JP2019149434A - Holding device - Google Patents

Abstract

To improve controllability of a temperature distribution on a surface of a plate-like member in a holding device.SOLUTION: A holding device comprises: a plate-like member; a base member; a plurality of heater electrodes arranged on the plate-like member; a power feeding terminal electrically connected to the heater electrodes; and an adhesion part adhering the plate-like member to the base member. The holding device holds an object onto a surface of the plate-like member. The plate-like member includes: a first portion overlapping with a terminal hole when viewed in a first direction substantially orthogonal to the surface; and a second portion which is a portion other than the first portion. The plurality of heater electrodes include: a first heater electrode in which at least a portion in a width direction of a heater line part is arranged in the first portion of the plate-like member over the entirety of an extension direction of the heater line part; and a second heater electrode, connected in parallel to the first heater electrode, in which the entirety of the heater line part is arranged in the second portion of the plate-like member.SELECTED DRAWING: Figure 6

Description

  The technology disclosed in this specification relates to a holding device that holds an object.

  For example, an electrostatic chuck is used as a holding device for holding a wafer when manufacturing a semiconductor. The electrostatic chuck is made of, for example, ceramics, and has a plate-like member having a substantially planar surface (hereinafter referred to as an “adsorption surface”) substantially orthogonal to a predetermined direction (hereinafter referred to as “first direction”); For example, a base member made of metal, a bonding portion that bonds the plate member and the base member, and a chuck electrode disposed inside the plate member are provided. The electrostatic chuck attracts and holds the wafer on the attracting surface of the plate-like member by using electrostatic attraction generated by applying a voltage to the chuck electrode.

  If the temperature of the wafer held on the chucking surface of the electrostatic chuck does not reach a desired temperature, the accuracy of each process (film formation, etching, etc.) on the wafer may be reduced. The ability to control the distribution is required. Therefore, the electrostatic chuck is provided with a heater electrode arranged on the plate-like member and a power supply terminal electrically connected to the heater electrode. The heater electrode has a heater line portion that is a linear resistance heating element. The power supply terminal is accommodated in a terminal hole formed by a through hole formed in the base member and the bonding portion. In the electrostatic chuck having such a configuration, when a voltage is applied from the power source to the heater electrode via the power supply terminal, the heater electrode generates heat to heat the plate member, and thereby the suction surface of the plate member. Temperature distribution control (as a result, control of the temperature distribution of the wafer held on the suction surface) is realized.

  As described above, the electrostatic chuck is provided with a terminal hole constituted by a through hole formed in the base member and the bonding portion. Therefore, the plate-like member includes a portion that overlaps the terminal hole in the first direction view (hereinafter referred to as “overlap portion with the terminal hole” or simply “overlap portion”) and a portion other than the overlap portion (that is, The portion that does not overlap with the terminal hole when viewed in the first direction is referred to as “a non-overlapping portion with the terminal hole” or simply “non-overlapping portion”). Conventionally, in an electrostatic chuck, a configuration in which a heater electrode is disposed across an overlapping portion and a non-overlapping portion with a terminal hole in a plate-like member (for example, see Patent Document 1).

JP 2017-228360 A

  The conditions relating to heat transfer between the plate-shaped member and the base member (for example, heat extraction from the plate-shaped member by the base member) differ between the overlapping portion and the non-overlapping portion of the plate-shaped member with the terminal hole. For this reason, in the conventional electrostatic chuck in which the heater electrode described above is arranged across the overlapping portion and the non-overlapping portion with the terminal hole in the plate-like member, the above-mentioned heat transfer condition is applied when voltage is applied to the heater electrode. As a result, the difference between the temperature of the overlapping portion and the temperature of the non-overlapping portion with the terminal hole in the plate-like member becomes large, and as a result, the controllability of the temperature distribution on the adsorption surface of the plate-like member (and thus , The controllability of the temperature distribution of the wafer held by the electrostatic chuck may be reduced.

  Such a problem is not limited to an electrostatic chuck that holds a wafer using electrostatic attraction, but a plate-like member, a base member, an adhesive portion that bonds the plate-like member and the base member, and a plate This is a common problem in general for a holding device that includes a heater electrode arranged on a plate-like member and a power supply terminal electrically connected to the heater electrode and holds an object on the surface of the plate-like member.

  In this specification, the technique which can solve the subject mentioned above is disclosed.

  The technology disclosed in the present specification can be realized as, for example, the following forms.

(1) A holding device disclosed in the present specification includes a plate having a substantially planar first surface substantially orthogonal to a first direction, and a second surface opposite to the first surface. And a fourth surface opposite to the third surface, the third surface facing the second surface of the plate-shaped member. A base member in which a first through hole penetrating from the third surface to the fourth surface is formed, and a plurality of heater electrodes disposed in the plate-like member, A plurality of heater electrodes having a heater line portion that is a linear resistance heating element in a direction of 1; a power supply terminal electrically connected to the heater electrode; the second surface of the plate-like member; It is arrange | positioned between the said 3rd surface of a base member, and while adhering the said plate-shaped member and the said base member, An adhesive portion formed with a second through hole that communicates with the first through hole of the base member and forms a terminal hole in which the power supply terminal is accommodated together with the first through hole; In the holding device for holding an object on the first surface of the plate-shaped member, the plate-shaped member includes a first portion that overlaps the terminal hole in the first direction, and the first A plurality of heater electrodes, and at least a part of the heater line portion in the width direction is the plate-like shape over the entire extending direction of the heater line portion. The first heater electrode disposed in the first portion of the member is in a parallel connection relationship with the first heater electrode, and the entire heater line portion is the second portion of the plate-like member. And a second heater electrode. In the holding device, the plurality of heater electrodes arranged on the plate-like member includes a first heater electrode and a second heater electrode. The first heater electrode includes a first portion of the plate-like member in which at least a part in the width direction of the heater line portion extends in the extending direction of the heater line portion (a portion overlapping the terminal hole in the first direction view). It is the heater electrode arrange | positioned in. Further, the second heater electrode is connected in parallel with the first heater electrode, and the entire heater line portion is a second portion (a portion other than the first portion, that is, the first portion of the plate-like member). This is a heater electrode disposed in a portion not overlapping the terminal hole in a direction view. For this reason, in the holding device, the first heater electrode and the second heater electrode are individually controlled so as to compensate for the difference in conditions regarding the heat transfer between the first portion and the second portion of the plate-like member. By doing so, the temperature of the first part and the temperature of the second part can be individually controlled. Therefore, according to the present holding device, the controllability of the temperature distribution on the first surface of the plate-like member (and hence the controllability of the temperature distribution of the object held by the holding device) can be improved.

(2) In the holding device, the entire heater line portion of the first heater electrode may be arranged in the first portion of the plate-like member. In the holding device, the entire heater line portion of the first heater electrode is disposed in the first portion of the plate-like member (the portion overlapping the terminal hole as viewed in the first direction). Therefore, in the present holding device, the first heater electrode and the second heater electrode are arranged so as to effectively compensate for the difference in the conditions regarding the heat transfer between the first portion and the second portion of the plate-like member. By individually controlling the temperature, the temperature of the first portion and the temperature of the second portion can be individually and accurately controlled. Therefore, according to the present holding device, it is possible to effectively improve the controllability of the temperature distribution on the first surface of the plate-like member (and thus the controllability of the temperature distribution of the object held by the holding device). .

(3) In the holding device, the plurality of heater electrodes are arranged in the second portion of the plate-like member in the entire width direction of the heater line portion at one position in the extending direction of the heater line portion. And at least in a part of the width direction of the heater line portion at other positions in the extending direction of the heater line portion, the heater electrode arranged in the first portion of the plate-like member may not be included. Good. In this holding device, the entire width direction of the heater line portion is arranged in a second portion (a portion not overlapping the terminal hole in the first direction view) at one position in the extending direction of the heater line portion, and There is a heater electrode having a configuration in which at least a part in the width direction of the heater line portion is disposed in the first portion (portion overlapping the terminal hole as viewed in the first direction) at another position in the extending direction of the heater line portion. do not do. That is, the holding device does not have a heater electrode having a configuration in which the heater line portion extends over the first portion and the second portion. Therefore, in this holding device, the accuracy of the control of the temperature of the first part and the temperature of the second part is improved by the presence of the heater electrode having a configuration in which the heater line part extends over the first part and the second part. It can suppress that it falls. Therefore, according to the present holding device, the controllability of the temperature distribution on the first surface of the plate-like member (and hence the controllability of the temperature distribution of the object held by the holding device) can be more effectively improved. it can.

(4) In the holding device, the first heater electrode may have a higher resistance per unit area as viewed in the first direction than the second heater electrode. The first part of the plate-like member (the part that overlaps the terminal hole in the first direction) is compared with the second part (the part that does not overlap the terminal hole in the first direction) as compared with the base member. Due to the small amount of heat drawn by, it tends to be hot. In this holding device, the first heater electrode arranged in the first part of the plate-like member is a unit in the first direction view as compared with the second heater electrode arranged in the second part. High resistance per area. Therefore, when the same voltage is applied to the first heater electrode and the second heater electrode, the heat generation amount of the first heater electrode can be made smaller than the heat generation amount of the second heater electrode. Therefore, according to the present holding device, it is possible to easily compensate (by relatively simple control) the difference in the conditions regarding the heat transfer between the first portion and the second portion of the plate-like member, The controllability of the temperature distribution on the first surface of the first member (and hence the controllability of the temperature distribution of the object held by the holding device) can be effectively improved.

(5) The holding device may further include a temperature sensor accommodated in the terminal hole. According to the present holding device, the holding device is arranged in the first portion (the portion overlapping the terminal hole in the first direction view) based on the temperature detection result by the temperature sensor accommodated in the terminal hole. The first heater electrode can be controlled. Therefore, according to the present holding device, the temperature of the first portion, which is a portion that tends to be a temperature singular point in the plate member, can be accurately controlled, and the controllability of the temperature distribution on the first surface of the plate member. (As a result, the controllability of the temperature distribution of the object held by the holding device) can be improved extremely effectively.

  The technology disclosed in this specification can be realized in various forms, for example, in the form of a holding device, an electrostatic chuck, a vacuum chuck, a manufacturing method thereof, and the like. is there.

1 is a perspective view schematically showing an external configuration of an electrostatic chuck 100 in the present embodiment. It is explanatory drawing which shows roughly the XZ cross-sectional structure of the electrostatic chuck 100 in this embodiment. It is explanatory drawing which shows roughly the XY plane (upper surface) structure of the electrostatic chuck 100 in this embodiment. FIG. 4 is an explanatory diagram schematically showing a heater electrode layer and a configuration for supplying power to the heater electrode layer. It is explanatory drawing which expands and shows the YZ cross-section structure of the peripheral part (X1 part in FIG. 4) of the hole Ht for terminals. It is explanatory drawing which shows typically XY cross-section structure of the heater electrode 500 arrange | positioned at each segment SE. It is explanatory drawing which shows typically XY cross-section structure of the heater electrode 500 arrange | positioned at each segment SE in a modification. It is explanatory drawing which shows typically XY cross-section structure of the one heater electrode 500 arrange | positioned at one segment SE in a comparative example.

A. This embodiment:
A-1. Configuration of the electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing an external configuration of the electrostatic chuck 100 in the present embodiment, and FIG. 2 is an explanatory diagram schematically showing an XZ sectional configuration of the electrostatic chuck 100 in the present embodiment. FIG. 3 is an explanatory diagram schematically showing an XY plane (upper surface) configuration of the electrostatic chuck 100 according to the present embodiment. In each figure, XYZ axes orthogonal to each other for specifying the direction are shown. In this specification, for convenience, the positive direction of the Z-axis is referred to as the upward direction, and the negative direction of the Z-axis is referred to as the downward direction. However, the electrostatic chuck 100 is actually installed in a direction different from such a direction. May be.

  The electrostatic chuck 100 is a device that attracts and holds an object (for example, a wafer W) by electrostatic attraction, and is used, for example, to fix the wafer W in a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 100 includes a plate-like member 10 and a base member 20 arranged in a predetermined arrangement direction (in this embodiment, the vertical direction (Z-axis direction)). The plate member 10 and the base member 20 are arranged so that the lower surface S2 (see FIG. 2) of the plate member 10 and the upper surface S3 of the base member 20 face each other in the arrangement direction.

  The plate-like member 10 is a plate-like member having a substantially circular planar upper surface (hereinafter referred to as “adsorption surface”) S1 substantially orthogonal to the arrangement direction (Z-axis direction) described above. For example, ceramic (for example, alumina or For example, aluminum nitride). The diameter of the plate member 10 is, for example, about 50 mm to 500 mm (usually, about 200 mm to 350 mm), and the thickness of the plate member 10 is, for example, about 1 mm to 10 mm. The suction surface S1 of the plate member 10 corresponds to the first surface in the claims, the lower surface S2 of the plate member 10 corresponds to the second surface in the claims, and the Z-axis direction is This corresponds to the first direction in the claims. Further, in this specification, a direction orthogonal to the Z-axis direction is referred to as a “surface direction”. As shown in FIG. 3, a circumferential direction centered on the center point CP of the suction surface S1 among the surface directions is “ The direction “circumferential direction CD” is referred to as a “radial direction RD”.

  As shown in FIG. 2, a chuck electrode 40 made of a conductive material (for example, tungsten, molybdenum, platinum, etc.) is disposed inside the plate-like member 10. The shape of the chuck electrode 40 as viewed in the Z-axis direction is, for example, a substantially circular shape. When a voltage is applied to the chuck electrode 40 from a power source (not shown), an electrostatic attractive force is generated, and the wafer W is attracted and fixed to the attracting surface S1 of the plate-like member 10 by the electrostatic attractive force.

  Inside the plate-like member 10, a heater electrode layer 50, a driver 51 for supplying power to the heater electrode layer 50, and various types, each formed of a conductive material (for example, tungsten, molybdenum, platinum, etc.) Vias 53 and 54 are arranged. In the present embodiment, the heater electrode layer 50 is disposed below the chuck electrode 40, and the driver 51 is disposed below the heater electrode layer 50. These configurations will be described in detail later. The plate-like member 10 having such a structure is prepared by, for example, producing a plurality of ceramic green sheets and performing processing such as formation of via holes, filling of metallized paste and printing on predetermined ceramic green sheets. The green sheet can be produced by thermocompression bonding, firing and cutting.

  The base member 20 is, for example, a circular flat plate-like member having the same diameter as the plate-like member 10 or a larger diameter than the plate-like member 10, and is formed of, for example, metal (aluminum, aluminum alloy, or the like). The diameter of the base member 20 is, for example, about 220 mm to 550 mm (usually 220 mm to 350 mm), and the thickness of the base member 20 is, for example, about 20 mm to 40 mm. The upper surface S3 of the base member 20 corresponds to the third surface in the claims, and the lower surface S4 of the base member 20 corresponds to the fourth surface in the claims.

  The base member 20 is joined to the plate member 10 by an adhesive portion 30 disposed between the lower surface S2 of the plate member 10 and the upper surface S3 of the base member 20. The adhesion part 30 is comprised by adhesive materials, such as silicone resin, acrylic resin, an epoxy resin, for example. The thickness of the bonding part 30 is, for example, about 0.1 mm to 1 mm.

  A coolant channel 21 is formed inside the base member 20. When a refrigerant (for example, a fluorine-based inert liquid or water) flows through the refrigerant flow path 21, the base member 20 is cooled, and heat transfer between the base member 20 and the plate-like member 10 via the adhesive portion 30 is performed. The plate member 10 is cooled by (heat drawing), and the wafer W held on the suction surface S1 of the plate member 10 is cooled. Thereby, control of the temperature distribution of the wafer W is implement | achieved.

A-2. Configuration for supplying power to the heater electrode layer 50 and the heater electrode layer 50:
Next, the configuration of the heater electrode layer 50 and the configuration for supplying power to the heater electrode layer 50 will be described in detail. As described above, the plate-like member 10 is provided with the heater electrode layer 50, the driver 51 for supplying power to the heater electrode layer 50, and various vias 53 and 54. In addition, the electrostatic chuck 100 is provided with another configuration for supplying power to the heater electrode layer 50 (a power supply terminal 72 accommodated in a terminal hole Ht described later). FIG. 4 is an explanatory diagram schematically showing a configuration for the heater electrode layer 50 and the power supply to the heater electrode layer 50. 4 schematically shows a YZ cross-sectional configuration of a part of the heater electrode layer 50 arranged on the plate-like member 10, and the middle row of FIG. 4 shows the arrangement on the plate-like member 10. An XY plane configuration of a part of the driver 51 is schematically shown, and a YZ cross-sectional configuration of another configuration for supplying power to the heater electrode layer 50 is schematically shown in the lower part of FIG. . FIG. 5 is an explanatory view showing, in an enlarged manner, a YZ cross-sectional configuration of a peripheral portion (X1 portion in FIG. 4) of a terminal hole Ht described later.

  Here, as shown in FIG. 3, in the electrostatic chuck 100 of the present embodiment, the segment SE (which is a plurality of virtual regions arranged in the plane direction (direction orthogonal to the Z-axis direction)) is arranged on the plate member 10. 3 is set). More specifically, when viewed in the Z-axis direction, the plate-like member 10 has a plurality of virtual annular regions (provided that a plurality of concentric first boundary lines BL1 around the center point CP of the suction surface S1). Only the region including the center point CP is divided into circular regions), and each annular region is a plurality of virtual regions arranged in the circumferential direction CD by a plurality of second boundary lines BL2 extending in the radial direction RD. It is divided into segments SE. In the upper part of FIG. 4, three segments SE set on the plate-like member 10 are shown as an example.

  As shown in the upper part of FIG. 4, the heater electrode layer 50 includes a plurality of heater electrodes 500. Each of the plurality of heater electrodes 500 included in the heater electrode layer 50 is disposed in one of the plurality of segments SE set in the plate-like member 10. That is, in the electrostatic chuck 100 of the present embodiment, one heater electrode 500 is disposed in each of the plurality of segments SE. In other words, in the plate-like member 10, a portion where one heater electrode 500 is disposed (mainly a portion heated by the heater electrode 500) becomes one segment SE.

  FIG. 6 is an explanatory diagram schematically showing the XY cross-sectional configuration of the heater electrode 500 arranged in each segment SE. FIG. 6 shows an XY cross-sectional configuration of two heater electrodes 500 arranged in two segments SE. As shown in FIG. 6, the heater electrode 500 includes a heater line portion 503 that is a linear resistance heating element as viewed in the Z-axis direction, and heater pad portions 504 connected to both ends of the heater line portion 503. In the present embodiment, the heater line portion 503 has a shape that passes through each position in the segment SE as much as possible when viewed in the Z-axis direction. The configuration of the heater electrode 500 disposed in the other segment SE is the same.

  As shown in the middle part of FIG. 4, the driver 51 arranged on the plate-like member 10 has a plurality of conductive regions (conductive lines) 510. The plurality of conductive regions 510 include individual conductive regions 510i and a common conductive region 510c. The individual conductive region 510 i is a conductive region 510 that is electrically connected to one heater electrode 500 through the via 53. On the other hand, the common conductive region 510 c is a conductive region 510 that is electrically connected to the plurality of heater electrodes 500 through the via 53. In the example of FIG. 4, the common conductive region 510 c is electrically connected to all three heater electrodes 500.

  As shown in the lower part of FIGS. 2 and 4 and FIG. 5, the electrostatic chuck 100 has a plurality of terminal holes Ht. As shown in FIG. 5, each terminal hole Ht includes a first through hole 22 that penetrates the base member 20 from the upper surface S3 to the lower surface S4, and a second through hole 32 that penetrates the bonding portion 30 in the vertical direction. The recess 12 formed on the lower surface S2 side of the plate-like member 10 is an integrated hole configured by communicating with each other. Although the cross-sectional shape orthogonal to the extending direction of the terminal hole Ht can be set arbitrarily, it is, for example, a circle, a square, a sector, or the like. A plurality of power supply pads 70 made of a conductive material are formed at positions corresponding to the terminal holes Ht on the lower surface S2 of the plate member 10 (positions overlapping the terminal holes Ht in the Z-axis direction). ing. Each power supply pad 70 is electrically connected to the conductive region 510 (individual conductive region 510 i or common conductive region 510 c) of the driver 51 through the via 54.

  Each terminal hole Ht accommodates a plurality of power supply terminals 72 made of a conductive material. Each power supply terminal 72 has a base portion 74 and a rod-like portion 76 extending from the base portion 74. The base 74 of the power supply terminal 72 is joined to the power supply pad 70 by brazing using, for example, a brazing material 78.

  Further, in each terminal hole Ht, each power supply terminal 72 is accommodated in each of a plurality of recesses 91 formed in the connector-shaped insulating member 90. That is, the plurality of power supply terminals 72 accommodated in one terminal hole Ht are arranged in the plane direction with the insulating member 90 interposed therebetween. Each power supply terminal 72 is electrically connected to a wiring (for example, jumper wire) 80 connected to the power source PS (FIG. 2). The insulating member 90 is made of, for example, a heat resistant resin (polyimide resin, epoxy resin, polyether ether ketone resin, etc.). In the present embodiment, each recess 91 of the insulating member 90 is configured to integrally surround one power supply terminal 72 and one power supply pad 70.

  In the present embodiment, the plurality of power supply terminals 72 provided on the electrostatic chuck 100 include individual power supply terminals 72i and a common power supply terminal 72c. The individual power supply terminal 72 i is a power supply terminal 72 electrically connected to one heater electrode 500 through the power supply pad 70, the via 54, the individual conductive region 510 i of the driver 51, and the via 53. On the other hand, the common power supply terminal 72 c is a power supply terminal 72 electrically connected to the plurality of heater electrodes 500 through the power supply pad 70, the via 54, the common conductive region 510 c of the driver 51, and the via 53. . That is, in the electrostatic chuck 100 of the present embodiment, one end of each of the plurality of heater electrodes 500 is electrically connected to different individual power supply terminals 72i, and the other end of each of the plurality of heater electrodes 500 is The heater electrode 500 is electrically connected to the common power supply terminal 72 c (one or more), and the heater electrodes 500 are connected in parallel to each other. For example, among the six power supply terminals 72 accommodated in the terminal hole Ht shown in the lower part of FIG. 4, the right three power supply terminals 72 are respectively the three heater electrodes 500 arranged in the three segments SE. Are three individual power supply terminals 72i electrically connected to each other. The three left power supply terminals 72 are three common power supply terminals 72c that are electrically connected to all of the three heater electrodes 500 arranged in the three segments SE.

  Since the electrostatic chuck 100 is provided with a terminal hole Ht, as shown in FIG. 2, the plate member 10 has a portion overlapping the terminal hole Ht as viewed in the Z-axis direction (hereinafter referred to as “terminal hole Ht”). The overlapping portion P1 ”or simply“ the overlapping portion P1 ”) and the portion other than the overlapping portion P1 with the terminal hole Ht (that is, the portion not overlapping the terminal hole Ht in the Z-axis direction view, A non-overlapping portion P2 "with the terminal hole Ht" or simply "non-overlapping portion P2"). The overlapping part P1 with the terminal hole Ht in the plate-like member 10 corresponds to the first part in the claims, and the non-overlapping part P2 with the terminal hole Ht in the plate-like member 10 is in the claims. This corresponds to the second part.

  In the electrostatic chuck 100 of the present embodiment, the position of the terminal hole Ht is considered with respect to the segment SE division in the plate-like member 10 (that is, the arrangement setting of the heater electrode 500 in the plate-like member 10). Specifically, as shown in FIGS. 3 and 4, segment SE division is performed so that the overlapping portion P1 of the plate-like member 10 with one terminal hole Ht substantially coincides with one segment SE. ing. In other words, one heater electrode 500 is disposed in the overlapping portion P1 of the plate-like member 10 with one terminal hole Ht.

  In the following description, among the plurality of segments SE set in the plate-like member 10, the “first segment SE <b> 1” is specifically indicated when the segment SE substantially coincides with the overlapping portion P <b> 1 with the terminal hole Ht. In other words, the segment SE other than the first segment SE1 (namely, the segment SE set in the non-overlapping portion P2 with the terminal hole Ht) is referred to as “second segment SE2”.

  In the following description, the heater electrode 500 disposed in the overlapping portion P1 (first segment SE1) with the terminal hole Ht among the plurality of heater electrodes 500 disposed in the plate-like member 10 is particularly shown. Is referred to as a “first heater electrode 501”, and the heater electrode 500 disposed in the non-overlapping portion P2 (second segment SE2) with the terminal hole Ht is specifically referred to as “second heater electrode 502”. " Here, in the present specification, the fact that the first heater electrode 501 is disposed in the overlapping portion P1 with the terminal hole Ht in the plate member 10 means that the heater line portion 503 of the first heater electrode 501 is extended. It means that at least a part of the heater line portion 503 in the width direction D2 is disposed in the overlapping portion P1 with the terminal hole Ht throughout the direction D1. That is, the fact that the first heater electrode 501 is disposed in the overlapping portion P1 with the terminal hole Ht in the plate-like member 10 means that the heater of the first heater electrode 501 as in this embodiment shown in FIG. In addition to the state in which the entire line portion 503 is disposed in the overlapping portion P1 with the terminal hole Ht, a part (503a) in the width direction D2 of the heater line portion 503 is formed as in the modification shown in FIG. The other part (503b) of the heater line portion 503 in the width direction D2 is disposed outside the overlapping part P1 with the terminal hole Ht (that is, the terminal hole Ht). And a state of being arranged in a non-overlapping portion P2).

  In the electrostatic chuck 100 of the present embodiment, the heater line portion 503 has a non-overlapping portion P2 (second segment SE2) between the overlapping portion P1 (first segment SE1) with the terminal hole Ht and the terminal hole Ht. ) Does not exist. More specifically, in the electrostatic chuck 100 according to the present embodiment, the entire width direction D2 of the heater line portion 503 forms a non-overlapping portion P2 with the terminal hole Ht at one position in the extending direction D1 of the heater line portion 503. A heater electrode 500 having a configuration in which at least a part of the heater line portion 503 in the width direction D2 is arranged in the overlapping portion P1 with the terminal hole Ht at another position in the extending direction D1 of the heater line portion 503 is provided. not exist.

  Further, as shown in FIGS. 6 and 7, in the present embodiment, the first heater electrode 501 disposed in the overlapping portion P1 (first segment SE1) with the terminal hole Ht is connected to the terminal hole Ht. Compared with the second heater electrode 502 arranged in the non-overlapping portion P2 (second segment SE2), the line width of the heater line portion 503 is narrowed. As a result, the extending direction of the heater line portion 503 The cross-sectional area perpendicular to D1 is small. Therefore, the first heater electrode 501 has a higher resistance per unit area when viewed in the Z-axis direction than the second heater electrode 502.

  Further, as shown in FIG. 4, a temperature sensor 92 is accommodated in the terminal hole Ht. The temperature sensor 92 is configured using, for example, a thermocouple, and is a sensor that detects temperature. As shown in FIGS. 6 and 7, the temperature sensor 92 is installed at a position close to the center of the terminal hole Ht as viewed in the Z-axis direction (that is, a position close to the center of the first segment SE1).

  In the electrostatic chuck 100 having such a configuration, from the power source PS to the wiring 80, the power supply terminal 72 (the individual power supply terminal 72i and the common power supply terminal 72c), the power supply pad 70, the via 54, and the conductive region 510 (the individual conductive region 510i) of the driver 51. When a voltage is applied to the heater electrode 500 through the common conductive region 510c) and the via 53, the heater electrode 500 generates heat. Thereby, the segment SE in which the heater electrode 500 is arranged is heated, and the temperature distribution of the suction surface S1 of the plate-like member 10 is controlled (as a result, the temperature distribution of the wafer W held on the suction surface S1 of the plate-like member 10). Control) is realized.

  In the electrostatic chuck 100 of this embodiment, the temperature sensor 92 disposed in the terminal hole Ht is used for the first heater electrode 501 disposed in the overlapping portion P1 (first segment SE1) with the terminal hole Ht. Control of the voltage applied to the first heater electrode 501 (that is, control of the amount of heat generated by the first heater electrode 501) is executed in accordance with the temperature detection result obtained by. In addition, for the second heater electrode 502 arranged in the non-overlapping portion P2 (second segment SE2) with the terminal hole Ht, according to the temperature estimation result based on the measurement result of the resistance value of the heater line portion 503, the first Control of the voltage applied to the second heater electrode 502 (that is, control of the amount of heat generated by the second heater electrode 502) is executed.

A-3. Effects of this embodiment:
As described above, the electrostatic chuck 100 of this embodiment includes the plate-like member 10 and the base member 20. The plate-like member 10 has a substantially planar suction surface S1 substantially orthogonal to the Z-axis direction, and a lower surface S2 opposite to the suction surface S1. The base member 20 has an upper surface S3 and a lower surface S4 opposite to the upper surface S3, and is disposed so that the upper surface S3 faces the lower surface S2 of the plate-like member 10. The base member 20 is formed with a first through hole 22 that penetrates from the upper surface S3 to the lower surface S4. In addition, the electrostatic chuck 100 according to the present embodiment includes a plurality of heater electrodes 500 arranged on the plate-like member 10 and a power supply terminal 72 electrically connected to the heater electrode 500. Each heater electrode 500 includes a heater line portion 503 that is a linear resistance heating element as viewed in the Z-axis direction. In addition, the electrostatic chuck 100 of the present embodiment includes an adhesive portion 30 that is disposed between the lower surface S2 of the plate-like member 10 and the upper surface S3 of the base member 20 and adheres the plate-like member 10 and the base member 20. . The bonding portion 30 is formed with a second through hole 32 that communicates with the first through hole 22 of the base member 20 and constitutes the terminal hole Ht in which the power supply terminal 72 is accommodated together with the first through hole 22. Has been. Further, the plate-like member 10 includes a portion that overlaps the terminal hole Ht as viewed in the Z-axis direction (overlapping portion P1 with the terminal hole Ht) and a portion other than the overlapping portion P1 (non-overlapping portion P2 with the terminal hole Ht). ). Further, as shown in FIGS. 6 and 7, the plurality of heater electrodes 500 included in the electrostatic chuck 100 have at least a part of the heater line portion 503 in the width direction D2 extending in the extending direction D1 of the heater line portion 503. The first heater electrode 501 disposed in the overlapping portion P1 (first segment SE1) with the terminal hole Ht in the plate member 10 is in a parallel connection relationship with the first heater electrode 501, and the heater line portion The entirety of 503 includes the second heater electrode 502 disposed in the non-overlapping portion P2 (second segment SE2) with the terminal hole Ht in the plate-like member 10. Since the electrostatic chuck 100 of the present embodiment has such a configuration, the controllability of the temperature distribution of the suction surface S1 of the plate-like member 10 can be improved as described in detail below.

  FIG. 8 is an explanatory diagram schematically showing an XY cross-sectional configuration of one heater electrode 500 arranged in one segment SE in the comparative example. In the comparative example shown in FIG. 8, the position of the terminal hole Ht is not considered with respect to the segment SE division in the plate-like member 10 (that is, the arrangement setting of the heater electrode 500 in the plate-like member 10). There is no segment SE that substantially matches the overlapping portion P1 with Ht. Therefore, in the comparative example shown in FIG. 8, the heater line portion 503 of one heater electrode 500 is disposed across the overlapping portion P1 and the non-overlapping portion P2 with the terminal hole Ht in the plate-like member 10. Here, in the overlapping part P1 (first segment SE1) and the non-overlapping part P2 (second segment SE2) with the terminal hole Ht in the plate-like member 10, between the plate-like member 10 and the base member 20 The heat transfer conditions (for example, heat extraction from the plate member 10 by the base member 20) are different. Therefore, as in the comparative example shown in FIG. 8, the heater line portion 503 of one heater electrode 500 is disposed across the overlapping portion P1 and the non-overlapping portion P2 with the terminal hole Ht in the plate-like member 10. In the configuration, when the voltage is applied to the heater electrode 500, the temperature of the overlapping portion P1 with the terminal hole Ht and the temperature of the non-overlapping portion P2 in the plate-like member 10 due to the difference in conditions regarding the heat transfer. As a result, the controllability of the temperature distribution of the suction surface S1 of the plate-like member 10 (and thus the controllability of the temperature distribution of the wafer W held by the electrostatic chuck 100) may be reduced.

  Further, in the heater electrode 500 arranged across the overlapping portion P1 and the non-overlapping portion P2 with the terminal hole Ht in the plate-like member 10, the above-described overlapping portion P1 with the terminal hole Ht and the non-overlapping portion P2 are described above. In order to compensate for the difference in conditions related to heat transfer, the heater electrode 500 is composed of a portion located in the overlapping portion P1 with the terminal hole Ht and a portion located in the non-overlapping portion P2 (for example, line width, etc. ) May be different. However, even if it does so, the difference in the conditions regarding the said heat transfer of the overlapping part P1 and the non-overlapping part P2 with the hole Ht for terminals with the change of environmental conditions (for example, temperature change accompanying ON / OFF of plasma). Therefore, the difference between the temperature of the overlapping portion P1 and the temperature of the non-overlapping portion P2 with respect to the terminal hole Ht becomes large. (As a result, the controllability of the temperature distribution of the wafer W held by the electrostatic chuck 100) may be reduced.

  On the other hand, in the electrostatic chuck 100 of the present embodiment, at least a part of the heater line portion 503 in the width direction D2 is in contact with the terminal hole Ht in the plate member 10 over the entire extending direction D1 of the heater line portion 503. The first heater electrode 501 disposed in the overlapping portion P1 (first segment SE1) is in parallel connection with the first heater electrode 501, and the entire heater line portion 503 is for terminals in the plate-like member 10. And a second heater electrode 502 arranged in a non-overlapping portion P2 (second segment SE2) with the hole Ht. Therefore, in the electrostatic chuck 100 of the present embodiment, the first heater is compensated so as to compensate for the difference in the heat transfer conditions between the overlapping portion P1 and the non-overlapping portion P2 of the plate-like member 10 with the terminal hole Ht. By individually controlling the electrode 501 and the second heater electrode 502, the temperature of the overlapping portion P1 and the temperature of the non-overlapping portion P2 with the terminal hole Ht can be individually controlled. Therefore, according to the electrostatic chuck 100 of the present embodiment, the controllability of the temperature distribution of the suction surface S1 of the plate member 10 (and hence the controllability of the temperature distribution of the wafer W held on the electrostatic chuck 100) is improved. Can be made.

  In particular, as shown in FIG. 6, in the electrostatic chuck 100 of the present embodiment, unlike the modification example shown in FIG. 7, the entire heater line portion 503 of the first heater electrode 501 is used for terminals in the plate member 10. It arrange | positions in the duplication part P1 with the hole Ht. In the electrostatic chuck 100 of the present embodiment, at least one part in the width direction D2 of the heater line portion 503 is not connected to the terminal hole Ht in the plate member 10 at one position in the extending direction D1 of the heater line portion 503. At least part of the width direction D2 of the heater line portion 503 is located at the overlap portion P1 with the terminal hole Ht in the plate member 10 at another position in the extending direction D1 of the heater line portion 503. There is no heater electrode 500 having the arrangement. For this reason, in the electrostatic chuck 100 of the present embodiment, the plate member 10 has a first so as to effectively compensate for the difference in the conditions regarding the heat transfer between the overlapping portion P1 and the non-overlapping portion P2 with the terminal hole Ht. By individually controlling the first heater electrode 501 and the second heater electrode 502, the temperature of the overlapping portion P1 and the temperature of the non-overlapping portion P2 with the terminal hole Ht can be individually controlled with high accuracy. . Therefore, according to the electrostatic chuck 100 of the present embodiment, the controllability of the temperature distribution of the attracting surface S1 of the plate-like member 10 (and thus the controllability of the temperature distribution of the wafer W held on the electrostatic chuck 100) is effective. Can be improved.

  In the electrostatic chuck 100 of the present embodiment, the heater line portion 503 has a non-overlapping portion P2 (second segment SE2) between the overlapping portion P1 (first segment SE1) with the terminal hole Ht and the terminal hole Ht. ) Does not exist. More specifically, in the electrostatic chuck 100 according to the present embodiment, the entire width direction D2 of the heater line portion 503 forms a non-overlapping portion P2 with the terminal hole Ht at one position in the extending direction D1 of the heater line portion 503. A heater electrode 500 having a configuration in which at least a part of the heater line portion 503 in the width direction D2 is arranged in the overlapping portion P1 with the terminal hole Ht at another position in the extending direction D1 of the heater line portion 503 is provided. not exist. For this reason, in the electrostatic chuck 100 of the present embodiment, the heater line 500 has a configuration in which the heater line portion 503 extends over the overlapping portion P1 and the non-overlapping portion P2 with the terminal hole Ht. It can suppress that the precision of control with the temperature of the duplication part P2 falls. Therefore, according to the electrostatic chuck 100 of this embodiment, the controllability of the temperature distribution of the suction surface S1 of the plate-like member 10 (and thus the controllability of the temperature distribution of the wafer W held on the electrostatic chuck 100) is further increased. It can be improved effectively.

  Further, the overlapping portion P1 (first segment SE1) with the terminal hole Ht in the plate-like member 10 is compared with the non-overlapping portion P2 (second segment SE2) with the terminal hole Ht. Due to the small amount of heat drawn by, it tends to be hot. In the electrostatic chuck 100 of the present embodiment, the first heater electrode 501 disposed in the overlapping portion P1 with the terminal hole Ht in the plate member 10 is the second heater electrode 502 disposed in the non-overlapping portion P2. Compared to the above, the resistance per unit area in the Z-axis direction view is high. Therefore, when the same voltage is applied to the first heater electrode 501 and the second heater electrode 502, the heat generation amount of the first heater electrode 501 can be made smaller than the heat generation amount of the second heater electrode 502. . Therefore, according to the electrostatic chuck 100 of the present embodiment, the heat transfer between the overlapping portion P1 and the non-overlapping portion P2 of the plate-like member 10 with the terminal hole Ht is easily (by relatively simple control). Differences in conditions can be compensated, and the controllability of the temperature distribution of the suction surface S1 of the plate-like member 10 (and thus the controllability of the temperature distribution of the wafer W held by the electrostatic chuck 100) is effectively improved. be able to. In the electrostatic chuck 100 of the present embodiment, the coolant channel 21 is formed in the base member 20, but the coolant channel 21 cannot be disposed at the position of the terminal hole Ht in the base member 20. Therefore, the overlapping part P1 with the terminal hole Ht in the plate-like member 10 is less likely to be cooled than the non-overlapping part P2 with the terminal hole Ht, and tends to be a temperature singularity having a higher temperature than the non-overlapping part P2. . In the electrostatic chuck 100 of the present embodiment, as described above, the amount of heat generated by the first heater electrode 501 disposed in the overlapping portion P1 is changed to the amount of heat generated by the second heater electrode 502 disposed in the non-overlapping portion P2. Since the temperature can be made smaller, the occurrence of such temperature singularities can be suppressed, and the controllability of the temperature distribution of the attracting surface S1 of the plate-like member 10 (as a result, the wafer W held on the electrostatic chuck 100). The controllability of the temperature distribution can be effectively improved.

  Further, the electrostatic chuck 100 of the present embodiment further includes a temperature sensor 92 accommodated in the terminal hole Ht. Therefore, based on the temperature detection result by the temperature sensor 92 accommodated in the terminal hole Ht, the 1st heater arrange | positioned in the overlap part P1 (1st segment SE1) with the terminal hole Ht in the plate-shaped member 10 is shown. The electrode 501 can be controlled. Therefore, according to the electrostatic chuck 100 of the present embodiment, the temperature of the overlapping portion P1 with the terminal hole Ht in the plate-like member 10 can be accurately controlled, and the temperature distribution of the suction surface S1 of the plate-like member 10 is achieved. The controllability (and hence the controllability of the temperature distribution of the wafer W held on the electrostatic chuck 100) can be improved extremely effectively.

B. Variations:
The technology disclosed in the present specification is not limited to the above-described embodiment, and can be modified into various forms without departing from the gist thereof. For example, the following modifications are possible.

  The configuration of the electrostatic chuck 100 in the above embodiment is merely an example, and various modifications can be made. For example, in the above embodiment, one end of each heater electrode 500 is electrically connected to three common power supply terminals 72c, but the number of common power supply terminals 72c electrically connected to each heater electrode 500 is 2 It may be less than or equal to four. In the above embodiment, one end of each heater electrode 500 is electrically connected to the individual power supply terminal 72i, and the other end is electrically connected to the common power supply terminal 72c, but both ends of each heater electrode 500 are individually connected. The power supply terminal 72i may be electrically connected.

  Further, in the above-described embodiment, regarding the position of the driver 51 in the Z-axis direction, the entire driver 51 is assumed to be at the same position (that is, the driver 51 has a single layer configuration), but a part of the driver 51 is different. (That is, the driver 51 has a multi-layer structure). In the above embodiment, each heater electrode 500 is electrically connected to the power supply terminal 72 via the driver 51, but each heater electrode 500 is electrically connected to the power supply terminal 72 without using the driver 51. It may be.

  In the above embodiment, the temperature sensor 92 is accommodated in the terminal hole Ht. However, the temperature sensor 92 is not necessarily accommodated in the terminal hole Ht. When the temperature sensor 92 is not accommodated in the terminal hole Ht, the first heater electrode 501 disposed in the overlapping portion P1 (first segment SE1) with the terminal hole Ht in the plate-like member 10 is connected. The control of the applied voltage is executed according to the temperature estimation result based on the measurement result of the resistance value of the heater line unit 503, for example. Moreover, in the said embodiment, control of the applied voltage to the 2nd heater electrode 502 arrange | positioned in the non-overlap part P2 (2nd segment SE2) with the hole Ht for terminals in the plate-shaped member 10 is a heater line part. It is assumed that the process is executed according to the temperature estimation result based on the measurement result of the resistance value 503, but a temperature sensor is also provided for the non-overlapping portion P2, and applied to the second heater electrode 502 according to the temperature detection result by the temperature sensor. Voltage control may be executed.

  Moreover, in the said embodiment, the 1st heater electrode 501 arrange | positioned in the overlapping part P1 (1st segment SE1) with the hole Ht for terminals in the plate-shaped member 10 is the hole Ht for terminals in the plate-shaped member 10. Compared with the second heater electrode 502 arranged in the non-overlapping portion P2 (second segment SE2), the line width of the heater line portion 503 is narrower, so that the unit area in the Z-axis direction is smaller. However, the resistance per unit area as viewed in the Z-axis direction may be increased due to the thickness of the heater line portion 503 being reduced, or the line of the heater line portion 503 may be increased. The resistance per unit area as viewed in the Z-axis direction may be increased by increasing the length. In addition, the first heater electrode 501 does not necessarily have a higher resistance per unit area as viewed in the Z-axis direction than the second heater electrode 502.

  Further, the configuration of the power supply terminal 72 in the above embodiment is merely an example, and various modifications can be made. For example, the power supply terminal 72 may be configured using a flexible printed wiring board (FPC) or a mounting connector.

  Further, the setting mode of the segment SE (the number of segments SE, the shape of each segment SE, etc.) in the above embodiment can be arbitrarily changed. For example, in the above embodiment, the plurality of segments SE are set so that the segments SE are arranged in the circumferential direction CD of the suction surface S1, but the plurality of segments SE are set so that the segments SE are arranged in a lattice pattern. May be. Further, for example, in the above embodiment, the entire electrostatic chuck 100 is virtually divided into a plurality of segments SE, but a part of the electrostatic chuck 100 may be virtually divided into a plurality of segments SE. Good. In the electrostatic chuck 100, the segment SE is not necessarily set.

  In the above-described embodiment, one heater electrode 500 is arranged for each of the plurality of segments SE. However, for at least one segment SE, a plurality of heater electrodes 500 in which the same control is performed for one segment SE. May be arranged. In this case, in the plate-like member 10, a portion where a plurality of heater electrodes 500 to which the same control is performed (a portion heated mainly by the plurality of heater electrodes 500) is one segment SE.

  In the configuration in which a very large number (for example, 100 or more) of segments SE is set on the plate-like member 10, the number of heater electrodes 500 arranged on the plate-like member 10 becomes very large, and accordingly. The number of power supply terminals 72 for supplying power to the heater electrode 500 is very large, and the number of terminal holes Ht and the number of power supply terminals 72 accommodated in each terminal hole Ht are likely to be very large. It is particularly effective to apply the present invention to such a configuration.

  In addition, the forming material of each member (the plate-like member 10, the base member 20, the bonding portion 30 and the like) of the electrostatic chuck 100 of the above embodiment is merely an example, and various changes can be made.

  In the above embodiment, each via may be configured by a single via or a group of a plurality of vias. Further, in the above embodiment, each via may have a single layer configuration including only a via portion, or a multiple layer configuration (for example, a configuration in which a via portion, a pad portion, and a via portion are stacked). Also good.

  Further, in the above embodiment, a monopolar system in which one chuck electrode 40 is provided inside the plate-like member 10 is adopted, but a bipolar type in which a pair of chuck electrodes 40 is provided inside the plate-like member 10. A method may be adopted. Moreover, the material which forms each member in the electrostatic chuck 100 of the said embodiment is an illustration to the last, and each member may be formed with another material.

  In addition, the present invention is not limited to the electrostatic chuck 100 that includes the plate-like member 10 and the base member 20 and holds the wafer W using electrostatic attraction, but the plate-like member, the base member, and the plate-like member. An adhesive portion for bonding the base member and the heater electrode, a heater electrode arranged on the plate-like member, and a power supply terminal electrically connected to the heater electrode, and holding an object on the surface of the plate-like member It is also applicable to a holding device (for example, a heater device such as a CVD heater or a vacuum chuck).

DESCRIPTION OF SYMBOLS 10: Plate-shaped member 12: Recessed part 20: Base member 21: Refrigerant flow path 22: 1st through-hole 30: Adhesion part 32: 2nd through-hole 40: Chuck electrode 50: Heater electrode layer 51: Driver 53: Via 54: Via 70: Power supply pad 72: Power supply terminal 72c: Common power supply terminal 72i: Individual power supply terminal 74: Base part 76: Rod-shaped part 78: Brazing material 80: Wiring 90: Insulating member 91: Recessed part 92: Temperature sensor 100: Electrostatic Chuck 500: heater electrode 501: first heater electrode 502: second heater electrode 503: heater line portion 504: heater pad portion 510: conductive region 510c: common conductive region 510i: individual conductive region BL1: first boundary line BL2: Second boundary line CD: Circumferential direction CP: Center point Ht: Terminal hole P1: Overlapping portion P2: Non-overlapping part PS: Power supply RD: Radial direction S1: Adsorption surface S2: Lower surface S3: Upper surface S4: Lower surface SE: Segment W: Wafer

Claims (5)

A plate-like member having a substantially planar first surface substantially orthogonal to the first direction, a second surface opposite to the first surface,
A third surface and a fourth surface opposite to the third surface, and the third surface is disposed so as to face the second surface of the plate-like member; A base member formed with a first through hole penetrating from the third surface to the fourth surface;
A plurality of heater electrodes arranged on the plate-like member, each having a heater line portion which is a linear resistance heating element in the first direction view;
A power supply terminal electrically connected to the heater electrode;
The first member is disposed between the second surface of the plate member and the third surface of the base member to bond the plate member and the base member, and the first penetration of the base member. An adhesive portion formed with a second through hole that communicates with the hole and forms a terminal hole in which the power supply terminal is accommodated together with the first through hole;
A holding device for holding an object on the first surface of the plate-like member,
The plate-like member is
A first portion overlapping the terminal hole as viewed in the first direction;
A second portion that is a portion other than the first portion;
Including
The plurality of heater electrodes are:
A first heater electrode in which at least a portion of the heater line portion in the width direction of the heater line portion is disposed in the first portion of the plate member, over the entire extending direction of the heater line portion;
A second heater electrode that is in parallel connection with the first heater electrode, the entire heater line portion being disposed in the second portion of the plate-like member;
including,
A holding device. The holding device according to claim 1, wherein
The entire heater line portion of the first heater electrode is disposed in the first portion of the plate member.
A holding device. The holding device according to claim 1 or 2,
The plurality of heater electrodes are arranged in the second portion of the plate-like member in the entire width direction of the heater line portion at one position in the extending direction of the heater line portion, and the heater line portion At least a part of the heater line portion in the width direction does not include the heater electrode disposed in the first portion of the plate-like member at another position in the extending direction.
A holding device. In the holding device according to any one of claims 1 to 3,
The first heater electrode has a higher resistance per unit area in the first direction as compared to the second heater electrode.
A holding device. The holding device according to any one of claims 1 to 4, further comprising:
A temperature sensor housed in the terminal hole;
A holding device.

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