JP7139165B2 - holding device - Google Patents

Description

The technology disclosed in this specification relates to a holding device that holds an object.

For example, an electrostatic chuck is used as a holding device for holding a wafer when manufacturing semiconductors. The electrostatic chuck comprises a ceramic plate-like member having a surface (hereinafter referred to as an "attraction surface") substantially orthogonal to a predetermined direction (hereinafter referred to as a "first direction"), a base member, and a plate-like member. and a chuck electrode provided inside the plate-like member. A wafer is held by suction on the suction surface of the member.

If the temperature of the wafer held on the attraction surface of the electrostatic chuck does not reach the desired temperature, the precision of each process (film formation, etching, etc.) on the wafer may decrease. The ability to control the distribution is required. Therefore, for example, the temperature distribution of the adsorption surface of the plate-like member is controlled by heating with a heater electrode arranged on the plate-like member or cooling by supplying a coolant to a coolant channel formed in the base member. .

The electrostatic chuck is provided with a configuration for power supply to the heater electrode (see, for example, Japanese Unexamined Patent Application Publication No. 2002-100003). Specifically, a through hole forming a terminal hole is formed in the base member and the bonding portion, and the bottom surface of the terminal hole on the surface of the plate-like member opposite to the attracting surface (hereinafter referred to as the "lower surface") is A power supply electrode (power supply pad) is provided in the region to be configured. The power supply electrodes are electrically connected to the heater electrodes through vias or the like. Further, the electrostatic chuck is provided with a power supply terminal having a convex connection portion, a connection member having a concave connection portion, and a cable. The convex connection portion of the power supply terminal is a metal part provided on the power supply electrode and formed to extend in the first direction. Further, the concave connecting portion of the connecting member is a metal portion that fits into the convex connecting portion of the power supply terminal and is electrically connected to the convex connecting portion. The cable is electrically connected with the recessed connection portion of the connection member. In such a configuration, power is supplied from the power supply to the heater electrode via the cable, the concave connection portion of the connection member, the convex connection portion of the power supply terminal, the power supply electrode, vias, and the like.

JP 2016-76646 A

As described above, the terminal holes are configured by through holes formed in the base member and the bonding portion. Therefore, when the base member is cooled by the coolant supplied to the coolant channel, the air in the terminal hole may be cooled and condensation may occur. When such dew condensation occurs, if the convex connection portion of the power supply terminal and the concave connection portion of the connection member are made of different metals, i. There is a possibility that the metal may enter between the connecting portion and the concave connecting portion and corrode and deteriorate, and the convex connecting portion of the power supply terminal may break and disconnection may occur.

Such problems are not limited to the electrostatic chuck that holds the wafer using electrostatic attraction, but include the plate-like member, the base member, the adhesive part, the heater electrode arranged on the plate-like member, This is a problem common to all holding devices that hold an object on the surface of a plate-like member and that have a configuration (power supply electrode, power supply terminal, connection member, etc.) for power supply to the heater electrode.

This specification discloses a technology capable of solving the above-described problems.

The technology disclosed in this specification can be implemented, for example, in the following forms.

(1) The holding device disclosed herein has a substantially planar first surface substantially perpendicular to a first direction and a second surface opposite the first surface. A plate-like member, a plurality of heater electrodes arranged on the plate-like member, a third surface, and a fourth surface opposite to the third surface, the third surface is disposed so as to face the second surface of the plate-like member, and a first through hole penetrating from the third surface to the fourth surface and a coolant channel are formed in the base. and a member disposed between the second surface of the plate-like member and the third surface of the base member to bond the plate-like member and the base member together, and the third surface of the base member. 1 through-holes and a second through-hole forming a terminal hole together with the first through-hole; a power supply terminal having a plurality of power supply electrodes electrically connected to the heater electrode and a convex connection portion, wherein the convex connection portion is for the terminal; A power supply terminal provided on each of the power supply electrodes in the hole and extending in the first direction is fitted into each of the convex connection parts and electrically connected to the convex connection part. and a cable electrically connected to each of the concave connection portions of the connection member, holding an object on the first surface of the plate member. In the holding device, the convex connection portion of each power supply terminal is made of a first metal material, and each concave connection portion of the connection member is made of a second metal different from the first metal material. Insulating resin is filled in a space from at least the bottom surface to an end of the connection member on the bottom surface side in the first direction in the space in the terminal hole. . Thus, in the present holding device, the insulating resin is filled in the space in the terminal hole from at least the bottom surface of the terminal hole to the end portion of the connection member on the bottom surface side in the first direction. filled. Therefore, according to this holding device, even if dew condensation occurs in the terminal hole, it is possible to suppress the entry of condensed water between the convex connection portion of the power supply terminal and the concave connection portion of the connection member. As a result, it is possible to suppress the occurrence of disconnection due to bending of the convex connection portion.

(2) In the above-described holding device, in the space within the terminal hole, the space from at least the bottom surface to the end portion of the connection member opposite to the bottom surface side in the first direction includes the A configuration characterized by being filled with an insulating resin may be employed. In this holding device, the insulating resin is filled in the space in the terminal hole, in the first direction, from at least the bottom surface of the terminal hole to the end portion of the connecting member on the side opposite to the bottom surface side. filled. Therefore, according to the present holding device, even if dew condensation occurs in the terminal hole, it is possible to effectively suppress the entry of condensed water between the convex connection portion of the power supply terminal and the concave connection portion of the connection member. As a result, it is possible to effectively suppress the occurrence of disconnection due to bending of the convex connection portion.

It should be noted that the technology disclosed in this specification can be implemented in various forms, for example, in the form of a holding device, an electrostatic chuck, a vacuum chuck, manufacturing methods thereof, and the like. be.

1 is a perspective view schematically showing an appearance configuration of an electrostatic chuck 100 according to a first embodiment; FIG. It is an explanatory view showing roughly the XZ section composition of electrostatic zipper 100 in a 1st embodiment. FIG. 2 is an explanatory diagram schematically showing the XY plane (upper surface) configuration of the electrostatic chuck 100 in the first embodiment; 4 is an explanatory diagram schematically showing a heater electrode layer 50 and a configuration for power supply to the heater electrode layer 50. FIG. It is explanatory drawing which expands and shows the YZ cross-sectional structure of the peripheral part (X1 part in FIG. 4) of the hole Ht for terminals. FIG. 4 is an explanatory diagram schematically showing an XY cross-sectional configuration of one heater electrode 500 arranged in one segment SE; FIG. 11 is an explanatory diagram showing an enlarged YZ cross-sectional configuration of the peripheral portion of the terminal hole Ht in the electrostatic chuck 100 of the second embodiment;

A. First embodiment:
A-1. Configuration of electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing the external configuration of an electrostatic chuck 100 according to the first embodiment, and FIG. 2 is an explanatory view schematically showing the XZ cross-sectional configuration of the electrostatic chuck 100 according to the first embodiment. , and FIG. 3 is an explanatory view schematically showing the configuration of the XY plane (upper surface) of the electrostatic chuck 100 according to the first embodiment. Each figure shows mutually orthogonal XYZ axes for specifying directions. In this specification, for the sake of convenience, the positive direction of the Z-axis is referred to as the upward direction, and the negative direction of the Z-axis is referred to as the downward direction. may be

The electrostatic chuck 100 is a device that attracts and holds an object (for example, a wafer W) by electrostatic attraction, and is used, for example, to fix the wafer W within a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 100 includes a plate-like member 10 and a base member 20 arranged side by side in a predetermined arrangement direction (vertical direction (Z-axis direction) in this embodiment). The plate member 10 and the base member 20 are arranged such that the lower surface S2 (see FIG. 2) of the plate member 10 and the upper surface S3 of the base member 20 face each other in the arrangement direction.

The plate-shaped member 10 is a member having a substantially circular planar upper surface (hereinafter referred to as “adsorption surface”) S1 substantially orthogonal to the arrangement direction (Z-axis direction) described above. etc.). The plate member 10 has a diameter of, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and a thickness of, for example, about 1 mm to 10 mm. The adsorption surface S1 of the plate member 10 corresponds to the first surface in the claims, the lower surface S2 of the plate member 10 corresponds to the second surface in the claims, and the Z-axis direction is It corresponds to the first direction in the claims. Further, in this specification, the direction perpendicular to the Z-axis direction is referred to as the "plane direction", and as shown in FIG. The direction perpendicular to the circumferential direction CD is called the "radial direction RD".

As shown in FIG. 2, a chuck electrode 40 made of a conductive material (eg, tungsten, molybdenum, platinum, etc.) is arranged inside the plate member 10 . The shape of the chuck electrode 40 as viewed in the Z-axis direction is, for example, a substantially circular shape. When a voltage is applied to the chuck electrode 40 from a power source (not shown), electrostatic attraction is generated, and the wafer W is attracted and fixed to the attraction surface S1 of the plate member 10 by this electrostatic attraction.

Inside the plate-shaped member 10, there are also provided a heater electrode layer 50, a driver 51 for supplying power to the heater electrode layer 50, and various heater electrode layers 50 each formed of a conductive material (e.g., tungsten, molybdenum, platinum, etc.). Vias 53 and 54 are arranged. In this embodiment, the heater electrode layer 50 is arranged below the chuck electrode 40 and the driver 51 is arranged below the heater electrode layer 50 . These configurations will be described in detail later. The plate-shaped member 10 having such a structure is produced by, for example, manufacturing a plurality of ceramic green sheets, and performing processes such as forming via holes in predetermined ceramic green sheets, filling metallizing paste, and printing. It can be produced by bonding green sheets by thermocompression, performing processing such as cutting, and then firing.

The base member 20 is, for example, a circular planar plate-like member having the same diameter as the plate-like member 10 or a larger diameter than the plate-like member 10, and is made of metal (aluminum, aluminum alloy, etc.), for example. The diameter of the base member 20 is, for example, approximately 220 mm to 550 mm (usually 220 mm to 350 mm), and the thickness of the base member 20 is, for example, approximately 20 mm to 40 mm. The upper surface S3 of the base member 20 corresponds to the third surface in the claims, and the lower surface S4 of the base member 20 corresponds to the fourth surface in the claims.

The base member 20 is joined to the plate-like member 10 by a bonding portion 30 arranged between the lower surface S2 of the plate-like member 10 and the upper surface S3 of the base member 20. As shown in FIG. The adhesive portion 30 is made of an adhesive such as silicone resin, acrylic resin, or epoxy resin. The thickness of the bonding portion 30 is, for example, about 0.1 mm to 1 mm.

A coolant channel 21 is formed inside the base member 20 . When a coolant (for example, a fluorine-based inert liquid, water, or the like) is caused to flow through the coolant channel 21 , the base member 20 is cooled, and heat is transferred between the base member 20 and the plate-like member 10 via the bonding portion 30 . The plate-like member 10 is cooled by (thermal drawing), and the wafer W held on the adsorption surface S1 of the plate-like member 10 is cooled. Thereby, control of the temperature distribution of the wafer W is realized.

A-2. Heater electrode layer 50 and configuration for power supply to heater electrode layer 50:
Next, the configuration of the heater electrode layer 50 and the configuration for power supply to the heater electrode layer 50 will be described in detail. As described above, the heater electrode layer 50 , the driver 51 for supplying power to the heater electrode layer 50 , and various vias 53 and 54 are arranged on the plate member 10 . Further, the electrostatic chuck 100 is provided with other components (such as a power supply terminal 72 accommodated in a terminal hole Ht, which will be described later) for supplying power to the heater electrode layer 50 . FIG. 4 is an explanatory view schematically showing the heater electrode layer 50 and the configuration for power supply to the heater electrode layer 50. As shown in FIG. The upper part of FIG. 4 schematically shows the YZ cross-sectional structure of a part of the heater electrode layer 50 arranged on the plate member 10, and the middle part of FIG. The XY plane configuration of part of the driver 51 is schematically shown, and the YZ cross-sectional configuration of another configuration for power supply to the heater electrode layer 50 is schematically shown in the lower part of FIG. . Also, FIG. 5 is an explanatory view showing an enlarged YZ cross-sectional configuration of a peripheral portion (X1 portion in FIG. 4) of a terminal hole Ht, which will be described later.

Here, as shown in FIG. 3, in the electrostatic chuck 100 of the present embodiment, segments SE ( 3) are set. More specifically, when viewed in the Z-axis direction, the plate-like member 10 is divided into a plurality of virtual annular regions (however, Only the area containing the center point CP is divided into circular areas), and each annular area is a plurality of virtual areas aligned in the circumferential direction CD by a plurality of second boundary lines BL2 extending in the radial direction RD. It is divided into segments SE. The upper part of FIG. 4 shows, as an example, six segments SE set on the plate member 10 .

As shown in the upper part of FIG. 4 , the heater electrode layer 50 includes multiple heater electrodes 500 . Each of the plurality of heater electrodes 500 included in the heater electrode layer 50 is arranged in one of the plurality of segments SE set on the plate member 10 . That is, in the electrostatic chuck 100 of this embodiment, one heater electrode 500 is arranged for each of the plurality of segments SE.

FIG. 6 is an explanatory view schematically showing the XY cross-sectional configuration of one heater electrode 500 arranged in one segment SE. As shown in FIG. 6, the heater electrode 500 has a heater line portion 502 which is a linear resistance heating element as viewed in the Z-axis direction, and heater pad portions 504 connected to both ends of the heater line portion 502 . In this embodiment, the heater line portion 502 is shaped so as to pass through each position in the segment SE as evenly as possible when viewed in the Z-axis direction. The configuration of heater electrodes 500 arranged in other segments SE is the same.

Further, as shown in the middle part of FIG. 4 , the driver 51 arranged on the plate member 10 has a plurality of conductive regions (conductive lines) 510 . The plurality of conductive regions 510 includes individual conductive regions 510i and common conductive regions 510c. An individual conductive region 510 i is a conductive region 510 electrically connected to one heater electrode 500 through vias 53 . On the other hand, the common conductive region 510 c is the conductive region 510 electrically connected to the multiple heater electrodes 500 through the vias 53 . In the example of FIG. 4, common conductive region 510 c is electrically connected to all six heater electrodes 500 .

In addition, as shown in FIGS. 2, 4 and 5, the electrostatic chuck 100 is formed with a plurality of terminal holes Ht. As shown in FIG. 5, each terminal hole Ht includes a first through hole 22 penetrating through the base member 20 from the upper surface S3 to the lower surface S4, and a second through hole 32 penetrating the bonding portion 30 in the vertical direction. , and the concave portion 12 formed on the lower surface S2 side of the plate-like member 10 are integral holes formed by communicating with each other. The cross-sectional shape orthogonal to the extending direction of the terminal hole Ht can be arbitrarily set, and may be, for example, circular, square, fan-shaped, or the like. In this embodiment, the width (size in the surface direction) of the concave portion 12 of the plate member 10 is equal to the width of the first through hole 22 of the base member 20 and the width of the second through hole 32 of the bonding portion 30. is narrower than the width of A plurality of power supply electrodes (power supply pads) 70 made of a conductive material are formed in a region of the lower surface S2 of the plate member 10 that constitutes the bottom surface 14 of each terminal hole Ht. Each power supply electrode 70 is electrically connected to the conductive region 510 (individual conductive region 510i or common conductive region 510c) of the driver 51 via the via 54 .

A plurality of power supply terminals 72 are accommodated in each terminal hole Ht. Each feed terminal 72 has a base portion 74 and a convex connection portion 76 . A base portion 74 and a convex connection portion 76 of each power supply terminal 72 are made of a metal material (for example, Kovar). A base portion 74 of the power supply terminal 72 is joined to the power supply electrode 70 by brazing using a brazing material 78, for example. A convex connection portion 76 of the power supply terminal 72 is a convex (pin-shaped) portion provided on the power supply electrode 70 and extending in the Z-axis direction (vertical direction). The cross-sectional shape of the convex connecting portion 76 (the cross-sectional shape in the direction orthogonal to the extending direction) is, for example, substantially circular, and the diameter of the cross section of the convex connecting portion 76 is, for example, about 0.2 mm to 0.5 mm. , the length of the convex connecting portion 76 in the extending direction is, for example, about 2 mm to 5 mm. Since each power supply terminal 72 has such a configuration, the convex connection portion 76 of each power supply terminal 72 is electrically connected to the power supply electrode 70 . The metal material that forms the convex connecting portion 76 corresponds to the first metal material in the scope of claims.

A connection member (connector) 90 is arranged in each terminal hole Ht. The connecting member 90 has a main body 92 and a plurality of concave connecting portions 91 . A main body 92 of the connection member 90 is a substantially rectangular parallelepiped member, and is made of, for example, a resin material. Each concave connecting portion 91 of the connecting member 90 is formed with a hole that opens to the end of the terminal hole Ht on the bottom surface 14 side (upper side) of the main body 92 and extends in the Z-axis direction (vertical direction). The hole formed in the concave connecting portion 91 is shaped so that the convex connecting portion 76 of the power supply terminal 72 is inserted and fitted. That is, the cross-sectional shape of the hole formed in the concave connecting portion 91 is substantially the same as the cross-sectional shape of the convex connecting portion 76, and the cross-sectional diameter of the hole is substantially the same as the cross-sectional diameter of the convex connecting portion 76 ( However, the hole diameter is slightly larger). By inserting the convex connection portion 76 of the power supply terminal 72 into the hole formed in the concave connection portion 91, the concave connection portion 91 and the convex connection portion 76 are fitted to each other, and the two are electrically connected. . Each concave connection portion 91 is made of a metal material (for example, gold-plated copper) different from the material forming the convex connection portion 76 of the power supply terminal 72 . In other words, the metal material forming the concave connecting portion 91 and the metal material forming the convex connecting portion 76 have different potentials. In the present embodiment, in each terminal hole Ht, the convex connecting portions 76 of all the power supply terminals 72 arranged in the terminal holes Ht are fitted with the concave connecting portions 91 formed in one connecting member 90. and is electrically connected to the recessed connection portion 91 . The metal material that forms the recessed connecting portion 91 corresponds to the second metal material in the claims.

Further, each concave connecting portion 91 of the connecting member 90 is electrically connected to the cable 80 . Each cable 80 is connected to a power supply PS (FIG. 2).

In the electrostatic chuck 100 having such a configuration, from the power source PS, the cable 80, each concave connection portion 91 of the connection member 90, the convex connection portion 76 of the power supply terminal 72, the power supply electrode 70, the via 54, the driver 51 and the via 53 When a voltage is applied to heater electrode 500 via , heater electrode 500 generates heat. As a result, the segment SE in which the heater electrode 500 is arranged is heated, and the temperature distribution of the attraction surface S1 of the plate member 10 is controlled (and the temperature distribution of the wafer W held on the attraction surface S1 of the plate member 10 is controlled). control) is realized.

Further, in the electrostatic chuck 100 of the present embodiment, in the space inside the terminal hole Ht, in the Z-axis direction, at least from the bottom surface 14 of the terminal hole Ht, the side opposite to the bottom surface 14 side of the connection member 90 ( Insulating resin 82 is filled in the space up to the end 96 on the lower side). More specifically, in the electrostatic chuck 100 of the present embodiment, the insulating resin 82 extends from the bottom surface 14 of the terminal hole Ht to the connecting member 90 in the Z-axis direction in the space inside the terminal hole Ht. The space from the end portion 96 to below is filled. The insulating resin 82 is also filled in the spaces between the power supply terminals 72 . Therefore, the entire power supply terminals 72 and the connecting members 90 are covered with the insulating resin 82 . Various resin materials can be used as the insulating resin 82. For example, it is preferable to use silicone resin, which has heat resistance and elasticity.

A-3. Effect of this embodiment:
As described above, the electrostatic chuck 100 of the first embodiment includes the plate-like member 10, the base member 20, and the bonding section 30. The plate-shaped member 10 has a substantially planar attracting surface S1 substantially orthogonal to the Z-axis direction, and a lower surface S2 opposite to the attracting surface S1. The base member 20 has an upper surface S<b>3 and a lower surface S<b>4 opposite to the upper surface S<b>3 , and is arranged so that the upper surface S<b>3 faces the lower surface S<b>2 of the plate member 10 . The base member 20 is formed with a coolant flow path 21 and a first through hole 22 penetrating from the upper surface S3 to the lower surface S4. The bonding portion 30 is arranged between the bottom surface S2 of the plate member 10 and the top surface S3 of the base member 20 to bond the plate member 10 and the base member 20 together. The bonding portion 30 is formed with a second through-hole 32 communicating with the first through-hole 22 of the base member 20 and forming a terminal hole Ht together with the first through-hole 22 of the base member 20 . . Further, the electrostatic chuck 100 of the first embodiment includes a plurality of heater electrodes 500 arranged on the plate-like member 10, a plurality of power supply electrodes 70 electrically connected to the heater electrodes 500, and a convex connection portion 76. , a connection member 90 having a plurality of concave connection portions 91, and a cable 80. The plurality of power supply electrodes 70 are arranged in a region forming the bottom surface 14 of the terminal hole Ht in the lower surface S2 of the plate member 10 . The convex connection portion 76 of the power supply terminal 72 is provided on each power supply electrode 70 in the terminal hole Ht and extends in the Z-axis direction. Each concave connection portion 91 of the connection member 90 is fitted to the convex connection portion 76 of the power supply terminal 72 to be electrically connected to the convex connection portion 76 . The cable 80 is electrically connected to each concave connecting portion 91 of the connecting member 90 . Further, in the electrostatic chuck 100 of the present embodiment, the convex connection portions 76 of the power supply terminals 72 are made of a predetermined metal material, and the concave connection portions 91 of the connection members 90 are formed of the convex connection portions 76 is formed of a predetermined metal material different from the forming material of . Further, in the space in the terminal hole Ht, in the Z-axis direction, at least the space from the bottom surface 14 of the terminal hole Ht to the end portion 96 of the connection member 90 opposite to the bottom surface 14 side has an insulating property. Resin 82 is filled.

Here, in the electrostatic chuck 100 of the present embodiment, since the terminal holes Ht are formed by the first through holes 22 of the base member 20 and the second through holes 32 of the bonding portion 30, the base member 20 is cooled by the coolant supplied to the coolant channel 21, the air in the terminal hole Ht may be cooled and condensation may occur. Further, in the electrostatic chuck 100 of the present embodiment, the convex connection portion 76 of the power supply terminal 72 and the concave connection portion 91 of the connection member 90 are made of different metals. Therefore, when dew condensed water generated in the terminal hole Ht enters between the convex connecting portion 76 of the power supply terminal 72 and the concave connecting portion 91 of the connecting member 90, corrosion deterioration of the metal occurs, and the convex connecting portion 76 may be bent and disconnection may occur. However, in the electrostatic chuck 100 of the present embodiment, as described above, in the space inside the terminal hole Ht, at least from the bottom surface 14 of the terminal hole Ht to the bottom surface 14 side of the connection member 90 in the Z-axis direction. The space up to the end 96 on the opposite side is filled with the insulating resin 82 . Therefore, according to the electrostatic chuck 100 of the present embodiment, even if dew condensation occurs in the terminal hole Ht, dew condensation is prevented between the convex connection portion 76 of the power supply terminal 72 and the concave connection portion 91 of the connection member 90 . Intrusion of water can be effectively suppressed, and as a result, breakage of the convex connection portion 76 and occurrence of disconnection can be effectively suppressed. In particular, in the electrostatic chuck 100 of the present embodiment, the insulating resin 82 extends from the bottom surface 14 of the terminal hole Ht to the end portion 96 of the connection member 90 in the Z-axis direction in the space inside the terminal hole Ht. The space is filled up to the lower part, and the space between the power supply terminals 72 is also filled. Therefore, according to the electrostatic chuck 100 of the present embodiment, even if dew condensation occurs in the terminal hole Ht, dew condensation is prevented between the convex connection portion 76 of the power supply terminal 72 and the concave connection portion 91 of the connection member 90 . The intrusion of water can be extremely effectively suppressed, and as a result, the occurrence of disconnection due to bending of the convex connecting portion 76 can be extremely effectively suppressed.

B. Second embodiment:
FIG. 7 is an explanatory view showing an enlarged YZ cross-sectional configuration of the peripheral portion of the terminal hole Ht in the electrostatic chuck 100 of the second embodiment. In the following, among the configurations of the electrostatic chuck 100 of the second embodiment, the same configurations as those of the electrostatic chuck 100 of the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. .

As shown in FIG. 7, the electrostatic chuck 100 of the second embodiment differs from the electrostatic chuck 100 of the first embodiment in the configuration of the insulating resin 82 (filling range of the insulating resin 82). there is Specifically, in the electrostatic chuck 100 of the second embodiment, the insulating resin 82 extends from the bottom surface 14 of the terminal hole Ht to the connecting member 90 in the Z-axis direction in the space inside the terminal hole Ht. The space up to the end 94 on the side of the bottom surface 14 is filled. In the electrostatic chuck 100 of the second embodiment, the insulating resin 82 extends from the bottom surface 14 of the terminal hole Ht in the Z-axis direction to each recessed connection of the connection member 90 in the space inside the terminal hole Ht. It can also be said that the space up to the end of the portion 91 on the side of the bottom surface 14 is filled.

As described above, in the electrostatic chuck 100 of the second embodiment, in the space inside the terminal hole Ht, at least from the bottom surface 14 of the terminal hole Ht to the end of the connection member 90 on the bottom surface 14 side in the Z-axis direction. The space up to the portion 94 is filled with the insulating resin 82 . Therefore, according to the electrostatic chuck 100 of the second embodiment, even if dew condensation occurs in the terminal hole Ht, there is no gap between the convex connection portion 76 of the power supply terminal 72 and the concave connection portion 91 of the connection member 90 . It is possible to suppress the entry of condensed water, and as a result, it is possible to suppress the occurrence of disconnection due to bending of the convex connection portion 76 .

C. Variant:
The technology disclosed in this specification is not limited to the above-described embodiments, and can be modified in various forms without departing from the scope of the invention. For example, the following modifications are possible.

The configuration of the electrostatic chuck 100 in the above embodiment is merely an example, and various modifications are possible. For example, the configuration (filling range) of the insulating resin 82 in the above embodiment is merely an example, and various modifications are possible. That is, in the insulating resin 82 , dew condensation water generated mainly on the inner peripheral surface of the first through hole 22 of the base member 20 acts as a contact between the convex connection portion 76 of the power supply terminal 72 and the concave connection portion 91 of the connection member 90 . It is only necessary to be configured so as to be able to suppress entry into the space. Therefore, the insulating resin 82 fills the space in the terminal hole Ht at least from the bottom surface 14 of the terminal hole Ht to the end portion 94 of the connection member 90 on the bottom surface 14 side in the Z-axis direction. As long as the space between the power supply terminals 72 is not necessarily filled with the insulating resin 82 , for example.

Further, in the above embodiment, the width (size in the surface direction) of the concave portion 12 of the plate-like member 10 constituting each terminal hole Ht is the width of the first through hole 22 of the base member 20 and the bonding portion Although the width of the recess 12 of the plate member 10 is narrower than the width of the second through hole 32 of the base member 20 , the width of the first through hole 22 of the base member 20 and the width of the second through hole 30 of the bonding portion 30 It may be the same as the width of the through hole 32, or may be wider than those widths. Also, the width of the first through-hole 22 of the base member 20 and the width of the second through-hole 32 of the bonding portion 30 may be different from each other. In the above embodiment, each terminal hole Ht is composed of the first through hole 22 of the base member 20, the second through hole 32 of the bonding portion 30, and the concave portion 12 of the plate member 10. However, even if the recess 12 is not formed in the plate member 10 and each terminal hole Ht is composed of the first through hole 22 of the base member 20 and the second through hole 32 of the bonding portion 30, good.

Also, the configuration of the power supply terminal 72 and the connection member 90 in the above embodiment is merely an example, and various modifications are possible. For example, in the above-described embodiment, the power supply terminal 72 is composed of the base portion 74 and the convex connection portion 76, but the power supply terminal 72 may have other portions, and the power supply terminal 72 may have the base portion 74. You may not.

Further, in the above-described embodiment, the position of the driver 51 in the Z-axis direction is assumed to be the same as the entire driver 51 (that is, the driver 51 has a single-layer structure). (that is, the driver 51 has a multi-layer structure). Further, in the above embodiment, each heater electrode 500 is electrically connected to the power supply electrode 70 via the driver 51, but each heater electrode 500 is electrically connected to the power supply electrode 70 without the driver 51. may be

Also, the setting mode of the segments SE (the number of segments SE, the shape of each segment SE, etc.) in the above embodiment can be arbitrarily changed. For example, in the above-described embodiment, a plurality of segments SE are set so that each segment SE is aligned in the circumferential direction CD of the attracting surface S1. may be Further, for example, in the above embodiment, the entire electrostatic chuck 100 is virtually divided into a plurality of segments SE, but even if part of the electrostatic chuck 100 is virtually divided into a plurality of segments SE good. Moreover, in the electrostatic chuck 100, the segment SE does not necessarily have to be set.

Further, the material for forming each member in the electrostatic chuck 100 of the above-described embodiment is merely an example, and can be arbitrarily changed. For example, in the above embodiment, the plate-like member 10 is made of ceramics, but the plate-like member 10 may be made of a material other than ceramics (for example, a resin material).

Further, in the above embodiments, each via may be composed of a single via, or may be composed of a group of multiple vias. In the above embodiments, each via may have a single-layer structure consisting only of a via portion, or may have a multi-layer structure (for example, a structure in which a via portion, a pad portion, and a via portion are laminated). good too.

Further, in the above-described embodiment, a monopolar system in which one chuck electrode 40 is provided inside the plate-like member 10 is adopted. method may be employed.

Further, the present invention is not limited to the electrostatic chuck 100 that holds the wafer W using electrostatic attraction, but includes a plate-like member, a base member, an adhesive portion, a heater electrode arranged on the plate-like member, Other holding devices (e.g., heater devices such as CVD heaters, vacuum chucks, etc.).

10: Plate-like member 12: Recess 14: Bottom surface 20: Base member 21: Coolant channel 22: First through hole 30: Adhesion part 32: Second through hole 40: Chuck electrode 50: Heater electrode layer 51: Driver 53: Via 54: Via 70: Feeding electrode 72: Feeding terminal 74: Base 76: Convex connecting part 78: Brazing material 80: Cable 82: Insulating resin 90: Connecting member 91: Concave connecting part 92: Body 94: End Part 96: Edge 100: Electrostatic chuck 500: Heater electrode 502: Heater line part 504: Heater pad part 510: Conductive region BL1: First boundary line BL2: Second boundary line CD: Circumferential direction CP: Center Point Ht: Terminal hole PS: Power supply RD: Radial direction S1: Attraction surface S2: Bottom surface S3: Top surface S4: Bottom surface SE: Segment W: Wafer

Claims (2)

a plate-shaped member having a substantially planar first surface substantially orthogonal to a first direction and a second surface opposite to the first surface;
a plurality of heater electrodes arranged on the plate-like member;
having a third surface and a fourth surface opposite to the third surface, the third surface being arranged to face the second surface of the plate-like member; a base member in which a first through hole penetrating from the third surface to the fourth surface and a coolant channel are formed;
The first through-hole of the base member is arranged between the second surface of the plate-like member and the third surface of the base member to bond the plate-like member and the base member together. a bonding portion in which a second through-hole communicating with the hole and forming a terminal hole together with the first through-hole is formed;
a plurality of power supply electrodes disposed on the second surface of the plate member in a region forming the bottom surface of the terminal hole and electrically connected to the heater electrode;
a power supply terminal having a convex connection portion, the convex connection portion being provided on each of the power supply electrodes in the terminal hole and extending in the first direction;
a connection member having a plurality of concave connection portions that are electrically connected to the convex connection portions by fitting with the respective convex connection portions;
a cable electrically connected to each of the recessed connections of the connection member;
A holding device for holding an object on the first surface of the plate member,
The convex connection portion of each power supply terminal is formed of a first metal material,
each of the concave connection portions of the connection member is formed of a second metal material different from the first metal material;
In the space in the terminal hole, in the first direction, at least a space from the bottom surface to an end portion of the connecting member on the bottom surface side is filled with an insulating resin.
A holding device characterized by: A holding device according to claim 1, wherein
In the space in the terminal hole, the insulating resin is filled in at least the space from the bottom surface to the end of the connection member opposite to the bottom surface in the first direction. ,
A holding device characterized by:

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