JP6865145B2 - Holding device - Google Patents

Description

The techniques disclosed herein relate to holding devices that hold objects.

For example, an electrostatic chuck is used as a holding device for holding a wafer when manufacturing a semiconductor. The electrostatic chuck includes a ceramic plate bonded to each other and a base member, and utilizes the electrostatic attraction generated by applying a voltage to the chuck electrodes arranged inside the ceramic plate to utilize the ceramic plate. The wafer is sucked and held on the surface of the surface (hereinafter referred to as "suction surface").

If the temperature distribution of the wafer held by the electrostatic chuck becomes non-uniform, the accuracy of each process (deposition, etching, etc.) on the wafer may decrease. Therefore, the temperature distribution of the wafer on the electrostatic chuck is as uniform as possible. Performance is required. Therefore, when the electrostatic chuck is used, the temperature of the suction surface of the ceramic plate is controlled by, for example, heating by the heater electrode or cooling by supplying the refrigerant to the refrigerant flow path.

Further, in order to improve the heat transfer property between the ceramic plate and the wafer and further improve the uniformity of the temperature distribution of the wafer, in order to supply a gas such as helium to the space between the adsorption surface of the ceramic plate and the surface of the wafer. A holding device having the above configuration is known (see, for example, Patent Document 1). In this holding device, a gas supply flow path connected to the gas source is formed inside the base member, and a gas ejection flow path that communicates with the gas supply flow path and opens to the adsorption surface is formed inside the ceramic plate. It is formed. The gas supplied from the gas source to the gas supply flow path of the base member flows into the gas ejection flow path of the ceramic plate from the gas supply flow path, and the suction surface is opened from the opening (spout outlet) opened in the suction surface of the ceramic plate. Is supplied to the space between the surface of the wafer and the surface of the wafer.

In the holding device having the above-mentioned configuration for supplying gas, a recess having a bottom surface through which the gas ejection flow path opens is provided on the surface of the ceramic plate facing the base member. The recess may be formed not on the surface of the ceramic plate but on the surface of the base member facing the ceramic plate. In this case, the gas supply flow path opens at the bottom surface of the recess. Further, the recesses may be formed on both the surface of the ceramic plate facing the base member and the surface of the base member facing the ceramic plate.

Further, in the above-mentioned holding device, in order to suppress the generation of electric discharge and gas discharge between the ceramic plate and the base member that have passed through the recess, the recess is formed of a breathable and insulating material. Filling members (also called "breathable plugs") are filled. The gas supplied to the gas supply flow path of the base member passes through the inside of the filling member filled in the recess and flows into the gas ejection flow path of the ceramic plate.

Japanese Unexamined Patent Publication No. 2013-232641

Since the filling member filled in the recess described above has a relatively high porosity, the thermal conductivity of the filling member is lower than that of the relatively dense ceramic plate or base member. Therefore, in the place where the filling member is provided, the heat transfer property (heat attraction characteristic) from the ceramic plate to the base member may be locally lowered, and the uniformity of the temperature distribution on the adsorption surface of the ceramic plate may be lowered.

It should be noted that such a problem is not limited to the electrostatic chuck that holds the wafer by utilizing the electrostatic attraction, and is not limited to the configuration provided with the heater electrode and the refrigerant flow path, and includes the ceramic plate and the base member. A holding device that holds an object on the surface of a ceramic plate is a common problem in general.

This specification discloses a technique capable of solving the above-mentioned problems.

The techniques disclosed herein can be realized, for example, in the following forms.

(1) The holding device disclosed in the present specification has a planar first surface substantially orthogonal to the first direction and a second surface opposite to the first surface. A ceramic plate having a gas ejection flow path opened on the first surface formed inside and a third surface, so that the third surface faces the second surface of the ceramic plate. In a holding device for holding an object on the first surface of the ceramic plate, the second surface of the ceramic plate is provided with a base member arranged in the ceramic plate and having a gas supply flow path formed inside. And at least one of the third surface of the base member, a recess having a bottom surface through which the gas ejection flow path or the gas supply flow path opens is formed, and the holding device further comprises the recess. It is formed of an insulating material that is filled inside and has a thermal conductivity lower than that of the ceramic plate and the member in which the recess is formed in the base member. The exposed surface exposed from the recess, the bottom facing surface facing the bottom surface of the recess, having a smaller area than the exposed surface, and overlapping the exposed surface as a whole in the first directional view, and the said surface. It has a side surface connecting the peripheral edge of the exposed surface and the peripheral edge of the bottom surface facing surface, and the size of the second direction orthogonal to the first direction becomes continuously smaller as the size of the second direction orthogonal to the first direction becomes closer to the bottom surface facing surface. A filling member having a specific portion and an adhesive layer arranged between the recess and the side surface of the filling member and having a thermal conductivity higher than that of the filling member are provided. According to this holding device, the path of heat transfer from the ceramic plate (first surface of the ceramic plate) to the base member is shortened without passing through the filling member (that is, through the ceramic plate or the adhesive layer). Therefore, it is possible to suppress the decrease in heat transfer property from the ceramic plate to the base member at the place where the filling member is provided, and the decrease in the uniformity of the temperature distribution on the first surface of the ceramic plate due to the presence of the filling member. Can be suppressed.

(2) In the holding device, the thermal conductivity of the adhesive layer is lower than the thermal conductivity of the member in which the recess is formed in the ceramic plate and the base member, and the recess is in the second direction. In the configuration, the filling member may have a recess-specific portion that faces the specific portion and that is continuously narrowed as the width in the second direction approaches the bottom surface. According to this holding device, the path of heat transfer from the ceramic plate (first surface of the ceramic plate) to the base member is shortened without passing through the filling member and the adhesive layer (that is, through the ceramic plate). Therefore, it is possible to effectively suppress the decrease in heat transfer property from the ceramic plate to the base member at the place where the filling member is provided, and the uniform temperature distribution on the first surface of the ceramic plate due to the presence of the filling member. The decrease in sex can be effectively suppressed.

(3) In the holding device, the filling member may be configured to be composed of only the specific portion. According to this holding device, the path of heat transfer from the ceramic plate (first surface of the ceramic plate) to the base member is extremely short without passing through the filling member (that is, through the ceramic plate or the adhesive layer). Therefore, it is possible to extremely effectively suppress the decrease in heat transfer property from the ceramic plate to the base member at the place where the filling member is provided, and the temperature distribution on the first surface of the ceramic plate due to the presence of the filling member. The decrease in the uniformity of the ceramic can be suppressed extremely effectively.

(4) In the holding device, the thermal conductivity of the adhesive layer is lower than the thermal conductivity of the member in which the recess is formed in the ceramic plate and the base member, and the recess is in the second direction. The configuration is also characterized in that it is composed of only the recessed specific portion that faces the specific portion of the filling member and that is continuously reduced as the width in the second direction becomes closer to the bottom surface. Good. According to this holding device, the path of heat transfer from the ceramic plate (first surface of the ceramic plate) to the base member is extremely short without passing through the filling member and the adhesive layer (that is, through the ceramic plate). Therefore, it is possible to extremely effectively suppress the decrease in heat transfer property from the ceramic plate to the base member at the place where the filling member is provided, and the temperature distribution on the first surface of the ceramic plate due to the presence of the filling member. The decrease in the uniformity of the ceramic can be suppressed extremely effectively.

(5) The holding device further includes a coating layer having a thermal conductivity higher than that of the adhesive layer and covering at least a part of a region between the side surface and the bottom surface facing surface of the filling member. May be. According to this holding device, the coating layer having a thermal conductivity higher than the thermal conductivity of the adhesive layer transfers heat from the ceramic plate (first surface of the ceramic plate) to the base member without passing through the filling member. Since at least a part of the path can be formed, the amount of heat transfer through the path becomes large, and the decrease in heat transferability from the ceramic plate to the base member at the place where the filling member is provided is effectively suppressed. This makes it possible to effectively suppress a decrease in the uniformity of the temperature distribution on the first surface of the ceramic plate due to the presence of the filling member.

The technique disclosed in the present specification can be realized in various forms, for example, in the form of a holding device, an electrostatic chuck, a vacuum chuck, a heater device, a method for manufacturing the same, and the like. Is possible.

It is a perspective view which shows schematic appearance structure of the electrostatic chuck 10 in 1st Embodiment. It is explanatory drawing which shows typically the XZ cross-sectional structure of the electrostatic chuck 10 in 1st Embodiment. It is explanatory drawing which shows typically the XY cross-sectional structure of the electrostatic chuck 10 in 1st Embodiment. It is explanatory drawing which enlarges and shows X1 part of the electrostatic chuck 10 in 1st Embodiment. It is a flowchart which shows the manufacturing method of the electrostatic chuck 10 in this embodiment. It is explanatory drawing which shows schematic structure of the electrostatic chuck 10X of a comparative example. It is explanatory drawing which shows schematic structure of the electrostatic chuck 10Y of another comparative example. It is explanatory drawing which shows schematic structure of the electrostatic chuck 10a of 2nd Embodiment. It is explanatory drawing which shows schematic structure of the electrostatic chuck 10b of 3rd Embodiment. It is explanatory drawing which shows schematic structure of the electrostatic chuck 10c of 4th Embodiment. It is explanatory drawing which shows schematic structure of the electrostatic chuck 10d of 5th Embodiment. It is explanatory drawing which shows schematic structure of the electrostatic chuck 10e of 6th Embodiment. It is explanatory drawing which shows schematic structure of the electrostatic chuck 10f of 7th Embodiment.

A. First Embodiment:
A-1. Configuration of electrostatic chuck 10:
FIG. 1 is a perspective view schematically showing an external configuration of the electrostatic chuck 10 according to the first embodiment, and FIG. 2 is an explanatory view schematically showing an XZ cross-sectional configuration of the electrostatic chuck 10 according to the first embodiment. FIG. 3 is an explanatory view schematically showing the XY cross-sectional configuration of the electrostatic chuck 10 according to the first embodiment. FIG. 2 shows the XY cross-sectional configuration of the electrostatic chuck 10 at the position II-II of FIG. 3, and FIG. 3 shows the XY cross-sectional configuration of the electrostatic chuck 10 at the position III-III of FIG. It is shown. Each figure shows XYZ axes that are orthogonal to each other to identify the direction. In the present specification, for convenience, the Z-axis positive direction is referred to as an upward direction, and the Z-axis negative direction is referred to as a downward direction, but the electrostatic chuck 10 is actually installed in a direction different from such a direction. May be done.

The electrostatic chuck 10 is a device that attracts and holds an object (for example, a wafer W) by electrostatic attraction, and is used, for example, for fixing a wafer W in a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 10 includes a ceramic plate 100 and a base member 200 arranged side by side in a predetermined arrangement direction (in the present embodiment, the vertical direction (Z-axis direction)). The ceramic plate 100 and the base member 200 are arranged so that the lower surface S2 of the ceramic plate 100 and the upper surface S3 of the base member 200 face each other in the arrangement direction. The lower surface S2 of the ceramic plate 100 corresponds to the second surface in the claims, and the upper surface S3 of the base member 200 corresponds to the third surface in the claims.

The ceramic plate 100 is, for example, a circular flat plate-shaped member, and is made of ceramics (for example, alumina, aluminum nitride, etc.). The diameter of the ceramic plate 100 is, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the thickness of the ceramic plate 100 is, for example, about 1 mm to 10 mm.

Inside the ceramic plate 100, a pair of chuck electrodes 400 formed of a conductive material (for example, tungsten, molybdenum, etc.) are provided. When a voltage is applied to the pair of chuck electrodes 400 from a power source (not shown), an electrostatic attraction is generated, and the electrostatic attraction causes the wafer W to be on the surface of the ceramic plate 100 opposite to the lower surface S2 (hereinafter referred to as “)”. It is adsorbed and fixed to the "adsorption surface S1"). The suction surface S1 of the ceramic plate 100 is a planar surface substantially orthogonal to the above-mentioned arrangement direction (Z-axis direction). However, in the present embodiment, a plurality of minute protrusions are formed on the suction surface S1 of the ceramic plate 100, and when the wafer W is suction-fixed to the suction surface S1, the suction surface S1 and the surface of the wafer W are in contact with each other. There is a small space between them. The suction surface S1 of the ceramic plate 100 corresponds to the first surface in the claims, and the Z-axis direction corresponds to the first direction in the claims. Further, in the present specification, the direction orthogonal to the Z axis (that is, the direction parallel to the suction surface S1) is referred to as "plane direction". The plane direction corresponds to the second direction in the claims.

The base member 200 is, for example, a circular flat plate-like member having the same diameter as the ceramic plate 100 or having a diameter larger than that of the ceramic plate 100, and is formed of, for example, a metal (aluminum, an aluminum alloy, or the like). The diameter of the base member 200 is, for example, about 220 mm to 550 mm (usually 220 mm to 350 mm), and the thickness of the base member 200 is, for example, about 20 mm to 40 mm.

A refrigerant flow path 210 is formed inside the base member 200. When a refrigerant (for example, a fluorine-based inert liquid, water, etc.) is flowed through the refrigerant flow path 210, the base member 200 is cooled, and heat is transferred between the base member 200 and the ceramic plate 100 via the adhesive layer 300. The ceramic plate 100 is cooled, and the wafer W held on the suction surface S1 of the ceramic plate 100 is cooled. Thereby, the temperature control of the wafer W is realized.

The ceramic plate 100 and the base member 200 are joined to each other by an adhesive layer 300 arranged between the lower surface S2 of the ceramic plate 100 and the upper surface S3 of the base member 200. The adhesive layer 300 is made of an adhesive such as a silicone resin, an acrylic resin, or an epoxy resin. The thickness of the adhesive layer 300 is, for example, about 0.1 mm to 1 mm.

Further, in order to enhance the heat transfer property between the ceramic plate 100 and the wafer W and further enhance the uniformity of the temperature distribution of the wafer W, the electrostatic chuck 10 is formed between the suction surface S1 of the ceramic plate 100 and the surface of the wafer W. It has a configuration for supplying gas to the space existing between them. In this embodiment, helium gas (He gas) is used as such a gas. Hereinafter, the configuration for supplying the helium gas will be described with reference to FIGS. 1 to 3 and FIG. 4 in which the X1 portion of FIG. 2 is enlarged.

As shown in FIGS. 2 and 4, a gas source connection hole 221 connected to a helium gas source (not shown) is formed on the lower surface S4 of the base member 200, and a gas supply is provided on the upper surface S3 of the base member 200. The hole 222 is open. Inside the base member 200, a gas supply flow path 220 that communicates the gas source connection hole 221 and the gas supply hole 222 is formed.

Further, as shown in FIGS. 2 and 4, the adhesive layer 300 is a through hole that communicates with the gas supply hole 222 formed in the base member 200 and penetrates the adhesive layer 300 in the thickness direction (vertical direction). 310 is formed.

Further, as shown in FIGS. 1 and 2, eight gas ejection holes 102 are opened on the suction surface S1 of the ceramic plate 100. Further, inside the ceramic plate 100, gas ejection is connected to the bottom surface 144 (FIG. 4) of the recess 140 formed in the ceramic plate 100, which will be described later, and the gas ejection hole 102 that opens in the suction surface S1 of the ceramic plate 100. The flow path 110 is formed. The gas ejection flow path 110 communicates with the first vertical flow path 111 (FIGS. 2 to 4) extending upward from the bottom surface 144 of the recess 140 and the first vertical flow path 111, and is a cross flow extending in an annular shape in the plane direction. It is composed of a road 114 (FIGS. 2 and 3) and a second vertical channel 112 (FIG. 2) extending upward from the lateral channel 114 and communicating with the gas ejection hole 102.

In the electrostatic chuck 10 of the present embodiment, there are two systems of helium gas supply paths. That is, as shown in FIG. 3, two lateral flow paths 114 are formed inside the ceramic plate 100. As shown in FIGS. 2 and 3, the horizontal flow path 114 closer to the center of the ceramic plate 100 among the two horizontal flow paths 114 is shown in FIGS. 2 and 4 via the first vertical flow path 111. With the four gas ejection holes 102 near the center of the ceramic plate 100 among the eight gas ejection holes 102 that communicate with the recess 140 and open to the suction surface S1 via the second vertical flow path 112. Communicating. Further, the horizontal flow path 114 of the two horizontal flow paths 114, which is far from the center of the ceramic plate 100, communicates with the recess 140 (not shown) via the first vertical flow path 111, and is a second. Through the vertical flow path 112, it communicates with the four gas ejection holes 102 far from the center of the ceramic plate 100 among the eight gas ejection holes 102 that open in the suction surface S1.

Further, as shown in FIGS. 2 and 4, the gas supply formed on the base member 200 is provided on the lower surface S2 of the ceramic plate 100 even if there is some error in the relative positions of the ceramic plate 100 and the base member 200. The recess 140 is formed so that the flow path 220 and the gas ejection flow path 110 formed in the ceramic plate 100 are surely communicated with each other. The recess 140 communicates with the through hole 310 formed in the adhesive layer 300. The fact that the recess 140 communicates with the through hole 310 means that the recess 140 communicates with the through hole 310 in a state where no other member (for example, the filling member 160 and the adhesive layer 170 described later) is present in the recess 140. It means that it is. Specifically, the recess 140 is formed so as to overlap the through hole 310 in the thickness direction of the adhesive layer 300.

The recess 140 has a bottom surface 144 which is an inner surface on the side close to the suction surface S1 and a side surface 142 which is an inner surface connecting the peripheral edge of the opening 146 of the recess 140 (the hole which opens in the lower surface S2) and the peripheral edge of the bottom surface 144. Have. A gas ejection flow path 110 (first vertical flow path 111 constituting the gas ejection flow path 110) is opened in the bottom surface 144 of the recess 140. In the ceramic plate 100 of the present embodiment, since such a recess 140 is formed, the relative position of the base member 200 with respect to the ceramic plate 100 in the plane direction is such that the gas supply flow path 220 formed in the base member 200 is recessed. If it is in a range facing the 140, the communication between the gas supply flow path 220 and the gas ejection flow path 110 is ensured.

In the present embodiment, the shape of the recess 140 (the internal space of the recess 140) is a partial cone (a part of the cone on the apex side is missing). That is, the opening 146 and the bottom surface 144 of the recess 140 are both substantially circular, and the bottom surface 144 has a smaller area than the opening 146 and overlaps the opening 146 as a whole in the Z-axis direction. Further, the side surface 142 of the recess 140 has a side surface shape of the partial cone. Further, the shape of the XZ cross section (that is, the cross section shown in FIG. 4) of the recess 140 passing through the center of the bottom surface 144 is trapezoidal. Since the recess 140 has such a configuration, it is said that the recess 140 is composed of only the recess specific portion SP2 that continuously decreases as the width W2 in the direction orthogonal to the Z axis (that is, the surface direction) approaches the bottom surface 144. I can say. The phrase "continuously decreases as the width W2 approaches the bottom surface 144" does not include a form in which the width W2 decreases discretely as it approaches the bottom surface 144. Here, the form in which the width W2 becomes discretely smaller as the width W2 approaches the bottom surface 144 is defined as the side surface 142 in the cross section of the recess 140 shown in FIG. 7, as in the electrostatic chuck 10Y (FIG. 7) of the comparative example described later. (That is, the line representing the side surface 142 has a portion parallel to the surface direction). "The width W2 becomes continuously smaller as the width W2 approaches the bottom surface 144" means a form in which the line representing the side surface 142 does not have a portion parallel to the surface direction in the cross section of the recess 140 shown in FIG.

As shown in FIGS. 2 and 4, the recess 140 formed in the ceramic plate 100 is filled with a filling member (also referred to as a “breathable plug”) 160 formed of an insulating material and having breathability. There is. Since the filling member 160 has a relatively high porosity, the thermal conductivity of the filling member 160 is lower than that of the relatively dense ceramic plate 100. As the material for forming the filling member 160, for example, a porous ceramic body, glass fiber, a heat-resistant polytetrafluoroethylene resin sponge, or the like can be used.

The filling member 160 has an exposed surface 166 exposed from the opening 146 of the recess 140 (exposed through the opening 146), a bottom surface facing surface 164 facing the bottom surface 144 of the recess 140, and a peripheral edge and a bottom surface facing surface of the exposed surface 166. It has a side surface 162 that connects the peripheral edge of 164. In the present embodiment, the shape of the filling member 160 is a partial cone (a part of the cone on the apex side is missing). That is, the exposed surface 166 and the bottom surface facing surface 164 of the filling member 160 are both substantially circular, and the bottom surface facing surface 164 has a smaller area than the exposed surface 166 and is the exposed surface 166 as a whole in the Z-axis direction. Overlap. Further, the side surface 162 of the filling member 160 has a side surface shape of the partial cone. Further, the shape of the XZ cross section (that is, the cross section shown in FIG. 4) of the filling member 160 passing through the center of the bottom surface facing surface 164 is trapezoidal. Since the filling member 160 has such a configuration, only the specific portion SP1 whose size (width) W1 in the direction orthogonal to the Z axis (that is, the surface direction) becomes continuously smaller as it approaches the bottom surface facing surface 164. It can be said that it is composed of. In this embodiment, the side surface 162 of the filling member 160 is substantially parallel to the side surface 142 of the recess 140. Further, "the width W1 becomes continuously smaller as it approaches the bottom surface facing surface 164" means that the width W1 becomes discretely smaller as it becomes closer to the bottom surface facing surface 164, as described above for the width W2. Does not include. Here, the form in which the width W1 becomes discretely smaller as the width W1 approaches the bottom surface facing surface 164 is defined in the cross section of the filling member 160 shown in FIG. 7, as in the electrostatic chuck 10Y (FIG. 7) of the comparative example described later. , The line representing the side surface 162 has a stepped shape (that is, the line representing the side surface 162 has a portion parallel to the surface direction). "The width W1 becomes continuously smaller as it approaches the bottom surface facing surface 164" means that the line representing the side surface 162 does not have a portion parallel to the surface direction in the cross section of the filling member 160 shown in FIG. means.

An adhesive layer 170 is arranged between the side surface 142 of the recess 140 and the side surface 162 of the filling member 160, and the filling member 160 is joined to the ceramic plate 100 by the adhesive layer 170. The adhesive layer 170 is made of an adhesive such as a silicone resin, an acrylic resin, or an epoxy resin. The thermal conductivity of the adhesive layer 170 is higher than the thermal conductivity of the filling member 160 and lower than the thermal conductivity of the ceramic plate 100. In the present embodiment, the bottom surface facing surface 164 of the filling member 160 is in contact with the bottom surface 144 of the recess 140, and the adhesive layer 170 is arranged between the bottom surface facing surface 164 of the filling member 160 and the bottom surface 144 of the recess 140. It has not been.

In this way, the filling member 160 formed of the insulating material is filled in the recess 140, and the adhesive layer 170 is arranged between the side surface 142 of the recess 140 and the side surface 162 of the filling member 160, so that the inside of the recess 140 is filled. The generation of electric discharge between the ceramic plate 100 and the base member 200 and the electric discharge of helium gas in the recess 140 is suppressed.

As shown in FIGS. 2 and 4, when helium gas supplied from a helium gas source (not shown) flows into the gas supply flow path 220 inside the base member 200 from the gas source connection hole 221, the inflowing helium gas is released. It flows from the gas supply flow path 220 through the gas supply hole 222 into the through hole 310 of the adhesive layer 300, and further passes through the inside of the filling member 160 filled in the recess 140, and the gas is ejected inside the ceramic plate 100. It flows into the first vertical flow path 111 constituting the flow path 110, and is ejected from each gas ejection hole 102 formed in the suction surface S1 via the horizontal flow path 114 and the second vertical flow path 112. In this way, the helium gas is supplied to the space existing between the suction surface S1 and the surface of the wafer W.

A-2. Manufacturing method of electrostatic chuck 10:
FIG. 5 is a flowchart showing a method of manufacturing the electrostatic chuck 10 according to the first embodiment. First, the ceramic plate 100 and the base member 200 are prepared (S110). The ceramic plate 100 and the base member 200 can be manufactured by a known manufacturing method. For example, the ceramic plate 100 is manufactured by the following method. That is, a plurality of ceramic green sheets (for example, alumina green sheets) are prepared, and each ceramic green sheet is subjected to perforation processing for forming the chuck electrode 400, each gas flow path, etc., printing of metallized ink, etc., and then. The ceramic plate 100 is manufactured by laminating a plurality of ceramic green sheets, thermocompression bonding them, cutting them into a predetermined disk shape, firing them, and finally performing a polishing process or the like. In the present embodiment, the gas ejection flow path 110 (first vertical flow path 111, horizontal flow path 114, second vertical flow path 112) is formed by performing the above-mentioned drilling process in the ceramic green sheet. To.

Next, a recess 140 is formed on the lower surface S2 of the ceramic plate 100 (S120). The recess 140 is formed by, for example, polishing. The recess 140 is formed so as to communicate with the first vertical flow path 111 constituting the gas ejection flow path 110.

Next, the filling member 160 is installed in the recess 140 of the ceramic plate 100 (S130). Specifically, an adhesive is applied to the side surface 162 of the filling member 160 formed of the insulating material, and the filling member 160 is inserted into the recess 140. At this time, the filling member 160 is pushed in until the bottom surface facing surface 164 of the filling member 160 comes into contact with the bottom surface 144 of the recess 140. When the insertion of the filling member 160 is completed, an adhesive is arranged between the side surface 162 of the filling member 160 and the side surface 142 of the recess 140, and between the bottom surface facing surface 164 of the filling member 160 and the bottom surface 144 of the recess 140. There is no adhesive in. Then, the adhesive is cured to form the adhesive layer 170. As described above, the filling member 160 is installed in the recess 140.

Next, the ceramic plate 100 and the base member 200 are joined (S140). Specifically, the adhesive layer 300 is formed by performing a curing treatment in which the lower surface S2 of the ceramic plate 100 and the upper surface S3 of the base member 200 are bonded to each other via an adhesive and the adhesive is cured. .. When arranging the adhesive between the ceramic plate 100 and the base member 200, holes corresponding to the above-mentioned through holes 310 are provided, and the through holes 310 are formed in the adhesive layer 300 formed by the curing treatment of the adhesive. To be done. Through the above steps, the production of the electrostatic chuck 10 having the above-described configuration is completed.

A-3. Effect of the first embodiment:
As described above, the electrostatic chuck 10 of the first embodiment has a planar suction surface S1 substantially orthogonal to the Z-axis direction and a lower surface S2 on the opposite side of the suction surface S1, and has a suction surface. The gas ejection flow path 110 that opens into S1 has a ceramic plate 100 formed inside and an upper surface S3, the upper surface S3 is arranged so as to face the lower surface S2 of the ceramic plate 100, and the gas supply flow path 220 is inside. The base member 200 formed in the above is provided. A recess 140 having a bottom surface 144 through which the gas ejection flow path 110 opens is formed on the lower surface S2 of the ceramic plate 100. The ceramic plate 100 further includes a filling member 160 filled in the recess 140. The filling member 160 is made of an insulating material that is breathable and has a thermal conductivity lower than that of the ceramic plate 100, and has an exposed surface 166, a bottom surface facing surface 164, and a side surface 162. .. The exposed surface 166 of the filling member 160 is a surface exposed from the recess 140. The bottom surface facing surface 164 of the filling member 160 is a surface facing the bottom surface 144 of the recess 140, has a smaller area than the exposed surface 166, and overlaps the exposed surface 166 as a whole in the Z-axis direction. The side surface 162 is a surface connecting the peripheral edge of the exposed surface 166 and the peripheral edge of the bottom surface facing surface 164. Further, the filling member 160 is composed of only a specific portion SP1 whose size W1 in the direction orthogonal to the Z-axis direction (plane direction) becomes continuously smaller as the size W1 approaches the bottom surface facing surface 164.

Further, the electrostatic chuck 10 of the first embodiment includes an adhesive layer 170 arranged between the side surface 142 of the recess 140 and the side surface 162 of the filling member 160. The thermal conductivity of the adhesive layer 170 is higher than the thermal conductivity of the filling member 160 and lower than the thermal conductivity of the ceramic plate 100. Further, the recess 140 faces the specific portion SP1 of the filling member 160 in the direction orthogonal to the Z-axis direction (plane direction), and the recess 140 is continuously reduced as the width W2 in the plane direction becomes closer to the bottom surface 144. It is composed of only the partial SP2.

Since the electrostatic chuck 10 of the first embodiment has the above configuration, as described below, it is possible to suppress a decrease in the uniformity of the temperature distribution on the suction surface S1 of the ceramic plate 100 due to the presence of the filling member 160. be able to.

FIG. 6 is an explanatory diagram schematically showing the configuration of the electrostatic chuck 10X of the comparative example. FIG. 6 shows an enlarged configuration of a portion equivalent to the portion (X1 portion) shown in FIG. 4 among the configurations of the electrostatic chuck 10X of the comparative example. The electrostatic chuck 10X of the comparative example shown in FIG. 6 is different from the electrostatic chuck 10 of the first embodiment shown in FIG. 4 in the shapes of the recess 140 and the filling member 160. Specifically, in the electrostatic chuck 10X of the comparative example, the shape of the recess 140 (the internal space of the recess 140) is substantially cylindrical. That is, the opening 146 and the bottom surface 144 of the recess 140 are substantially circular in the same size as each other. Further, the shape of the XZ cross section (that is, the cross section shown in FIG. 6) of the recess 140 passing through the center of the bottom surface 144 is rectangular. Since the recess 140 in the electrostatic chuck 10X of the comparative example has such a configuration, the width W2 in the surface direction is constant throughout, and the width W2 becomes continuously smaller as the width W2 approaches the bottom surface 144 ( The recessed specific portion SP2) in FIG. 4 does not exist.

The size of the opening 146 of the recess 140 in the electrostatic chuck 10X of the comparative example is the same as the size of the opening 146 of the recess 140 in the electrostatic chuck 10 of the first embodiment. Therefore, the size of the bottom surface 144 of the recess 140 in the electrostatic chuck 10X of the comparative example is larger than the size of the bottom surface 144 of the recess 140 in the electrostatic chuck 10 of the first embodiment. That is, the recess 140 in the electrostatic chuck 10 of the first embodiment has a smaller bottom surface 144 than the recess 140 in the electrostatic chuck 10X of the comparative example while maintaining the size of the opening 146. , The shape is such that the side surface 142 is provided with a taper.

Further, in the electrostatic chuck 10X of the comparative example, the shape of the filling member 160 is also substantially cylindrical. That is, the exposed surface 166 and the bottom surface facing surface 164 of the filling member 160 are substantially circular in the same size as each other. Further, the shape of the XZ cross section (that is, the cross section shown in FIG. 6) of the filling member 160 passing through the center of the bottom surface facing surface 164 is rectangular. Since the filling member 160 in the electrostatic chuck 10X of the comparative example has such a configuration, the size W1 in the surface direction is constant throughout, and the size W1 becomes continuously smaller as the size W1 approaches the bottom surface facing surface 164. There is no such part (specific part SP1 in FIG. 4).

The size of the exposed surface 166 of the filling member 160 in the electrostatic chuck 10X of the comparative example is the same as the size of the exposed surface 166 of the filling member 160 in the electrostatic chuck 10 of the first embodiment. Therefore, the size of the bottom surface facing surface 164 of the filling member 160 in the electrostatic chuck 10X of the comparative example is larger than the size of the bottom surface facing surface 164 of the filling member 160 in the electrostatic chuck 10 of the first embodiment. That is, the filling member 160 in the electrostatic chuck 10 of the first embodiment has the size of the bottom surface facing surface 164 while maintaining the size of the exposed surface 166 with respect to the filling member 160 in the electrostatic chuck 10X of the comparative example. The shape is such that the side surface 162 is scraped off so that

Since the electrostatic chuck 10X of the comparative example shown in FIG. 6 has the above-described configuration, the ceramic plate 100 (ceramic plate 100) does not pass through the filling member 160 and the adhesive layer 170 (that is, through the ceramic plate 100). The heat transfer path HR from the suction surface S1) to the base member 200 (refrigerant flow path 210 of the base member 200) becomes long. Since the thermal conductivity of the adhesive layer 170 is lower than that of the ceramic plate 100, the amount of heat transfer through the adhesive layer 170 is small. Further, since the thermal conductivity of the filling member 160 is even lower than that of the adhesive layer 170, the amount of heat transfer through the filling member 160 is very small. Therefore, in the electrostatic chuck 10X of the comparative example, the heat transfer property (heat attraction characteristic) from the ceramic plate 100 to the base member 200 at the location where the filling member 160 is provided is locally reduced, and the suction surface S1 of the ceramic plate 100 The uniformity of the temperature distribution in the above may decrease.

FIG. 7 is an explanatory diagram schematically showing the configuration of the electrostatic chuck 10Y of another comparative example. FIG. 7 shows an enlarged configuration of a portion equivalent to the portion (X1 portion) shown in FIG. 4 among the configurations of the electrostatic chuck 10Y of the comparative example. The electrostatic chuck 10Y of the comparative example shown in FIG. 7 is different from the electrostatic chuck 10 of the first embodiment shown in FIG. 4 in the shapes of the recess 140 and the filling member 160. Specifically, in the electrostatic chuck 10Y of the comparative example, the shape of the recess 140 (internal space of the recess 140) is substantially cylindrical in a part close to the bottom surface 144 (hereinafter, referred to as “bottom surface vicinity portion P11”). The remaining part (hereinafter referred to as "opening vicinity portion P12") has a substantially cylindrical shape having a diameter larger than that of the bottom surface vicinity portion P11. Therefore, in the electrostatic chuck 10Y of the comparative example, in the XZ cross section (that is, the cross section shown in FIG. 7) of the recess 140 passing through the center of the bottom surface 144, the line representing the side surface 142 is stepped (that is, the side surface 142). The line representing is having a part parallel to the plane direction). Since the recess 140 in the electrostatic chuck 10Y of the comparative example has such a configuration, a portion (recess specific portion SP2 in FIG. 4) in which the width W2 in the surface direction becomes continuously smaller as it approaches the bottom surface 144 is provided. I don't have it.

The size of the opening 146 of the recess 140 in the electrostatic chuck 10Y of the comparative example is the same as the size of the opening 146 of the recess 140 in the electrostatic chuck 10 of the first embodiment. The size of the bottom surface 144 of the recess 140 is the same as the size of the bottom surface 144 of the recess 140 in the electrostatic chuck 10 of the first embodiment.

Further, in the electrostatic chuck 10Y of the comparative example, the shape of the filling member 160 is substantially columnar in a part close to the bottom surface facing surface 164 (hereinafter, referred to as “opposite surface vicinity portion P21”), and the remaining part (hereinafter, referred to as , "Exposure surface vicinity portion P22") has a substantially cylindrical shape having a diameter larger than that of the facing surface vicinity portion P21. Therefore, in the electrostatic chuck 10Y of the comparative example, the line representing the side surface 162 is stepped (that is, in the XZ cross section (that is, the cross section shown in FIG. 7) of the filling member 160 passing through the center of the bottom surface facing surface 164). , The line representing the side surface 162 has a portion parallel to the plane direction). Since the filling member 160 in the electrostatic chuck 10Y of the comparative example has such a configuration, a portion (specific portion SP1 in FIG. 4) in which the width W1 in the surface direction becomes continuously smaller as it approaches the bottom surface facing surface 164. ) Does not have.

The size of the exposed surface 166 of the filling member 160 in the electrostatic chuck 10Y of the comparative example is the same as the size of the exposed surface 166 of the filling member 160 in the electrostatic chuck 10 of the first embodiment. The size of the bottom surface facing surface 164 of the filling member 160 in the electrostatic chuck 10Y is the same as the size of the bottom surface facing surface 164 of the filling member 160 in the electrostatic chuck 10 of the first embodiment.

Since the electrostatic chuck 10Y of the comparative example shown in FIG. 7 has the above-described configuration, the ceramic plate 100 (ceramic plate 100) does not pass through the filling member 160 and the adhesive layer 170 (that is, through the ceramic plate 100). The heat transfer path HR from the suction surface S1) to the base member 200 (refrigerant flow path 210 of the base member 200) becomes long. Therefore, in the electrostatic chuck 10Y of the comparative example, the heat transfer property (heat attraction characteristic) from the ceramic plate 100 to the base member 200 at the location where the filling member 160 is provided is locally reduced, and the suction surface S1 of the ceramic plate 100 The uniformity of the temperature distribution in the above may decrease.

On the other hand, in the electrostatic chuck 10 of the first embodiment shown in FIG. 4, the filling member 160 is composed of only the specific portion SP1 that continuously decreases as the size W1 in the surface direction approaches the bottom surface facing surface 164. Has been done. Further, in the electrostatic chuck 10 of the first embodiment, the recess 140 faces the specific portion SP1 of the filling member 160 in the surface direction, and the width W2 in the surface direction becomes continuously smaller as the width W2 approaches the bottom surface 144. It is composed of only the recess specific portion SP2. Therefore, in the electrostatic chuck 10 of the first embodiment, the base is formed from the ceramic plate 100 (adsorption surface S1 of the ceramic plate 100) without passing through the filling member 160 and the adhesive layer 170 (that is, through the ceramic plate 100). The heat transfer path HR to the member 200 (refrigerant flow path 210 of the base member 200) is significantly shorter than that of the electrostatic chucks 10X and 10Y of the above-mentioned comparative example. Therefore, in the electrostatic chuck 10 of the first embodiment, it is possible to extremely effectively suppress the decrease in heat transfer property from the ceramic plate 100 to the base member 200 at the portion where the filling member 160 is provided, and the filling member 160 can be used. It is possible to extremely effectively suppress the decrease in the uniformity of the temperature distribution on the suction surface S1 of the ceramic plate 100 due to the presence.

As described above, the recess 140 ensures that the gas supply flow path 220 and the gas ejection flow path 110 communicate with each other even if there is some error in the relative positions of the ceramic plate 100 and the base member 200. It is provided to do. Therefore, if the size of the opening 146 of the recess 140 (and the size of the exposed surface 166 of the filling member 160 filled in the recess 140) is excessively small, the gas supply flow path 220 and the gas ejection flow path 110 are surely connected. Communication may be hindered. However, in the electrostatic chuck 10 of the first embodiment, as described above, the size of the opening 146 of the recess 140 (and the size of the exposed surface 166 of the filling member 160 filled in the recess 140) is a comparative example. Since it is secured to be equivalent to the electrostatic chucks 10X and 10Y of the above, there is a problem of communication between the gas supply flow path 220 and the gas ejection flow path 110 due to the misalignment between the ceramic plate 100 and the base member 200. Occurrence can be suppressed.

B. Second embodiment:
FIG. 8 is an explanatory diagram schematically showing the configuration of the electrostatic chuck 10a of the second embodiment. FIG. 8 shows an enlarged configuration of a portion equivalent to the portion (X1 portion) shown in FIG. 4 among the configurations of the electrostatic chuck 10a of the second embodiment. In the following, among the configurations of the electrostatic chuck 10a of the second embodiment, the same configurations as the configurations of the electrostatic chuck 10 of the first embodiment described above (see FIG. 4 and the like) are designated by the same reference numerals. The description thereof will be omitted as appropriate.

As shown in FIG. 8, in the electrostatic chuck 10a of the second embodiment, the shape of the recess 140 is different from the configuration of the electrostatic chuck 10 of the first embodiment described above. Specifically, in the electrostatic chuck 10a of the second embodiment, the shape of the recess 140 (internal space of the recess 140) is substantially cylindrical, as in the comparative example shown in FIG. That is, the opening 146 of the recess 140 and the bottom surface 144 are substantially circular in size, and the shape of the XZ cross section (that is, the cross section shown in FIG. 8) of the recess 140 passing through the center of the bottom surface 144 is rectangular. is there. The size of the opening 146 of the recess 140 in the electrostatic chuck 10a of the second embodiment is the same as the size of the opening 146 of the recess 140 in the electrostatic chuck 10 of the first embodiment shown in FIG. Therefore, the size of the bottom surface 144 of the recess 140 in the electrostatic chuck 10a of the second embodiment is larger than the size of the bottom surface 144 of the recess 140 in the electrostatic chuck 10 of the first embodiment. Since the recess 140 in the electrostatic chuck 10a of the second embodiment has such a configuration, the width W2 in the surface direction is constant over the entire surface, and the width W2 becomes continuously smaller as the width W2 approaches the bottom surface 144. There is no portion (recess specific portion SP2 in FIG. 4).

The configuration of the filling member 160 in the electrostatic chuck 10a of the second embodiment is the same as the configuration of the filling member 160 in the electrostatic chuck 10 of the first embodiment. That is, the bottom surface facing surface 164 of the filling member 160 in the electrostatic chuck 10a of the second embodiment has a smaller area than the exposed surface 166 and overlaps the exposed surface 166 as a whole in the Z-axis direction. Further, the filling member 160 is composed of only the specific portion SP1 whose size W1 in the surface direction becomes continuously smaller as the size W1 approaches the bottom surface facing surface 164. Therefore, in the electrostatic chuck 10a of the second embodiment, the distance between the side surface 162 of the filling member 160 and the side surface 142 of the recess 140 is wider than that of the electrostatic chuck 10 of the first embodiment, and the electrostatic chuck 10a is arranged within the distance. The volume of the bonded adhesive layer 170 is increased.

Since the electrostatic chuck 10a of the second embodiment has the above-described configuration, the ceramic plate 100 (adsorption of the ceramic plate 100) does not pass through the filling member 160 (that is, through the ceramic plate 100 or the adhesive layer 170). The heat transfer path HR from the surface S1) to the base member 200 (refrigerant flow path 210 of the base member 200) is shorter than that of the electrostatic chucks 10X and 10Y of the comparative examples shown in FIGS. 6 and 7. Since the thermal conductivity of the adhesive layer 170 is higher than that of the filling member 160, the amount of heat transfer via the adhesive layer 170 is much larger than the amount of heat transfer via the filling member 160. Therefore, in the electrostatic chuck 10a of the second embodiment, it is possible to suppress a decrease in heat transferability from the ceramic plate 100 to the base member 200 at the location where the filling member 160 is provided, which is caused by the presence of the filling member 160. It is possible to suppress a decrease in the uniformity of the temperature distribution on the suction surface S1 of the ceramic plate 100.

Further, in the electrostatic chuck 10a of the second embodiment, the size of the opening 146 of the recess 140 (and the exposure of the filling member 160 to be filled in the recess 140) is the same as that of the electrostatic chuck 10 of the first embodiment described above. Since the size of the surface 166) is secured to be the same as that of the electrostatic chucks 10X and 10Y of the comparative examples shown in FIGS. 6 and 7, the gas caused by the misalignment between the ceramic plate 100 and the base member 200. It is possible to suppress the occurrence of communication problems between the supply flow path 220 and the gas ejection flow path 110.

C. Third Embodiment:
FIG. 9 is an explanatory diagram schematically showing the configuration of the electrostatic chuck 10b of the third embodiment. FIG. 9 shows an enlarged configuration of a portion equivalent to the portion (X1 portion) shown in FIG. 4 among the configurations of the electrostatic chuck 10b of the third embodiment. In the following, among the configurations of the electrostatic chuck 10b of the third embodiment, the same configurations as the configurations of the electrostatic chuck 10 of the first embodiment described above (see FIG. 4 and the like) are designated by the same reference numerals. The description thereof will be omitted as appropriate.

As shown in FIG. 9, in the electrostatic chuck 10b of the third embodiment, the shapes of the recess 140 and the filling member 160 are different from the configuration of the electrostatic chuck 10 of the first embodiment described above. Specifically, in the electrostatic chuck 10b of the third embodiment, in a part where the shape of the filling member 160 is close to the bottom surface facing surface 164 (hereinafter, referred to as “opposite surface proximity portion P21”), the first shown in FIG. Similar to the embodiment, it has a partial conical shape, but the remaining part (hereinafter, referred to as “exposed surface vicinity portion P22”) has a substantially cylindrical shape as in the comparative example shown in FIG. That is, the filling member 160 in the electrostatic chuck 10b of the third embodiment has a shape in which the corner portion on the bottom surface facing surface 164 side is C-chamfered with respect to the filling member 160 in the electrostatic chuck 10X of the comparative example shown in FIG. is there. The XZ cross section (that is, the cross section shown in FIG. 9) of the filling member 160 passing through the center of the bottom facing surface 164 is a rectangular shape in which two corners on the bottom facing surface 164 side are C-chamfered. Since the filling member 160 in the electrostatic chuck 10b of the third embodiment has such a configuration, the specific portion SP1 (that is, facing each other) becomes continuously smaller as the size W1 in the surface direction becomes closer to the bottom surface facing surface 164. It can be said that the surface vicinity portion P21) is included. However, the filling member 160 is not composed of only the specific portion SP1. Further, in the electrostatic chuck 10b of the third embodiment, similarly to the electrostatic chuck 10 of the first embodiment, the bottom surface facing surface 164 of the filling member 160 has a smaller area than the exposed surface 166 and is viewed in the Z-axis direction. It overlaps with the exposed surface 166 as a whole.

Further, in the electrostatic chuck 10b of the third embodiment, the shape of the recess 140 (internal space of the recess 140) is the first portion shown in FIG. 4 in a part close to the bottom surface 144 (hereinafter, referred to as “bottom surface vicinity portion P11”). Similar to the embodiment, it has a partial conical shape, but the remaining part (hereinafter, referred to as “opening vicinity portion P12”) is substantially columnar as in the comparative example shown in FIG. That is, the recess 140 in the electrostatic chuck 10b of the third embodiment has a shape in which the corner portion on the bottom surface 144 side is tapered with respect to the recess 140 in the electrostatic chuck 10X of the comparative example shown in FIG. Further, the shape of the XZ cross section (that is, the cross section shown in FIG. 9) of the recess 140 passing through the center of the bottom surface 144 is a shape in which two corners on the bottom surface 144 side of the rectangle are C-chamfered. Since the recess 140 in the electrostatic chuck 10b of the third embodiment has such a configuration, it faces the specific portion SP1 of the filling member 160 in the surface direction, and the width W2 in the surface direction becomes closer to the bottom surface 144. It can be said that the recess specific portion SP2 (that is, the portion near the bottom surface P11) that becomes continuously smaller is included. However, the recess 140 is not composed of only the recess specific portion SP2. In the electrostatic chuck 10b of the third embodiment, the side surface 162 of the filling member 160 near the facing surface P21 is substantially parallel to the side surface 142 of the recess 140 near the bottom surface P11.

Since the electrostatic chuck 10b of the third embodiment has the above-described configuration, the ceramic plate 100 (adsorption of the ceramic plate 100) does not pass through the filling member 160 and the adhesive layer 170 (that is, through the ceramic plate 100). The heat transfer path HR from the surface S1) to the base member 200 (refrigerant flow path 210 of the base member 200) is shorter than that of the electrostatic chucks 10X and 10Y of the comparative examples shown in FIGS. 6 and 7. Therefore, in the electrostatic chuck 10b of the third embodiment, it is possible to effectively suppress a decrease in heat transfer property from the ceramic plate 100 to the base member 200 at the location where the filling member 160 is provided, and the presence of the filling member 160 can be suppressed. It is possible to effectively suppress the decrease in the uniformity of the temperature distribution on the suction surface S1 of the ceramic plate 100 due to the above.

Further, in the electrostatic chuck 10b of the third embodiment, the size of the opening 146 of the recess 140 (and the exposure of the filling member 160 to be filled in the recess 140) is the same as that of the electrostatic chuck 10 of the first embodiment described above. Since the size of the surface 166) is secured to be the same as that of the electrostatic chucks 10X and 10Y of the comparative examples shown in FIGS. 6 and 7, the gas caused by the misalignment between the ceramic plate 100 and the base member 200. It is possible to suppress the occurrence of communication problems between the supply flow path 220 and the gas ejection flow path 110.

D. Fourth Embodiment:
FIG. 10 is an explanatory diagram schematically showing the configuration of the electrostatic chuck 10c of the fourth embodiment. FIG. 10 shows an enlarged configuration of a portion equivalent to the portion (X1 portion) shown in FIG. 4 among the configurations of the electrostatic chuck 10c of the fourth embodiment. In the following, among the configurations of the electrostatic chuck 10c of the fourth embodiment, the configuration of the electrostatic chuck 10 of the first embodiment described above (see FIG. 4 and the like) or the configuration of the electrostatic chuck 10b of the third embodiment (FIG. For the same configuration as (see 9 etc.), the description thereof will be omitted as appropriate by adding the same reference numerals.

As shown in FIG. 10, in the electrostatic chuck 10c of the fourth embodiment, the shape of the recess 140 is different from the configuration of the electrostatic chuck 10b of the third embodiment described above. Specifically, in the electrostatic chuck 10c of the fourth embodiment, the shape of the corner portion on the bottom surface 144 side of the concave portion 140 is not a tapered shape but a concave curved surface shape. Further, the shape of the XZ cross section (that is, the cross section shown in FIG. 10) of the recess 140 passing through the center of the bottom surface 144 is a rectangular shape in which two corners on the bottom surface 144 side are chamfered. Since the recess 140 in the electrostatic chuck 10c of the fourth embodiment has such a configuration, it faces the specific portion SP1 of the filling member 160 in the surface direction, and the width W2 in the surface direction becomes closer to the bottom surface 144. It can be said that the recess specific portion SP2 (that is, the portion near the bottom surface P11) that becomes continuously smaller is included. However, the recess 140 is not composed of only the recess specific portion SP2.

The configuration of the filling member 160 in the electrostatic chuck 10c of the fourth embodiment is the same as the configuration of the filling member 160 in the electrostatic chuck 10b of the third embodiment. That is, the bottom surface facing surface 164 of the filling member 160 in the electrostatic chuck 10c of the fourth embodiment has a smaller area than the exposed surface 166 and overlaps the exposed surface 166 as a whole in the Z-axis direction. Further, the filling member 160 is configured to include a specific portion SP1 (that is, a portion near the facing surface P21) that continuously decreases as the size W1 in the surface direction approaches the bottom surface facing surface 164. Therefore, in the electrostatic chuck 10c of the fourth embodiment, as compared with the electrostatic chuck 10b of the third embodiment, the side surface 142 of the recess 140 near the bottom surface P11 and the side surface 162 of the filling member 160 near the opposite surface P21. The space between the two and the adhesive layer 170 is wide, and the volume of the adhesive layer 170 arranged within the space is large.

Since the electrostatic chuck 10c of the fourth embodiment has the above-described configuration, the ceramic plate 100 (adsorption of the ceramic plate 100) does not pass through the filling member 160 and the adhesive layer 170 (that is, through the ceramic plate 100). The heat transfer path HR from the surface S1) to the base member 200 (refrigerant flow path 210 of the base member 200) is shorter than that of the electrostatic chucks 10X and 10Y of the comparative examples shown in FIGS. 6 and 7. Therefore, in the electrostatic chuck 10c of the fourth embodiment, it is possible to effectively suppress a decrease in heat transfer property from the ceramic plate 100 to the base member 200 at the location where the filling member 160 is provided, and the presence of the filling member 160 can be suppressed. It is possible to effectively suppress the decrease in the uniformity of the temperature distribution on the suction surface S1 of the ceramic plate 100 due to the above.

Further, in the electrostatic chuck 10b of the fourth embodiment, the size of the opening 146 of the recess 140 (and the exposure of the filling member 160 to be filled in the recess 140) is the same as that of the electrostatic chuck 10 of the first embodiment described above. Since the size of the surface 166) is secured to be the same as that of the electrostatic chucks 10X and 10Y of the comparative examples shown in FIGS. 6 and 7, the gas caused by the misalignment between the ceramic plate 100 and the base member 200. It is possible to suppress the occurrence of communication problems between the supply flow path 220 and the gas ejection flow path 110.

E. Fifth embodiment:
FIG. 11 is an explanatory diagram schematically showing the configuration of the electrostatic chuck 10d according to the fifth embodiment. FIG. 11 shows an enlarged configuration of a portion equivalent to the portion (X1 portion) shown in FIG. 4 among the configurations of the electrostatic chuck 10d of the fifth embodiment. In the following, among the configurations of the electrostatic chuck 10d of the fifth embodiment, the configuration of the electrostatic chuck 10 of the first embodiment described above (see FIG. 4 and the like) or the configuration of the electrostatic chuck 10b of the third embodiment (FIG. For the same configuration as (see 9 etc.), the description thereof will be omitted as appropriate by adding the same reference numerals.

As shown in FIG. 11, in the electrostatic chuck 10d of the fifth embodiment, the shape of the recess 140 is different from the configuration of the electrostatic chuck 10b of the third embodiment described above. Specifically, in the electrostatic chuck 10d of the fifth embodiment, the shape of the recess 140 (internal space of the recess 140) is substantially cylindrical, as in the comparative example shown in FIG. That is, the opening 146 and the bottom surface 144 of the recess 140 are substantially circular in the same size as each other. Further, the size of the opening 146 of the recess 140 in the electrostatic chuck 10d of the fifth embodiment is determined by the electrostatic chuck 10 of the first embodiment shown in FIG. 4 and the electrostatic chuck 10b of the third embodiment shown in FIG. It is the same size as the opening 146 of the recess 140. Therefore, the size of the bottom surface 144 of the recess 140 in the electrostatic chuck 10d of the fifth embodiment is larger than the size of the bottom surface 144 of the recess 140 in the electrostatic chuck 10 of the first embodiment and the electrostatic chuck 10b of the third embodiment. It will be big. Since the recess 140 in the electrostatic chuck 10d of the fifth embodiment has such a configuration, the width W2 in the surface direction is constant over the entire surface, and the width W2 becomes continuously smaller as the width W2 approaches the bottom surface 144. There is no portion (recess specific portion SP2 in FIG. 4).

The configuration of the filling member 160 in the electrostatic chuck 10d of the fifth embodiment is the same as the configuration of the filling member 160 in the electrostatic chuck 10b of the third embodiment. That is, the bottom surface facing surface 164 of the filling member 160 in the electrostatic chuck 10d of the fifth embodiment has a smaller area than the exposed surface 166 and overlaps the exposed surface 166 as a whole in the Z-axis direction. Further, the filling member 160 is configured to include a specific portion SP1 (that is, a portion near the facing surface P21) that continuously decreases as the size W1 in the surface direction approaches the bottom surface facing surface 164. Therefore, in the electrostatic chuck 10d of the fifth embodiment, as compared with the electrostatic chuck 10b of the third embodiment, the side surface 142 of the recess 140 near the bottom surface P11 and the side surface 162 of the filling member 160 near the opposite surface P21. The space between the two and the adhesive layer 170 is wide, and the volume of the adhesive layer 170 arranged within the space is large.

Since the electrostatic chuck 10d of the fifth embodiment has the above-described configuration, the ceramic plate 100 (adsorption of the ceramic plate 100) does not pass through the filling member 160 (that is, through the ceramic plate 100 or the adhesive layer 170). The heat transfer path HR from the surface S1) to the base member 200 (refrigerant flow path 210 of the base member 200) is shorter than that of the electrostatic chucks 10X and 10Y of the comparative examples shown in FIGS. 6 and 7. Therefore, in the electrostatic chuck 10d of the fifth embodiment, it is possible to suppress a decrease in heat transfer property from the ceramic plate 100 to the base member 200 at the location where the filling member 160 is provided, which is caused by the presence of the filling member 160. It is possible to suppress a decrease in the uniformity of the temperature distribution on the suction surface S1 of the ceramic plate 100.

Further, in the electrostatic chuck 10d of the fifth embodiment, the size of the opening 146 of the recess 140 (and the exposure of the filling member 160 to be filled in the recess 140) is the same as that of the electrostatic chuck 10 of the first embodiment described above. Since the size of the surface 166) is secured to be the same as that of the electrostatic chucks 10X and 10Y of the comparative examples shown in FIGS. 6 and 7, the gas caused by the misalignment between the ceramic plate 100 and the base member 200. It is possible to suppress the occurrence of communication problems between the supply flow path 220 and the gas ejection flow path 110.

F. Sixth Embodiment:
FIG. 12 is an explanatory diagram schematically showing the configuration of the electrostatic chuck 10e according to the sixth embodiment. FIG. 12 shows an enlarged configuration of a portion equivalent to the portion (X1 portion) shown in FIG. 4 among the configurations of the electrostatic chuck 10e of the sixth embodiment. In the following, among the configurations of the electrostatic chuck 10e of the sixth embodiment, the same configurations as the configurations of the electrostatic chuck 10 of the first embodiment described above (see FIG. 4 and the like) are designated by the same reference numerals. The description thereof will be omitted as appropriate.

As shown in FIG. 12, in the electrostatic chuck 10e of the sixth embodiment, the point that the recess 140 is formed not in the ceramic plate 100 but in the base member 200 is that the electrostatic chuck 10 of the first embodiment described above has. Different from the configuration. Specifically, in the electrostatic chuck 10e of the sixth embodiment, a recess 140 having the same configuration as the recess 140 of the electrostatic chuck 10 of the first embodiment is formed on the upper surface S3 of the base member 200. That is, the recess 140 formed in the base member 200 has a bottom surface 144, which is an inner surface on the side close to the lower surface S4 (see FIG. 2), and a peripheral edge and a bottom surface 144 of the opening 146 (hole opened in the upper surface S3) of the recess 140. It has a side surface 142 which is an inner surface connecting the peripheral edge of the surface. A gas supply flow path 220 is opened in the bottom surface 144 of the recess 140. In the present embodiment, the shape of the recess 140 (the internal space of the recess 140) is a partial cone (a part of the cone on the apex side is missing). That is, the opening 146 and the bottom surface 144 of the recess 140 are both substantially circular. Further, the bottom surface 144 has a smaller area than the opening 146, and overlaps the opening 146 as a whole in the Z-axis direction. Further, the side surface 142 of the recess 140 has a side surface shape of the partial cone. Since the recess 140 has such a configuration, it can be said that the recess 140 is composed of only the recess specific portion SP2 that continuously decreases as the width W2 in the surface direction approaches the bottom surface 144.

The recess 140 formed in the base member 200 is filled with a filling member 160 having the same configuration as the filling member 160 in the electrostatic chuck 10 of the first embodiment. That is, the filling member 160 has an exposed surface 166 exposed from the opening 146 of the recess 140 (exposed through the opening 146), a bottom surface facing surface 164 facing the bottom surface 144 of the recess 140, and a peripheral edge and a bottom surface of the exposed surface 166. It has a side surface 162 that connects the peripheral edges of the facing surface 164. In the present embodiment, the shape of the filling member 160 is a partial cone (a part of the cone on the apex side is missing). That is, the exposed surface 166 and the bottom surface facing surface 164 of the filling member 160 are both substantially circular, and the bottom surface facing surface 164 has a smaller area than the exposed surface 166 and is the exposed surface 166 as a whole in the Z-axis direction. Overlap. Further, the side surface 162 of the filling member 160 has a side surface shape of the partial cone. Since the filling member 160 has such a configuration, it can be said that the filling member 160 is composed of only the specific portion SP1 that continuously decreases as the size W1 in the surface direction approaches the bottom surface facing surface 164. In this embodiment, the side surface 162 of the filling member 160 is substantially parallel to the side surface 142 of the recess 140.

An adhesive layer 170 is arranged between the side surface 142 of the recess 140 and the side surface 162 of the filling member 160, and the filling member 160 is joined to the base member 200 by the adhesive layer 170. In the present embodiment, the bottom surface facing surface 164 of the filling member 160 is in contact with the bottom surface 144 of the recess 140, and the adhesive layer 170 is arranged between the bottom surface facing surface 164 of the filling member 160 and the bottom surface 144 of the recess 140. It has not been.

In this way, the filling member 160 formed of the insulating material is filled in the recess 140, and the adhesive layer 170 is arranged between the side surface 142 of the recess 140 and the side surface 162 of the filling member 160, so that the inside of the recess 140 is filled. The generation of electric discharge between the ceramic plate 100 and the base member 200 and the electric discharge of helium gas in the recess 140 is suppressed.

When the helium gas flows into the gas supply flow path 220 inside the base member 200 from the gas source connection hole 221 (FIG. 2), the inflowing helium gas is discharged from the gas supply flow path 220 into the recess 140 and is discharged into the recess 140. It passes through the inside of the filling member 160 filled therein, flows into the through hole 310 of the adhesive layer 300, and further, in the first vertical flow path 111 constituting the gas ejection flow path 110 inside the ceramic plate 100. , It is ejected from each gas ejection hole 102 formed in the suction surface S1 through the horizontal flow path 114 and the second vertical flow path 112 (see FIGS. 1 to 3). In this way, the helium gas is supplied to the space existing between the suction surface S1 and the surface of the wafer W.

In the electrostatic chuck 10e of the sixth embodiment shown in FIG. 12, similarly to the electrostatic chuck 10 of the first embodiment described above, the filling member 160 becomes closer to the bottom surface facing surface 164 in the size W1 in the surface direction. It is composed of only a specific portion SP1 that is continuously reduced. Further, in the electrostatic chuck 10e of the sixth embodiment, the recess 140 faces the specific portion SP1 of the filling member 160 in the surface direction, and the width W2 in the surface direction becomes continuously smaller as the width W2 approaches the bottom surface 144. It is composed of only the recess specific portion SP2. Therefore, in the electrostatic chuck 10e of the sixth embodiment, the base is formed from the ceramic plate 100 (adsorption surface S1 of the ceramic plate 100) without passing through the filling member 160 and the adhesive layer 170 (that is, through the base member 200). The heat transfer path HR to the member 200 (refrigerant flow path 210 of the base member 200) is significantly shortened. Therefore, in the electrostatic chuck 10e of the sixth embodiment, it is possible to extremely effectively suppress the decrease in heat transfer property from the ceramic plate 100 to the base member 200 at the portion where the filling member 160 is provided, and the filling member 160 It is possible to extremely effectively suppress the decrease in the uniformity of the temperature distribution on the suction surface S1 of the ceramic plate 100 due to the presence.

Further, in the electrostatic chuck 10e of the sixth embodiment, the size of the opening 146 of the recess 140 (and the exposure of the filling member 160 to be filled in the recess 140) is the same as that of the electrostatic chuck 10 of the first embodiment described above. Since the size of the surface 166) is secured to be the same as that of the electrostatic chucks 10X and 10Y of the comparative examples shown in FIGS. 6 and 7, the gas caused by the misalignment between the ceramic plate 100 and the base member 200. It is possible to suppress the occurrence of communication problems between the supply flow path 220 and the gas ejection flow path 110.

G. Seventh Embodiment:
FIG. 13 is an explanatory diagram schematically showing the configuration of the electrostatic chuck 10f according to the seventh embodiment. FIG. 13 shows an enlarged configuration of a portion equivalent to the portion (X1 portion) shown in FIG. 4 among the configurations of the electrostatic chuck 10f of the seventh embodiment. In the following, among the configurations of the electrostatic chuck 10f of the seventh embodiment, the same configurations as the configurations of the electrostatic chuck 10 of the first embodiment described above (see FIG. 4 and the like) are designated by the same reference numerals. The description thereof will be omitted as appropriate.

As shown in FIG. 13, the electrostatic chuck 10f of the seventh embodiment is different from the configuration of the electrostatic chuck 10 of the first embodiment described above in that it includes the coating layer 180. Specifically, in the electrostatic chuck 10f of the seventh embodiment, the side surface 162 and the bottom surface facing surface 164 of the filling member 160 are covered with the coating layer 180. In the present embodiment, the thickness of the adhesive layer 170 (the size in the direction orthogonal to the Z axis) is thinner due to the provision of the coating layer 180 as compared with the configuration of the electrostatic chuck 10 of the first embodiment described above. It has become.

The thermal conductivity of the coating layer 180 is higher than the thermal conductivity of the adhesive layer 170. As described above, since the thermal conductivity of the adhesive layer 170 is higher than the thermal conductivity of the filling member 160, the thermal conductivity of the coating layer 180 is higher than the thermal conductivity of the filling member 160. As the material for forming the coating layer 180, for example, alumina, yttria, or the like can be used.

In the electrostatic chuck 10f of the seventh embodiment, as described above, the coating layer 180 having a thermal conductivity higher than the thermal conductivity of the filling member 160 and the adhesive layer 170 has the side surface 162 and the bottom surface facing surface 164 of the filling member 160. In addition to the ceramic plate 100 and the adhesive layer 170, the coating layer 180 is provided from the ceramic plate 100 (adhesive surface S1 of the ceramic plate 100) to the base member 200 (base member) without passing through the filling member 160. It constitutes a path HR for heat transfer to the refrigerant flow path 210) of 200. Since the thermal conductivity of the coating layer 180 is higher than that of the adhesive layer 170, the amount of heat transfer via the path HR increases when the coating layer 180 constitutes the above-mentioned heat transfer path HR. Therefore, in the electrostatic chuck 10f of the seventh embodiment, the decrease in heat transferability from the ceramic plate 100 to the base member 200 at the location where the filling member 160 is provided can be effectively suppressed, and the presence of the filling member 160 can be suppressed. It is possible to effectively suppress the decrease in the uniformity of the temperature distribution on the suction surface S1 of the ceramic plate 100 due to the above.

In the present embodiment, the coating layer 180 covers the entire side surface 162 and the bottom surface facing surface 164 of the filling member 160, but at least a part of the side surface 162 and the bottom surface facing surface 164 of the filling member 160. A form that covers the region may be adopted. For example, in order to prevent the flow of helium gas from being obstructed by the coating layer 180, the first longitudinal flow of the ceramic plate 100 among the exposed surface 166 of the filling member 160 and the bottom surface facing surface 164 of the filling member 160. The coating layer 180 may not be formed in the region facing the road 111. If the coating layer 180 is formed so as to cover at least a part of a region on the side surface 162 and the bottom surface facing surface 164 of the filling member 160, the coating layer 180 covers at least a part of the heat transfer path HR described above. Since it can be configured, the amount of heat transfer via the path HR becomes large, and the decrease in heat transferability from the ceramic plate 100 to the base member 200 at the location where the filling member 160 is provided can be effectively suppressed. Therefore, it is possible to effectively suppress a decrease in the uniformity of the temperature distribution on the suction surface S1 of the ceramic plate 100 due to the presence of the filling member 160.

H. Modification example:
The technique disclosed in the present specification is not limited to the above-described embodiment, and can be transformed into various forms without departing from the gist thereof, and for example, the following modifications are also possible.

The configuration of the electrostatic chuck 10 in each of the above embodiments is merely an example, and can be variously deformed. For example, in each of the above embodiments, the shape of the filling member 160 faces the exposed surface 166 exposed from the recess 140 and the bottom surface 144 of the recess 140, has a smaller area than the exposed surface 166, and is the entire shape in the Z-axis direction. It has a bottom surface facing surface 164 that overlaps the exposed surface 166, and a side surface 162 that connects the peripheral edge of the exposed surface 166 and the peripheral edge of the bottom surface facing surface 164. As long as it has a specific portion SP1 that becomes continuously smaller, it can be variously deformed. For example, in the first embodiment (FIG. 4), the shape of the filling member 160 is such that the shape of the XZ cross section (that is, the cross section shown in FIG. 4) of the filling member 160 passing through the center of the bottom surface facing surface 164 is trapezoidal. However, the shape of the filling member 160 may be such that the sides (legs) connecting the two bases in the trapezoid are curved instead of straight. Similarly, in the third embodiment (FIG. 9), the shape of the filling member 160 is rectangular, and the shape of the XZ cross section (that is, the cross section shown in FIG. 9) of the filling member 160 passing through the center of the bottom surface facing surface 164 is rectangular. The shape is such that the two corners on the bottom facing surface 164 side are C-chamfered, but the shape of the filling member 160 is the shape in which the two corners in the rectangle are R-chamfered. It may have such a shape.

Further, in each of the above embodiments, the shape of the recess 140 can be variously deformed. For example, in the first embodiment (FIG. 4), the side surface 142 of the recess 140 is substantially parallel to the side surface 162 of the filling member 160, but both are not necessarily parallel to each other. Further, in the first embodiment, the shape of the recess 140 is such that the XZ cross section (that is, the cross section shown in FIG. 4) of the recess 140 passing through the center of the bottom surface 144 is trapezoidal. The shape of the trapezoid may be such that the sides (legs) connecting the two bases in the trapezoid are curved instead of straight.

Further, in each of the above embodiments, the recess 140 is formed on either the lower surface S2 of the ceramic plate 100 or the upper surface S3 of the base member 200, but the recess 140 is formed on the lower surface S2 of the ceramic plate 100 and the base member. It may be formed on both the upper surface S3 of 200. In such a configuration, when the helium gas flows into the gas supply flow path 220 inside the base member 200 from the gas source connection hole 221 (FIG. 2), the inflowing helium gas flows from the gas supply flow path 220 to the base member 200. It is discharged into the recess 140 formed in the recess 140, passes through the inside of the filling member 160 filled in the recess 140, flows into the through hole 310 of the adhesive layer 300, and further, the recess formed in the ceramic plate 100. It is discharged into the 140, passes through the inside of the filling member 160 filled in the recess 140, flows into the first vertical flow path 111 constituting the gas ejection flow path 110 inside the ceramic plate 100, and flows in a cross flow. It is ejected from each gas ejection hole 102 formed in the suction surface S1 through the passage 114 and the second vertical flow path 112.

Further, in each of the above embodiments, the bottom surface facing surface 164 of the filling member 160 is in contact with the bottom surface 144 of the recess 140, but there is a space between the bottom surface facing surface 164 of the filling member 160 and the bottom surface 144 of the recess 140. May be. Further, the adhesive layer 170 may be arranged in all or a part of this space. Further, in each of the above embodiments, other configurations for supplying helium gas (gas source connection hole 221, gas supply flow path 220, through hole 310, first vertical flow path 111, horizontal flow path 114, second vertical flow path). The shape, position, number, etc. of the flow path 112, the gas ejection hole 102, etc.) can be arbitrarily set. For example, even if the gas ejection flow path 110 does not include the horizontal flow path 114 (that is, the first vertical flow path 111 and the second vertical flow path 112 communicate with each other without passing through the horizontal flow path 114). Good.

Further, in each of the above embodiments, a heater electrode composed of a resistance heating element formed of a conductive material (for example, tungsten, molybdenum, etc.) may be provided inside the ceramic plate 100. In such a configuration, when a voltage is applied to the heater electrode from the power source, the heater electrode generates heat to heat the ceramic plate 100, and the wafer W held on the suction surface S1 of the ceramic plate 100 is heated. Thereby, the temperature control of the wafer W is realized. The heater electrode may be arranged not inside the ceramic plate 100 but on the base member 200 side (between the ceramic plate 100 and the adhesive layer 300) of the ceramic plate 100.

Further, in each of the above embodiments, the refrigerant flow path 210 is formed inside the base member 200, but the refrigerant flow path 210 is not inside the base member 200 but on the surface of the base member 200 (for example, the base member 200). And the adhesive layer 300).

Further, in each of the above embodiments, the ceramic plate 100 and the base member 200 are joined by the adhesive layer 300, but as a method of joining the ceramic plate 100 and the base member 200, another method (for example, brazing) is used. And mechanical joining, etc.) may be adopted.

Further, in each of the above embodiments, a bipolar method in which a pair of chuck electrodes 400 are provided inside the ceramic plate 100 is adopted, but a unipolar method in which one chuck electrode 400 is provided inside the ceramic plate 100 is adopted. May be adopted. Further, the material forming each member in each of the above embodiments is merely an example, and each member may be formed of another material.

Further, the method for manufacturing the electrostatic chuck 10 in each of the above embodiments is merely an example, and various modifications can be made. For example, in each of the above embodiments, the recess 140 is formed by polishing after the ceramic plate 100 is manufactured, but even if the recess 140 is formed by drilling a hole in the ceramic green sheet before firing. Good.

Further, the present invention is not limited to the electrostatic chuck 10 that holds the wafer W by utilizing electrostatic attraction, but another holding device that includes a ceramic plate and a base member and holds an object on the surface of the ceramic plate. It can also be applied (for example, a vacuum chuck, a heater device, etc.).

10: Electrostatic chuck 100: Ceramic plate 102: Gas ejection hole 110: Gas ejection flow path 111: First vertical flow path 112: Second vertical flow path 114: Horizontal flow path 140: Recessed 142: Side surface 144: Bottom surface 146 : Opening 160: Filling member 162: Side surface 164: Bottom facing surface 166: Exposed surface 170: Adhesive layer 180: Coating layer 200: Base member 210: Refrigerant flow path 220: Gas supply flow path 221: Gas source connection hole 222: Gas Supply hole 300: Adhesive layer 310: Through hole 400: Chuck electrode

Claims (5)

A gas ejection flow path having a planar first surface substantially orthogonal to the first direction and a second surface opposite to the first surface, and opening to the first surface. The ceramic plate formed inside and
A base member having a third surface, the third surface being arranged so as to face the second surface of the ceramic plate, and a gas supply flow path formed inside.
In a holding device for holding an object on the first surface of the ceramic plate.
At least one of the second surface of the ceramic plate and the third surface of the base member is formed with a recess having a bottom surface through which the gas ejection flow path or the gas supply flow path opens.
The holding device further
A filling member filled in the recess.
It is made of an insulating material that is breathable and has a thermal conductivity lower than the thermal conductivity of the ceramic plate and the member in which the recess is formed.
An exposed surface exposed from the recess, a bottom facing surface facing the bottom surface of the recess, having a smaller area than the exposed surface, and overlapping the exposed surface as a whole in the first directional view, and the exposed surface. A specific portion having a side surface connecting the peripheral edge of the surface and the peripheral edge of the bottom surface facing surface, and continuously decreasing in size in a second direction orthogonal to the first direction as it approaches the bottom surface facing surface. Filling member with
An adhesive layer arranged between the recess and the side surface of the filling member and having a thermal conductivity higher than that of the filling member.
A holding device comprising. In the holding device according to claim 1,
The thermal conductivity of the adhesive layer is lower than the thermal conductivity of the ceramic plate and the member in which the recess is formed in the base member.
The recess is characterized by having a recess-specific portion that faces the specific portion of the filling member in the second direction and that is continuously narrowed as the width of the second direction approaches the bottom surface. And the holding device. In the holding device according to claim 1 or 2.
A holding device, wherein the filling member is composed of only the specific portion. In the holding device according to claim 3,
The thermal conductivity of the adhesive layer is lower than the thermal conductivity of the ceramic plate and the member in which the recess is formed in the base member.
The recess is composed of only a recess-specific portion that faces the specific portion of the filling member in the second direction and that continuously decreases as the width in the second direction approaches the bottom surface. A holding device characterized by being present. In the holding device according to any one of claims 1 to 4, further
A holding device comprising a coating layer having a thermal conductivity higher than that of the adhesive layer and covering at least a part of a region between the side surface and the bottom surface facing surface of the filling member.

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