhausted through the suction hole 7 and the flow path 4 to form a space. The object 2 can be adsorbed to the adsorption region 12 by making 16 a vacuum state.

  The second substrate 10 has one main surface bonded to one main surface of the first substrate 9 to form the flow path 4 and the dummy flow path 5 between the first substrate 9 and the second substrate 10. . The second substrate 10 has the same material, shape, and characteristics as the first substrate 9.

  The bonding agent 11 joins one main surface of the first substrate 9 and one main surface of the second substrate 10. As the bonding agent 11, for example, an inorganic bonding agent such as a glass bonding agent can be used. This glass bonding agent contains, for example, silicon oxide as a main component and as a subsidiary component such as magnesium oxide, sodium oxide, or calcium oxide. When a glass bonding agent is used when one main surface of first substrate 9 and one main surface of second substrate 10 are made of a silicon carbide sintered body or a silicon carbide film, silicon oxide of the glass bonding agent is silicon carbide. And the first substrate 9 and the second substrate 10 can be firmly bonded.

The flow path 4 is located between the first substrate 9 and the second substrate 10 and has a longitudinal direction along the main surface direction of the base 3. The flow path 4 is connected to the suction hole 7, and the fluid exhausted from the space 16 flows. The flow path 4 has a plurality of portions that are formed radially from, for example, the central portion of the base 3 in the main surface direction. Further, the flow path 4 is surrounded by a groove portion 17 formed on one main surface of the second substrate 10 and a flat region of the one main surface of the first substrate in a cross section along the thickness direction of the base 3. . The cross section orthogonal to the longitudinal direction of the flow path 4 is, for example, rectangular. The width of the channel 4 is
For example, it is 1 mm or more and 5 mm or less. The thickness of the flow path 4 is 0.1 mm or more and 3 mm or less, for example.

  The dummy flow path 5 is located between the first substrate 9 and the second substrate 10 and has a longitudinal direction along the main surface direction of the base 3. The dummy flow path 5 is not connected to the adsorption region 12 and the suction hole 7, and the fluid exhausted from the space 16 does not flow. In addition, the dummy flow path 5 is surrounded by a dummy groove portion 18 formed on one main surface of the second substrate 10 and a flat region on one main surface of the first substrate 9 in a cross section along the thickness direction of the base 3. It is. The cross section orthogonal to the longitudinal direction of the dummy flow path 5 is, for example, rectangular. The width of the dummy channel 5 is, for example, not less than 1 mm and not more than 5 mm. The thickness of the dummy channel 5 is, for example, not less than 0.1 mm and not more than 3 mm.

  The through hole 6 is for inserting a lift pin (not shown) for moving the object 2. The through hole 6 penetrates the first substrate 9 and the second substrate 10 in the thickness direction. The through hole 6 has a columnar shape, for example. The width of the through hole 6 is, for example, 5 mm or more and 10 mm or less.

  The suction hole 7 penetrates the first substrate 9 in the thickness direction and is connected to the flow path 4, and the suction hole 7 penetrates the second substrate 10 in the thickness direction and is connected to the flow path 4. And a second suction hole 7b.

  The first suction hole 7 a opens in the suction region 12 on the other main surface of the first substrate 9. The first suction hole 7a has, for example, a cylindrical shape. The width (diameter) of the first suction hole 7a is, for example, not less than 0.5 mm and not more than 2 mm.

  The second suction hole 7 b is connected to a connection portion 19 with exhaust means (not shown) opened on the other main surface of the second substrate 10. The second suction hole 7b has the same shape as the first suction hole 7a.

  The connecting portion 19 is connected to the exhaust means while sealing the fluid. The connection portion 19 may be formed with a screw hole to seal a fluid, or a helicate or a seal ring may be inserted.

  The dummy hole 8 penetrates the second substrate 10 in the thickness direction and is connected to the dummy flow path 5. The dummy hole 8 opens to the other main surface of the second substrate 10 and is connected to the outside, but is not connected to the exhaust means. As described above, since the dummy hole 8 is opened in the other main surface of the second substrate 10, the dummy hole 8 remains in the dummy hole 8 as compared with the case where the dummy hole is opened in the other main surface of the first substrate 9. It is possible to prevent the particles 2 from being scattered and contaminating the object 2. The dummy hole 8 has a cylindrical shape, for example. The width (diameter) of the dummy hole 8 is, for example, 1 mm or more and 5 mm or less. The dummy hole 8 may not be connected to the outside because the opening of the other main surface of the second substrate 10 is closed with, for example, an adhesive.

  The flow path member 1 described above evacuates the fluid in the space 16 between the object 2 and the adsorption region 12 from the exhaust means through the suction hole 7 and the flow path 4, thereby bringing the space 16 into a vacuum state. Thus, the object 2 can be adsorbed. The flow path member 1 constitutes a vacuum suction device used in various apparatuses such as an exposure apparatus and an inspection apparatus. This vacuum suction device includes a suction means having a flow path member 1 for vacuum suction of the object 2 and an exhaust means for exhausting a fluid between the suction region 12 and the target object 2 through the suction hole 7 and the flow path 4. And.

  By the way, when the pressure of the fluid flowing through the flow path 4 is repeatedly applied to the boundary between the first substrate 9 and the second substrate 10, the first substrate 9 and the second substrate 10 may be separated.

  On the other hand, the flow path member 1 of the present embodiment is located between the first substrate 9 and the second substrate 10 and has a longitudinal direction along the main surface direction of the base 3 as shown in FIGS. And a dummy flow path 5 through which no fluid flows. As a result, when the separation between the first substrate 9 and the second substrate 10 reaches the dummy flow path 5 where no fluid flows, the progress of the separation is suppressed, so that the separation between the first substrate 9 and the second substrate 10 occurs. Expansion of the area can be suppressed. Therefore, since the fall of the rigidity of channel member 1 can be controlled, the deformation and distortion in channel member 1 when stress is added can be controlled. As a result, the positional accuracy of the target object 2 can be increased, and as a result, the processing accuracy of the target object 2 can be increased.

  Moreover, it can suppress that the 1st board | substrate 9 and the 2nd board | substrate 10 peel from the flow path 4 of the base | substrate 3 over the outer peripheral part 3a. As a result, since the fluid leakage of the flow path 4 from the outer peripheral part 3a can be suppressed, the reliability of the adsorption function by the flow path member 1 can be enhanced.

  As shown in FIG. 3B, a part of the bonding agent 11 of this embodiment enters the dummy flow path 5. As a result, the bonding agent 11 can increase the bonding strength between the first substrate 9 and the second substrate 10 and suppress the separation of the first substrate 9 and the second substrate 10. It is desirable that a part of the bonding agent 11 is bonded to the inner wall of the dummy flow path 5. As a result, the bonding strength between the first substrate 9 and the second substrate 10 can be further increased. Further, it is desirable that a part of the bonding agent 11 is bonded to both the first substrate 9 and the second substrate 10 in the dummy flow path 5. As a result, the bonding strength between the first substrate 9 and the second substrate 10 can be further increased. A part of the bonding agent 11 of the present embodiment is bonded to the inner wall of the dummy groove 18 on one main surface of the second substrate 10 and one main surface of the first substrate 9 in the dummy flow path 5.

  As shown in FIG. 3C, at least a part of the dummy flow path 5 of the present embodiment is filled with a bonding agent 11. As a result, the bonding strength between the first substrate 9 and the second substrate 10 can be increased.

  The dummy channel 5 of the present embodiment surrounds the channel 4 as shown in FIG. As a result, the enlargement of the separation region between the first substrate 9 and the second substrate 10 can be further suppressed. Moreover, it can suppress that the 1st board | substrate 9 and the 2nd board | substrate 10 peel from the flow path 4 of the base | substrate 3 over the outer peripheral part 3a.

  The dummy flow path 5 of this embodiment is located between the outer peripheral part 3a of the base | substrate 3, and the flow path 4, as shown in FIG.2 (b). As a result, it is possible to prevent the first substrate 9 and the second substrate 10 from peeling from the flow path 4 of the base 3 to the outer peripheral portion 3a.

  At least a part of the dummy channel 5 of the present embodiment has a longitudinal direction along the longitudinal direction of a part of the adjacent channel 4 as shown in FIG. As a result, variation in the distance between the flow path 4 and the dummy flow path 5 can be suppressed. Therefore, it is possible to suppress the distance between the flow path 4 and the dummy flow path 5 from becoming too large, and to suppress the expansion of the separation region between the first substrate 9 and the second substrate 10. Furthermore, it can suppress that the distance of the flow path 4 and the dummy flow path 5 becomes small too much, and it can suppress that the flow path 4 and the dummy flow path 5 connect easily.

  The dummy channel 5 of this embodiment is arranged along the channel 4, and the distance between the dummy channel 5 and the channel 4 is not more than twice the width of the channel 4. As a result, it is possible to suppress the distance between the flow path 4 and the dummy flow path 5 from becoming too large, and to suppress the expansion of the separation region between the first substrate 9 and the second substrate 10.

The dummy flow path 5 of the present embodiment is arranged along the flow path 4, and the distance between the dummy flow path 5 and the flow path 4 is one or more times the width of the flow path 4. As a result, it is possible to suppress the distance between the channel 4 and the dummy channel 5 from becoming too small, and to prevent the channel 4 and the dummy channel 5 from being easily connected.

  At least a part of the dummy channel 5 of the present embodiment is located between a part of the channel 4 and another part as shown in FIG. As a result, the enlargement of the separation region between the first substrate 9 and the second substrate 10 can be suppressed between a part of the flow path 4 and another part.

  The dummy flow path 5 of this embodiment is located between the flow path 4 and the through-hole 6 as shown in FIG. As a result, the first substrate 9 and the second substrate 10 can be prevented from peeling from the flow path 4 to the through hole 6, and the fluid in the flow path 4 can be prevented from leaking from the through hole 6.

  Next, the manufacturing method of the flow path member 1 described above will be described in detail with reference to FIG. 4 in the case where the first substrate 9 and the second substrate 10 are formed of a silicon carbide sintered body.

  (1) As shown in FIGS. 4A and 4B, a first substrate 9 and a second substrate 10 are prepared. Specifically, for example, the following is performed.

  First, pure water and an organic binder are added to silicon carbide powder, and then wet-mixed with a ball mill to prepare a slurry. Next, the slurry is granulated by spray drying. Next, the granulated silicon carbide particles are molded using various molding methods to prepare a molded body, and then the molded body is cut to produce a molded body having a desired shape. Next, as shown to Fig.4 (a), the 1st board | substrate 9 and the 2nd board | substrate 10 are produced by baking this molded object at 1900 degreeC or more and 2100 degrees C or less, for example. Next, as illustrated in FIG. 4B, the suction region 12 including the annular portion 13, the bottom surface 14, and the protruding portion 15 is formed on the other main surface of the first substrate 9 using blasting. Further, by using grinding, a groove portion 17 having a shape corresponding to the flow path 4, a dummy groove portion 18 having a shape corresponding to the dummy flow path 5, the second suction hole 7 b, and the dummy hole are formed on one main surface of the second substrate 10. 8 is formed. As a result, the first substrate 9 and the second substrate 10 can be prepared.

  (2) As shown in FIG. 4C, the base 3 is formed by bonding one main surface of the first substrate 9 and one main surface of the second substrate 10 via the bonding agent 11. Specifically, for example, the following is performed.

  First, the bonding agent 11 that is, for example, a glass bonding agent is applied to a region other than the groove 17 and the dummy groove 18 on one main surface of the second substrate 10. Next, the one principal surface of the first substrate 9 and the one principal surface of the second substrate 10 are overlapped. At this time, while the groove portion 17 on the one main surface of the second substrate 10 is superimposed on a flat region on the one main surface of the first substrate 9, the dummy groove portion 18 on the one main surface of the second substrate 10 is overlapped with the first substrate 9. Superimpose on a flat area of one main surface. Next, the main surface of the first substrate 9 and the main surface of the second substrate 10 are bonded via the bonding agent 11 while the bonding agent 11 is melted by baking at 1600 ° C. or less. As a result, the substrate 3 can be formed.

  In the present embodiment, the bonding agent 11 is applied to a region other than the groove 17 and the dummy groove 18 on the one main surface of the second substrate 10 without applying the bonding agent 11 to the one main surface of the first substrate 9. . As a result, the bonding agent 11 can be prevented from entering the groove portion 17.

  In the present embodiment, by forming the base 3 by bonding one main surface of the first substrate 9 and one main surface of the second substrate 10 via the bonding agent 11, the groove portion 17 is formed on the first substrate 9 and The dummy groove 18 is formed between the first substrate 9 and the second substrate 10 while being located between the second substrates 10 and having a longitudinal direction along the main surface direction of the base 3 and a flow path 4 through which fluid flows. The dummy channel 5 is located between and has a longitudinal direction along the main surface direction of the base 3 and does not flow fluid. As a result, the above-described channel 4 and dummy channel 5 can be formed.

  By the way, when the one main surface of the first substrate 9 and the one main surface of the second substrate 10 are bonded, the molten bonding agent 11 may flow. In particular, the bonding region between the first substrate 9 and the second substrate 10 is between a part of the groove 17 and another part or between the groove 17 and the outer periphery of the first substrate 9 and the second substrate 10. It tends to be large, and the amount of the flowing bonding agent 11 tends to increase.

  On the other hand, in the present embodiment, when the first substrate 9 and the second substrate 10 are joined, the dummy groove portion 18 is located between the first substrate 9 and the second substrate 10. Therefore, since the molten bonding agent 11 enters the dummy groove 18, the bonding agent 11 can be prevented from entering the groove 17. As a result, since clogging of the flow path 4 by the bonding agent 11 can be suppressed, the reliability of the adsorption function of the flow path member 1 can be enhanced while maintaining the ease of fluid flow in the flow path 4.

  Further, when the first substrate 9 and the second substrate 10 are bonded, a part of the bonding agent 11 can enter the dummy flow path 5 by allowing the molten bonding agent 11 to enter the dummy groove portion 18. Furthermore, the bonding agent 11 can be filled in at least a part of the dummy flow path 5.

  In the present embodiment, the dummy groove portion 18 surrounds the groove portion 17 when the one main surface of the first substrate 9 and the one main surface of the second substrate 10 are joined. As a result, since the entrance of the bonding agent 11 can be suppressed over the entire groove portion 17, clogging of the flow path 4 by the bonding agent 11 can be suppressed satisfactorily. Further, the bonding agent 11 enters the groove part 17 from a bonding region formed between a part of the groove part 17 and another part or between the groove part 17 and the outer peripheral parts of the first substrate 9 and the second substrate 10. Can be suppressed.

  In the present embodiment, when the one main surface of the first substrate 9 and the one main surface of the second substrate 10 are joined, the dummy groove portion 18 includes the outer peripheral portion of the first substrate 9 and the second substrate 10 and the groove portion 17. Located between. As a result, the bonding agent 11 can be prevented from entering the groove portion 17 from the bonding region formed between the groove portion 17 and the outer peripheral portions of the first substrate 9 and the second substrate 10.

  In the present embodiment, when joining one main surface of the first substrate 9 and one main surface of the second substrate 10, at least a part of the dummy groove 18 extends along the longitudinal direction of a part of the adjacent groove 17. Has a longitudinal direction. As a result, by suppressing variation in the distance between the groove 17 and the dummy groove 18, it is possible to satisfactorily prevent the bonding agent 11 from entering the groove 17.

  In the present embodiment, when the one main surface of the first substrate 9 and the one main surface of the second substrate 10 are joined, the dummy groove portion 18 is arranged along the groove portion 17, and the dummy groove portion 18 and the groove portion 17 are arranged. Is less than twice the width of the groove 17. As a result, the bonding agent 11 enters the groove part 17 from a bonding region formed between a part of the groove part 17 and another part or between the groove part 17 and the outer peripheral parts of the first substrate 9 and the second substrate 10. This can be suppressed.

  In the present embodiment, when the one main surface of the first substrate 9 and the one main surface of the second substrate 10 are bonded, at least a part of the dummy groove 18 is between a part of the groove 17 and another part. Located in. As a result, the bonding agent 11 can be prevented from entering the groove portion 17 from a bonding region formed between a part of the groove portion 17 and the other portion.

In the present embodiment, when joining one main surface of the first substrate 9 and one main surface of the second substrate 10, the second substrate 10 penetrates in the thickness direction and is connected to the dummy groove portion 18. A dummy hole 8 is formed. As a result, when the one main surface of the first substrate 9 and the one main surface of the second substrate 10 are joined, the air in the dummy groove 18 can be released to the outside through the dummy holes 8, so Generation of cracks in the base 3 due to expansion of air in the groove portion 18 can be suppressed. In addition, since the air in the dummy groove 18 can be released to the outside through the dummy hole 8, a part of the bonding agent 11 can enter the dummy groove 18 favorably.

  (3) As shown in FIG. 4D, the flow path member 1 is manufactured by forming the first suction holes 7a and the through holes 6 in the base 3 by using, for example, grinding.

  As described above, the flow path member 1 can be manufactured.

  The present invention is not limited to the above-described embodiments, and various changes, improvements, combinations, and the like can be made without departing from the spirit of the present invention.

  For example, in the embodiment described above, the flow path member 1 used in the manufacturing process of the semiconductor integrated circuit has been described as an example, but the flow path member 1 may be used in the manufacturing process of the liquid crystal display device. In this case, the object 2 is, for example, a square plate-like glass substrate, and the channel member 1 can be a square plate corresponding to the object 2.

  In the above-described embodiment, the configuration in which the flow path member 1 is used as a vacuum chuck (adsorption means) constituting the vacuum suction device has been described as an example. However, the flow path member 1 is cooled to constitute the cooling device. It may be used as a means. This cooling device is for adjusting the temperature of the object 2 by cooling the object 2. The cooling device includes a cooling means having a flow path member 1 for cooling the object 2 and a fluid supply means for supplying a fluid for cooling the object 2 to the flow path 4. As a fluid for cooling the object 2, for example, a liquid such as water can be used. Further, the flow path member 1 used as the cooling means may be an electrostatic chuck having a cooling function.

  Further, in the above-described embodiment, the configuration in which the dummy groove portion 18 is formed on one main surface of the second substrate 10 has been described as an example. However, as shown in FIG. It may be formed on one main surface of one substrate 9, and as shown in FIG. 5B, at a corresponding position on one main surface of the first substrate 9 and one main surface of the second substrate 10. It may be formed.

  In the above-described embodiment, the configuration in which the cross section orthogonal to the longitudinal direction of the dummy flow path 5 is rectangular has been described as an example. However, the cross section orthogonal to the longitudinal direction of the dummy flow path 5 may have other shapes. Well, as shown in FIG. 5C, for example, it may be trapezoidal.

  In the embodiment described above, the configuration in which the groove portion 17 is formed on one main surface of the second substrate 10 has been described as an example. However, the groove portion 17 is formed on one main surface of the first substrate 9. Alternatively, they may be formed at corresponding positions on one main surface of the first substrate 9 and one main surface of the second substrate 10.

  In the above-described embodiment, the configuration in which the cross section orthogonal to the longitudinal direction of the flow path 4 is rectangular is described as an example, but the cross section orthogonal to the longitudinal direction of the flow path 4 may have other shapes, For example, it may be trapezoidal.

  In the above-described embodiment, the configuration in which the suction hole 7 has the second suction hole 7b has been described as an example. However, the suction hole 7 may not have the second suction hole 7a. In this case, for example, the flow path 4 may be open on the side surface of the base 3, and this opening may be connected to the exhaust means.

In the above-described embodiment, the configuration in which the bonding agent 11 is applied to the region other than the groove 17 and the dummy groove 18 on one main surface of the second substrate 10 in the step (2) has been described as an example. The bonding agent 11 may be applied to one main surface of the substrate 9, or the bonding agent 11 may be applied to both one main surface of the first substrate 9 and one main surface of the second substrate 10.

DESCRIPTION OF SYMBOLS 1 Flow path member 2 Target object 3 Base | substrate 3a Outer peripheral part 4 Flow path 5 Dummy flow path 6 Through hole 7 Suction hole 7a 1st suction hole 7b 2nd suction hole 8 Dummy hole 9 1st board | substrate 10 2nd board | substrate 11 Bonding agent 12 Adsorption region 13 Annular portion 14 Bottom surface 15 Projection portion 16 Space between object and adsorption region 17 Groove portion 18 Dummy groove portion 19 Connection portion

Claims (10)

A base having a first substrate and a second substrate bonded to one major surface of the first substrate;
A flow path that is located between the first substrate and the second substrate and has a longitudinal direction along a main surface direction of the base body, and through which a fluid flows;
A dummy channel located between the first substrate and the second substrate and having a longitudinal direction along the principal surface direction of the base body,
The flow path and the dummy flow path are located across a portion where the first substrate and the second substrate are joined,
The dummy channel has a space in at least a part thereof. In the flow path member according to claim 1,
A flow path member, wherein the dummy flow path contains a bonding agent in at least a part thereof. The flow path member according to claim 2,
A channel member, wherein at least a part of the dummy channel is filled with the bonding agent. In the flow path member according to claim 1,
The flow path member, wherein the dummy flow path surrounds the flow path. In the flow path member according to claim 1,
The dummy channel is disposed along the channel, and the distance between the dummy channel and the channel is not more than twice the width of the channel. In the flow path member according to claim 1,
Further comprising a through hole penetrating the substrate in the thickness direction;
The channel member, wherein the dummy channel is located between the channel and the through hole. In the flow path member according to claim 1,
A suction hole penetrating the first substrate in the thickness direction;
The first substrate has an adsorption area in which the suction hole is opened and vacuum-adsorbs an object on the other main surface,
The flow path member, wherein the suction hole is connected to the flow path and is not connected to the dummy flow path. The suction means having the flow path member according to claim 7 for vacuum-sucking the object, and the exhaust means for exhausting the fluid between the suction region and the target object through the suction hole and the flow path. And a vacuum suction device. A cooling means having a flow path member according to any one of claims 1 to 8 for cooling the object, and a fluid supply means for supplying the fluid for cooling the object to the flow path. A cooling device characterized by. While forming a groove having a longitudinal direction along a corresponding one principal surface direction on at least one of the one principal surface of the first substrate and the one principal surface of the second substrate, the one principal surface of the first substrate and the first substrate Forming a dummy groove portion having a longitudinal direction along one main surface direction at a position not overlapping with the groove portion on at least one main surface of the two substrates;
A step of bonding one main surface of the first substrate and one main surface of the second substrate with a bonding agent so that the dummy groove portion becomes a dummy flow path having a space in at least a part thereof. A method for manufacturing a flow path member.

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