JP2020004809A - Holding device - Google Patents

Abstract

To suppress the generation of a disconnection by breaking a convex connection part of a power supply terminal.SOLUTION: A holding device is a device that comprises a plate-like member, a base member, and an adhesion part, and holds an object to a front surface of the plate-like member. The holding device further comprises: a heater electrode; a power supply electrode connected to the heater electrode; a power supply terminal having a convex connection part; and a connection member having a concave connection part. The power supply electrode is arranged at a bottom surface of a hole for a terminal. The convex connection part of the power supply terminal is provided on the power supply electrode and is extended to a first direction. The concave connection part of the connection member is electrically connected with the convex connection part. The convex connection part is formed by a metal material, and the concave connection part is formed by the metal material different from the convex connection part. An insulation resin is filled in a space of the hole for the terminal at least from the bottom surface of the hole for the terminal to an end part on the bottom surface in the connection member.SELECTED DRAWING: Figure 5

Description

  The technology disclosed in this specification relates to a holding device that holds an object.

  For example, an electrostatic chuck is used as a holding device for holding a wafer when manufacturing a semiconductor. The electrostatic chuck includes a ceramic plate-shaped member having a surface (hereinafter, referred to as “adsorption surface”) substantially orthogonal to a predetermined direction (hereinafter, referred to as “first direction”), a base member, and a plate-shaped member. And a chuck electrode provided inside the plate-shaped member. The plate-shaped member is formed by utilizing an electrostatic attraction generated when a voltage is applied to the chuck electrode. The wafer is sucked and held on the suction surface of the member.

  If the temperature of the wafer held on the chucking surface of the electrostatic chuck does not reach a desired temperature, the accuracy of each process (film formation, etching, etc.) on the wafer may be reduced. The ability to control the distribution is required. Therefore, for example, the temperature distribution on the adsorption surface of the plate-shaped member is controlled by heating with a heater electrode arranged on the plate-shaped member or cooling by supplying a refrigerant to a refrigerant flow path formed in the base member. .

  The electrostatic chuck is provided with a configuration for supplying power to the heater electrode (for example, see Patent Document 1). Specifically, a through hole that forms a terminal hole is formed in the base member and the bonding portion, and the bottom surface of the terminal hole on the surface opposite to the suction surface of the plate-like member (hereinafter, referred to as “lower surface”) is formed. A power supply electrode (power supply pad) is provided in the region to be configured. The power supply electrode is electrically connected to the heater electrode via a via or the like. Further, the electrostatic chuck is provided with a power supply terminal having a convex connection portion, a connection member having a concave connection portion, and a cable. The convex connection portion of the power supply terminal is a metal portion provided on the power supply electrode and formed so as to extend in the first direction. The concave connection portion of the connection member is a metal portion that fits with the projection connection portion of the power supply terminal and is electrically connected to the projection connection portion. The cable is electrically connected to the concave connection portion of the connection member. In such a configuration, power is supplied from the power supply to the heater electrode via the cable, the concave connection portion of the connection member, the convex connection portion of the power supply terminal, the power supply electrode, the via, and the like.

JP-A-2006-76646A

  As described above, the terminal holes are formed by the through holes formed in the base member and the bonding portion. Therefore, when the base member is cooled by the coolant supplied to the coolant channel, the air in the terminal holes is cooled, and dew condensation may occur. In the case where such dew condensation occurs, if the convex connection portion of the power supply terminal and the concave connection portion of the connection member are formed of different metals, that is, metals having different potentials, the dew condensation water becomes convex. There is a possibility that the metal enters between the connection portion and the concave connection portion, causes corrosion deterioration of the metal, and the convex connection portion of the power supply terminal is broken to cause disconnection.

  In addition, such a problem is not limited to the electrostatic chuck that holds a wafer using electrostatic attraction, but also includes a plate-shaped member, a base member, an adhesive portion, and a heater electrode disposed on the plate-shaped member. This is a common problem in a holding device generally provided with a configuration for supplying power to a heater electrode (a power supply electrode, a power supply terminal, a connection member, and the like), and for holding an object on the surface of a plate-shaped member.

  This specification discloses a technique capable of solving the above-described problem.

  The technology disclosed in this specification can be realized, for example, as the following modes.

(1) The holding device disclosed in the present specification has a substantially planar first surface substantially perpendicular to a first direction, and a second surface opposite to the first surface. A third surface having a plate-shaped member, a plurality of heater electrodes disposed on the plate-shaped member, a third surface, and a fourth surface opposite to the third surface; Is disposed so as to face the second surface of the plate-shaped member, and has a first through-hole penetrating from the third surface to the fourth surface, and a base in which a coolant channel is formed. A member, which is disposed between the second surface of the plate member and the third surface of the base member to bond the plate member and the base member, and An adhesive portion formed with a second through hole communicating with the first through hole and forming a terminal hole together with the first through hole; A plurality of power supply electrodes, which are arranged in a region constituting the bottom surface of the terminal hole and are electrically connected to the heater electrode, and a power supply terminal having a convex connection portion; In addition, the convex connection portion is provided on each of the power supply electrodes in the terminal hole, and is fitted with a power supply terminal extending in the first direction and each of the convex connection portions. A connection member having a plurality of concave connection portions electrically connected to the convex connection portion, and a cable electrically connected to each of the concave connection portions of the connection member, In a holding device that holds an object on the first surface of a member, the convex connection portion of each of the power supply terminals is formed of a first metal material, and each of the concave connection portions of the connection member is The terminal is formed of a second metal material different from the first metal material, Of the space in the pores, in the first direction, from at least the bottom surface, the space to the end of the bottom side of the connecting member, the insulating resin is filled. As described above, in the present holding device, in the first direction, of the space in the terminal hole, the insulating resin is provided at least in the space from the bottom surface of the terminal hole to the end of the connection member on the bottom surface side. Is filled. Therefore, according to the present holding device, even when dew condensation occurs in the terminal hole, it is possible to prevent dew condensation water from entering between the convex connection portion of the power supply terminal and the concave connection portion of the connection member. As a result, it is possible to suppress the occurrence of disconnection due to breakage of the convex connection portion.

(2) In the holding device, in the space in the terminal hole, in the first direction, at least a space from the bottom surface to an end of the connection member opposite to the bottom surface side, It may be configured to be filled with an insulating resin. In the present holding device, in the first direction, in the space in the terminal hole, at least a space from the bottom surface of the terminal hole to an end of the connection member opposite to the bottom surface side is provided with an insulating resin. Is filled. Therefore, according to the present holding device, even if dew condensation occurs in the terminal hole, dew condensation water is effectively prevented from entering between the convex connection portion of the power supply terminal and the concave connection portion of the connection member. As a result, it is possible to effectively suppress the occurrence of breakage due to breakage of the convex connection portion.

  The technology disclosed in the present specification can be realized in various forms, for example, in a form of a holding device, an electrostatic chuck, a vacuum chuck, a manufacturing method thereof, and the like. is there.

FIG. 2 is a perspective view schematically showing an external configuration of the electrostatic chuck 100 according to the first embodiment. FIG. 2 is an explanatory diagram schematically showing an XZ cross-sectional configuration of the electrostatic chuck 100 according to the first embodiment. FIG. 2 is an explanatory diagram schematically showing an XY plane (upper surface) configuration of the electrostatic chuck 100 according to the first embodiment. FIG. 4 is an explanatory diagram schematically showing a heater electrode layer and a configuration for supplying power to the heater electrode layer. FIG. 5 is an enlarged explanatory diagram illustrating a YZ cross-sectional configuration of a peripheral portion (a portion X1 in FIG. 4) of a terminal hole Ht. FIG. 4 is an explanatory diagram schematically showing an XY cross-sectional configuration of one heater electrode 500 arranged in one segment SE. It is explanatory drawing which expands and shows the YZ cross-sectional structure of the peripheral part of the hole Ht for terminals in the electrostatic chuck 100 of 2nd Embodiment.

A. First embodiment:
A-1. Configuration of electrostatic chuck 100:
FIG. 1 is a perspective view schematically illustrating an external configuration of the electrostatic chuck 100 according to the first embodiment, and FIG. 2 is an explanatory diagram schematically illustrating an XZ cross-sectional configuration of the electrostatic chuck 100 according to the first embodiment. FIG. 3 is an explanatory view schematically showing an XY plane (upper surface) configuration of the electrostatic chuck 100 according to the first embodiment. Each drawing shows XYZ axes orthogonal to each other for specifying a direction. In this specification, for convenience, the positive direction of the Z axis is referred to as an upward direction, and the negative direction of the Z axis is referred to as a downward direction. However, the electrostatic chuck 100 is actually installed in a direction different from such a direction. May be done.

  The electrostatic chuck 100 is a device that attracts and holds an object (for example, a wafer W) by electrostatic attraction, and is used, for example, for fixing the wafer W in a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 100 includes a plate member 10 and a base member 20 arranged side by side in a predetermined arrangement direction (in the present embodiment, a vertical direction (Z-axis direction)). The plate member 10 and the base member 20 are arranged such that the lower surface S2 (see FIG. 2) of the plate member 10 and the upper surface S3 of the base member 20 face each other in the arrangement direction.

  The plate-shaped member 10 is a member having a substantially circular flat upper surface (hereinafter, referred to as “adsorption surface”) S1 that is substantially perpendicular to the above-described arrangement direction (Z-axis direction), for example, ceramics (for example, alumina or aluminum nitride). Etc.). The diameter of the plate member 10 is, for example, about 50 mm to 500 mm (normally, about 200 mm to 350 mm), and the thickness of the plate member 10 is, for example, about 1 mm to 10 mm. The suction surface S1 of the plate member 10 corresponds to the first surface in the claims, the lower surface S2 of the plate member 10 corresponds to the second surface in the claims, and the Z-axis direction is This corresponds to the first direction in the claims. In this specification, a direction orthogonal to the Z-axis direction is referred to as a “surface direction”, and as shown in FIG. 3, a circumferential direction around the center point CP of the suction surface S1 among the surface directions is referred to as a “surface direction”. The direction perpendicular to the circumferential direction CD in the plane direction is referred to as “radial direction RD”.

  As shown in FIG. 2, a chuck electrode 40 made of a conductive material (for example, tungsten, molybdenum, platinum, or the like) is arranged inside the plate-shaped member 10. The shape of the chuck electrode 40 when viewed in the Z-axis direction is, for example, substantially circular. When a voltage is applied to the chuck electrode 40 from a power supply (not shown), an electrostatic attraction is generated, and the wafer W is suction-fixed to the suction surface S1 of the plate member 10 by the electrostatic attraction.

  Inside the plate-shaped member 10, a heater electrode layer 50, a driver 51 for supplying power to the heater electrode layer 50, and various other components formed of a conductive material (eg, tungsten, molybdenum, platinum, etc.) are also provided. Vias 53 and 54 are arranged. In the present embodiment, the heater electrode layer 50 is disposed below the chuck electrode 40, and the driver 51 is disposed below the heater electrode layer 50. These configurations will be described later in detail. The plate-like member 10 having such a configuration is prepared by, for example, preparing a plurality of ceramic green sheets, forming via holes in a predetermined ceramic green sheet, filling a metallized paste, printing, and the like. The green sheet can be manufactured by thermocompression bonding, performing processing such as cutting, and then firing.

  The base member 20 is, for example, a plate member having the same diameter as the plate member 10 or a circular flat plate having a larger diameter than the plate member 10, and is formed of, for example, a metal (aluminum, an aluminum alloy, or the like). The diameter of the base member 20 is, for example, about 220 mm to 550 mm (usually, 220 mm to 350 mm), and the thickness of the base member 20 is, for example, about 20 mm to 40 mm. The upper surface S3 of the base member 20 corresponds to a third surface in the claims, and the lower surface S4 of the base member 20 corresponds to a fourth surface in the claims.

  The base member 20 is joined to the plate member 10 by an adhesive portion 30 disposed between the lower surface S2 of the plate member 10 and the upper surface S3 of the base member 20. The bonding section 30 is made of, for example, an adhesive such as a silicone resin, an acrylic resin, or an epoxy resin. The thickness of the bonding portion 30 is, for example, about 0.1 mm to 1 mm.

  A coolant channel 21 is formed inside the base member 20. When a coolant (for example, a fluorine-based inert liquid or water) flows through the coolant channel 21, the base member 20 is cooled, and the heat transfer between the base member 20 and the plate member 10 via the bonding portion 30. The plate member 10 is cooled by (heat drawing), and the wafer W held on the suction surface S1 of the plate member 10 is cooled. Thereby, control of the temperature distribution of the wafer W is realized.

A-2. Heater electrode layer 50 and configuration for power supply to heater electrode layer 50:
Next, the configuration of the heater electrode layer 50 and the configuration for supplying power to the heater electrode layer 50 will be described in detail. As described above, the plate-shaped member 10 is provided with the heater electrode layer 50, the driver 51 for supplying power to the heater electrode layer 50, and the various vias 53 and 54. Further, the electrostatic chuck 100 is provided with another configuration for supplying power to the heater electrode layer 50 (such as a power supply terminal 72 accommodated in a terminal hole Ht described later). FIG. 4 is an explanatory diagram schematically showing the heater electrode layer 50 and a configuration for supplying power to the heater electrode layer 50. 4 schematically shows a YZ cross-sectional configuration of a part of the heater electrode layer 50 disposed on the plate-shaped member 10, and is disposed on the plate-shaped member 10 in the middle of FIG. The XY plane configuration of a part of the driver 51 is schematically illustrated, and the YZ cross-sectional configuration of another configuration for supplying power to the heater electrode layer 50 is schematically illustrated in the lower part of FIG. . FIG. 5 is an explanatory diagram showing an enlarged YZ sectional configuration of a peripheral portion (X1 portion in FIG. 4) of a terminal hole Ht described later.

  Here, as shown in FIG. 3, in the electrostatic chuck 100 of the present embodiment, the segment SE (a plurality of virtual regions arranged in the plane direction (the direction orthogonal to the Z-axis direction)) is formed on the plate-shaped member 10. 3 (indicated by a broken line in FIG. 3). More specifically, when viewed in the Z-axis direction, the plate-shaped member 10 is formed by a plurality of virtual annular regions (however, a plurality of concentric circular first boundary lines BL1 around the center point CP of the suction surface S1). Only the region including the center point CP is divided into circular regions), and each annular region is a plurality of virtual regions arranged in the circumferential direction CD by the plurality of second boundary lines BL2 extending in the radial direction RD. It is divided into segments SE. In the upper part of FIG. 4, as an example, six segments SE set on the plate-shaped member 10 are shown.

  4, the heater electrode layer 50 includes a plurality of heater electrodes 500. Each of the plurality of heater electrodes 500 included in the heater electrode layer 50 is arranged in one of the plurality of segments SE set in the plate-shaped member 10. That is, in the electrostatic chuck 100 of the present embodiment, one heater electrode 500 is arranged in each of the plurality of segments SE.

  FIG. 6 is an explanatory diagram schematically showing an XY cross-sectional configuration of one heater electrode 500 arranged in one segment SE. As shown in FIG. 6, the heater electrode 500 has a heater line portion 502 which is a linear resistance heating element as viewed in the Z-axis direction, and a heater pad portion 504 connected to both ends of the heater line portion 502. In the present embodiment, the heater line section 502 is shaped so as to pass through each position in the segment SE as evenly as possible when viewed in the Z-axis direction. The same applies to the configuration of the heater electrodes 500 arranged in other segments SE.

  As shown in the middle part of FIG. 4, the driver 51 arranged on the plate-shaped member 10 has a plurality of conductive regions (conductive lines) 510. The plurality of conductive regions 510 include an individual conductive region 510i and a common conductive region 510c. The individual conductive region 510i is a conductive region 510 electrically connected to one heater electrode 500 via the via 53. On the other hand, the common conductive region 510c is a conductive region 510 electrically connected to the plurality of heater electrodes 500 via the via 53. In the example of FIG. 4, the common conductive region 510c is electrically connected to all the six heater electrodes 500.

  Further, as shown in the lower part of FIGS. 2 and 4 and FIG. 5, a plurality of terminal holes Ht are formed in the electrostatic chuck 100. As shown in FIG. 5, each terminal hole Ht includes a first through hole 22 penetrating the base member 20 from the upper surface S3 to the lower surface S4, and a second through hole 32 penetrating the bonding portion 30 in the vertical direction. The recess 12 formed on the lower surface S2 side of the plate member 10 is an integral hole formed by communicating with each other. The cross-sectional shape orthogonal to the extending direction of the terminal hole Ht can be arbitrarily set, and is, for example, a circle, a square, a sector, or the like. In the present embodiment, the width (the size in the surface direction) of the concave portion 12 of the plate member 10 is determined by the width of the first through hole 22 of the base member 20 and the second through hole 32 of the bonding portion 30. Is narrower than the width. A plurality of power supply electrodes (power supply pads) 70 made of a conductive material are formed in a region of the lower surface S2 of the plate member 10 that forms the bottom surface 14 of each terminal hole Ht. Each power supply electrode 70 is electrically connected to the conductive region 510 (the individual conductive region 510i or the common conductive region 510c) of the driver 51 via the via 54.

  A plurality of power supply terminals 72 are accommodated in each terminal hole Ht. Each power supply terminal 72 has a base 74 and a convex connection 76. The base 74 and the convex connection 76 of each power supply terminal 72 are formed of a metal material (for example, Kovar). The base 74 of the power supply terminal 72 is joined to the power supply electrode 70 by, for example, brazing using a brazing material 78. The convex connection portion 76 of the power supply terminal 72 is a convex (pin-shaped) portion provided on the power supply electrode 70 and extending in the Z-axis direction (vertical direction). The cross-sectional shape (the cross-sectional shape in the direction orthogonal to the stretching direction) of the convex connection portion 76 is, for example, substantially circular, and the diameter of the cross-section of the convex connection portion 76 is, for example, about 0.2 mm to 0.5 mm. The length of the convex connection portion 76 in the extending direction is, for example, about 2 mm to 5 mm. Since each power supply terminal 72 has such a configuration, the convex connection portion 76 of each power supply terminal 72 is electrically connected to the power supply electrode 70. The above-mentioned metal material which is a material for forming the convex connection portion 76 corresponds to a first metal material in the claims.

  A connection member (connector) 90 is arranged in each terminal hole Ht. The connection member 90 has a main body 92 and a plurality of concave connection portions 91. The main body 92 of the connection member 90 is a substantially rectangular parallelepiped member, and is formed of, for example, a resin material. Each concave connection portion 91 of the connection member 90 has an opening at the end of the terminal hole Ht on the bottom surface 14 side (upper side) of the main body 92 and a hole extending in the Z-axis direction (vertical direction). The hole formed in the concave connection portion 91 has a shape such that the convex connection portion 76 of the power supply terminal 72 is inserted and fitted. That is, the cross-sectional shape of the hole formed in the concave connecting portion 91 is substantially the same as the cross-sectional shape of the convex connecting portion 76, and the cross-sectional diameter of the hole is substantially the same as the cross-sectional diameter of the convex connecting portion 76 ( However, the diameter of the hole is slightly larger. By inserting the convex connecting portion 76 of the power supply terminal 72 into the hole formed in the concave connecting portion 91, the concave connecting portion 91 and the convex connecting portion 76 are fitted, and both are electrically connected. . Each of the concave connection portions 91 is formed of a metal material (for example, gold-plated copper) different from the material of the convex connection portion 76 of the power supply terminal 72. In other words, the potential of the metal material forming the concave connection portion 91 and the potential of the metal material forming the projection connection portion 76 are different from each other. In this embodiment, in each terminal hole Ht, the convex connection portions 76 of all the power supply terminals 72 arranged in the terminal holes Ht are fitted with the respective concave connection portions 91 formed in one connection member 90. Thus, it is electrically connected to the concave connection portion 91. The metal material that is the material for forming the concave connection portion 91 corresponds to the second metal material in the claims.

  Each concave connecting portion 91 of the connecting member 90 is electrically connected to the cable 80. Each cable 80 is connected to a power supply PS (FIG. 2).

  In the electrostatic chuck 100 having such a configuration, from the power supply PS, the cable 80, each concave connection portion 91 of the connection member 90, the convex connection portion 76 of the power supply terminal 72, the power supply electrode 70, the via 54, the driver 51, and the via 53 are provided. When a voltage is applied to the heater electrode 500 through the, the heater electrode 500 generates heat. Thereby, the segment SE on which the heater electrode 500 is arranged is heated, and the temperature distribution of the suction surface S1 of the plate member 10 is controlled (therefore, the temperature distribution of the wafer W held on the suction surface S1 of the plate member 10 is controlled). Control) is realized.

  Further, in the electrostatic chuck 100 of the present embodiment, in the space within the terminal hole Ht, at least the bottom surface 14 of the terminal hole Ht and the opposite side of the connection member 90 from the bottom surface 14 side in the Z-axis direction ( The insulating resin 82 is filled in the space up to the lower end 96. More specifically, in the electrostatic chuck 100 according to the present embodiment, the insulating resin 82 extends from the bottom surface 14 of the terminal hole Ht in the Z-axis direction in the space in the terminal hole Ht. The space below the end 96 is filled. Further, the insulating resin 82 is also filled in the space between the power supply terminals 72. Therefore, the entirety of each power supply terminal 72 and the entirety of the connection member 90 are covered with the insulating resin 82. As the insulating resin 82, various resin materials are used. For example, a heat-resistant and elastic silicone resin is preferably used.

A-3. Effects of this embodiment:
As described above, the electrostatic chuck 100 according to the first embodiment includes the plate member 10, the base member 20, and the bonding unit 30. The plate-shaped member 10 has a substantially planar suction surface S1 substantially orthogonal to the Z-axis direction, and a lower surface S2 opposite to the suction surface S1. The base member 20 has an upper surface S3 and a lower surface S4 opposite to the upper surface S3, and is arranged such that the upper surface S3 faces the lower surface S2 of the plate-shaped member 10. The base member 20 is formed with a coolant channel 21 and a first through hole 22 penetrating from the upper surface S3 to the lower surface S4. The bonding portion 30 is disposed between the lower surface S2 of the plate member 10 and the upper surface S3 of the base member 20, and bonds the plate member 10 and the base member 20 together. The bonding portion 30 is formed with a second through hole 32 which communicates with the first through hole 22 of the base member 20 and forms a terminal hole Ht together with the first through hole 22 of the base member 20. . The electrostatic chuck 100 according to the first embodiment includes a plurality of heater electrodes 500 disposed on the plate member 10, a plurality of power supply electrodes 70 electrically connected to the heater electrodes 500, and a convex connection portion 76. , A connection member 90 having a plurality of concave connection portions 91, and a cable 80. The plurality of power supply electrodes 70 are arranged in a region constituting the bottom surface 14 of the terminal hole Ht in the lower surface S2 of the plate-shaped member 10. The convex connection portion 76 of the power supply terminal 72 is provided on each power supply electrode 70 in the terminal hole Ht, and extends in the Z-axis direction. Each concave connecting portion 91 of the connecting member 90 is fitted with the convex connecting portion 76 of the power supply terminal 72 to be electrically connected to the convex connecting portion 76. The cable 80 is electrically connected to each of the concave connecting portions 91 of the connecting member 90. Further, in the electrostatic chuck 100 of the present embodiment, the convex connecting portions 76 of the power supply terminals 72 are formed of a predetermined metal material, and the concave connecting portions 91 of the connecting member 90 are formed of the convex connecting portions 76. Is formed of a predetermined metal material different from the material for forming the above. Further, in the space in the terminal hole Ht, at least a space from the bottom surface 14 of the terminal hole Ht to the end 96 of the connecting member 90 opposite to the bottom surface 14 side in the Z-axis direction has an insulating property. Resin 82 is filled.

  Here, in the electrostatic chuck 100 of the present embodiment, since the terminal hole Ht is constituted by the first through hole 22 of the base member 20 and the second through hole 32 of the bonding portion 30, the base member 20 has Is cooled by the refrigerant supplied to the refrigerant channel 21, the air in the terminal hole Ht is cooled, and dew condensation may occur. Further, in the electrostatic chuck 100 of the present embodiment, the convex connection portion 76 of the power supply terminal 72 and the concave connection portion 91 of the connection member 90 are formed of different metals. Therefore, when dew water generated in the terminal hole Ht enters between the convex connection portion 76 of the power supply terminal 72 and the concave connection portion 91 of the connection member 90, corrosion deterioration of the metal occurs, and the convex connection portion There is a possibility that the wire 76 may break and break. However, in the electrostatic chuck 100 of the present embodiment, as described above, at least the bottom surface 14 of the terminal hole Ht and the bottom surface 14 side of the connection member 90 in the Z-axis direction in the space inside the terminal hole Ht. The space up to the end 96 on the opposite side is filled with the insulating resin 82. Therefore, according to the electrostatic chuck 100 of the present embodiment, even if dew condensation occurs in the terminal hole Ht, dew condensation occurs between the convex connection portion 76 of the power supply terminal 72 and the concave connection portion 91 of the connection member 90. It is possible to effectively prevent water from entering, and as a result, it is possible to effectively suppress the occurrence of breakage due to breakage of the convex connection portion 76. In particular, in the electrostatic chuck 100 of the present embodiment, the insulating resin 82 extends from the bottom surface 14 of the terminal hole Ht to the end 96 of the connection member 90 in the Z-axis direction in the space inside the terminal hole Ht. The space below is filled, and the space between the power supply terminals 72 is also filled. Therefore, according to the electrostatic chuck 100 of the present embodiment, even if dew condensation occurs in the terminal hole Ht, dew condensation occurs between the convex connection portion 76 of the power supply terminal 72 and the concave connection portion 91 of the connection member 90. The entry of water can be extremely effectively suppressed, and as a result, the occurrence of breakage due to breakage of the convex connection portion 76 can be extremely effectively suppressed.

B. Second embodiment:
FIG. 7 is an explanatory diagram showing an enlarged YZ cross-sectional configuration of the peripheral portion of the terminal hole Ht in the electrostatic chuck 100 according to the second embodiment. Hereinafter, among the configurations of the electrostatic chuck 100 of the second embodiment, the same components as those of the above-described electrostatic chuck 100 of the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate. .

  As shown in FIG. 7, the electrostatic chuck 100 of the second embodiment differs from the electrostatic chuck 100 of the first embodiment in the configuration of the insulating resin 82 (the filling range of the insulating resin 82). I have. Specifically, in the electrostatic chuck 100 according to the second embodiment, the insulating resin 82 is formed in the connection member 90 from the bottom surface 14 of the terminal hole Ht in the Z-axis direction in the space inside the terminal hole Ht. The space up to the end 94 on the bottom surface 14 side is filled. Note that, in the electrostatic chuck 100 according to the second embodiment, the insulating resin 82 is connected to the concave connection of the connection member 90 from the bottom surface 14 of the terminal hole Ht in the Z-axis direction in the space inside the terminal hole Ht. It can also be said that the space in the portion 91 up to the end on the bottom surface 14 side is filled.

  As described above, in the electrostatic chuck 100 according to the second embodiment, in the Z-axis direction, at least from the bottom surface 14 of the terminal hole Ht to the end of the connection member 90 on the bottom surface 14 side in the space inside the terminal hole Ht. The space up to the portion 94 is filled with the insulating resin 82. Therefore, according to the electrostatic chuck 100 of the second embodiment, even if dew condensation occurs in the terminal hole Ht, the space between the convex connection portion 76 of the power supply terminal 72 and the concave connection portion 91 of the connection member 90 can be obtained. It is possible to suppress the dew condensation water from entering, and as a result, it is possible to suppress the occurrence of breakage due to breakage of the convex connection portion 76.

C. Modification:
The technology disclosed in the present specification is not limited to the above-described embodiment, and can be modified into various forms without departing from the gist thereof. For example, the following modifications are also possible.

  The configuration of the electrostatic chuck 100 in the above embodiment is merely an example, and can be variously modified. For example, the configuration (filling range) of the insulating resin 82 in the above embodiment is merely an example, and can be variously modified. That is, the insulative resin 82 causes the dew condensation water generated mainly on the inner peripheral surface of the first through hole 22 of the base member 20 to cause the condensed water between the convex connection portion 76 of the power supply terminal 72 and the concave connection portion 91 of the connection member 90 to be formed. What is necessary is just to be comprised so that entry into the middle can be suppressed. Therefore, the insulating resin 82 fills at least the space from the bottom surface 14 of the terminal hole Ht to the end 94 of the connection member 90 on the bottom surface 14 side in the Z-axis direction in the space inside the terminal hole Ht. For example, the space between the power supply terminals 72 does not necessarily have to be filled with the insulating resin 82 as long as it is performed.

  Further, in the above embodiment, the width (the size in the surface direction) of the concave portion 12 of the plate member 10 constituting each terminal hole Ht is equal to the width of the first through hole 22 of the base member 20 and the bonding portion. Although the width of the concave portion 12 of the plate member 10 is smaller than the width of the second through hole 32 of the plate member 10, the width of the first through hole 22 of the base member 20 and the width of the second The width may be the same as the width of the through hole 32 or may be wider than the width. Further, the width of the first through hole 22 of the base member 20 and the width of the second through hole 32 of the bonding portion 30 may be different from each other. In the above-described embodiment, each terminal hole Ht includes the first through hole 22 of the base member 20, the second through hole 32 of the bonding portion 30, and the concave portion 12 of the plate member 10. However, even if the concave portion 12 is not formed in the plate member 10 and each terminal hole Ht is configured by the first through hole 22 of the base member 20 and the second through hole 32 of the bonding portion 30. Good.

  Further, the configurations of the power supply terminal 72 and the connection member 90 in the above embodiment are merely examples, and can be variously modified. For example, in the above-described embodiment, the power supply terminal 72 includes the base 74 and the convex connection portion 76. However, the power supply terminal 72 may include other portions, or the power supply terminal 72 includes the base 74. You may not.

  In the above embodiment, the position of the driver 51 in the Z-axis direction is such that the entirety of the driver 51 is at the same position (that is, the driver 51 has a single-layer configuration), but a part of the driver 51 is at a different position. (That is, the driver 51 has a multi-layer configuration). In the above embodiment, each heater electrode 500 is electrically connected to the power supply electrode 70 via the driver 51. However, each heater electrode 500 is electrically connected to the power supply electrode 70 without the driver 51. You may.

  Further, the setting mode of the segment SE (the number of the segment SEs, the shape of each segment SE, and the like) in the above embodiment can be arbitrarily changed. For example, in the above embodiment, the plurality of segments SE are set such that the segments SE are arranged in the circumferential direction CD of the suction surface S1, but the plurality of segments SE are set such that the segments SE are arranged in a lattice pattern. May be done. Further, for example, in the above embodiment, the entire electrostatic chuck 100 is virtually divided into a plurality of segments SE, but a part of the electrostatic chuck 100 may be virtually divided into a plurality of segments SE. Good. In the electrostatic chuck 100, the segment SE does not necessarily need to be set.

  Further, the material for forming each member in the electrostatic chuck 100 of the above embodiment is merely an example, and can be arbitrarily changed. For example, in the above embodiment, the plate member 10 is formed of ceramics, but the plate member 10 may be formed of a material other than ceramics (for example, a resin material).

  Further, in the above embodiment, each via may be configured by a single via, or may be configured by a group of a plurality of vias. In the above-described embodiment, each via may have a single-layer configuration including only a via portion, or a multi-layer configuration (for example, a configuration in which a via portion, a pad portion, and a via portion are stacked). Is also good.

  Further, in the above-described embodiment, a monopolar system in which one chuck electrode 40 is provided inside the plate-shaped member 10 is adopted. However, a bipolar system in which a pair of chuck electrodes 40 are provided inside the plate-shaped member 10 is used. A scheme may be adopted.

  In addition, the present invention is not limited to the electrostatic chuck 100 that holds the wafer W using electrostatic attraction, but also includes a plate-shaped member, a base member, an adhesive portion, and a heater electrode disposed on the plate-shaped member. A configuration (power supply electrode, power supply terminal, connection member, etc.) for supplying power to the heater electrode, and another holding device (for example, a heater device such as a CVD heater or the like) for holding an object on the surface of the plate-shaped member. Similarly, the present invention can be applied to a vacuum chuck or the like.

10: Plate member 12: Concave portion 14: Bottom surface 20: Base member 21: Refrigerant channel 22: First through hole 30: Adhesive portion 32: Second through hole 40: Chuck electrode 50: Heater electrode layer 51: Driver 53: Via 54: Via 70: Power supply electrode 72: Power supply terminal 74: Base 76: Convex connection 78: Brazing material 80: Cable 82: Insulating resin 90: Connection member 91: Concave connection 92: Body 94: End Part 96: End part 100: Electrostatic chuck 500: Heater electrode 502: Heater line part 504: Heater pad part 510: Conductive area BL1: First boundary line BL2: Second boundary line CD: Circumferential direction CP: Center Point Ht: Terminal hole PS: Power supply RD: Radial direction S1: Suction surface S2: Lower surface S3: Upper surface S4: Lower surface SE: Segment W: Wafer

Claims (2)

A plate-shaped member having a substantially planar first surface substantially orthogonal to the first direction, and a second surface opposite to the first surface;
A plurality of heater electrodes arranged on the plate-shaped member,
A third surface, and a fourth surface opposite to the third surface, wherein the third surface is disposed so as to face the second surface of the plate member; A base member formed with a first through hole penetrating from the third surface to the fourth surface, and a coolant channel;
The plate member is disposed between the second surface of the plate member and the third surface of the base member to bond the plate member and the base member, and the first penetrating of the base member. An adhesive portion formed with a second through hole communicating with the hole and forming a terminal hole together with the first through hole;
A plurality of power supply electrodes disposed in a region of the second surface of the plate-like member that constitutes a bottom surface of the terminal hole, and electrically connected to the heater electrode;
A power supply terminal having a convex connection portion, wherein the convex connection portion is provided on each of the power supply electrodes in the terminal hole, and extends in the first direction.
A connection member having a plurality of concave connection portions that are fitted with each of the convex connection portions and are electrically connected to the convex connection portion;
A cable electrically connected to each of the concave connection portions of the connection member;
A holding device for holding an object on the first surface of the plate-like member,
The convex connection portion of each of the power supply terminals is formed of a first metal material,
Each of the concave connection portions of the connection member is formed of a second metal material different from the first metal material,
In the space in the terminal hole, in the first direction, at least a space from the bottom surface to an end of the connection member on the bottom surface side is filled with an insulating resin.
A holding device characterized by the above-mentioned. The holding device according to claim 1,
In the space in the terminal hole, in the first direction, at least a space from the bottom surface to an end of the connection member opposite to the bottom surface side is filled with the insulating resin. ,
A holding device characterized by the above-mentioned.

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