JP7101058B2 - Holding device - Google Patents

Description

The techniques disclosed herein relate to holding devices that hold objects.

For example, an electrostatic chuck is used as a holding device for holding a wafer when manufacturing a semiconductor. The electrostatic chuck includes, for example, a plate-shaped member made of ceramics and having a substantially planar surface (hereinafter referred to as “adsorption surface”) substantially orthogonal to a predetermined direction (hereinafter referred to as “first direction”). For example, it includes a base member made of metal, an adhesive portion for adhering the plate-shaped member and the base member, and a chuck electrode arranged inside the plate-shaped member. The electrostatic chuck uses the electrostatic attraction generated by applying a voltage to the chuck electrode to suck and hold the wafer on the suction surface of the plate-shaped member.

If the temperature of the wafer held on the suction surface of the electrostatic chuck does not reach the desired temperature, the accuracy of each process (deposition, etching, etc.) on the wafer may decrease. Therefore, the temperature of the wafer is applied to the electrostatic chuck. Performance to control the distribution is required. Therefore, when the electrostatic chuck is used, the suction surface of the plate-shaped member is heated by heating by a plurality of heater electrodes arranged on the plate-shaped member or by supplying the refrigerant to the refrigerant flow path formed in the base member. The temperature distribution is controlled (and thus the temperature distribution of the wafer held on the adsorption surface) is controlled.

The electrostatic chuck is provided with a configuration for supplying power to each heater electrode (see, for example, Patent Document 1). Specifically, a driver electrode layer including a plurality of driver electrodes electrically connected to each heater electrode is arranged on the plate-shaped member. Further, through holes forming the terminal holes are formed in the base member and the adhesive portion. A plurality of feeding electrodes (feeding pads) are arranged in a region constituting the bottom surface of the terminal hole in the surface of the plate-shaped member opposite to the suction surface (hereinafter referred to as “lower surface”). Each feeding electrode is electrically connected to the driver electrode via a via or the like. Further, a first feeding terminal is provided on each feeding electrode. Further, in the terminal hole, a connection member having a plurality of second power supply terminals that are fitted with each first power supply terminal and electrically connected to the first power supply terminal is arranged. In such a configuration, electric power is supplied from the power source to each heater electrode via the second power supply terminal, the first power supply terminal, the power supply electrode, the driver electrode, and the like.

Japanese Unexamined Patent Publication No. 2016-76646

In the electrostatic chuck, the heat transfer property (heat attraction) from the plate-shaped member to the base member decreases in the vicinity of the region overlapping with the terminal hole in the first directional view, so that the temperature distribution of the suction surface of the plate-shaped member is reduced. In order to suppress a decrease in controllability (and thus controllability of the temperature distribution of the wafer held on the suction surface), it is preferable that the number of holes for terminals is small. Therefore, in the electrostatic chuck provided with a plurality of heater electrodes as described above, in order to reduce the number of terminal holes, a configuration in which a plurality of first feeding terminals are accommodated in each terminal hole is adopted. be. However, in such a configuration, a plurality of driver electrodes electrically connected to a plurality of first feeding terminals accommodated in the terminal holes in the vicinity of the region overlapping the terminal holes in the first directional view. Are densely arranged. Therefore, in such a configuration, the direction of current flow in the driver electrode layer is concentrated, so that the calorific value of a specific region in the driver electrode layer is increased, and as a result, the temperature distribution of the suction surface of the plate-shaped member is controlled. There is a risk that the property (and thus the controllability of the temperature distribution of the wafer held by the electrostatic chuck) will deteriorate.

It should be noted that such a problem is not limited to the electrostatic chuck that holds the wafer by utilizing electrostatic attraction, and includes a plate-shaped member, a base member, and an adhesive portion for adhering the plate-shaped member and the base member. , A holding device that holds an object on the surface of a plate-shaped member is a common problem in general.

This specification discloses a technique capable of solving the above-mentioned problems.

The techniques disclosed herein can be realized, for example, in the following forms.

(1) The holding device disclosed in the present specification has a substantially planar first surface that is substantially orthogonal to the first direction, and a second surface that is opposite to the first surface. It includes a plate-shaped member, a plurality of heater electrodes arranged on the plate-shaped member and configured by a resistance heating element, and a plurality of driver electrodes arranged on the plate-shaped member and electrically connected to the heater electrode. It has a driver electrode layer, a third surface, and a fourth surface opposite to the third surface, and the third surface faces the second surface of the plate-shaped member. A base member in which a first through hole penetrating from the third surface to the fourth surface and a refrigerant flow path are formed, and the second surface of the plate-shaped member. The plate-shaped member and the base member are arranged between the third surface of the base member, and the plate-shaped member and the base member are adhered to each other and communicate with the first through hole of the base member to allow the first penetration. M (m However, M is an integer of 3 or more), and the M feeding electrodes electrically connected to the driver electrode and the first feeding electrode provided on each of the feeding electrodes in the terminal hole. It has one power supply terminal and M second power supply terminals housed in the terminal hole, fitted with each of the first power supply terminals, and electrically connected to the first power supply terminal. In a holding device including a connecting member and holding an object on the first surface of the plate-shaped member, N (however, N is 3 or more and M or less) among the M feeding electrodes. The feeding electrodes are arranged at substantially equal pitches on the circumference of the virtual circle in the first direction view, and N feeding electrodes are electrically connected to the N feeding electrodes. Each of the driver electrodes has a radial portion extending radially outward from the connection position with the feeding electrode in the first directional view.

As described above, in this holding device, a plurality of (M (where M is an integer of 3 or more) feeding electrodes (and M first feeding terminals) are accommodated in the terminal holes. Therefore, according to this holding device, the number of terminal holes provided in the holding device can be reduced, and the heat transfer property from the plate-shaped member to the base member in the vicinity of the region overlapping the terminal holes in the first directional view. Due to the decrease in (heat attractability), the controllability of the temperature distribution on the first surface of the plate-shaped member (and by extension, the controllability of the temperature distribution of the object held on the first surface) decreases. Can be suppressed.

Further, in this holding device, among the M feeding electrodes arranged in the terminal holes, N (however, N is an integer of 3 or more and M or less) of the feeding electrodes are in the first directional view. , Each of the N driver electrodes electrically arranged on the circumference of the virtual circle at approximately equal pitches and electrically connected to the N feeding electrodes is the feeding electrode in the first direction. It has a radial portion extending from the connection position with the virtual circle toward the radial outer side of the virtual circle. That is, the radial portions of each driver electrode are arranged at substantially equal pitches on the circumference of the virtual circle in the first directional view. Therefore, in this holding device, the direction in which the current flows in the driver electrode layer can be dispersed substantially evenly in the vicinity of the region overlapping the terminal hole in the first direction view, and the calorific value of the specific region in the driver electrode layer can be dispersed. Can be suppressed from becoming large. Therefore, according to this holding device, the controllability of the temperature distribution on the first surface of the plate-shaped member (and by extension, the holding on the first surface) is caused by the increase in the calorific value in the specific region in the driver electrode layer. It is possible to suppress the decrease in the controllability of the temperature distribution of the object).

(2) The holding device may be configured such that N = M. In this holding device, all of the M feeding electrodes arranged in the terminal holes are arranged at substantially equal pitches on the circumference of the virtual circle in the first directional view. The size of the terminal hole in the first directional view can be made as small as possible while ensuring the insulation between the first power feeding terminals. Therefore, according to this holding device, the controllability of the temperature distribution on the first surface of the plate-shaped member due to the presence of the terminal holes (and thus the control of the temperature distribution of the object held on the first surface). It is possible to effectively suppress the decrease in sex).

(3) In the holding device, the virtual surface of the connecting member, which is fixed to the base member and is opposite to the side of the connecting member facing the plate-shaped member, in the first directional view. The configuration may be characterized in that it is provided with a pressing member that abuts at a position overlapping the center of the circle. In this holding device, the connecting member is connected to the base member by a pressing member that abuts at a position overlapping the center of the virtual circle in the first directional view on the surface of the connecting member opposite to the side facing the plate-shaped member. The movement of the member in the first direction (that is, the disconnection of the connecting member from the first feeding terminal) can be restricted. Therefore, according to this holding device, it is possible to suppress the size of the terminal hole in the first directional view from becoming large, and to prevent the connecting member from coming off from the first power feeding terminal.

The techniques disclosed in the present specification can be realized in various forms, for example, in the form of a holding device, an electrostatic chuck, a vacuum chuck, a method for manufacturing them, and the like. be.

It is a perspective view which shows schematic appearance structure of the electrostatic chuck 100 in this embodiment. It is explanatory drawing which shows schematic the XZ cross-sectional structure of the electrostatic chuck 100 in this embodiment. It is explanatory drawing which shows schematic the XY plane (top surface) structure of the electrostatic chuck 100 in this embodiment. It is explanatory drawing which shows typically the structure for feeding to the heater electrode layer 50 and the heater electrode layer 50. It is explanatory drawing which shows typically the XY cross-sectional structure of the heater electrode 500 arranged in each segment SE. It is explanatory drawing which magnified and shows the YZ cross-sectional structure of the part near the terminal hole Ht in the electrostatic chuck 100. It is explanatory drawing which magnified and shows the XY cross-sectional structure of the part near the terminal hole Ht in the electrostatic chuck 100.

A. Embodiment:
A-1. Configuration of electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing an external configuration of the electrostatic chuck 100 in the present embodiment, and FIG. 2 is an explanatory view schematically showing an XZ cross-sectional configuration of the electrostatic chuck 100 in the present embodiment. FIG. 3 is an explanatory diagram schematically showing the XY plane (upper surface) configuration of the electrostatic chuck 100 in the present embodiment. Each figure shows XYZ axes that are orthogonal to each other to identify the direction. In the present specification, for convenience, the Z-axis positive direction is referred to as an upward direction, and the Z-axis negative direction is referred to as a downward direction, but the electrostatic chuck 100 is actually installed in a direction different from such an orientation. May be done.

The electrostatic chuck 100 is a device that attracts and holds an object (for example, a wafer W) by electrostatic attraction, and is used, for example, for fixing a wafer W in a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 100 includes a plate-shaped member 10 and a base member 20 arranged side by side in a predetermined arrangement direction (in the present embodiment, the vertical direction (Z-axis direction)). The plate-shaped member 10 and the base member 20 are arranged so that the lower surface S2 (see FIG. 2) of the plate-shaped member 10 and the upper surface S3 of the base member 20 face each other in the above-mentioned arrangement direction.

The plate-shaped member 10 is a plate-shaped member having a substantially circular planar upper surface (hereinafter referred to as “suction surface”) S1 substantially orthogonal to the above-mentioned arrangement direction (Z-axis direction), and is, for example, ceramics (for example, alumina). And aluminum nitride, etc.). The diameter of the plate-shaped member 10 is, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the thickness of the plate-shaped member 10 is, for example, about 1 mm to 10 mm. The suction surface S1 of the plate-shaped member 10 corresponds to the first surface in the claims, the lower surface S2 of the plate-shaped member 10 corresponds to the second surface in the claims, and the Z-axis direction is It corresponds to the first direction in the claims. Further, in the present specification, the direction orthogonal to the Z-axis direction is referred to as "plane direction", and as shown in FIG. 3, the circumferential direction centered on the center point CP of the suction surface S1 is "plane direction". It is called "circumferential direction CD", and the direction orthogonal to the circumferential direction CD in the plane direction is called "diametrical direction RD".

As shown in FIG. 2, a chuck electrode 40 made of a conductive material (for example, tungsten, molybdenum, platinum, etc.) is arranged inside the plate-shaped member 10. The shape of the chuck electrode 40 in the Z-axis direction is, for example, substantially circular. When a voltage is applied to the chuck electrode 40 from a power source (not shown), an electrostatic attraction is generated, and the wafer W is attracted and fixed to the suction surface S1 of the plate-shaped member 10 by this electrostatic attraction.

Inside the plate-shaped member 10, there is also a heater electrode layer 50 formed of a conductive material (for example, tungsten, molybdenum, platinum, etc.) and a driver electrode layer 51 for supplying power to the heater electrode layer 50. And various vias 53 and 54 are arranged. In the present embodiment, the heater electrode layer 50 is arranged below the chuck electrode 40, and the driver electrode layer 51 is arranged below the heater electrode layer 50. These configurations will be described in detail later.

The base member 20 is, for example, a circular flat plate-shaped member having the same diameter as the plate-shaped member 10 or having a diameter larger than that of the plate-shaped member 10, and is formed of, for example, a metal (aluminum, an aluminum alloy, or the like). The diameter of the base member 20 is, for example, about 220 mm to 550 mm (usually 220 mm to 350 mm), and the thickness of the base member 20 is, for example, about 20 mm to 40 mm. The upper surface S3 of the base member 20 corresponds to the third surface in the claims, and the lower surface S4 of the base member 20 corresponds to the fourth surface in the claims.

The base member 20 is joined to the plate-shaped member 10 by an adhesive portion 30 arranged between the lower surface S2 of the plate-shaped member 10 and the upper surface S3 of the base member 20. The adhesive portion 30 is made of an adhesive material such as a silicone resin, an acrylic resin, or an epoxy resin. The thickness of the bonded portion 30 is, for example, about 0.1 mm to 1 mm.

A refrigerant flow path 21 is formed inside the base member 20. When a refrigerant (for example, a fluorine-based inert liquid, water, etc.) is flowed through the refrigerant flow path 21, the base member 20 is cooled, and heat is transferred between the base member 20 and the plate-shaped member 10 via the adhesive portion 30. The plate-shaped member 10 is cooled by (heat transfer), and the wafer W held on the suction surface S1 of the plate-shaped member 10 is cooled. As a result, control of the temperature distribution of the wafer W is realized.

A-2. Configuration for feeding the heater electrode layer 50 and the heater electrode layer 50:
Next, the configuration of the heater electrode layer 50 and the configuration for supplying power to the heater electrode layer 50 will be described in detail. As described above, the plate-shaped member 10 is provided with a heater electrode layer 50, a driver electrode layer 51 for supplying power to the heater electrode layer 50, and various vias 53 and 54. Further, the electrostatic chuck 100 is provided with another configuration for feeding power to the heater electrode layer 50 (pad-side feeding terminal 72 and the like accommodated in the terminal hole Ht described later). FIG. 4 is an explanatory diagram schematically showing a configuration for supplying power to the heater electrode layer 50 and the heater electrode layer 50. The upper part of FIG. 4 schematically shows the YZ cross-sectional configuration of a part of the heater electrode layer 50 arranged on the plate-shaped member 10, and the middle part of FIG. 4 is arranged on the plate-shaped member 10. The XY planar configuration of a part of the driver electrode layer 51 is schematically shown, and the lower part of FIG. 4 schematically shows the YZ cross-sectional configuration of another configuration for supplying power to the heater electrode layer 50. ing.

Here, as shown in FIG. 3, in the electrostatic chuck 100 of the present embodiment, the segment SE (segment SE) which is a plurality of virtual regions arranged in the plane direction (direction orthogonal to the Z-axis direction) on the plate-shaped member 10. (Indicated by a broken line in FIG. 3) is set. More specifically, in the Z-axis direction view, the plate-shaped member 10 has a plurality of virtual annular regions (provided that the plate-shaped member 10 is formed by a plurality of concentric first boundary lines BL1 centered on the center point CP of the suction surface S1. Only the region including the center point CP is divided into circular regions), and each annular region is a plurality of virtual regions arranged in the circumferential direction CD by a plurality of second boundary lines BL2 extending in the radial direction RD. It is divided into segments SE. In the upper part of FIG. 4, as an example, six segment SEs set on the plate-shaped member 10 are shown.

As shown in the upper part of FIG. 4, the heater electrode layer 50 includes a plurality of heater electrodes 500. Each of the plurality of heater electrodes 500 included in the heater electrode layer 50 is arranged in one of the plurality of segments SE set in the plate-shaped member 10. That is, in the electrostatic chuck 100 of the present embodiment, one heater electrode 500 is arranged in each of the plurality of segments SE. In other words, in the plate-shaped member 10, the portion where one heater electrode 500 is arranged (mainly the portion heated by the heater electrode 500) becomes one segment SE.

FIG. 5 is an explanatory diagram schematically showing an XY cross-sectional configuration of the heater electrodes 500 arranged in each segment SE. As shown in FIG. 5, the heater electrode 500 has a heater line portion 502 which is a linear resistance heating element in the Z-axis direction, and a heater pad portion 504 connected to both ends of the heater line portion 502. In the present embodiment, the heater line portion 502 is shaped so as to pass through each position in the segment SE as evenly as possible in the Z-axis direction. The same applies to the configuration of the heater electrodes 500 arranged in the other segment SE.

As described above, in the electrostatic chuck 100 of the present embodiment, one heater electrode 500 is arranged in each of the plurality of segments SE, but it is independent of the one heater electrode 500 referred to here. It means a unit of a controllable heater electrode 500, and is not necessarily limited to a single heater electrode 500. For example, a plurality of heater electrodes 500 that are controlled in common with each other may be arranged in one segment SE. Further, it is assumed that the configuration of the heater line portion 502 of the heater electrode 500 arranged in one segment SE is such that the portions of the heater line portions 502 of a plurality of layers having different positions in the Z-axis direction are connected in series with each other. May be good.

Further, as shown in the middle stage of FIG. 4, the driver electrode layer 51 arranged on the plate-shaped member 10 has a plurality of driver electrodes 510. In the present embodiment, the driver electrode 510 is a linear conductive member having a certain width in the Z-axis direction. For each of the plurality of heater electrodes 500, one end of the heater electrode 500 is electrically connected to one driver electrode 510 via the via 53, and the other end of the heater electrode 500 is electrically connected via the via 53. , Electrically connected to one other driver electrode 510. As in the example shown in FIG. 4, one end of each heater electrode 500 may be electrically connected to the same driver electrode 510.

Further, as shown in FIGS. 2 and 4, a plurality of terminal holes Ht are formed in the electrostatic chuck 100. FIG. 6 is an explanatory view showing an enlarged YZ cross-sectional configuration of a portion (X1 portion in FIG. 4) near the terminal hole Ht in the electrostatic chuck 100. As shown in FIG. 6, each terminal hole Ht has a first through hole 22 that penetrates the base member 20 from the upper surface S3 to the lower surface S4, and a second through hole 32 that penetrates the adhesive portion 30 in the vertical direction. , The recess 12 formed on the lower surface S2 side of the plate-shaped member 10 is an integral hole formed by communicating with each other. The cross-sectional shape orthogonal to the extending direction of the terminal hole Ht can be arbitrarily set, but in the present embodiment, it is circular. In the present embodiment, the first through hole 22 of the base member 20 constituting the terminal hole Ht and the second through hole 32 of the adhesive portion 30 have substantially the same diameter, but the plate-shaped member 10 has a similar diameter. The diameter of the formed recess 12 is smaller than the diameter of the first through hole 22 and the second through hole 32. Further, in the present embodiment, the first through hole 22 of the base member 20 constituting the terminal hole Ht has an enlarged diameter at the lower end portion thereof (hereinafter, referred to as “first through hole lower end portion 23”). ..

At the position corresponding to each terminal hole Ht on the lower surface S2 of the plate-shaped member 10 (position overlapping with the terminal hole Ht in the Z-axis direction), a plurality of feeding pads (feeding electrodes) 70 made of a conductive material are provided. It is formed. Each feeding pad 70 is electrically connected to the driver electrode 510 of the driver electrode layer 51 via the via 54. The feeding pad 70 corresponds to a feeding electrode in the claims.

As shown in FIGS. 2, 4 and 6, in each terminal hole Ht, a pad-side feeding terminal 72 made of a conductive material is provided on each feeding pad 70. Each pad-side feeding terminal 72 has a base portion 74 and a rod-shaped portion 76 extending from the base portion 74. The base portion 74 of the pad-side feeding terminal 72 is joined to the feeding pad 70 by, for example, brazing with a brazing material 78. The pad-side power supply terminal 72 corresponds to the first power supply terminal within the scope of the claims.

Further, as shown in FIGS. 2, 4 and 6, the upper connector 200 is housed in each terminal hole Ht. The upper connector 200 is located near the upper end in the terminal hole Ht. The upper connector 200 includes a first housing 210, a second housing 220, and a socket 230. The upper connector 200 corresponds to a connecting member within the scope of the claims.

The first housing 210 of the upper connector 200 is a substantially columnar member, and is formed of an insulating material such as resin. The diameter of the first housing 210 in the Z-axis direction is smaller than the diameter of the first through hole 22 of the base member 20 and the second through hole 32 of the adhesive portion 30 constituting the terminal hole Ht, and It is larger than the diameter of the recess 12 of the plate-shaped member 10. The lower portion 214 of the first housing 210 has a smaller diameter than the other portions. The region near the outer periphery on the upper surface of the first housing 210 is in contact with the lower surface S2 of the plate-shaped member 10. As a result, the first housing 210 is positioned in the Z-axis direction with respect to the plate-shaped member 10 (that is, with respect to the feeding pad 70 and the pad-side feeding terminal 72). Further, a plurality of through holes 212 extending in the Z-axis direction are formed in the first housing 210, and a rod-shaped portion 76 of the pad-side feeding terminal 72 is inserted through each through hole 212. As a result, the first housing 210 is positioned in the surface direction and the rotation direction with respect to the plate-shaped member 10 (that is, with respect to the feeding pad 70 and the pad-side feeding terminal 72). In the space surrounded by the upper surface of the first housing 210 and the bottom surface and the side surface of the recess 12 of the plate-shaped member 10, for insulation between the feeding pads 70 and between the feeding terminals 72 on each pad side, The resin adhesive 79 is filled. Further, the side surface of the first housing 210 is separated from the side surface of the terminal hole Ht (the side surface of the second through hole 32 and the first through hole 22 constituting the terminal hole Ht), and is between the two. There is a space in.

The second housing 220 of the upper connector 200 is a substantially columnar member, and is formed of an insulating material such as resin. The diameter of the second housing 220 in the Z-axis direction is substantially the same as the diameter of the first housing 210. A recess 224 that fits with the lower portion 214 of the first housing 210 is formed on the upper surface side of the second housing 220. The second housing 220 is in contact with the lower surface of the first housing 210 with the lower portion 214 of the first housing 210 fitted in the recess 224 of the second housing 220. As a result, the second housing 220 is positioned in the Z-axis direction and the surface direction with respect to the first housing 210 (that is, with respect to the plate-shaped member 10, the feeding pad 70, and the pad-side feeding terminal 72). Further, although not shown, a convex portion is formed on one of the side surface of the concave portion 224 of the second housing 220 and the side surface of the lower portion 214 of the first housing 210, and the other side is fitted with the convex portion. A matching recess is formed. By fitting these convex portions and concave portions, the positioning of the second housing 220 with respect to the first housing 210 (that is, with respect to the plate-shaped member 10, the feeding pad 70, and the pad-side feeding terminal 72) in the rotational direction can be achieved. Will be done. Further, a plurality of through holes 222 extending in the Z-axis direction are formed in the second housing 220, and a socket 230 is inserted (press-fitted) into each through hole 222. Further, the side surface of the second housing 220 is separated from the side surface of the terminal hole Ht (the side surface of the second through hole 32 and the first through hole 22 constituting the terminal hole Ht), and is between the two. There is a space in.

The socket 230 of the upper connector 200 is a substantially columnar member, and is formed of a conductive material such as metal. A hole 232 into which the rod-shaped portion 76 of the pad-side feeding terminal 72 is inserted is formed on the upper surface side of the socket 230. When the rod-shaped portion 76 of the pad-side power supply terminal 72 is inserted into the hole 232 of the socket 230, the socket 230 and the pad-side power supply terminal 72 are electrically connected. In this state, the pad-side feeding terminals 72 are insulated from each other by the intervention of the resin adhesive 79, the first housing 210, and the second housing 220. The socket 230 corresponds to the second feeding terminal in the claims.

Further, as shown in FIGS. 2, 4 and 6, the lower connector 300 is housed in each terminal hole Ht. The lower connector 300 is located near the lower end in the terminal hole Ht. The lower connector 300 includes a housing 310 and a socket 330.

The housing 310 of the lower connector 300 is a substantially columnar member, and is formed of an insulating material such as resin. The diameter of the housing 310 in the Z-axis direction is substantially the same as the diameter of the first through hole 22 of the base member 20 constituting the terminal hole Ht. Therefore, the side surface of the housing 310 is in contact with the side surface of the terminal hole Ht (the side surface of the first through hole 22). A plurality of through holes 312 extending in the Z-axis direction are formed in the housing 310, and a socket 330 is inserted (press-fitted) into each through hole 312.

Further, a slit 314 extending in the plane direction is formed on the side surface of the housing 310. A C ring 352 formed of an insulating material such as resin is inserted into the slit 314. A part of the outer peripheral side of the C ring 352 protrudes from the slit 314, and the upper surface of the protruding portion abuts on the upper surface of the lower end portion 23 of the first through hole of the base member 20. As a result, the housing 310 is positioned in the Z-axis direction with respect to the base member 20. Further, in the lower end portion 23 of the first through hole, a substantially cylindrical pressing plate 356 that surrounds the lower portion of the housing 310 is arranged, and the pressing plate 356 is a base member by a set screw 354. It is fixed at 20. As a result, the housing 310 (lower connector 300) is fixed to the base member 20. The holding plate 356 is formed of an insulating material such as resin.

Further, a through hole 315 extending in the Z-axis direction is formed in the vicinity of the center of the housing 310 in the Z-axis direction, and the holding member 340 formed of an insulating material such as resin is formed in the through hole 315. Is inserted. The pressing member 340 is fixed to the housing 310 by being screwed into a screw formed on the inner peripheral surface of the through hole 315 of the housing 310. Further, the upper end of the pressing member 340 is in contact with the lower surface 226 of the second housing 220 of the upper connector 200 (that is, the surface opposite to the side facing the plate-shaped member 10). The presence of the holding member 340 restricts the downward movement of the upper connector 200 from the second housing 220 (that is, the removal of the upper connector 200 from the pad-side feeding terminal 72 of the second housing 220).

The socket 330 of the lower connector 300 is a substantially columnar member, and is formed of a conductive material such as metal. A hole 332 into which a terminal on the power supply side is inserted is formed on the lower surface side of the socket 330. Further, the socket 330 is electrically connected to the socket 230 of the upper connector 200 via the lead wire 80.

In such a configuration, the heater electrodes 500 are connected in parallel to each other with respect to a power source (not shown). Voltage from the power supply to the heater electrode 500 via the socket 330 of the lower connector 300, the lead wire 80, the socket 230 of the upper connector 200, the pad side power supply terminal 72, the power supply pad 70, the via 54, the driver electrode 510 and the via 53. Is applied, the heater electrode 500 generates heat. As a result, the segment SE in which the heater electrode 500 is arranged is heated, and the temperature distribution of the suction surface S1 of the plate-shaped member 10 is controlled (and by extension, the temperature distribution of the wafer W held on the suction surface S1 of the plate-shaped member 10). Control) is realized. In the present embodiment, since each heater electrode 500 is connected in parallel to the heater power supply, the calorific value of the heater electrode 500 is controlled in each heater electrode 500 unit (that is, in each segment SE unit). It is possible to control the temperature distribution of the suction surface S1 of the plate-shaped member 10 in the segment SE unit (that is, control the temperature distribution in a finer unit).

A-3. Detailed configuration near the terminal hole Ht:
The configuration of the portion of the electrostatic chuck 100 near the terminal hole Ht will be described in more detail. FIG. 7 is an enlarged explanatory view showing an enlarged XY cross-sectional configuration of a portion of the electrostatic chuck 100 near the terminal hole Ht. FIG. 7 shows the positional relationship of each member (feeding pad 70, pad-side feeding terminal 72, driver electrode 510, etc.) in the portion near the terminal hole Ht in the Z-axis direction.

As described above, in the electrostatic chuck 100 of the present embodiment, a plurality of power feeding pads 70 are arranged in the holes Ht for each terminal. More specifically, as shown in FIG. 7, in the electrostatic chuck 100 of the present embodiment, the number M of the power feeding pads 70 arranged in the holes Ht for each terminal is five. Since the pad side power supply terminal 72 is provided on each power supply pad 70, the number of pad side power supply terminals 72 arranged in each terminal hole Ht and the upper connector 200 connected to the pad side power supply terminal 72 The number of sockets 230 is also five.

As shown in FIG. 7, in the electrostatic chuck 100 of the present embodiment, all of the five power feeding pads 70 arranged in the terminal hole Ht are circles of a single virtual circle VC in the Z-axis direction. They are arranged on the circumference at approximately equal pitches. In the Z-axis direction view, the position of the feeding pad 70 means the position of the center P1 of the feeding pad 70. Further, in the Z-axis direction view, the fact that the power feeding pads 70 are arranged on the circumference of the virtual circle VC at substantially equal pitches means that between the two power feeding pads 70 adjacent to each other along the circumference direction of the virtual circle VC. It means that the difference between the maximum value of the distance (distance along the circumference of the virtual circle VC) and the minimum value of the distance is 10% or less of the maximum value of the distance. The virtual circle VC is a virtual circle centered on the center P0 of the terminal hole Ht in the Z-axis direction.

Since the pad-side power supply terminal 72 is provided on each power supply pad 70, the five pad-side power supply terminals 72 arranged in the terminal hole Ht are also on the circumference of the virtual circle VC in the Z-axis direction. They are arranged at approximately equal pitches. In this embodiment, the rod-shaped portion 76 of the pad-side feeding terminal 72 overlaps with the center P1 of the feeding pad 70 in the Z-axis direction. Further, since each pad-side power supply terminal 72 is fitted to the socket 230 of the upper connector 200, the five sockets 230 included in the upper connector 200 arranged in the terminal hole Ht are also virtual in the Z-axis direction. They are arranged at approximately equal pitches on the circumference of the circle VC.

Further, as shown in FIG. 7, in the electrostatic chuck 100 of the present embodiment, each of the five driver electrodes 510 electrically connected to the five power feeding pads 70 arranged in the terminal hole Ht is It has a radial portion 512. Here, the radial portion 512 of the driver electrode 510 is the virtual circle from the connection position with the feeding pad 70 in the driver electrode 510 (that is, the region overlapping with the feeding pad 70 in the Z-axis direction) in the Z-axis direction. It is a portion extending outward in the radial direction of the VC. That is, the radial portion 512 of the driver electrode 510 is a virtual straight line connecting the center P0 of the terminal hole Ht and the center P1 of the feeding pad 70 electrically connected to the driver electrode 510 in the Z-axis direction. It overlaps with VL. It is preferable that the radial portion 512 of the driver electrode 510 extends from at least the connection position of the driver electrode 510 with the feeding pad 70 to a region that does not overlap with the terminal hole Ht in the Z-axis direction.

Further, as described above, the upper end of the holding member 340 inserted into the through hole 315 of the lower connector 300 is in contact with the lower surface 226 of the upper connector 200 (FIG. 6), but as shown in FIG. 7, In the electrostatic chuck 100 of the present embodiment, the upper end of the holding member 340 is in contact with the lower surface 226 of the upper connector 200 at a position overlapping the center P0 of the virtual circle VC in the Z-axis direction.

A-4. Manufacturing method of electrostatic chuck 100:
The manufacturing method of the electrostatic chuck 100 of this embodiment is as follows, for example. First, a plurality of ceramic green sheets are produced, and a predetermined process is performed on a predetermined ceramic green sheet. Predetermined processing includes, for example, printing of metallized paste for forming the heater electrode layer 50, driver electrode layer 51, feeding pad 70, etc., drilling for forming various vias 53 and 54, filling of metallized paste, and the like. Can be mentioned. A laminated body of ceramic green sheets is produced by laminating these ceramic green sheets, thermocompression bonding, and processing such as cutting. The plate-shaped member 10 is manufactured by firing the laminated body of the manufactured ceramic green sheet.

Next, the pad-side feeding terminal 72 is joined to the feeding pad 70 formed on the plate-shaped member 10 by, for example, brazing. Next, the first housing 210 constituting the upper connector 200 is joined to the plate-shaped member 10 with the resin adhesive 79. At this time, the rod-shaped portion 76 of the pad-side feeding terminal 72 is inserted into each through hole 212 formed in the first housing 210. When the installation of the first housing 210 is completed, the tip of the rod-shaped portion 76 of the pad-side feeding terminal 72 protrudes from each through hole 212 of the first housing 210.

Next, the second housing 220 constituting the upper connector 200 is attached to the first housing 210. At this time, the socket 230 is press-fitted into each through hole 222 of the second housing 220, and the lower connector 300 (housing 310 into which the socket 330 is press-fitted) is inserted into the socket 230 via the lead wire 80. It is connected. When attaching the second housing 220, the side surface of the lower portion 214 of the first housing 210 and the convex portion or the concave portion formed on the side surface are used as guides in the surface direction of the second housing 220. And position in the direction of rotation. When the attachment of the second housing 220 is completed, the tip of the rod-shaped portion 76 of the pad-side power supply terminal 72 is inserted into the hole 232 of each socket 230, and each socket 230 and each pad-side power supply terminal 72 are electrically connected. Connected to.

Next, the plate-shaped member 10 and the base member 20 are joined by using, for example, a sheet-shaped adhesive portion 30.

Next, the C ring 352 is attached to the slit 314 of the housing 310 of the lower connector 300, and the holding plate 356 is in a state where the upper surface of the C ring 352 is in contact with the lower surface of the lower end portion 23 of the first through hole of the base member 20. Is fixed to the base member 20 with the set screw 354. As a result, the lower connector 300 is fixed to the base member 20. Next, the pressing member 340 is inserted into the through hole 315 of the housing 310 of the lower connector 300, and screwed in a state where the upper end of the pressing member 340 is in contact with the lower surface 226 of the second housing 220 of the upper connector 200. Thereby, the movement of the second housing 220 of the upper connector 200 in the Z-axis direction (disengagement from the pad-side power feeding terminal 72 of the first housing 210 of the upper connector 200) is restricted. The electrostatic chuck 100 of the present embodiment is manufactured mainly by the above steps.

A-5. Effect of this embodiment:
As described above, the electrostatic chuck 100 of the present embodiment includes a plate-shaped member 10, a base member 20, and an adhesive portion 30. The plate-shaped member 10 has a substantially planar suction surface S1 substantially orthogonal to the Z-axis direction and a lower surface S2 on the opposite side of the suction surface S1. The base member 20 has an upper surface S3 and a lower surface S4 on the opposite side of the upper surface S3, and the upper surface S3 is arranged so as to face the lower surface S2 of the plate-shaped member 10. The base member 20 is formed with a plurality of first through holes 22 penetrating from the upper surface S3 to the lower surface S4, and a refrigerant flow path 21. The adhesive portion 30 is arranged between the lower surface S2 of the plate-shaped member 10 and the upper surface S3 of the base member 20, and adheres the plate-shaped member 10 and the base member 20. The adhesive portion 30 is formed with a second through hole 32 that communicates with the first through hole 22 of the base member 20 and forms a terminal hole Ht together with the first through hole 22. Further, the electrostatic chuck 100 of the present embodiment is arranged on a plate-shaped member 10 and is arranged on a plurality of heater electrodes 500 composed of a resistance heating element and on the plate-shaped member 10 and electrically connected to the heater electrode 500. The driver electrode layer 51 including the plurality of driver electrodes 510 and the feeding pad 70 arranged in the region forming the bottom surface of the terminal hole Ht in the lower surface S2 of the plate-shaped member 10 are provided. The power feeding pad 70 is electrically connected to the driver electrode 510. The number M of the power supply pads 70 arranged in each terminal hole Ht is five. Further, the electrostatic chuck 100 of the present embodiment includes a pad-side feeding terminal 72 provided on each feeding pad 70 in the terminal hole Ht, and an upper connector 200 housed in the terminal hole Ht. The upper connector 200 has a socket 230 that is fitted with each pad-side power supply terminal 72 and electrically connected to the pad-side power supply terminal 72. Further, in the electrostatic chuck 100 of the present embodiment, the five power feeding pads 70 arranged in the holes Ht for each terminal are arranged at substantially equal pitches on the circumference of the virtual circle VC in the Z-axis direction view. There is. Further, in the electrostatic chuck 100 of the present embodiment, each of the five driver electrodes 510 electrically connected to the five power feeding pads 70 arranged in the holes Ht for each terminal is viewed in the Z-axis direction. It has a radial portion 512 extending radially outward from the connection position with the power feeding pad 70.

As described above, in the electrostatic chuck 100 of the present embodiment, since a plurality of (five) pad-side feeding terminals 72 are accommodated in each terminal hole Ht, the terminal hole Ht provided in the electrostatic chuck 100 is provided. Due to the decrease in heat transfer (heat attraction) from the plate-shaped member 10 to the base member 20 in the vicinity of the region overlapping the terminal hole Ht in the Z-axis direction, the number of plate-shaped members can be reduced. It is possible to suppress the deterioration of the controllability of the temperature distribution of the suction surface S1 of 10 (and by extension, the controllability of the temperature distribution of the wafer W held on the suction surface S1).

On the other hand, in the electrostatic chuck 100 of the present embodiment, five power supply pads 70 (five pad-side power supply terminals) housed in the terminal hole Ht are located near the region overlapping the terminal hole Ht in the Z-axis direction. The five driver electrodes 510 that are electrically connected to 72) are densely arranged. Therefore, by concentrating the current flow directions in the driver electrode layer 51, the amount of heat generated in a specific region of the driver electrode layer 51 may increase, and the controllability of the temperature distribution of the suction surface S1 of the plate-shaped member 10 may deteriorate. There is.

However, in the electrostatic chuck 100 of the present embodiment, the five power feeding pads 70 arranged in the holes Ht for each terminal are arranged at substantially equal pitches on the circumference of the virtual circle VC in the Z-axis direction. Each of the five driver electrodes 510 electrically connected to the five feeding pads 70 is radially outside the virtual circle VC from the connection position with the feeding pad 70 in the Z-axis direction. It has a radial portion 512 extending toward. That is, the radial portions 512 of each driver electrode 510 are arranged at substantially equal pitches on the circumference of the virtual circle VC in the Z-axis direction. Therefore, in the electrostatic chuck 100 of the present embodiment, the direction in which the current flows in the driver electrode layer 51 can be substantially evenly dispersed in the vicinity of the region overlapping the terminal hole Ht in the Z-axis direction, and the driver electrode layer 51 can be distributed. It is possible to suppress an increase in the amount of heat generated in a specific region in the above. Therefore, according to the electrostatic chuck 100 of the present embodiment, the controllability of the temperature distribution of the suction surface S1 of the plate-shaped member 10 (and by extension, the suction surface) is caused by the increase in the calorific value in the specific region of the driver electrode layer 51. It is possible to suppress a decrease in the controllability of the temperature distribution of the wafer W held in S1). It should be noted that the fact that the deterioration of the controllability of the temperature distribution of the suction surface S1 of the plate-shaped member 10 can be suppressed means that the variation in the temperature distribution of the entire suction surface S1 can be suppressed and that the segment SE can be suppressed. It includes at least one meaning that it is possible to suppress the occurrence of variation in the temperature distribution of the adsorption surface S1 for each time.

Further, in the electrostatic chuck 100 of the present embodiment, all of the five power feeding pads 70 arranged in the holes Ht for each terminal are substantially on the circumference of a single virtual circle VC in the Z-axis direction. Arranged on the pitch. Therefore, in the electrostatic chuck 100 of the present embodiment, the size of the terminal hole Ht in the Z-axis direction is large while ensuring the insulation between the feeding pads 70 and the pad-side feeding terminal 72 in each terminal hole Ht. The static electricity can be made as small as possible. Therefore, according to the electrostatic chuck 100 of the present embodiment, the controllability of the temperature distribution of the suction surface S1 of the plate-shaped member 10 due to the presence of the terminal hole Ht (and by extension, the wafer W held on the suction surface S1). It is possible to effectively suppress the decrease in the controllability of the temperature distribution.

Further, the electrostatic chuck 100 of the present embodiment is further fixed to the base member 20, and the lower surface 226 of the second housing 220 of the upper connector 200 (the surface opposite to the side facing the plate-shaped member 10). ), The holding member 340 that abuts at a position overlapping the center P0 of the virtual circle VC in the Z-axis direction is provided. In the electrostatic chuck 100 of the present embodiment, the position overlapping the center P0 of the virtual circle VC in the Z-axis direction of the lower surface 226 of the second housing 220 of the upper connector 200, that is, the socket 230 is not arranged. The pressing member 340 abutting on the position causes the upper connector 200 to move downward with respect to the base member 20 (that is, the upper connector 200 comes off from the pad-side feeding terminal 72 of the second housing 220 of the upper connector 200). Can be regulated. Therefore, according to the electrostatic chuck 100 of the present embodiment, the pad-side feeding terminal of the second housing 220 of the upper connector 200 is suppressed from increasing the size of the terminal hole Ht in the Z-axis direction. It is possible to suppress the omission from 72.

Further, in the electrostatic chuck 100 of the present embodiment, the upper connector 200 and the side surface of the terminal hole Ht (the first through hole 22 of the base member 20 constituting the terminal hole Ht and the second through hole of the adhesive portion 30). There is a space between it and the side surface of 32). Therefore, even when the electrostatic chuck 100 is exposed to the thermal cycle, it is possible to prevent the upper connector 200 from coming into contact with the base member 20 due to the difference in thermal expansion between the plate-shaped member 10 and the base member 20. It is possible to prevent the members such as the pad-side feeding terminal 72 from being damaged due to the contact.

B. Modification example:
The technique disclosed in the present specification is not limited to the above-described embodiment, and can be transformed into various forms without departing from the gist thereof, and for example, the following modifications are also possible.

The configuration of the electrostatic chuck 100 in the above embodiment is merely an example and can be variously modified. For example, the number M of the power supply pads 70 and the pad-side power supply terminals 72 arranged in the holes Ht for each terminal (M = 5 in the above embodiment) can be set to any number of 3 or more. However, if the number M is 7 or more, a large region in which the power feeding pad 70 and the pad-side feeding terminal 72 are not arranged may be formed near the center of the terminal hole Ht in the Z-axis direction. The number M is preferably 6 or less. Further, the number M may be different for each terminal hole Ht of the electrostatic chuck 100.

Further, in the above embodiment, all of the M power feeding pads 70 arranged in the holes Ht for each terminal are arranged at substantially equal pitches on the circumference of the virtual circle VC in the Z-axis direction view. , Only a part of the M power supply pads 70 arranged in the holes Ht for each terminal is arranged at substantially equal pitch on the circumference of the virtual circle VC in the Z-axis direction view, and M pieces. The remaining part of the feeding pad 70 may not be so arranged. That is, among the M power supply pads 70, N (however, N is an integer of 3 or more and M or less) of the power supply pads 70 are abbreviated on the circumference of the virtual circle VC in the Z-axis direction. It may be assumed that they are arranged on a pitch. In the above embodiment, N = M.

Further, in the above embodiment, a plurality of power feeding pads 70 arranged in the holes Ht for each terminal are arranged at substantially equal pitches on the circumference of a single virtual circle VC in the Z-axis direction. Even if the plurality of power feeding pads 70 are divided on the circumference of a plurality of virtual circle VCs having different diameters in the Z-axis direction and are arranged at substantially equal pitches on the circumference of each virtual circle VC. good.

Further, in the above embodiment, the pad-side power feeding terminal 72 is provided with a rod-shaped portion 76, and a hole 232 is formed in the socket 230 of the upper connector 200, and the rod-shaped portion 76 is inserted into the hole 232 to form a pad. The side power supply terminal 72 and the socket 230 of the upper connector 200 are electrically connected, but on the contrary, a hole is formed in the pad side power supply terminal 72, a rod-shaped portion is formed in the upper connector 200, and the rod-shaped portion is the rod-shaped portion. By being inserted into the hole, the pad-side power supply terminal 72 and the upper connector 200 may be electrically connected.

Further, in the above embodiment, the cross-sectional shape orthogonal to the extending direction of the terminal hole Ht is circular, but the cross-sectional shape may be a shape other than the circular shape.

Further, in the above embodiment, the holding member 340 is in contact with the lower surface 226 of the second housing 220 of the upper connector 200 at a position overlapping the center P0 of the virtual circle VC in the Z-axis direction. The contact position of the pressing member 340 is not limited to this. For example, the pressing member 340 may abut on the lower surface 226 of the second housing 220 of the upper connector 200 other than the region to which the lead wire 80 is connected, or the pressing member 340 may be attached to the upper connector 200. It may abut on the region near the center of the lower surface 226 of the second housing 220 (the region between the center of the lower surface 226 and the position where the lead wire 80 is connected).

Further, the configurations of the upper connector 200 and the lower connector 300 in the above embodiment are merely examples and can be variously modified. For example, in the above embodiment, the upper connector 200 includes two housings (the first housing 210 and the second housing 220), but the upper connector 200 may include only one housing.

Further, in the above embodiment, regarding the position of the driver electrode layer 51 in the Z-axis direction, the entire driver electrode layer 51 is at the same position (that is, the driver electrode layer 51 has a single layer configuration), but the driver electrode A part of the layer 51 may be located at a different position (that is, the driver electrode layer 51 may have a plurality of layers).

Further, the setting mode of the segment SE in the above embodiment (the number of the segment SE, the shape of each segment SE, etc.) can be arbitrarily changed. For example, in the above embodiment, a plurality of segment SEs are set so that the segment SEs are arranged in the circumferential direction CD of the suction surface S1, but a plurality of segment SEs are set so that the segment SEs are arranged in a grid pattern. May be done. Further, for example, in the above embodiment, the entire electrostatic chuck 100 is virtually divided into a plurality of segment SEs, but even if a part of the electrostatic chuck 100 is virtually divided into a plurality of segment SEs. good. Further, in the electrostatic chuck 100, the segment SE does not necessarily have to be set.

In a configuration in which a very large number (for example, 100 or more) of segment SEs are set in the plate-shaped member 10, the number of heater electrodes 500 arranged in the plate-shaped member 10 becomes very large, and the number of heater electrodes 500 is increased accordingly. The number of pad-side power supply terminals 72 for supplying power to the heater electrode 500 is very large, and the number of terminal hole Hts and the number of pad-side power supply terminals 72 accommodated in each terminal hole Ht are very large. Therefore, it is particularly effective to apply the present invention to such a configuration.

Further, in the above embodiment, each via may be composed of a single via or a group of a plurality of vias. Further, in the above embodiment, each via may have a single-layer configuration consisting of only a via portion, or may have a multi-layer configuration (for example, a configuration in which a via portion, a pad portion, and a via portion are laminated). May be good. Further, in the above embodiment, a unipolar method in which one chuck electrode 40 is provided inside the plate-shaped member 10 is adopted, but a bipolar system in which a pair of chuck electrodes 40 are provided inside the plate-shaped member 10 is adopted. The method may be adopted.

Further, the forming material of each member (plate-shaped member 10, base member 20, adhesive portion 30, etc.) of the electrostatic chuck 100 of the above embodiment is merely an example and can be variously changed. For example, in the above embodiment, the plate-shaped member 10 is formed of ceramics, but the plate-shaped member 10 may be formed of a material other than ceramics (for example, a resin material).

Further, the present invention is not limited to the electrostatic chuck 100 which includes the plate-shaped member 10 and the base member 20 and holds the wafer W by utilizing electrostatic attraction, but also the plate-shaped member, the base member, and the plate-shaped member. It is also applicable to other holding devices (for example, a heater device such as a CVD heater, a vacuum chuck, etc.) for holding an object on the surface of a plate-shaped member, which is provided with an adhesive portion for adhering the base member to the base member.

10: Plate-shaped member 12: Recessed portion 20: Base member 21: Refrigerant flow path 22: First through hole 23: First through hole lower end 30: Adhesive part 32: Second through hole 40: Chuck electrode 50: Heater electrode layer 51: Driver electrode layer 53: Via 54: Via 70: Feeding pad 72: Pad side feeding terminal 74: Base 76: Rod-shaped part 78: Wax material 79: Resin adhesive 80: Lead wire 100: Electrostatic chuck 200 : Upper connector 210: First housing 212: Through hole 214: Lower part 220: Second housing 222: Through hole 224: Recessed portion 226: Bottom surface 230: Socket 232: Hole 300: Lower connector 310: Housing 312: Through hole 314: Slit 315: Through hole 330: Socket 332: Hole 340: Holding member 352: C ring 354: Set screw 356: Holding plate 500: Heater electrode 502: Heater line part 504: Heater pad part 510: Driver electrode 512 : Radial part BL1: First boundary line BL2: Second boundary line CD: Circumferential direction CP: Center point Ht: Terminal hole P0: Center P1: Center RD: Radial direction S1: Suction surface S2: Bottom surface S3 : Top surface S4: Bottom surface SE: Segment VC: Virtual circle VL: Virtual straight line W: Wafer

Claims (3)

A plate-like member having a substantially planar first surface substantially orthogonal to the first direction and a second surface opposite to the first surface.
A plurality of heater electrodes arranged on the plate-shaped member and composed of a resistance heating element, and
A driver electrode layer arranged on the plate-shaped member and including a plurality of driver electrodes electrically connected to the heater electrode,
It has a third surface and a fourth surface opposite to the third surface, and the third surface is arranged so as to face the second surface of the plate-like member. A base member in which a plurality of first through holes penetrating from the third surface to the fourth surface and a refrigerant flow path are formed.
A plurality of the first surfaces of the base member are arranged between the second surface of the plate-shaped member and the third surface of the base member to bond the plate-shaped member and the base member. An adhesive portion in which a plurality of second through holes forming a plurality of terminal holes together with the plurality of the first through holes are formed in communication with the through holes of the above.
The driver electrodes are M (however, M is an integer of 3 or more) feeding electrodes arranged in a region constituting the bottom surface of each terminal hole in the second surface of the plate-shaped member. With M feeding electrodes electrically connected to
A first feeding terminal provided on each feeding electrode in each of the terminal holes,
A connection member having M second feeding terminals housed in each of the terminal holes, fitted with each of the first feeding terminals, and electrically connected to the first feeding terminal.
In a holding device for holding an object on the first surface of the plate-shaped member.
Of the M feeding electrodes, N (where N is an integer of 3 or more and M or less) of the feeding electrodes have substantially equal pitches on the circumference of the virtual circle in the first directional view. Arranged in,
Each of the N driver electrodes electrically connected to the N feeding electrodes extends radially outward from the connection position with the feeding electrode in the first directional view. Has a radial portion,
A holding device characterized by that. In the holding device according to claim 1,
N = M,
A holding device characterized by that. In the holding device according to claim 1 or 2, further
A presser that is fixed to the base member and abuts on a position overlapping the center of the virtual circle in the first directional view of the surface of the connecting member on the side opposite to the side facing the plate-shaped member. Equipped with members
A holding device characterized by that.

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