JP6758175B2 - Electrostatic chuck - Google Patents

Description

The techniques disclosed herein relate to electrostatic chucks.

For example, an electrostatic chuck is used to hold a wafer when manufacturing a semiconductor. The electrostatic chuck includes a metal base member and a ceramic plate bonded to the base member, and exerts an electrostatic attraction generated by applying a voltage to a chuck electrode arranged inside the ceramic plate. Utilizing this, the wafer is attracted and held on the surface of the ceramic plate (hereinafter referred to as "adsorption surface").

The electrostatic chuck has a configuration for supplying power to the chuck electrode. Specifically, a through hole for terminals is formed inside the base member to open on the surface of the base member facing the ceramic plate (hereinafter referred to as "upper surface"), and a columnar shape is formed in the through hole for terminals. Electrode terminals are arranged. Further, an electrode pad conducting to the chuck electrode is arranged in a predetermined region in the surface of the ceramic plate facing the base member (hereinafter, referred to as “lower surface”). The predetermined region on the lower surface of the ceramic plate is a region that overlaps the terminal through hole in a direction substantially orthogonal to the suction surface (hereinafter, referred to as “first direction”). The electrode terminals arranged in the terminal through holes of the base member are joined to the electrode pads by, for example, brazing. Further, in order to insulate between the electrode terminal and the metal base member, the electrode terminal is continuously provided in the terminal through hole of the base member so as to be interposed between the electrode terminal and the surface of the terminal through hole. Insulating members are arranged to surround the surface. When using an electrostatic chuck, a voltage is applied to the chuck electrode via a conduction path from a power source to the chuck electrode via an electrode terminal and an electrode pad (see, for example, Patent Document 1).

JP-A-2007-258615

In the conventional electrostatic chuck, the creepage distance from the electrode pad to the base member is short along the lower surface of the ceramic plate, and a short circuit may occur between the electrode pad and the base member.

The problem of such a short circuit is not limited to between the electrode pad conducting to the chuck electrode and the base member, but also to the electrode pad conducting to the internal electrode arranged inside the ceramic plate such as a heater electrode. It is a problem that can occur similarly with the base member.

This specification discloses a technique capable of solving the above-mentioned problems.

The techniques disclosed herein can be realized, for example, in the following forms.

(1) The electrostatic chuck disclosed in the present specification has a planar first surface substantially orthogonal to the first direction and a second surface opposite to the first surface. It has a plate-shaped ceramic plate and a third surface, and the third surface is arranged so as to face the second surface of the ceramic plate, and opens to the refrigerant flow path and the third surface. A metal base member having a through hole for terminals formed inside, a first adhesive material arranged between the ceramic plate and the base member, and an internal electrode arranged inside the ceramic plate. An electrode that is arranged in the first region on the second surface of the ceramic plate and that overlaps the terminal through hole in the first directional view and conducts to the internal electrode. Between the pad, the columnar electrode terminal arranged in the terminal through hole and joined to the electrode pad, and the surface of the electrode terminal and the terminal through hole arranged in the terminal through hole. An insulating member that continuously surrounds the electrode terminal so as to intervene in the electrode terminal and a second adhesive material that is arranged around the insulating member are provided, and an object is placed on the first surface of the ceramic plate. In the electrostatic chuck to be held, the first region on the second surface of the ceramic plate includes a recess recessed toward the internal electrode side from the position where the electrode pad is arranged in the first direction. At least one of the convex portion protruding from the position where the electrode pad is arranged in the first direction toward the side away from the internal electrode is continuous so as to surround the electrode pad in the first direction view. It is formed. According to the present electrostatic chuck, the first region (the region overlapping the through hole for the terminal in the first direction) on the second surface (the surface facing the base member) of the ceramic plate is the first. At least one of a concave portion recessed toward the internal electrode side from the position where the electrode pad is arranged in the direction and a convex portion protruding toward the side away from the internal electrode from the position where the electrode pad is arranged in the first direction is the first. Since it is continuously formed so as to surround the electrode pad in the direction of 1, the creepage distance from the electrode pad to the base member can be lengthened along the second surface of the ceramic plate, and the electrode pad can be increased. It is possible to suppress the occurrence of a short circuit between the base member and the base member.

(2) In the electrostatic chuck, the insulating member is formed with at least one of an insulating member-side convex portion that fits into the concave portion and an insulating member-side concave portion that fits into the convex portion. May be. According to this electrostatic chuck, at least one of an insulating member side convex portion that fits into the concave portion of the ceramic plate and an insulating member side concave portion that fits into the convex portion of the ceramic plate is formed on the insulating member. Therefore, the occurrence of a short circuit between the electrode pad and the base member can be more effectively suppressed and the ceramic plate can be suppressed as compared with the configuration in which the inside of the concave portion of the ceramic plate and the circumference of the convex portion of the ceramic plate are spaces. By promoting the heat transfer from the ceramic plate to the base member around the concave and convex portions of the ceramic plate, it is possible to suppress a decrease in heat soaking property of the first surface due to the presence of the concave and convex portions of the ceramic plate. ..

(3) In the electrostatic chuck, at least one of the concave portion and the convex portion may be formed in the first region on the second surface of the ceramic plate. .. According to this electrostatic chuck, the creepage distance from the electrode pad to the base member can be significantly increased along the second surface of the ceramic plate, and a short circuit occurs between the electrode pad and the base member. Can be suppressed more effectively.

(4) In the electrostatic chuck, the thermal conductivity of the ceramic plate is equal to or higher than the thermal conductivity of the insulating member, and the recess is formed in the first region of the second surface of the ceramic plate. , The insulating member is formed at a position inside the virtual surface that divides the wall thickness into two equal parts, and the insulating member is formed with a convex portion on the insulating member side that fits into the concave portion. Good. According to this electrostatic chuck, it is possible to reduce the degree of volume reduction (degree of volume increase of the insulating member) of the ceramic plate due to the formation of concave portions in the ceramic plate and the formation of convex portions on the insulating member side in the insulating member. Therefore, it is possible to more effectively suppress the decrease in heat soaking property of the first surface.

(5) In the electrostatic chuck, the thermal conductivity of the ceramic plate is equal to or higher than the thermal conductivity of the insulating member, and the convex portion is formed in the first region on the second surface of the ceramic plate. However, the insulating member is formed at a position outside the virtual surface that divides the wall thickness of the insulating member into two equal parts, and the insulating member is formed with a concave portion on the insulating member side that fits into the convex portion. May be good. According to this electrostatic chuck, it is possible to increase the degree of volume increase (degree of volume decrease of the insulating member) of the ceramic plate by forming a convex portion on the ceramic plate and forming a concave portion on the insulating member side in the insulating member. Therefore, it is possible to more effectively suppress the decrease in heat soaking property of the first surface.

(6) In the electrostatic chuck, the thermal conductivity of the ceramic plate is lower than the thermal conductivity of the insulating member, and the recess is formed in the first region of the second surface of the ceramic plate. It may be formed at a position outside the virtual surface that divides the wall thickness of the insulating member into two equal parts, and the insulating member may be formed with a convex portion on the insulating member side that fits into the concave portion. .. According to this electrostatic chuck, it is possible to increase the degree of volume reduction (degree of volume increase of the insulating member) of the ceramic plate due to the formation of concave portions in the ceramic plate and the formation of convex portions on the insulating member side in the insulating member. Therefore, it is possible to more effectively suppress the decrease in heat soaking property of the first surface.

(7) In the electrostatic chuck, the thermal conductivity of the ceramic plate is lower than the thermal conductivity of the insulating member, and the convex portion is formed in the first region of the second surface of the ceramic plate. The insulating member is formed at a position inside the virtual surface that divides the wall thickness of the insulating member into two equal parts, and the insulating member is formed with a concave portion on the insulating member side that fits into the convex portion. Good. According to this electrostatic chuck, it is possible to reduce the degree of volume increase (degree of volume decrease of the insulating member) of the ceramic plate due to the formation of the convex portion on the ceramic plate and the concave portion on the insulating member side in the insulating member. Therefore, it is possible to more effectively suppress the decrease in heat soaking property of the first surface.

The technique disclosed in the present specification can be realized in various forms, for example, an electrostatic chuck and a method for manufacturing the same.

It is a perspective view which shows schematic appearance structure of the electrostatic chuck 10 in 1st Embodiment. It is explanatory drawing which shows typically the XZ cross-sectional structure of the electrostatic chuck 10 in 1st Embodiment. It is explanatory drawing which shows typically the XY cross-sectional structure (cross-sectional structure at the position of III-III of FIG. 2) of the electrostatic chuck 10 in 1st Embodiment. It is explanatory drawing which shows typically the XY cross-sectional structure (cross-sectional structure at the position of IV-IV of FIG. 2) of the electrostatic chuck 10 in 1st Embodiment. It is explanatory drawing which enlarges and shows the XZ cross-sectional structure of a part (X1 part of FIG. 2) of an electrostatic chuck 10. FIG. 5 is an enlarged explanatory view showing an enlarged XY cross-sectional configuration of a part of the electrostatic chuck 10 at the position of VI-VI in FIG. FIG. 5 is an enlarged explanatory view showing an enlarged XY cross-sectional configuration of a part of the electrostatic chuck 10 at the position of VII-VII in FIG. It is a flowchart which shows the manufacturing method of the electrostatic chuck 10 in 1st Embodiment. It is explanatory drawing which shows schematic structure of the electrostatic chuck 10X of a comparative example. It is explanatory drawing which shows schematic structure (XZ cross section structure) of the electrostatic chuck 10a of 2nd Embodiment. It is explanatory drawing which shows schematic structure (XY cross section structure) of the electrostatic chuck 10a of 2nd Embodiment. It is explanatory drawing which shows schematic structure (XZ cross section structure) of the electrostatic chuck 10b of 3rd Embodiment. It is explanatory drawing which shows schematic structure (XY cross section structure) of the electrostatic chuck 10b of 3rd Embodiment.

A. First Embodiment:
A-1. Configuration of electrostatic chuck 10:
FIG. 1 is a perspective view schematically showing an external configuration of the electrostatic chuck 10 according to the first embodiment, and FIG. 2 is an explanatory view schematically showing an XZ cross-sectional configuration of the electrostatic chuck 10 according to the first embodiment. 3 and 4 are explanatory views schematically showing the XY cross-sectional configuration of the electrostatic chuck 10 in the first embodiment. FIG. 2 shows the XZ cross-sectional configuration of the electrostatic chuck 10 at the positions II-II of FIGS. 3 and 4, and FIG. 3 shows the electrostatic chuck 10 at the position III-III of FIG. The XY cross-sectional configuration is shown, and FIG. 4 shows the XY cross-sectional configuration of the electrostatic chuck 10 at the position IV-IV of FIG. Each figure shows XYZ axes that are orthogonal to each other to identify the direction. In the present specification, for convenience, the Z-axis positive direction is referred to as an upward direction, and the Z-axis negative direction is referred to as a downward direction, but the electrostatic chuck 10 is actually installed in a direction different from such a direction. May be done.

The electrostatic chuck 10 is a device that attracts and holds an object (for example, a wafer W) by electrostatic attraction, and is used for fixing the wafer W in a vacuum chamber of a semiconductor manufacturing apparatus, for example. The electrostatic chuck 10 includes a ceramic plate 100 and a base member 200 arranged side by side in a predetermined arrangement direction (in the present embodiment, the vertical direction (Z-axis direction)). The ceramic plate 100 and the base member 200 are arranged so that the lower surface S2 (see FIG. 2) of the ceramic plate 100 and the upper surface S3 of the base member 200 face each other in the arrangement direction. The lower surface S2 of the ceramic plate 100 corresponds to the second surface in the claims, and the upper surface S3 of the base member 200 corresponds to the third surface in the claims.

The ceramic plate 100 is, for example, a circular flat plate-shaped member, and is made of ceramics (for example, alumina, aluminum nitride, etc.). The diameter of the ceramic plate 100 is, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the thickness of the ceramic plate 100 is, for example, about 1 mm to 10 mm.

As shown in FIGS. 2 and 4, a chuck electrode 400 formed of a conductive material (for example, tungsten, molybdenum, etc.) is provided inside the ceramic plate 100. The shape of the chuck electrode 400 in the Z-axis direction is, for example, substantially circular. When a voltage is applied to the chuck electrode 400 from a power source (not shown), an electrostatic attraction is generated, and the electrostatic attraction causes the wafer W to be on the surface of the ceramic plate 100 opposite to the lower surface S2 (hereinafter, “adsorption”). It is adsorbed and fixed to the surface S1). The suction surface S1 of the ceramic plate 100 is a planar surface substantially orthogonal to the above-mentioned arrangement direction (Z-axis direction). The suction surface S1 of the ceramic plate 100 corresponds to the first surface in the claims, the Z-axis direction corresponds to the first direction in the claims, and the chuck electrode 400 corresponds to the claims. Corresponds to the internal electrode. Further, in the present specification, the direction orthogonal to the Z axis (that is, the direction parallel to the suction surface S1) is referred to as "plane direction".

As shown in FIGS. 2 and 3, a heater electrode 500 made of a resistance heating element made of a conductive material (for example, tungsten, molybdenum, etc.) is provided inside the ceramic plate 100. The shape of the heater electrode 500 in the Z-axis direction is, for example, substantially spiral. When a voltage is applied to the heater electrode 500 from a power source (not shown), the heater electrode 500 generates heat to heat the ceramic plate 100, and the wafer W held on the suction surface S1 of the ceramic plate 100 is heated. As a result, temperature control of the wafer W is realized.

The base member 200 is, for example, a plate-shaped member having the same diameter as the ceramic plate 100 or a larger diameter than the ceramic plate 100, and is made of metal (aluminum, aluminum alloy, etc.). The diameter of the base member 200 is, for example, about 220 mm to 550 mm (usually 220 mm to 350 mm), and the thickness of the base member 200 is, for example, about 20 mm to 40 mm.

A refrigerant flow path 210 is formed inside the base member 200. When a refrigerant (for example, a fluorine-based inert liquid, water, etc.) is flowed through the refrigerant flow path 210, the base member 200 is cooled and transmitted between the base member 200 and the ceramic plate 100 via the adhesive layer 300 described later. The ceramic plate 100 is cooled by the heat, and the wafer W held on the suction surface S1 of the ceramic plate 100 is cooled. As a result, temperature control of the wafer W is realized.

The ceramic plate 100 and the base member 200 are joined to each other by an adhesive layer 300 arranged between the lower surface S2 of the ceramic plate 100 and the upper surface S3 of the base member 200. The adhesive layer 300 is made of an adhesive material such as a silicone resin, an acrylic resin, or an epoxy resin. The thickness of the adhesive layer 300 is, for example, about 0.1 mm to 1 mm. The adhesive layer 300 corresponds to the first adhesive in the claims.

Next, a configuration for supplying power to the chuck electrode 400 will be described. FIG. 5 is an enlarged explanatory view showing an XZ cross-sectional configuration of a part of the electrostatic chuck 10 (X1 part in FIG. 2), and FIG. 6 is a part of the electrostatic chuck 10 at the position of VI-VI in FIG. FIG. 7 is an enlarged explanatory view showing an enlarged XY cross-sectional structure of FIG. 7, and FIG. 7 is an enlarged explanatory view showing an enlarged XY cross-sectional structure of a part of the electrostatic chuck 10 at the position of VII-VII of FIG.

As shown in FIGS. 2, 5 and 6, a terminal through hole 22 is formed inside the base member 200 to open in the upper surface S3 of the base member 200. In the present embodiment, the terminal through hole 22 has a circular cross section (cross section parallel to the plane direction) and is a hole that penetrates the base member 200 in the Z-axis direction.

Further, as shown in FIG. 5, a circular recess 12 is formed on the lower surface S2 of the ceramic plate 100. In the circular recess 12, the region of the lower surface S2 of the electrostatic chuck 10 that overlaps the terminal through hole 22 in the Z-axis direction (hereinafter, referred to as “first region R1”) is located on the chuck electrode 400 side as a whole. It is a dent. As described above, in the present embodiment, since the cross section of the terminal through hole 22 is circular, the first region R1 is also circular. Therefore, the cross section (cross section parallel to the plane direction) of the circular recess 12 is also circular.

Further, at a position between the terminal through hole 22 formed in the base member 200 and the circular recess 12 formed in the ceramic plate 100, the adhesive layer 300 has a through hole that penetrates the adhesive layer 300 in the Z-axis direction. 32 is formed. Therefore, the terminal through hole 22 formed in the base member 200 and the circular recess 12 formed in the ceramic plate 100 form an integral hole that communicates with each other through the through hole 32 formed in the adhesive layer 300. ing.

As shown in FIGS. 2 and 5, an electrode pad 42 conducting to the chuck electrode 400 via the via 41 is arranged in the first region R1 on the lower surface S2 of the ceramic plate 100. In the present embodiment, the shape of the electrode pad 42 in the Z-axis direction is substantially circular. The electrode pad 42 and the via 41 are made of a conductive material (for example, tungsten, molybdenum, etc.). As shown in FIG. 5, the entire electrode pad 42 in the thickness direction (Z-axis direction) is exposed from the ceramic plate 100. However, as long as the lower surface of the electrode pad 42 is exposed from the ceramic plate 100, a part or the whole of the electrode pad 42 in the thickness direction may be embedded in the ceramic plate 100. Even with such a configuration, it can be said that the electrode pad 42 is arranged on the lower surface S2 of the ceramic plate 100.

A columnar electrode terminal 44 extending in the Z-axis direction is arranged in the terminal through hole 22 formed in the base member 200. In the present embodiment, the cross section of the electrode terminal 44 (cross section parallel to the plane direction) is circular. The upper end of the electrode terminal 44 reaches the electrode pad 42, and the electrode terminal 44 is joined to the electrode pad 42 by, for example, a joint portion 43 made of a metal brazing material.

An insulating member 60 is arranged in the terminal through hole 22 of the base member 200 in order to insulate between the base member 200 and the electrode terminal 44 arranged in the terminal through hole 22 of the base member 200. The insulating member 60 continuously surrounds the electrode terminal 44 so as to be interposed between the electrode terminal 44 and the surface of the terminal through hole 22. The insulating member 60 is made of, for example, an insulating material such as resin or ceramics. In the present embodiment, the thermal conductivity of the insulating member 60 is lower than the thermal conductivity of the ceramic plate 100 (that is, the thermal conductivity of the ceramic plate 100 is higher than the thermal conductivity of the insulating member 60). Adhesion is performed around the insulating member 60, specifically, between the insulating member 60 and the electrode terminal 44, between the insulating member 60 and the ceramic plate 100, and between the insulating member 60 and the base member 200. The material 70 is arranged. The adhesive 70 is made of an adhesive such as a silicone resin, an acrylic resin, or an epoxy resin, and the insulating member 60 is joined to the electrode terminal 44, the ceramic plate 100, and the base member 200.

The configuration for supplying power to the chuck electrode 400 is as described above. When the electrostatic chuck 10 is used, a voltage is applied to the chuck electrode 400 from a power source (not shown) via a conduction path from a power source (not shown) to the chuck electrode 400 via an electrode terminal 44, an electrode pad 42 and a via 41. .. As a result, an electrostatic attractive force for sucking and fixing the wafer W to the suction surface S1 is generated.

The configuration for supplying power to the heater electrode 500 is also the same as the configuration for supplying power to the chuck electrode 400. That is, as shown in FIG. 2, a terminal through hole 24 is formed inside the base member 200 to open in the upper surface S3 of the base member 200, and a circular recess 16 is formed in the lower surface S2 of the ceramic plate 100. The terminal through hole 24 formed in the base member 200 and the circular recess 16 formed in the ceramic plate 100 are integrated holes that communicate with each other through the through hole 32 formed in the adhesive layer 300. Consists of. Further, on the lower surface S2 of the ceramic plate 100, an electrode pad 52 that conducts to the heater electrode 500 via the via 51 is arranged. A columnar electrode terminal 54 is arranged in the terminal through hole 24 formed in the base member 200, and the electrode terminal 54 is joined to the electrode pad 52. Further, in the terminal through hole 24 of the base member 200, an insulating member 80 that continuously surrounds the electrode terminal 54 is arranged so as to be interposed between the electrode terminal 54 and the surface of the terminal through hole 24. .. When the electrostatic chuck 10 is used, a voltage is applied to the heater electrode 500 from a power source (not shown) via a conduction path from a power source (not shown) to the heater electrode 500 via an electrode terminal 54, an electrode pad 52, and a via 51. .. As a result, the heater electrode 500 generates heat.

Here, as shown in FIG. 5, in the electrostatic chuck 10 of the present embodiment, the chuck electrode 400 is located in the first region R1 on the lower surface S2 of the ceramic plate 100 from the position where the electrode pad 42 is arranged in the Z-axis direction. An annular recess 14 recessed on the side is formed. The annular recess 14 is different from the above-mentioned circular recess 12 in which the first region R1 on the lower surface S2 of the ceramic plate 100 is recessed toward the chuck electrode 400 as a whole, and a part of the first region R1 is the chuck electrode. It is dented on the 400 side. As shown in FIG. 7, the annular recess 14 is continuously formed so as to surround the electrode pad 42 in the Z-axis direction. In the present embodiment, the annular recess 14 is formed at a position inside the virtual surface VS that divides the wall thickness T1 of the insulating member 60 into two equal parts. The annular recess 14 corresponds to a recess within the scope of the claims.

Further, as shown in FIG. 5, in the electrostatic chuck 10 of the present embodiment, an insulating member side convex portion 62 that fits into the annular concave portion 14 formed in the ceramic plate 100 is formed on the upper surface of the insulating member 60. Has been done. As shown in FIG. 7, the insulating member side convex portion 62 is continuously formed so as to surround the electrode pad 42 in the Z-axis direction. The above-mentioned adhesive 70 is also arranged between the annular recess 14 formed in the ceramic plate 100 and the insulating member side convex portion 62 formed in the insulating member 60. Further, the wall thickness T1 of the insulating member 60 described above is not the wall thickness of the portion where the insulating member side convex portion 62 is formed, but the wall thickness of the portion of the upper end portion of the insulating member 60 excluding the insulating member side convex portion 62. Means.

A-2. Manufacturing method of electrostatic chuck 10:
FIG. 8 is a flowchart showing a method of manufacturing the electrostatic chuck 10 according to the first embodiment. First, the ceramic plate 100 and the base member 200 are prepared (S110). The ceramic plate 100 and the base member 200 can be manufactured by a known manufacturing method. For example, the ceramic plate 100 is manufactured by the following method. That is, a plurality of ceramic green sheets (for example, alumina green sheets) are prepared, and metallized ink for forming a chuck electrode 400, a heater electrode 500, a via 41, an electrode pad 42, etc. is printed or perforated on each ceramic green sheet. The ceramic plate 100 is manufactured by performing processing and the like, then laminating a plurality of ceramic green sheets, heat-bonding them, cutting them into a predetermined disk shape, firing them, and finally performing polishing processing and the like. .. The circular recess 12 and the annular recess 14 on the lower surface S2 of the ceramic plate 100 may be formed by drilling a hole in the ceramic green sheet before firing, or may be formed by polishing after firing.

Next, the electrode terminal 44 is joined to the electrode pad 42 (S120). Specifically, a jig (not shown) having a substantially cylindrical shape similar to that of the insulating member 60 described above is installed on the lower surface S2 side of the ceramic plate 100, and the electrode terminal 44 is inserted into the hollow hole of the jig. By doing so, the electrode terminal 44 is joined to the electrode pad 42 by, for example, brazing, in a state where the electrode terminal 44 is positioned. A convex portion is formed at the upper end of the jig used at this time, and when the jig is installed, the convex portion is fitted into the annular concave portion 14 of the ceramic plate 100 to position the jig. Do. After the bonding between the electrode terminal 44 and the electrode pad 42 is completed, the jig is removed.

Next, the insulating member 60 is installed around the electrode terminal 44 (S130). Specifically, the insulating member 60 is positioned by fitting the insulating member-side convex portion 62 of the insulating member 60 into the annular recess 14 of the ceramic plate 100, and the insulating member 60 and the electrode terminal 44 are connected by the adhesive 70. The space or between the insulating member 60 and the ceramic plate 100 is joined. In this way, the positioning of the jig used when joining the electrode terminal 44 to the electrode pad 42 and the positioning of the insulating member 60 when installing the insulating member 60 are both performed by forming the annular recess 14 of the ceramic plate 100. By performing this as a reference, the accuracy of the relative position between the electrode terminal 44 and the insulating member 60 can be improved.

Next, the ceramic plate 100 and the base member 200 are joined (S140). Specifically, with the electrode terminal 44 and the insulating member 60 inserted through the terminal through hole 22 of the base member 200, the lower surface S2 of the ceramic plate 100 and the upper surface S3 of the base member 200 are opposed to each other, and the ceramic plate 100 And the base member 200 are joined by an adhesive layer 300. Further, the adhesive member 70 joins the insulating member 60 and the base member 200. Through the above steps, the production of the electrostatic chuck 10 having the above-described configuration is completed.

A-3. Effect of the first embodiment:
As described above, the electrostatic chuck 10 of the first embodiment is a plate-shaped ceramic having a planar suction surface S1 substantially orthogonal to the Z-axis direction and a lower surface S2 opposite to the suction surface S1. A metal having a plate 100 and an upper surface S3, the upper surface S3 is arranged so as to face the lower surface S2 of the ceramic plate 100, and the refrigerant flow path 210 and the terminal through hole 22 opening in the upper surface S3 are formed inside. A first base member 200 made of metal, an adhesive layer 300 arranged between the ceramic plate 100 and the base member 200, a chuck electrode 400 arranged inside the ceramic plate 100, and a first surface S2 of the lower surface S2 of the ceramic plate 100. An electrode pad 42 that is a region R1 and is arranged in a first region R1 that overlaps the terminal through hole 22 in the Z-axis direction and conducts to the chuck electrode 400, and an electrode pad that is arranged in the terminal through hole 22. Insulation that is arranged in the terminal through hole 22 and the columnar electrode terminal 44 joined to the 42, and continuously surrounds the electrode terminal 44 so as to be interposed between the electrode terminal 44 and the surface of the terminal through hole 22. A member 60 and an adhesive 70 arranged around the insulating member 60 are provided. Further, in the electrostatic chuck 10 of the present embodiment, an annular recess 14 recessed toward the chuck electrode 400 from the position where the electrode pad 42 is arranged in the Z-axis direction is provided in the first region R1 on the lower surface S2 of the ceramic plate 100. , Is continuously formed so as to surround the electrode pad 42 in the Z-axis direction.

Since the electrostatic chuck 10 of the first embodiment has the above configuration, it is possible to suppress the occurrence of a short circuit between the electrode pad 42 and the base member 200, as described below.

FIG. 9 is an explanatory diagram schematically showing the configuration of the electrostatic chuck 10X of the comparative example. FIG. 9 shows an enlarged configuration of a portion equivalent to the portion (X1 portion) shown in FIG. 5 among the configurations of the electrostatic chuck 10X of the comparative example. The electrostatic chuck 10X of the comparative example shown in FIG. 9 is different from the electrostatic chuck 10 of the first embodiment shown in FIG. 5 in the shape of the lower surface S2 of the ceramic plate 100 and the shape of the insulating member 60. Specifically, in the electrostatic chuck 10X of the comparative example, the recess is not formed in the first region R1 on the lower surface S2 of the ceramic plate 100. Further, in the electrostatic chuck 10X of the comparative example, the convex portion is not formed on the upper surface of the insulating member 60. Since the electrostatic chuck 10X of the comparative example has such a configuration, the creepage distance CD from the position where the electrode pad 42 is arranged along the lower surface S2 of the ceramic plate 100 to the base member 200 is short, and the electrode pad A short circuit may occur between the 42 and the base member 200.

On the other hand, as shown in FIG. 5, in the electrostatic chuck 10 of the present embodiment, since the annular recess 14 is formed in the first region R1 on the lower surface S2 of the ceramic plate 100, a comparative example shown in FIG. Compared with the electrostatic chuck 10X of the above, the creepage distance CD from the position where the electrode pad 42 is arranged along the lower surface S2 of the ceramic plate 100 to the base member 200 can be lengthened. Therefore, according to the electrostatic chuck 10 of the present embodiment, it is possible to suppress the occurrence of a short circuit between the electrode pad 42 and the base member 200, and it is possible to suppress the occurrence of dielectric breakdown of the electrostatic chuck 10. .. Further, since a specified voltage is applied to the chuck electrode 400 inside the electrostatic chuck 10 (without leakage), a stable electrostatic attraction can be generated, and the wafer W can be stably attracted and fixed. In the configuration in which the annular recess 14 is not continuously formed in the first region R1 on the lower surface S2 of the ceramic plate 100 and the recess is partially formed in the first region R1, the leakage current has a recess. It passes through a place that is not formed, that is, a place where the creepage distance is short. Therefore, it is not possible to suppress the occurrence of a short circuit between the electrode pad 42 and the base member 200. In the electrostatic chuck 10 of the present embodiment, since the annular recess 14 is continuously formed in the first region R1 on the lower surface S2 of the ceramic plate 100 so as to surround the electrode pad 42, the electrode pad 42 and the base member The occurrence of a short circuit with 200 can be effectively suppressed.

Further, in the electrostatic chuck 10 of the present embodiment, as described above, the positioning of the jig used when the annular recess 14 of the ceramic plate 100 is joined to the electrode pad 42 and the insulating member 60. Can be used as a reference for both positioning of the insulating member 60 when installing the ceramic member 60, and as a result, the accuracy of the relative position between the electrode terminal 44 and the insulating member 60 can be improved.

Further, in the electrostatic chuck 10 of the present embodiment, the insulating member 60 is formed with an insulating member-side convex portion 62 that fits into the annular recess 14 formed in the ceramic plate 100. Therefore, according to the electrostatic chuck 10 of the present embodiment, the insulating property between the electrode pad 42 and the base member 200 can be improved as compared with the configuration in which the inside of the annular recess 14 of the ceramic plate 100 is a space. This makes it possible to more effectively suppress the occurrence of a short circuit between the electrode pad 42 and the base member 200. Further, according to the electrostatic chuck 10 of the present embodiment, the ceramic plate 100 to the base member 200 around the annular recess 14 of the ceramic plate 100 is compared with the configuration in which the inside of the annular recess 14 of the ceramic plate 100 is a space. Since the heat transfer is promoted, it is possible to suppress a decrease in the soaking property of the suction surface S1 due to the presence of the annular recess 14 of the ceramic plate 100.

The higher the height of the annular recess 14 in the Z-axis direction, the longer the creepage distance CD from the position where the electrode pad 42 is arranged along the lower surface S2 of the ceramic plate 100 to the base member 200. be able to. However, in the electrostatic chuck 10 of the present embodiment, since the thermal conductivity of the ceramic plate 100 is higher than the thermal conductivity of the insulating member 60, an annular recess 14 is formed in the ceramic plate 100, and the insulating member 60 is convex on the insulating member side. When the portion 62 is formed, the volume of the ceramic plate 100 having high thermal conductivity is reduced as compared with the configuration in which the annular concave portion 14 and the insulating member side convex portion 62 are not formed, and the volume of the ceramic plate 100 is reduced by that amount. The volume of the insulating member 60 having low thermal conductivity increases, and as a result, the amount of heat transfer from the ceramic plate 100 to the base member 200 decreases. In the electrostatic chuck 10 of the present embodiment, the position of the annular recess 14 (and the insulating member side convex portion 62 fitted therein) is located inside the virtual surface VS that divides the wall thickness T1 of the insulating member 60 into two equal parts. Therefore, the volume of the ceramic plate 100 is reduced due to the formation of the annular recess 14 as compared with the configuration in which the annular recess 14 (and the insulating member side convex portion 62 fitted therein) is located outside the virtual surface VS. The degree (the degree of volume increase of the insulating member 60 due to the formation of the convex portion 62 on the insulating member side) can be reduced, and the decrease in the amount of heat transfer from the ceramic plate 100 to the base member 200 can be suppressed to suppress the suction surface. The decrease in heat soaking property of S1 can be suppressed more effectively.

B. Second embodiment:
10 and 11 are explanatory views schematically showing the configuration of the electrostatic chuck 10a of the second embodiment. FIG. 10 shows an enlarged configuration of a portion equivalent to the portion (X1 portion) shown in FIG. 5 among the configurations of the electrostatic chuck 10a of the second embodiment. Further, FIG. 11 shows an enlarged XY cross-sectional configuration of a part of the electrostatic chuck 10a at the position of XI-XI in FIG. In the following, among the configurations of the electrostatic chuck 10a of the second embodiment, the same reference numerals are given to the same configurations as the configurations of the electrostatic chuck 10 of the first embodiment described above (see FIGS. 5 and 7 and the like). The description will be omitted as appropriate by adding.

As shown in FIGS. 10 and 11, in the electrostatic chuck 10a of the second embodiment, the shape of the lower surface S2 of the ceramic plate 100 and the shape of the insulating member 60 are the same as those of the electrostatic chuck 10 of the first embodiment described above. It is different from the configuration of. Specifically, in the electrostatic chuck 10a of the second embodiment, two annular recesses 14 are formed in the first region R1 on the lower surface S2 of the ceramic plate 100. Both of the two annular recesses 14 are recesses recessed toward the chuck electrode 400 from the position where the electrode pad 42 is arranged in the Z-axis direction, and are continuously formed so as to surround the electrode pad 42 in the Z-axis direction. ing. In the present embodiment, one of the two annular recesses 14 is formed at a position inside the virtual surface VS that divides the wall thickness T1 of the insulating member 60 into two equal parts, and the two annular recesses 14 are formed. The other of the above is formed at a position outside the virtual surface VS.

Further, in the electrostatic chuck 10a of the second embodiment, two insulating member side convex portions 62 that fit into the two annular concave portions 14 formed in the ceramic plate 100 are formed on the upper surface of the insulating member 60. There is. Both of the two insulating member-side convex portions 62 are continuously formed so as to surround the electrode pad 42 in the Z-axis direction.

As described above, in the electrostatic chuck 10a of the second embodiment, since the two annular recesses 14 are formed in the first region R1 on the lower surface S2 of the ceramic plate 100, the electrostatic chuck of the first embodiment described above is described. Compared with 10, the creepage distance CD from the position where the electrode pad 42 is arranged along the lower surface S2 of the ceramic plate 100 to the base member 200 can be significantly lengthened. Therefore, according to the electrostatic chuck 10a of the second embodiment, the occurrence of a short circuit between the electrode pad 42 and the base member 200 can be suppressed extremely effectively.

In the electrostatic chuck 10a of the second embodiment, as in the first embodiment described above, the jig used when the two annular recesses 14 of the ceramic plate 100 are joined to the electrode pad 42 with the electrode terminals 44. It can be used as a reference for both the positioning of the jig and the positioning of the insulating member 60 when installing the insulating member 60, and as a result, the accuracy of the relative position between the electrode terminal 44 and the insulating member 60 can be improved. it can.

Further, in the electrostatic chuck 10a of the second embodiment, the insulating member 60 is formed with two insulating member-side convex portions 62 that fit into the two annular recesses 14 formed in the ceramic plate 100. Therefore, according to the electrostatic chuck 10a of the second embodiment, the insulating property between the electrode pad 42 and the base member 200 is improved as compared with the configuration in which the inside of the two annular recesses 14 of the ceramic plate 100 is a space. It is possible to more effectively suppress the occurrence of a short circuit between the electrode pad 42 and the base member 200. Further, according to the electrostatic chuck 10a of the second embodiment, the base member is formed from the ceramic plate 100 around the annular recess 14 of the ceramic plate 100 as compared with the configuration in which the inside of the two annular recesses 14 of the ceramic plate 100 is a space. Since the heat transfer to the 200 is promoted, it is possible to suppress a decrease in the heat soaking property of the suction surface S1 due to the presence of the two annular recesses 14 of the ceramic plate 100.

C. Third Embodiment:
12 and 13 are explanatory views schematically showing the configuration of the electrostatic chuck 10b of the third embodiment. FIG. 12 shows an enlarged configuration of a portion equivalent to the portion (X1 portion) shown in FIG. 5 among the configurations of the electrostatic chuck 10b of the third embodiment. Further, FIG. 13 shows an enlarged XY cross-sectional configuration of a part of the electrostatic chuck 10b at the position of XIII-XIII in FIG. In the following, among the configurations of the electrostatic chuck 10b of the third embodiment, the same reference numerals are given to the same configurations as the configurations of the electrostatic chuck 10 of the first embodiment described above (see FIGS. 5 and 7 and the like). The description will be omitted as appropriate by adding.

As shown in FIGS. 12 and 13, in the electrostatic chuck 10b of the third embodiment, the shape of the lower surface S2 of the ceramic plate 100 and the shape of the insulating member 60 are the same as those of the electrostatic chuck 10 of the first embodiment described above. It is different from the configuration of. Specifically, in the electrostatic chuck 10b of the third embodiment, the annular convex portion 18 is formed instead of the annular concave portion 14 in the first region R1 on the lower surface S2 of the ceramic plate 100. The annular convex portion 18 is a convex portion that protrudes from the position where the electrode pad 42 is arranged in the Z-axis direction toward the side away from the chuck electrode 400. The annular convex portion 18 is continuously formed so as to surround the electrode pad 42 in the Z-axis direction. In the present embodiment, the annular convex portion 18 is formed at a position outside the virtual surface VS that divides the wall thickness T1 of the insulating member 60 into two equal parts.

Further, in the electrostatic chuck 10b of the third embodiment, an insulating member side recess 64 that fits into the annular convex portion 18 formed on the ceramic plate 100 is formed on the upper surface of the insulating member 60. The insulating member side recess 64 is continuously formed so as to surround the electrode pad 42 in the Z-axis direction.

As described above, in the electrostatic chuck 10b of the third embodiment, since the annular convex portion 18 is formed in the first region R1 on the lower surface S2 of the ceramic plate 100, the electrostatic chuck 10X of the comparative example shown in FIG. In comparison with the above, the creepage distance CD from the position where the electrode pad 42 is arranged along the lower surface S2 of the ceramic plate 100 to the base member 200 can be lengthened. Therefore, according to the electrostatic chuck 10b of the third embodiment, it is possible to suppress the occurrence of a short circuit between the electrode pad 42 and the base member 200.

In the electrostatic chuck 10b of the third embodiment, a jig used when the annular convex portion 18 of the ceramic plate 100 is joined to the electrode pad 42 by the annular convex portion 18 of the ceramic plate 100, as in the first embodiment described above. Can be used as a reference for both positioning of the insulating member 60 and positioning of the insulating member 60 when installing the insulating member 60, and as a result, the accuracy of the relative position between the electrode terminal 44 and the insulating member 60 can be improved. ..

Further, in the electrostatic chuck 10b of the third embodiment, the insulating member 60 is formed with an insulating member side recess 64 that fits into the annular convex portion 18 formed on the ceramic plate 100. Therefore, according to the electrostatic chuck 10b of the third embodiment, the insulating property between the electrode pad 42 and the base member 200 is improved as compared with the configuration in which a space exists around the annular convex portion 18 of the ceramic plate 100. It can be improved, and the occurrence of a short circuit between the electrode pad 42 and the base member 200 can be suppressed more effectively. Further, according to the electrostatic chuck 10b of the third embodiment, the ceramic plate 100 around the annular convex portion 18 of the ceramic plate 100 is compared with the configuration in which a space exists around the annular convex portion 18 of the ceramic plate 100. Since the heat transfer to the base member 200 is promoted, it is possible to suppress a decrease in the soaking property of the suction surface S1 due to the presence of the annular convex portion 18 of the ceramic plate 100.

Further, in the electrostatic chuck 10b of the third embodiment, since the thermal conductivity of the ceramic plate 100 is higher than the thermal conductivity of the insulating member 60, an annular convex portion 18 is formed on the ceramic plate 100 and the insulating member 60 is insulated. When the member-side recess 64 is formed, the volume of the ceramic plate 100 having high thermal conductivity increases as compared with the configuration in which the annular convex portion 18 and the insulating member-side recess 64 are not formed, and the ceramic plate is correspondingly increased. The volume of the insulating member 60 having a thermal conductivity lower than 100 decreases, and as a result, the amount of heat transfer from the ceramic plate 100 to the base member 200 increases. In the electrostatic chuck 10b of the third embodiment, the position of the annular convex portion 18 (and the insulating member side concave portion 64 fitted therein) is located outside the virtual surface VS that divides the wall thickness T1 of the insulating member 60 into two equal parts. Therefore, the volume of the ceramic plate 100 due to the formation of the annular convex portion 18 as compared with the configuration in which the annular convex portion 18 (and the insulating member side concave portion 64 fitted therein) is located inside the virtual surface VS. The degree of increase (the degree of volume reduction of the insulating member 60 due to the formation of the insulating member side recess 64) can be increased, and the amount of heat transfer from the ceramic plate 100 to the base member 200 is increased to attract the suction surface S1. It is possible to more effectively suppress the decrease in the soaking property of the ceramic.

D. Modification example:
The technique disclosed in the present specification is not limited to the above-described embodiment, and can be transformed into various forms without departing from the gist thereof. For example, the following modifications are also possible.

The configuration of the electrostatic chuck 10 in each of the above embodiments is merely an example, and can be variously deformed. For example, in the first and second embodiments, the insulating member 60 does not necessarily have the insulating member side convex portion 62 formed, and similarly, in the third embodiment, the insulating member 60 does not necessarily have the insulating member side concave portion. It is not necessary that 64 is formed.

Further, in the second embodiment, two annular recesses 14 are formed on the lower surface S2 of the ceramic plate 100, but three or more annular recesses 14 may be formed on the lower surface S2 of the ceramic plate 100. Further, in the third embodiment, one annular convex portion 18 is formed on the lower surface S2 of the ceramic plate 100, but even if two or more annular convex portions 18 are formed on the lower surface S2 of the ceramic plate 100. Good.

Further, in each of the above embodiments, the thermal conductivity of the ceramic plate 100 is higher than the thermal conductivity of the insulating member 60, but the thermal conductivity of the ceramic plate 100 may be equal to the thermal conductivity of the insulating member 60. Further, the thermal conductivity of the ceramic plate 100 may be lower than the thermal conductivity of the insulating member 60.

Further, in each of the above embodiments, the positions of the annular concave portion 14 and the annular convex portion 18 with respect to the virtual surface VS can be arbitrarily changed. When the thermal conductivity of the ceramic plate 100 is lower than the thermal conductivity of the insulating member 60, the annular recess 14 (and the insulating member side convex portion 62 fitted therein) is opposed to the first embodiment. It is preferable that the heat insulating member 60 is formed outside the virtual surface VS that divides the wall thickness T1 into two equal parts. When the annular recess 14 is formed in the ceramic plate 100 and the insulating member side convex portion 62 is formed in the insulating member 60, thermal conductivity is compared with a configuration in which the annular concave portion 14 and the insulating member side convex portion 62 are not formed. The volume of the ceramic plate 100 having a low rate decreases, and the volume of the insulating member 60 having a higher thermal conductivity than the ceramic plate 100 increases by that amount, and as a result, the amount of heat transfer from the ceramic plate 100 to the base member 200 increases. To do. By locating the annular recess 14 (and the insulating member side convex portion 62 that fits the annular recess 14) outside the virtual surface VS that divides the wall thickness T1 of the insulating member 60 into two equal parts, the annular recess 14 (and the insulating member side convex portion 62) is positioned. The degree of volume reduction of the ceramic plate 100 due to the formation of the annular concave portion 14 (the insulating member side convex portion 62) is compared with the configuration in which the insulating member side convex portion 62) to be fitted is located inside the virtual surface VS. The degree of volume increase of the insulating member 60 due to the formation) can be increased, and the amount of heat transfer from the ceramic plate 100 to the base member 200 can be increased to more effectively reduce the soaking property of the suction surface S1. It can be suppressed.

Further, when the thermal conductivity of the ceramic plate 100 is lower than the thermal conductivity of the insulating member 60, the annular convex portion 18 (and the insulating member side concave portion 64 fitted therein) is opposed to the third embodiment. It is preferable that the heat insulating member 60 is formed inside the virtual surface VS that divides the wall thickness T1 into two equal parts. When the annular convex portion 18 is formed on the ceramic plate 100 and the insulating member side concave portion 64 is formed on the insulating member 60, thermal conductivity is compared with a configuration in which the annular convex portion 18 and the insulating member side concave portion 64 are not formed. The volume of the ceramic plate 100 having a low ratio increases, and the volume of the insulating member 60 having a higher thermal conductivity than the ceramic plate 100 decreases by that amount, and as a result, the amount of heat transfer from the ceramic plate 100 to the base member 200 decreases. To do. By setting the position of the annular convex portion 18 (and the insulating member side concave portion 64 fitted therein) to the position inside the virtual surface VS that divides the wall thickness T1 of the insulating member 60 into two equal parts, the annular convex portion 18 (and the insulating member side concave portion 64) The degree of volume increase of the ceramic plate 100 due to the formation of the annular convex portion 18 (the insulating member side concave portion 64) is compared with the configuration in which the insulating member side concave portion 64) fitted therein is located outside the virtual surface VS. The degree of volume reduction of the insulating member 60 due to the formation) can be reduced, the decrease in the amount of heat transfer from the ceramic plate 100 to the base member 200 is suppressed, and the decrease in the soaking property of the suction surface S1 is more effective. Can be suppressed.

Further, in each of the above embodiments, one of the annular recess 14 and the annular convex portion 18 is formed on the lower surface S2 of the ceramic plate 100, but the annular recess 14 and the annular convex portion 18 are formed on the lower surface S2 of the ceramic plate 100. Both of and may be formed. Similarly, in each of the above embodiments, one of the insulating member side convex portion 62 and the insulating member side concave portion 64 is formed on the insulating member 60, but the insulating member 60 has the insulating member side convex portion 62 and the insulating member. Both with the side recess 64 may be formed.

Further, in each of the above embodiments, the circular recess 12 is formed on the lower surface S2 of the ceramic plate 100, but it is not always necessary that the circular recess 12 is formed on the lower surface S2 of the ceramic plate 100. When the circular recess 12 is formed on the lower surface S2 of the ceramic plate 100, the creepage distance CD from the position where the electrode pad 42 is arranged along the lower surface S2 of the ceramic plate 100 to the base member 200 is lengthened. It is preferable because it can be used.

Further, in each of the above embodiments, the electrostatic chuck 10 includes the heater electrode 500, but the electrostatic chuck 10 does not have to include the heater electrode 500. Further, in each of the above embodiments, the refrigerant flow path 210 is formed inside the base member 200, but the refrigerant flow path 210 is not inside the base member 200 but on the surface of the base member 200 (for example, the base member 200). It may be formed between the and the adhesive layer 300).

Further, in each of the above embodiments, a unipolar method in which one chuck electrode 400 is provided inside the ceramic plate 100 is adopted, but a bipolar method in which a pair of chuck electrodes 400 are provided inside the ceramic plate 100 is adopted. May be adopted. Further, the material forming each member in the electrostatic chuck 10 of each of the above embodiments is merely an example, and each member may be formed of another material.

Further, the method for manufacturing the electrostatic chuck 10 in each of the above embodiments is merely an example, and various modifications can be made.

Further, the present invention is not limited to the configuration for supplying power to the chuck electrode 400, and the same applies to the configuration for supplying power to other internal electrodes (for example, the heater electrode 500) arranged inside the ceramic plate 100. It is applicable to. For example, the electrode pad 52 conducting to the heater electrode 500 is arranged in the first region overlapping the terminal through hole 24 in the Z-axis direction on the lower surface S2 of the ceramic plate 100, and is a columnar electrode joined to the electrode pad 52. An insulating member 80 that continuously surrounds the terminal 54 and the electrode terminal 54 so as to be interposed between the electrode terminal 54 and the surface of the terminal through hole 24 is arranged in the terminal through hole 24, and the insulating member 80 is provided. In an electrostatic chuck having a structure in which an adhesive is arranged around the above, a recess recessed in the first region of the lower surface S2 of the ceramic plate 100 toward the heater electrode 500 from the position where the electrode pad 52 is arranged in the Z-axis direction. At least one of the convex portion protruding from the position where the electrode pad 52 is arranged in the Z-axis direction toward the side away from the heater electrode 500 is continuously formed so as to surround the electrode pad 52 in the Z-axis direction. It may be. By doing so, it is possible to suppress the occurrence of a short circuit between the electrode pad 52 and the base member 200.

10: Electrostatic chuck 12: Circular recess 14: Circular recess 16: Circular recess 18: Circular convex part 22: Through hole for terminal 24: Through hole for terminal 32: Through hole 41: Via 42: Electrode pad 43: Joint part 44 : Electrode terminal 51: Via 52: Electrode pad 54: Electrode terminal 60: Insulating member 62: Insulating member side convex part 64: Insulating member side concave part 70: Adhesive material 80: Insulating member 100: Ceramic plate 200: Base member 210: Refrigerator Flow path 300: Adhesive layer 400: Chuck electrode 500: Heater electrode

Claims (7)

A plate-shaped ceramic plate having a planar first surface substantially orthogonal to the first direction and a second surface opposite to the first surface.
It has a third surface, the third surface is arranged so as to face the second surface of the ceramic plate, and a refrigerant flow path and a through hole for a terminal opening to the third surface are inside. With the metal base member formed in
A first adhesive disposed between the ceramic plate and the base member,
With the internal electrodes arranged inside the ceramic plate,
An electrode pad that is a first region on the second surface of the ceramic plate, is arranged in the first region that overlaps the terminal through hole in the first directional view, and conducts to the internal electrode. ,
A columnar electrode terminal arranged in the terminal through hole and joined to the electrode pad,
An insulating member that is arranged in the through hole for the terminal and continuously surrounds the electrode terminal so as to be interposed between the electrode terminal and the surface of the through hole for the terminal.
With the second adhesive arranged around the insulating member,
In an electrostatic chuck comprising, and holding an object on the first surface of the ceramic plate.
In the first region on the second surface of the ceramic plate, a recess recessed from the position where the electrode pad is arranged in the first direction toward the internal electrode side, and the recess in the first direction. At least one of the convex portion protruding from the position where the electrode pad is arranged toward the side away from the internal electrode is continuously formed so as to surround the electrode pad in the first directional view. The electrostatic chuck. The electrostatic chuck according to claim 1.
The electrostatic chuck is characterized in that at least one of an insulating member-side convex portion that fits into the concave portion and an insulating member-side concave portion that fits into the convex portion is formed on the insulating member. The electrostatic chuck according to claim 1 or 2.
An electrostatic chuck characterized in that at least one of the concave portion and the convex portion is formed in the first region on the second surface of the ceramic plate. The electrostatic chuck according to claim 2.
The thermal conductivity of the ceramic plate is equal to or higher than the thermal conductivity of the insulating member.
In the first region on the second surface of the ceramic plate, the recess is formed at a position inside the virtual surface that divides the wall thickness of the insulating member into two equal parts.
An electrostatic chuck characterized in that the insulating member is formed with a convex portion on the insulating member side that fits into the concave portion. The electrostatic chuck according to claim 2.
The thermal conductivity of the ceramic plate is equal to or higher than the thermal conductivity of the insulating member.
In the first region on the second surface of the ceramic plate, the convex portion is formed at a position outside the virtual surface that divides the wall thickness of the insulating member into two equal parts.
An electrostatic chuck characterized in that the insulating member is formed with a concave portion on the insulating member side that fits into the convex portion. The electrostatic chuck according to claim 2.
The thermal conductivity of the ceramic plate is lower than the thermal conductivity of the insulating member.
In the first region on the second surface of the ceramic plate, the recess is formed at a position outside the virtual surface that divides the wall thickness of the insulating member into two equal parts.
An electrostatic chuck characterized in that the insulating member is formed with a convex portion on the insulating member side that fits into the concave portion. The electrostatic chuck according to claim 2.
The thermal conductivity of the ceramic plate is lower than the thermal conductivity of the insulating member.
In the first region on the second surface of the ceramic plate, the convex portion is formed at a position inside the virtual surface that divides the wall thickness of the insulating member into two equal parts.
An electrostatic chuck characterized in that the insulating member is formed with a concave portion on the insulating member side that fits into the convex portion.

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