JP6224330B2 - Suction member, vacuum suction device and cooling device using the same - Google Patents

Description

The present invention relates to an adsorption member used for adsorbing or cooling an object when the object such as a semiconductor wafer or a glass substrate is processed in a manufacturing process of a semiconductor integrated circuit or a liquid crystal display device, for example. It relates to a vacuum suction device and a cooling equipment that had.

  Conventionally, semiconductor integrated circuits and liquid crystal display devices are manufactured by processing objects such as semiconductor wafers and glass substrates. In this manufacturing process, an adsorption member is used to adsorb an object when the object is processed.

  For example, in paragraphs 0055 to 0056 and 0162 to 0164 of Patent Document 1, a first base (first member) having a suction area (pin part or rim part) for sucking an object (wafer) on one main surface and the first A substrate (holder body) having a first substrate including a first coating (coating) formed in the adsorption region of the base and a second substrate (second member) bonded to the other main surface of the first substrate is provided. The configuration is described.

  Such an adsorbing member generally has a different coefficient of thermal expansion in the main surface direction between the first base and the first coating. Therefore, if heat is applied to the first substrate during use of the adsorption member, the amount of thermal expansion differs between the region on the one principal surface side of the first substrate and the region on the other principal surface side, so that tensile stress is applied to the first substrate. Arise. As a result, stress may be applied to the joint between the first substrate and the second substrate, and the first substrate and the second substrate may be separated. The adsorption member is distorted in the region where the separation occurs (peeling region) because the rigidity is reduced as compared with the state where the first substrate and the second substrate are joined and the thickness is increased. On the other hand, if the bonding strength between the first substrate and the second substrate is high, peeling between the first substrate and the second substrate hardly occurs, but the adsorption member warps due to the tensile stress generated in the first substrate.

  In particular, in recent years, since the diameter of a semiconductor wafer has been required to be increased, the suction member is also required to be increased in diameter. On the other hand, when the diameter of the attracting member is increased, the weight of the attracting member increases, so that the speed at which the attracting member is moved is reduced, and the production efficiency of the semiconductor integrated circuit is lowered. Therefore, in order to reduce the weight of the adsorption member 1 while increasing its diameter, it is required to make the adsorption member thin. However, if the adsorption member is thinned, the rigidity of the adsorption member is reduced, and the adsorption member is likely to be deformed.

  When deformation such as distortion or warpage occurs in the attracting member, the positional accuracy of the target object is lowered, and as a result, the processing accuracy of the target object is likely to decrease. Accordingly, there is a demand for a suction member with improved processing accuracy of the object.

JP 2003-249542 A

  An object of the present invention is to provide an adsorbing member that meets the demand for increasing the processing accuracy of an object, a vacuum adsorbing device and a cooling device using the adsorbing member, and a method for manufacturing the adsorbing member.

An adsorption member according to an aspect of the present invention includes a substrate having a first substrate having an adsorption region that adsorbs an object on one main surface and a second substrate bonded to the other main surface of the first substrate, The substrate includes a first base made of a ceramic sintered body, a first coating made of the same material as the first base covering one main surface of the first base on the adsorption region side, and another main base of the first base. look containing a second coating of the first coating and the same material coated with a surface, having a longitudinal direction along the main surface direction of the substrate while located between the first substrate and the second substrate, And a flow path through which the fluid flows, the flow path having a groove located on the other main surface of the first substrate and surrounded by the second coating. An adsorption member according to another embodiment of the present invention includes a substrate having a first substrate having an adsorption region for adsorbing an object on one main surface and a second substrate bonded to the other main surface of the first substrate, The first substrate includes a first substrate made of a ceramic sintered body, a first coating made of the same material as the first substrate covering one main surface of the first substrate on the adsorption region side, and the first substrate. A first coating covering the other main surface and a second coating made of the same material, and located between the first substrate and the second substrate and having a longitudinal direction along the main surface direction of the substrate. And a flow path through which the fluid flows, wherein the adsorption region includes an annular portion corresponding to the shape of the object, a bottom surface positioned inside the annular portion, and a plurality of protrusions protruding from the bottom surface. The first coating has a first region constituting the bottom surface, Serial second membrane has a second region remote from the flow channel at the main surface direction of the substrate, the thickness of the first region is smaller than the thickness of the second region.

Vacuum suction device according to one embodiment of the present invention is vacuum adsorbing the object exhaust and suction member described above, the fluid between the front Symbol suction hole and the flow path the suction region and the object via And an exhaust means.

Cooling device according to one embodiment of the present invention cools while adsorbing the object comprises a suction member described above, and a fluid supply means for supplying the fluid to the flow path for cooling the pre-Symbol object.

  According to the adsorbing member in one aspect of the present invention, the second substrate made of the same material as the first coating covering one main surface of the first base coats the other main surface of the first base. The tensile stress generated in the first substrate when heat is applied to can be reduced. Therefore, deformation of the adsorption member can be suppressed and the processing accuracy of the object can be increased.

  According to the vacuum suction device of one aspect of the present invention, since the above-described suction member is provided, deformation of the suction member can be suppressed and the processing accuracy of the object can be increased.

  According to the cooling device in one aspect of the present invention, since the above-described suction member is provided, deformation of the suction member can be suppressed and the processing accuracy of the object can be increased.

According to the method for manufacturing an adsorbing member in one embodiment of the present disclosure , since the second coating of the same material as the first coating covering one main surface of the first base coats the other main surface of the first base, Separation of the first substrate and the second substrate at the time of joining the first substrate and the second substrate can be suppressed. Therefore, it is possible to produce a suction member that is excellent in processing accuracy of the object.

(A) is a perspective view which shows the adsorption member in 1st Embodiment of this invention, (b) is a perspective view which shows the 1st board | substrate with which the adsorption member of Fig.1 (a) is provided, (c). FIG. 2 is a perspective view showing a second substrate provided in the adsorbing member of FIG. (A) is a top view of the adsorption | suction member of Fig.1 (a), (b) is a top view of the 2nd board | substrate of FIG.1 (c). (A) is sectional drawing along the thickness direction of the adsorption member which adsorb | sucked the target object in the AA line of Fig.2 (a), (b) is equipped with the adsorption member of Fig.1 (a). It is sectional drawing orthogonal to the longitudinal direction of a flow path. (A) thru | or (e) is sectional drawing of the part corresponded to Fig.3 (a) explaining the manufacturing method of the adsorption | suction member of Fig.1 (a). (A) is sectional drawing along the thickness direction of the adsorption member which adsorb | sucked the target object in 2nd Embodiment of this invention, (b) is a flow path with which the adsorption member of Fig.5 (a) is provided. It is sectional drawing orthogonal to the longitudinal direction. (A) thru | or (e) is sectional drawing of the part corresponded to Fig.5 (a) explaining the manufacturing method of the adsorption | suction member of Fig.5 (a).

<First Embodiment>
Hereinafter, the suction member according to the first embodiment of the present invention will be described in detail with reference to FIGS. 1 to 3.

  The suction member 1 according to the present embodiment is used as a vacuum chuck (suction means) for vacuum-sucking an object 2 such as a semiconductor wafer in various apparatuses such as an exposure apparatus and an inspection apparatus used in a semiconductor integrated circuit manufacturing process. It is. The object 2 adsorbed by the adsorbing member 1 is subjected to various processes in various apparatuses. For example, the exposure apparatus includes an adsorbing member 1 that adsorbs the object 2 and a light source that irradiates and exposes the object 2 adsorbed on the adsorbing member 1. A pattern can be formed.

  As shown in FIGS. 1 to 3, the adsorbing member 1 is connected to the substrate 3, the flow channel 4 located inside the substrate 3, the through-hole 5 penetrating the substrate 3 in the thickness direction, and the flow channel 4. Suction holes 6.

  The substrate 3 forms the main part of the adsorption member 1 and supports the object 2. The substrate 3 includes a first substrate 8 having an adsorption region 7 for adsorbing the object 2 on one main surface, a second substrate 9 bonded to the other main surface of the first substrate 8, the first substrate 8, and the second substrate 8. And a bonding agent 10 interposed between the substrates 9. The board | substrate 3 is flat form, for example, and is disk shape in this embodiment.

  The suction region 7 includes an annular portion 11 corresponding to the shape of the object 2, a bottom surface 12 positioned inside the annular portion 11, and a plurality of protrusions 13 protruding from the bottom surface 12. The object 2 is supported by the annular portion 11 and the protrusion 13. At this time, since the space 14 between the object 2 and the adsorption region 7 is sealed by the annular portion 11, the fluid (gas) in the space 14 is exhausted through the suction hole 6 and the flow path 4. The object 2 can be adsorbed to the adsorption region 7 by making the space 14 in a vacuum state. The height (Z direction) of the annular portion 11 and the protruding portion 13 is, for example, not less than 50 μm and not more than 200 μm.

  The first substrate 8 adsorbs the object 2 by the adsorption region 7. The first substrate 8 includes a first base 15 made of a ceramic sintered body, a first coating 16 made of the same material as the first base 15 covering one main surface of the first base 15 on the adsorption region 7 side, A first coating 16 covering the other main surface of the substrate 15 and a second coating 17 of the same material are included.

  The first base 15 is a main part of the first substrate 8. The first base 15 is made of a ceramic sintered body such as a silicon carbide sintered body. The first base 15 has a flat plate shape, for example, and in the present embodiment, has a disk shape. The thickness (Z direction) of the 1st base | substrate 15 is 1 mm or more and 10 mm or less, for example. The width (diameter) of the first substrate 15 is, for example, not less than 200 mm and not more than 500 mm.

  The first coating 16 constitutes one main surface of the first substrate 8 and constitutes the adsorption region 7. The first coating 16 is made of a ceramic film such as a silicon carbide film. The first film 16 is a CVD film, for example. The thickness of the first coating 16 is, for example, not less than 50 μm and not more than 500 μm.

  The second film 17 constitutes the other main surface of the first substrate 8. The second film 17 is made of a ceramic film made of the same material. The second film 17 is a film formed by the same method as the first film 16. The thickness of the second coating 17 is the same as that of the first coating 16.

  The second substrate 9 has a main surface bonded to one main surface of the first substrate 8 to form the flow path 4 between the first substrate 8 and the second substrate 9. The second substrate 9 includes a second base 18 made of a ceramic sintered body. The second base 18 is made of a ceramic sintered body similar to the first base 15. The shape of the second base 18 is the same as that of the first base 18.

  The bonding agent 10 bonds the other main surface of the first substrate 8 and one main surface of the second substrate 9. As the bonding agent 10, for example, an inorganic bonding agent such as a glass bonding agent can be used. This glass bonding agent contains, for example, silicon oxide as a main component and magnesium oxide, sodium oxide, calcium oxide or the like as a subcomponent. When a glass bonding agent is used when the other main surface of the first substrate 8 and one main surface of the second substrate 9 are made of a silicon carbide sintered body or a silicon carbide film, the silicon oxide of the glass bonding agent is silicon carbide. And the first substrate 8 and the second substrate 9 can be firmly bonded.

  The flow path 4 is located between the first substrate 8 and the second substrate 9 and has a longitudinal direction along the main surface direction of the substrate 3. The flow path 4 is connected to the suction hole 6, and the fluid exhausted from the space 14 flows. The flow path 4 has a plurality of portions formed radially, for example, from the center of the substrate 3 in the main surface direction. The flow path 4 includes a first groove portion 19 that is located on one main surface of the second substrate 9 and is surrounded by the second base 18. The flow path 4 is surrounded by the inner surface of the first groove portion 19 and the flat area of the other main surface of the first substrate 8, and the second coating film 17 disposed between the flow path 4 and the adsorption area 7. Is exposed. The cross section orthogonal to the longitudinal direction of the flow path 4 is, for example, rectangular. The width of the flow path 4 is, for example, 1 mm or more and 5 mm or less. The height (Z direction) of the flow path 4 is 0.1 mm or more and 3 mm or less, for example.

  The through hole 5 is inserted with a lift pin (not shown) for moving the object 2. The through hole 5 penetrates the first substrate 8 and the second substrate 9 in the thickness direction. The through hole 5 has a columnar shape, for example. The width of the through hole 5 is, for example, 5 mm or more and 10 mm or less.

  The suction hole 6 penetrates the first substrate 8 in the thickness direction and is connected to the flow path 4, and the suction hole 6 penetrates the second substrate 9 in the thickness direction and is connected to the flow path 4. And a second suction hole 6b.

  The first suction hole 6 a opens in the suction region 7 on the one main surface of the first substrate 8. The first suction hole 6a has, for example, a cylindrical shape. The width (diameter) of the first suction hole 6a is, for example, not less than 0.5 mm and not more than 2 mm.

  The second suction hole 6 b is connected to a connection portion 20 with exhaust means (not shown) opened on the other main surface of the second substrate 9. The second suction hole 6b has the same shape as the first suction hole 6a.

The connecting portion 20 is connected to the exhaust means while sealing the fluid. The connecting portion 20 may be formed with a screw hole to seal a fluid, or a helicate or a seal ring may be inserted.

  The suction member 1 described above exhausts the fluid in the space 14 between the object 2 and the suction region 7 from the exhaust means through the suction hole 6 and the flow path 4, and makes the space 14 in a vacuum state. The object 2 can be adsorbed. The suction member 1 constitutes a vacuum suction device used in various apparatuses such as an exposure apparatus and an inspection apparatus. The vacuum suction device includes a suction member 1 that vacuum-sucks the object 2, and an exhaust unit that exhausts the fluid between the suction region 7 and the object 2 via the suction hole 6 and the flow path 4.

  In the adsorption member 1 of the present embodiment, as shown in FIG. 3A, the first substrate 8 includes a first base 15 made of a ceramic sintered body, and one main surface of the first base 15 on the adsorption region 7 side. The first coating 16 made of the same material as the first base 15 coated with the first coating 15 and the second coating 17 made of the same material as the first coating 16 coated on the other main surface of the first base 15 are included.

  As a result, the first coating 16 with less surface voids compared to the first substrate 15 made of a ceramic sintered body covers one main surface of the first substrate 15 on the adsorption region 7 side. Particle adhesion to the adsorption region 7 of the substrate 8 can be reduced, and contamination of the object 2 by the particles can be suppressed. Further, since the first coating 16 is made of the same material as the first substrate 15, the adhesion strength between the first coating 16 and the first substrate 15 is increased, and as a result, peeling of the first substrate 15 and the first coating 16 is suppressed. Can do.

  Further, since the second coating 17 made of the same material as the first coating 16 covers the other main surface of the first base body 15, one main surface of the first substrate 8 is heated when heat is applied to the first substrate 8. The amount of thermal expansion between the region on the side and the region on the other main surface side can be made more uniform, and the tensile stress generated in the first substrate 8 can be reduced. Therefore, since the stress applied to the joint between the first substrate 8 and the second substrate 9 can be reduced and the separation between the first substrate 8 and the second substrate 9 can be suppressed, the distortion of the adsorption member 1 is suppressed. can do. Further, since the tensile stress generated in the first substrate 8 can be reduced, the warp of the adsorption member 1 due to the tensile stress can be suppressed. Therefore, deformation such as distortion or warping of the suction member 1 can be suppressed, and as a result, the processing accuracy of the object 2 can be increased.

  In addition, by suppressing the deformation of the suction member 1 in this way, the suction member 1 can be thinned while maintaining the processing accuracy of the suction member 1. As a result, since the adsorption member 1 can be reduced in weight, it is possible to increase the diameter of the adsorption member 1 while maintaining the speed at which the adsorption member is moved.

  In the adsorption member 1 of the present embodiment, the second substrate 9 is composed of a second base 18 made of a ceramic sintered body made of the same material as the first base 15. As a result, since the second substrate 9 does not have a film corresponding to the first film 16 and the second film 17, the thickness of the second substrate 9 can be reduced. Therefore, the adsorption member 1 can be thinned.

  Desirably, first substrate 15 is made of a silicon carbide sintered body, and first coating 16 and second coating 17 are made of a silicon carbide film. As a result, since the specific rigidity of the first substrate 8 can be increased, the rigidity can be increased while reducing the weight of the adsorption member 1. Further, since the thermal conductivity of the first substrate 8 can be increased, the heat of the fluid can be transmitted to the first substrate 8 satisfactorily. Moreover, since the coefficient of thermal expansion of the first substrate 8 can be reduced, the amount of thermal expansion of the first substrate 8 when processing the object 2 can be reduced, and the processing accuracy of the object 2 can be increased. .

The first coating 16 and the second coating 17 are preferably CVD films. As a result, the thickness of the first film 16 and the second film 17 can be easily reduced. Further, since the first coating 16 and the second coating 17 are formed by the same film forming method, the physical properties of the first coating 16 and the second coating 17 can be made closer. Therefore, the tensile stress generated in the first substrate 8 when heat is applied to the first substrate 8 can be reduced.

  Here, the first base 15 made of a ceramic sintered body is a polycrystalline body, whereas the first coating 16 and the second coating 17 which are CVD films are single crystals that have grown on the main surface of the first base 15. It is a crystal. Therefore, the first base 15 has a uniform crystal expansion in each direction because the crystal axes are random, whereas the first coating 16 and the second coating 17 have a single crystal axis. Therefore, anisotropy occurs in the thermal expansion coefficient, and the thermal expansion coefficient in the main surface direction (XY plane direction) becomes smaller than the thickness direction (Z direction) that is the crystal growth direction. Therefore, the first coating film 16 and the second coating film 17 have a smaller coefficient of thermal expansion in the principal surface direction than the first base body 15.

  On the other hand, as described above, in the adsorbing member 1 of the present embodiment, since the second coating 17 made of the same material as the first coating 16 covers the other main surface of the first base body 15, heat is applied to the first substrate 8. When added, the amount of thermal expansion between the region on the one principal surface side of the first substrate 8 and the region on the other principal surface side can be made more uniform, and the tensile stress generated in the first substrate 8 can be reduced well. can do. In addition, it can confirm that the 1st base | substrate 15 is a polycrystal body and the cross section of the adsorption | suction member 1 is grind | polished and observed that the 1st coating film 16 and the 2nd coating film 17 are a single crystal body.

  As shown in FIGS. 3A and 3B, the suction member 1 of the present embodiment is located between the first substrate 8 and the second substrate 9 and has a longitudinal direction along the main surface direction of the substrate 3. And a flow path 4 through which fluid flows. As a result, as described above, separation of the first substrate 8 and the second substrate 9 can be suppressed by the second coating 17, and therefore leakage of fluid (gas) from the flow path 4 can be suppressed. Accordingly, it is possible to suppress a decrease in the suction force of the suction member 1 and to increase the processing accuracy of the object 2.

  In the adsorption member 1 of the present embodiment, as shown in FIG. 3B, the second coating 17 disposed between the flow path 4 and the adsorption region 7 is exposed in the flow path 4. As a result, the heat of the fluid can be efficiently transferred by the second film 17 having a higher thermal conductivity than that of the first base body 15. Therefore, when the adsorption member 1 is used, when heat is applied to the adsorption member 1 in order to process the object 2, thermal expansion of the fluid (gas) can be suppressed. Therefore, a decrease in the negative pressure in the space 14 can be suppressed, and a decrease in the suction force of the suction member 1 can be suppressed.

  In the adsorption member 1 of the present embodiment, the first coating 16 has a first region 21 that constitutes the bottom surface 12, and the second coating 17 is separated from the flow path 4 in the main surface direction of the substrate 3. The second region 22 is provided, and the thickness of the first region 21 is the same as the thickness of the second region 22. As a result, when heat is applied to the first substrate 8, the amount of thermal expansion between the region on the one principal surface side of the first substrate 8 and the region on the other principal surface side can be made more uniform. In this case, the thickness error between the first region 21 and the second region 22 is within ± 20%.

  Next, in the manufacturing method of the adsorbing member 1 of the present embodiment, the first base 15 and the second base 18 are formed of a silicon carbide sintered body, and the first coating 16 and the second coating 17 are formed of a silicon carbide film. The case will be described in detail with reference to FIG.

  (1) As shown in FIGS. 4A to 4C, a first substrate 8 and a second substrate 9 are prepared. Specifically, for example, the following is performed.

First, pure water and an organic binder are added to silicon carbide powder, and then wet-mixed with a ball mill to prepare a slurry. Next, the slurry is granulated by spray drying. Next, the granulated silicon carbide particles are molded using various molding methods to prepare a molded body, and then the molded body is cut to produce a molded body having a desired shape. Next, as shown in FIG. 4A, the molded body is fired at, for example, 1900 ° C. or more and 2100 ° C. or less to produce the first substrate 15 and the second substrate 18.

  Next, as shown in FIG. 4B, the first coating 16 is formed on one main surface of the first base 15 using a film forming method such as a CVD method, and the other main main body 15 is used. A second film 17 is formed on the surface. At this time, the thickness of the first coating 16 is made larger than the thickness of the second coating 17. Next, as shown in FIG. 4C, the first groove portion 19 having a shape corresponding to the flow path 4 is formed on one main surface of the second base 18 using grinding, and the thickness of the second base 18 is increased. A second suction hole 6b penetrating in the direction is formed.

  As described above, the first substrate 8 including the first base 15, the first coating 16, and the second coating 17 and the second substrate 9 including the second base 18 can be prepared.

  (2) As shown in FIGS. 4D and 4E, the other main surface of the first substrate 8 and one main surface of the second substrate 9 are bonded via the bonding agent 10 to form the substrate 3, The adsorption member 1 is produced. Specifically, for example, the following is performed.

  First, a bonding agent 10 that is, for example, a glass bonding agent is applied to a region other than the first groove portion 19 on one main surface of the second substrate 9. Next, the other main surface of the first substrate 8 and one main surface of the second substrate 9 are overlapped. At this time, the first groove portion 19 of the second substrate 9 is overlaid on a flat region of one main surface of the first substrate 8. Next, for example, by baking at 1000 ° C. or more and 1600 ° C. or less, as shown in FIG. 4D, the other main surface of the first substrate 8 and the first substrate 8 are melted through the bonding agent 10 while melting the bonding agent 10. The substrate 3 is formed by bonding one main surface of the second substrate 9. Next, as illustrated in FIG. 4E, the suction region 7 including the annular portion 11, the bottom surface 12, and the protruding portion 13 is formed on one main surface of the first coating 16 using, for example, blasting. At this time, the thickness of the first region 21 constituting the bottom surface 12 of the first coating 16 and the thickness of the second region 22 of the second coating 17 are made the same. Moreover, the 1st suction hole 6a and the through-hole 5 are formed in the board | substrate 3 using a grinding process, for example.

  As described above, the suction member 1 of the present embodiment can be manufactured.

  The manufacturing method of the adsorption member 1 of the present embodiment includes a first base 15 made of a ceramic sintered body, a first coating 16 made of the same material as the first base 15 covering one main surface of the first base 15, and a first A step of preparing a first substrate 8 including a second coating 17 of the same material as the first coating 16 covering the other main surface of the base body 15; a step of preparing a second substrate 9; Bonding the main surface of the second substrate 9 to the surface, and processing the first film 16 of the first substrate 8, the suction region 7 for adsorbing the object 2 is formed on the main surface of the first substrate 8. Forming.

  As a result, since the second coating 17 made of the same material as the first coating 16 covers the other main surface of the first base body 15, heat is applied to the first substrate 8 when the first substrate 8 and the second substrate 9 are joined. When added, the amount of thermal expansion between the region on the one principal surface side of the first substrate 8 and the region on the other principal surface side can be made more uniform, and the tensile stress generated in the first substrate 8 can be reduced. Can do. Therefore, warpage of the first substrate 8 at the time of joining the first substrate 8 and the second substrate 9 can be suppressed, so that peeling between the first substrate 8 and the second substrate 9 can be suppressed. Therefore, deformation of the adsorption member 1 can be suppressed and the processing accuracy of the object 2 can be increased.

Moreover, in the manufacturing method of the adsorption member 1 of the present embodiment, after the step of preparing the first substrate 8 including the first base 15, the first coating 16 and the second coating 17, the other main surface of the first substrate 8. And a step of bonding one main surface of the second substrate 9. As a result, since the first coating 16 and the second coating 17 can be formed without the bonding agent 10, the first coating 16 and the second coating 17 can be formed without generating gas from the bonding agent 10. Can do.

Second Embodiment
Next, an adsorption member according to a second embodiment of the present invention will be described in detail with reference to FIG. In addition, description is abbreviate | omitted regarding the structure similar to 1st Embodiment mentioned above.

  As illustrated in FIGS. 5A and 5B, the suction member 1 of the present embodiment is different from the suction member 1 of the first embodiment in the configuration of the flow path 4. The flow path 4 of the present embodiment is located on one main surface of the second substrate 8 and is surrounded by the second base 18 and the second groove on the other main surface of the first substrate 9. 17 and a second groove portion 23 surrounded by 17. As a result, the distance between the bottom surface of the first groove 19 and the other main surface of the second base 18 can be increased by reducing the depth (Z direction) of the first groove 19. For this reason, generation | occurrence | production of the crack in the area | region between the bottom face of the 1st groove part 19 and the other main surface of the 2nd base | substrate 18 can be suppressed, and the leakage of the fluid (gas) from the flow path 4 can be suppressed. Therefore, it is possible to suppress a decrease in the suction force of the suction member 1. In addition, the adsorption member 1 can be thinned while suppressing the occurrence of cracks in the region between the bottom surface of the first groove portion 19 and the other main surface of the second base 18.

  Further, since the flow path 4 includes the second groove portion 23 surrounded by the second coating film 17, the fluid (gas) flowing through the flow path 4 by the second coating film 17 having a higher thermal conductivity than the first base body 15. Heat can be efficiently transmitted to suppress the thermal expansion of the fluid (gas).

  The bottom surface 12 of the suction region 7 and the inner surface of the second groove portion 23 are preferably formed by a blasted surface. As a result, the difference in surface roughness between the bottom surface 12 of the suction region 7 and the inner surface of the second groove portion 23 can be reduced, so that the tensile stress generated in the first substrate 8 due to the difference in surface roughness is reduced. be able to. Note that the inner surface of the second groove portion 23 may be a ground surface.

  Further, as shown in FIG. 5A, the suction member 1 of the present embodiment is different from the suction member 1 of the first embodiment in the configuration of the first film 16 and the second film 17. In the suction member 1 of the present embodiment, the thickness of the first region 21 is smaller than the thickness of the second region 22. As a result, when the first substrate 8 and the second substrate 9 are joined before the adsorption region 7 is formed in the first coating 16, the difference in thickness between the first coating 16 and the second coating 17 is reduced. Warpage of the first substrate 8 can be suppressed.

  Next, the manufacturing method of the adsorption member 1 of this embodiment is demonstrated in detail, referring FIG. In addition, description is abbreviate | omitted regarding the method similar to 1st Embodiment mentioned above.

  First, as shown in FIG. 6A, the first base 15 and the second base 18 are produced. Next, as shown in FIG. 6B, a first film 16 and a second film 17 are formed. At this time, the thickness of the first coating 16 and the thickness of the second coating 17 are the same. Next, as shown in FIG. 6C, the second groove portion 23 is formed on the other main surface of the second coating film 17 by using, for example, blasting. In addition, you may form the 2nd groove part 23 using grinding processes, such as a machining process. Next, the first groove portion 19 and the second suction hole 6b are formed. Next, as shown in FIG. 6D, the substrate 3 is formed by bonding the other main surface of the first substrate 8 and one main surface of the second substrate 9 through the bonding agent 10. Next, as illustrated in FIG. 6E, the suction region 7 including the annular portion 11, the bottom surface 12, and the protruding portion 13 is formed on one main surface of the first coating 16 using, for example, blasting. At this time, the thickness of the first region 21 constituting the bottom surface 12 of the first coating 16 is made smaller than the thickness of the second region 22 of the second coating 17. Next, the first suction hole 6a and the through hole 5 are formed.

  As described above, the suction member 1 of the present embodiment can be manufactured.

In the method for manufacturing the adsorption member 1 of the present embodiment, in the step of preparing the first substrate 8, the thickness of the first coating 16 is the same as the thickness of the second coating 17. As a result, warpage of the first substrate 8 when the first substrate 8 and the second substrate 9 are bonded can be suppressed. The thickness error between the first coating 16 and the second coating 17 in the step of preparing the first substrate 8 is within ± 20%.

  The manufacturing method of the adsorbing member 1 of the present embodiment includes a step of forming the second groove portion 23 surrounded by the second film 17 on the other main surface of the first substrate 8, In the step of joining one main surface of the two substrates 9, the flow path 4 having the second groove portion 23 is formed. As a result, for example, when forming the second groove portion 23 using blasting, the second groove portion 23 can be formed by processing only the second coating film 17. Therefore, compared with the case where the second coating 17 and the first base 15 are processed, the processing rate does not change because the material to be processed is uniform, so that the shape of the second groove 23 can be processed with high accuracy. it can.

  The present invention is not limited to the above-described embodiments, and various modifications, improvements, combinations, and the like can be made without departing from the scope of the present invention.

  For example, in the above-described embodiment, the suction member 1 used in the manufacturing process of the semiconductor integrated circuit has been described as an example. However, the suction member 1 may be used in the manufacturing process of the liquid crystal display device. In this case, the object 2 is, for example, a square plate-like glass substrate, and the adsorption member 1 can be a square plate corresponding to the object 2.

  In the embodiment described above, the configuration in which the cross section orthogonal to the longitudinal direction of the flow path 4 is rectangular is described as an example, but the cross section orthogonal to the longitudinal direction of the flow path 4 may have other shapes, For example, it may be trapezoidal.

  Further, in the above-described embodiment, the configuration in which the flow channel 4 includes only the first groove portion 19 and the configuration in which the flow channel 4 includes the first groove portion 19 and the second groove portion 23 have been described as examples. May consist only of the second groove 23.

  In the above-described embodiment, the configuration in which the suction hole 6 has the second suction hole 6b has been described as an example. However, the suction hole 6 may not have the second suction hole 6a. In this case, for example, the flow path 4 may be open on the side surface of the substrate 3, and this opening may be connected to the exhaust means.

  In the above-described embodiment, the configuration in which the second substrate 9 includes the second base 18 has been described as an example. However, the second substrate 9 has the same coating as the first coating 16 and the second coating 17. It does not matter.

  In the above-described embodiment, the configuration in which the first substrate 8 and the second substrate 9 are bonded via the bonding agent 10 has been described as an example. However, the first substrate 8 and the second substrate 9 may be combined with other bonding methods. For example, it may be bonded by diffusion bonding.

  In the above-described embodiment, the configuration in which the bonding agent 10 is applied to one main surface of the second substrate 9 in the step (2) has been described as an example. However, the bonding agent 10 is applied to one main surface of the first substrate 8. The bonding agent 10 may be applied to both one main surface of the first substrate 8 and one main surface of the second substrate 9.

  In the embodiment described above, the adsorption region 7 is formed by processing the first coating 16 after joining the other principal surface of the first substrate 8 and the one principal surface of the second substrate 9 in the step (2). However, before the other main surface of the first substrate 8 and one main surface of the second substrate 9 are bonded, the first coating 16 may be processed to form the adsorption region 7.

  In the above-described embodiment, the flow path 4 is described as an example of the configuration in which the flow path 4 is used as an exhaust flow path for exhausting the fluid (gas) between the space 14 between the adsorption region 7 and the object 2. The flow path 4 may be used as a cooling flow path through which a fluid for cooling the object 2 flows.

  In this case, the adsorbing member 1 constitutes a cooling device used in various apparatuses such as an exposure apparatus and an inspection apparatus. The cooling device includes an adsorbing member 1 that cools the object 2 while adsorbing the object 2, and a fluid supply unit that supplies a fluid that cools the object 2 to the cooling channel, and cools the object 2. The temperature of the object 2 is adjusted by the above. The adsorbing member 1 is, for example, a vacuum chuck or an electrostatic chuck, and in the case of being a vacuum chuck, has both an exhaust passage and a cooling passage. As a fluid for cooling the object 2, for example, a liquid such as water can be used. The cooling channel is not connected to the suction hole 6 but is connected to the fluid supply means. The other configuration of this cooling flow path is the same as that of the flow path 4 of the first and second embodiments described above.

  In the suction member 1, the first substrate 8 includes a first base 15, a first coating 16, and a second coating 17, as in the suction members 1 of the first and second embodiments described above. As a result, separation of the first substrate 8 and the second substrate 9 can be suppressed by the second coating film 17, so that leakage of fluid from the cooling channel can be suppressed. Therefore, it is possible to suppress a decrease in the cooling function in the adsorption member 1.

  Further, in the cooling flow path, the second coating 17 disposed between the cooling flow path and the adsorption region 7 is exposed, similarly to the flow path 4 of the first and second embodiments described above. Is desirable. As a result, since the heat of the object 2 can be efficiently transferred to the cooling flow path by the second coating film 17 having a higher thermal conductivity than the first base body 15, the cooling efficiency of the object 2 is increased. be able to.

  In addition, the cooling flow path desirably includes the second groove portion 23 that is located on the other main surface of the first substrate 9 and is surrounded by the second coating film 17, similarly to the flow path 4 of the second embodiment. . As a result, since the second groove portion 23 is surrounded by the second coating 17, the heat of the object 2 can be efficiently transmitted through the cooling channel.

DESCRIPTION OF SYMBOLS 1 Adsorption member 2 Object 3 Board | substrate 4 Flow path 5 Through-hole 6 Suction hole 6a 1st suction hole 6b 2nd suction hole 7 Suction area 8 1st board | substrate 9 2nd board | substrate 10 Bonding agent 11 Annular part 12 Bottom face 13 Projection part 14 Space between the object and the adsorption region 15 First base 16 First coating 17 Second coating 18 Second base 19 First groove 20 Connection portion 21 First region 22 Second region 23 Second groove

Claims (7)

A first substrate having an adsorption region for adsorbing an object on one main surface and a substrate having a second substrate bonded to the other main surface of the first substrate;
The first substrate includes a first substrate made of a ceramic sintered body, a first coating made of the same material as the first substrate covering one main surface of the first substrate on the adsorption region side, and the first substrate. A second coating of the same material as the first coating covering the other main surface,
A flow path that is located between the first substrate and the second substrate and has a longitudinal direction along a main surface direction of the substrate, and through which a fluid flows;
The said flow path has a groove part located in the said other main surface of the said 1st board | substrate, and was surrounded by the said 2nd film, The adsorption member characterized by the above-mentioned. A first substrate having an adsorption region for adsorbing an object on one main surface and a substrate having a second substrate bonded to the other main surface of the first substrate;
The first substrate includes a first substrate made of a ceramic sintered body, a first coating made of the same material as the first substrate covering one main surface of the first substrate on the adsorption region side, and the first substrate. A second coating of the same material as the first coating covering the other main surface,
A flow path that is located between the first substrate and the second substrate and has a longitudinal direction along a main surface direction of the substrate, and through which a fluid flows;
The suction region has an annular portion corresponding to the shape of the object, a bottom surface located inside the annular portion, and a plurality of protrusions protruding from the bottom surface,
The first coating has a first region constituting the bottom surface,
The second coating has a second region away from the flow path in the main surface direction of the substrate,
The adsorption member according to claim 1, wherein a thickness of the first region is smaller than a thickness of the second region. 3. The adsorption member according to claim 1, wherein the second substrate includes a second substrate made of a ceramic sintered body made of the same material as the first substrate. The adsorption member according to any one of claims 1 to 3 , wherein the first base is made of a silicon carbide sintered body,
The adsorbing member, wherein the first coating and the second coating are made of a silicon carbide film. Further comprising a claim 1 and extends through the first substrate in the thickness direction in the adsorption member according to claim 4 is open to the suction region, and the suction hole connected to the flow path An adsorption member characterized by the above. The suction member according to claim 5 that vacuum-sucks the object, and an exhaust unit that exhausts the fluid between the suction region and the object through the suction hole and the flow path. A vacuum suction device. The adsorption member according to any one of claims 1 to 5 , wherein the object is cooled while adsorbed, and fluid supply means for supplying the fluid that cools the object to the flow path. Cooling system.

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