JP7164974B2 - holding device - Google Patents

Description

The technology disclosed in this specification relates to a holding device that holds an object.

For example, an electrostatic chuck is used as a holding device for holding a wafer when manufacturing semiconductors. The electrostatic chuck includes a ceramic member having a substantially planar surface (hereinafter referred to as "adsorption surface") substantially perpendicular to a predetermined direction (hereinafter referred to as "first direction"), and an electrostatic chuck disposed inside the ceramic member. The wafer is attracted to and held by the attraction surface of the ceramic member using electrostatic attraction generated by applying a voltage to the chuck electrode.

If the temperature of the wafer held on the attraction surface of the electrostatic chuck does not reach the desired temperature, the precision of each process (film formation, etching, etc.) on the wafer may decrease. The ability to control the distribution is required. Therefore, for example, a heater electrode is provided inside the ceramic member. When a voltage is applied to the heater electrode, the heater electrode generates heat to heat the ceramic member, thereby controlling the temperature distribution of the attracting surface of the ceramic member (and thus controlling the temperature distribution of the wafer held by the attracting surface). control) is realized.

For power supply to the heater electrode, the electrostatic chuck is provided with a driver electrode electrically connected to the heater electrode and a power supply terminal electrically connected to the driver electrode. In such a configuration, power is supplied from the power supply to the heater electrodes via the power supply terminals and the driver electrodes. The shape of the driver electrode as viewed in the first direction is, for example, a fan shape with the vertex near the center point of the ceramic member (see, for example, Patent Document 1).

WO2017/115758

Conventionally, in the driver electrode, a point electrically connected to the power supply terminal (hereinafter referred to as "terminal side connection point") and a point electrically connected to the heater electrode in the driver electrode (hereinafter referred to as "heater side connection point") ) are spaced apart in the radial direction of the ceramic member (the direction from the center point of the ceramic member toward the outer peripheral side). In such a configuration, when power is supplied to the heater electrode, the current flows in the driver electrode in the radial direction, and the area near the current path in the driver electrode locally generates heat. Such local heat generation along the radial direction of the ceramic member in the driver electrode leads to the occurrence of a local temperature singularity on the attraction surface of the ceramic member, and the controllability of the temperature distribution on the attraction surface of the ceramic member decreases. There is a risk of As described above, the conventional electrostatic chuck has room for improvement in terms of controllability of the temperature distribution of the attracting surface of the ceramic member (and thus controllability of the temperature distribution of the wafer held by the attracting surface).

Note that such a problem is not limited to electrostatic chucks that hold a wafer using electrostatic attraction, but is common to all holding devices that include a plate-like member and hold an object on the surface of the plate-like member. is.

This specification discloses a technology capable of solving the above-described problems.

The technology disclosed in this specification can be implemented, for example, in the following forms.

(1) The holding device disclosed in this specification includes a plate-like member having a substantially planar first surface substantially orthogonal to a first direction, and at least one a heater electrode, a power supply terminal pair composed of a first power supply terminal and a second power supply terminal, and a driver electrode pair arranged inside a first position in the first direction of the plate member a first driver electrode electrically connected to the first power supply terminal and the heater electrode; and a second driver electrically connected to the second power supply terminal and the heater electrode. and a pair of driver electrodes, the holding device for holding an object on the first surface of the plate member, wherein the first driver electrode is arranged in the first direction when viewed in the first direction. a first arc-shaped portion extending along a portion of a circumference of an imaginary circle centered on the central point of the plate-shaped member, the first heater-side connection electrically connected to the heater electrode; and a first terminal-side connection point separated from the first heater-side connection point in the circumferential direction of the virtual circle and electrically connected to the first power supply terminal. and the second driver electrode is a second arcuate portion extending along another part of the circumference of the virtual circle when viewed in the first direction, wherein a second heater-side connection point electrically connected to the heater electrode; and the second power supply terminal spaced from the second heater-side connection point in the circumferential direction of the virtual circle and a second terminal-side connection point electrically connected to the second arcuate portion. In this holding device, when power is supplied to the heater electrode, the current path connecting the first terminal-side connection point and the first heater-side connection point in the first arcuate portion of the first driver electrode is: In the second arc-shaped portion of the second driver electrode, the second heater-side connection point and the second A current path connecting the terminal-side connection points is also substantially parallel to the circumferential direction of the virtual circle. Therefore, in the present holding device, heat is locally generated along the circumferential direction of the virtual circle in the arc-shaped portion of each driver electrode. The occurrence of local temperature singularities on the first surface can be easily suppressed by devising the arrangement and shape of the heater electrodes extending substantially parallel to the circumferential direction of the virtual circle. Therefore, according to this holding device, it is possible to improve the controllability of the temperature distribution on the first surface of the plate member (and thus the controllability of the temperature distribution of the object held on the first surface).

(2) In the above holding device, in the first arc-shaped portion of the first driver electrode, the first heater-side connection point extends in the circumferential direction of the virtual circle when viewed in the first direction. The first terminal-side connection point is located at the other end along the circumferential direction of the virtual circle, and the second driver electrode is located at one end along the second circle. In the arc-shaped portion, the second heater-side connection point is located at one end along the circumferential direction of the virtual circle, and the second terminal-side connection point is located in the circumferential direction of the virtual circle. The driver electrode pair is located at the other end along the line, and the driver electrode pair is positioned on the circumference of the virtual circle overlapping the first arc-shaped portion with respect to the total length of the circumference of the virtual circle when viewed in the first direction. A ratio of the sum of the length of the portion and the length of the portion of the circumference of the virtual circle that overlaps with the second arc-shaped portion may be configured to be 1/2 or more. In this holding device, when power is supplied to the heater electrode, current flows along the arc-shaped portion of each driver electrode along a half or more of the circumference of the virtual circle. Therefore, according to the present holding device, since it is possible to suppress variations in heat generation in the circumferential direction of the virtual circle in the arcuate portions of the driver electrodes, variations in heat generation along the circumferential direction can be prevented. It is possible to suppress the occurrence of a local temperature singularity on the first surface, and improve the controllability of the temperature distribution on the first surface of the plate member.

(3) In the above holding device, the driver electrode pair has a length of a portion of the circumference of the virtual circle overlapping the first arcuate portion and the second arcuate portion when viewed in the first direction. The total length of the overlapping portions of the circumference of the virtual circle may be substantially equal to the total length of the circumference of the virtual circle. In this holding device, current flows along substantially the entire circumference of the virtual circle in the arcuate portion of each driver electrode when power is supplied to the heater electrode. Therefore, according to this holding device, in the arcuate portion of each driver electrode, it is possible to effectively suppress variations in heat generation in the circumferential direction of the virtual circle. It is possible to effectively suppress the occurrence of local temperature singularities on the first surface caused by .

(4) The holding device includes a plurality of the power supply terminal pairs and a plurality of the driver electrode pairs provided corresponding to the plurality of the power supply terminal pairs, and for each of the plurality of the driver electrode pairs, The virtual circles may have different diameters. According to this holding device, for each of the plurality of driver electrode pairs to which a voltage is applied independently of each other, the first surface of the plate-like member is caused by the heat generated by the current flowing through the arc-shaped portion of each driver electrode. It is possible to easily suppress the occurrence of a local temperature singularity in the plate-shaped member by devising the arrangement and shape of heater electrodes extending substantially parallel to the circumferential direction of virtual circles having different diameters. Controllability of the temperature distribution on the first surface can be improved.

(5) In the above holding device, when viewed from the first direction, the first terminal side connection point on the first driver electrode constituting one of the plurality of driver electrode pairs and the plate-like member A virtual line segment connecting the center point is the center point of the plate-like member and the first terminal side connection point on the first driver electrode constituting the other one of the plurality of driver electrode pairs. It is good also as a structure which does not overlap with the virtual line segment which connects this. In this holding device, for each of the plurality of driver electrode pairs to which a voltage is applied independently of each other, the positions of the respective first terminal side connection points connected to the first power supply terminals are spaced apart from each other in the circumferential direction. is doing. Therefore, according to the present holding device, it is possible to suppress the occurrence of a local temperature singularity on the first surface of the plate-like member caused by the concentration of the positions of the first terminal-side connection points. It is possible to effectively improve the controllability of the temperature distribution on the first surface of the plate member.

(6) In the above holding device, the dummy electrode disposed inside the first position in the first direction of the plate-like member is made of a material having a higher thermal conductivity than the plate-like member. A configuration may be provided in which a dummy electrode is formed, is not overlapped with the circumference of the virtual circle when viewed in the first direction, and is not electrically connected to the power supply terminal. In this holding device, the heat generated by the current flowing through the driver electrodes constituting each driver electrode pair is well transmitted in the planar direction due to the presence of the dummy electrodes. Therefore, according to the present holding device, it is possible to effectively suppress the occurrence of local temperature singularities on the first surface of the plate-shaped member due to heat generation due to the current flowing through the driver electrode. It is possible to effectively improve the controllability of the temperature distribution on the first surface of the member.

(7) In the above holding device, the dummy electrode disposed inside the first position in the first direction of the plate-like member is made of a material having a higher thermal conductivity than that of the plate-like member. A configuration may be provided in which a dummy electrode is formed, overlaps the circumference of the virtual circle when viewed in the first direction, and is not electrically connected to the power supply terminal. According to this holding device, the heat generated by the current flowing through the driver electrodes forming the driver electrode pair is well transmitted along the circumferential direction of the virtual circle due to the presence of the dummy electrodes. Therefore, according to the present holding device, it is possible to effectively suppress the occurrence of a local temperature singularity on the first surface of the plate-shaped member due to heat generation due to the current flowing through the driver electrodes constituting the driver electrode pair. It is possible to effectively improve the controllability of the temperature distribution on the first surface of the plate member.

(8) In the above-described holding device, the other-layer driver electrode is arranged inside a second position different from the first position in the first direction of the plate-shaped member, is electrically connected to the first terminal-side connection point of the first arc-shaped portion of the driver electrode of the plate-like member from the first terminal-side connection point when viewed in the first direction. and a driver electrode in another layer, which is electrically connected to the first power supply terminal, at a position near the center point. According to this holding device, it is possible to arrange the first power supply terminal near the center point of the plate-like member while improving the controllability of the temperature distribution on the first surface of the plate-like member.

The technology disclosed in this specification can be implemented in various forms, for example, holding devices, electrostatic chucks, heater devices such as CVD heaters, vacuum chucks, manufacturing methods thereof, and the like. It is possible to realize by

1 is a perspective view schematically showing an appearance configuration of an electrostatic chuck 100 according to a first embodiment; FIG. It is an explanatory view showing roughly the XZ section composition of electrostatic zipper 100 in a 1st embodiment. It is an explanatory view showing roughly XY section composition of electrostatic chuck 100 in a 1st embodiment. It is an explanatory view showing roughly XY section composition of electrostatic chuck 100 in a 1st embodiment. It is an explanatory view showing roughly XY section composition of electrostatic chuck 100 in a 1st embodiment. FIG. 10 is an explanatory diagram schematically showing an XY cross-sectional configuration of an electrostatic chuck 100X in a comparative example; It is explanatory drawing which shows roughly the XY cross-sectional structure of the electrostatic chuck 100 in 2nd Embodiment. It is explanatory drawing which shows roughly the XY cross-sectional structure of the electrostatic chuck 100 in 3rd Embodiment.

A. First embodiment:
A-1. Configuration of electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing the external configuration of an electrostatic chuck 100 according to the first embodiment, and FIG. 2 is an explanatory view schematically showing the XZ cross-sectional configuration of the electrostatic chuck 100 according to the first embodiment. 3 to 5 are explanatory diagrams schematically showing the XY cross-sectional configuration of the electrostatic chuck 100 according to the first embodiment. 3 shows the XY cross-sectional configuration of the electrostatic chuck 100 at the position III-III in FIG. 2, and FIG. 4 shows the XY cross-sectional configuration of the electrostatic chuck 100 at the position IV-IV in FIG. , and FIG. 5 shows the XY cross-sectional configuration of the electrostatic chuck 100 at the position VV in FIG. Each figure shows mutually orthogonal XYZ axes for specifying directions. In this specification, for the sake of convenience, the positive direction of the Z-axis is referred to as the upward direction, and the negative direction of the Z-axis is referred to as the downward direction. may be

The electrostatic chuck 100 is a device that attracts and holds an object (for example, a wafer W) by electrostatic attraction, and is used, for example, to fix the wafer W within a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 100 includes a ceramic member 10 and a base member 20 arranged side by side in a predetermined arrangement direction (vertical direction (Z-axis direction) in this embodiment). The ceramic member 10 and the base member 20 are arranged such that the lower surface S2 (see FIG. 2) of the ceramic member 10 and the upper surface S3 of the base member 20 face each other in the arrangement direction.

The ceramic member 10 is a plate-shaped member having a substantially circular planar upper surface (hereinafter referred to as “adsorption surface”) S1 substantially orthogonal to the arrangement direction (Z-axis direction) described above, and is made of ceramics (for example, alumina or aluminum nitride). etc.). The diameter of the ceramic member 10 is, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the thickness of the ceramic member 10 is, for example, about 1 mm to 10 mm. The ceramic member 10 corresponds to a plate member in the claims, the adsorption surface S1 of the ceramic member 10 corresponds to the first surface in the claims, and the Z-axis direction corresponds to the first surface in the claims. 1 direction. Also, in this specification, a direction perpendicular to the Z-axis direction is referred to as a "plane direction".

As shown in FIG. 2, a chuck electrode 40 made of a conductive material (eg, tungsten, molybdenum, platinum, etc.) is arranged inside the ceramic member 10 . The shape of the chuck electrode 40 as viewed in the Z-axis direction is, for example, a substantially circular shape. When a voltage is applied to the chuck electrode 40 from a power supply (not shown), electrostatic attraction is generated, and the wafer W is attracted and fixed to the attraction surface S1 of the ceramic member 10 by this electrostatic attraction.

Inside the ceramic member 10, a heater electrode layer 500 for controlling the temperature distribution of the attraction surface S1 of the ceramic member 10 (that is, controlling the temperature distribution of the wafer W held on the attraction surface S1), a heater Arrangements for power supply to the electrode layer 500 are arranged. These configurations will be described in detail later. In addition, the ceramic member 10 having such a structure is produced, for example, by manufacturing a plurality of ceramic green sheets, and performing processes such as forming via holes in predetermined ceramic green sheets, filling metallizing paste, printing, etc., and producing these ceramic green sheets. It can be produced by bonding a sheet by thermocompression, performing processing such as cutting, and then firing.

The base member 20 is, for example, a circular planar plate member having the same diameter as the ceramic member 10 or having a larger diameter than the ceramic member 10, and is made of metal (aluminum, aluminum alloy, etc.), for example. The diameter of the base member 20 is, for example, approximately 220 mm to 550 mm (usually 220 mm to 350 mm), and the thickness of the base member 20 is, for example, approximately 20 mm to 40 mm.

The base member 20 is joined to the ceramic member 10 by an adhesive layer 30 arranged between the lower surface S2 of the ceramic member 10 and the upper surface S3 of the base member 20. As shown in FIG. The adhesive layer 30 is made of an adhesive such as silicone resin, acrylic resin, or epoxy resin. The thickness of the adhesive layer 30 is, for example, about 0.1 mm to 1 mm.

A coolant channel 21 is formed inside the base member 20 . When a coolant (for example, a fluorine-based inert liquid, water, or the like) is caused to flow through the coolant channel 21 , the base member 20 is cooled, and heat transfer ( The ceramic member 10 is cooled by the thermal drawing, and the wafer W held on the adsorption surface S1 of the ceramic member 10 is cooled. Thereby, control of the temperature distribution of the wafer W is realized.

A-2. Configuration of heater electrode layer 500 and the like:
Next, the configuration of the heater electrode layer 500 and the configuration for power supply to the heater electrode layer 500 will be described in detail. As described above, the electrostatic chuck 100 includes the heater electrode layer 500 (see FIG. 2). The heater electrode layer 500 is made of a conductive material (eg, tungsten, molybdenum, platinum, etc.). In this embodiment, the heater electrode layer 500 is arranged below the chuck electrode 40 in the Z-axis direction.

Here, as shown in FIG. 3, in the electrostatic chuck 100 of the present embodiment, the ceramic member 10 has four segments SE (SEa , SEb, SEc, SEd) are set. More specifically, when viewed in the Z-axis direction, the ceramic member 10 is divided into four virtual annular regions (including the central point P0) by concentric boundary lines BL centered on the central point P0 of the ceramic member 10. Only the area is divided into segments SE, which are circular areas). Below, the suffixes (a, b, c, d) of the corresponding segment SE may be added to the end of the reference numerals indicating the configuration provided corresponding to each segment SE.

As shown in FIG. 3, the heater electrode layer 500 includes a plurality of heater electrodes 50 (50a, 50b, 50c, 50d). In this embodiment, the heater electrode layer 500 includes a total of eight heater electrodes 50, two for each segment SE. Each heater electrode 50 includes a heater line portion 56, which is a linear resistance heating element as viewed in the Z-axis direction, and a first heater pad portion 51 and a second heater pad connected to respective ends of the heater line portion 56. and a portion 52 . Hereinafter, the first heater pad portion 51 and the second heater pad portion 52 are also collectively referred to as the heater pad portions 51 and 52 . The width of the heater pad portions 51 and 52 is larger than the width of the heater line portion 56 when viewed in the Z-axis direction. Further, the shape of the heater line portion 56 of each heater electrode 50 as viewed in the Z-axis direction is substantially circular.

The electrostatic chuck 100 also has a configuration for supplying power to each heater electrode 50 that constitutes the heater electrode layer 500 . Specifically, as shown in FIG. 2 , the electrostatic chuck 100 has a power supply terminal pair 81 . Although only one power supply terminal pair 81 is shown in FIG. 2, in this embodiment, the electrostatic chuck 100 has four power supply terminal pairs 81 corresponding to the four segments SE.

Each feed terminal pair 81 is composed of a first feed terminal 811 and a second feed terminal 812 . The first power supply terminal 811 and the second power supply terminal 812 are made of a conductive material (for example, tungsten, molybdenum, platinum, etc.). Hereinafter, the first power supply terminal 811 and the second power supply terminal 812 are also collectively referred to as power supply terminals 811 and 812 .

Power supply terminals 811 and 812 constituting each power supply terminal pair 81 are accommodated in terminal holes 110 extending from the bottom surface S4 of the base member 20 to the inside of the ceramics member 10 . Each terminal hole 110 includes a through hole 22 vertically penetrating the base member 20, a through hole 32 vertically penetrating the adhesive layer 30, and a concave portion 12 formed on the lower surface S2 side of the ceramic member 10. , are integral holes formed by communicating with each other. An electrode pad 82 made of a conductive material is provided on the bottom surface of the concave portion 12 of the ceramic member 10 forming each terminal hole 110 . The power supply terminals 811 and 812 are joined to the electrode pads 82 by, for example, brazing.

In addition, as shown in FIG. 2, the electrostatic chuck 100 includes an upper driver electrode layer 600 and a lower driver electrode layer 700 as a structure for supplying power to each heater electrode 50 that constitutes the heater electrode layer 500 . The upper driver electrode layer 600 and the lower driver electrode layer 700 are made of a conductive material (eg, tungsten, molybdenum, platinum, etc.). In this embodiment, the lower driver electrode layer 700 is arranged below the heater electrode layer 500 in the Z-axis direction, and the upper driver electrode layer 600 is located between the heater electrode layer 500 and the lower driver electrode layer 700. are placed in In other words, the lower driver electrode layer 700 is arranged on the lower surface S2 side (opposite to the attraction surface S1) from the upper driver electrode layer 600 .

As shown in FIG. 4, the upper driver electrode layer 600 includes four upper driver electrode pairs 60 (60a, 60b, 60c, 60d). Each upper driver electrode pair 60 is composed of a first upper driver electrode 61 and a second upper driver electrode 62 . Hereinafter, the first upper driver electrode 61 and the second upper driver electrode 62 are also collectively referred to as upper driver electrodes 61 and 62 . The upper layer driver electrode pair 60 corresponds to the driver electrode pair in the claims, and the position where the upper layer driver electrode pair 60 is arranged in the Z-axis direction of the ceramic member 10 corresponds to the first position in the claims. The first upper layer driver electrode 61 corresponds to the first driver electrode in the claims, and the second upper layer driver electrode 62 corresponds to the second driver electrode in the claims. The configuration of each upper driver electrode pair 60 included in the upper driver electrode layer 600 will be further detailed later.

As shown in FIG. 5, the lower driver electrode layer 700 has four lower driver electrode pairs 70 (70a, 70b, 70c, 70d) corresponding to the four segments SE. Each lower driver electrode pair 70 is composed of a first lower driver electrode 71 and a second lower driver electrode 72 . Hereinafter, the first lower driver electrode 71 and the second lower driver electrode 72 are also collectively referred to as the lower driver electrodes 71 and 72 . The lower layer driver electrodes 71 and 72 correspond to other layer driver electrodes in the claims, and the position where the lower layer driver electrode pair 70 is arranged in the Z-axis direction of the ceramic member 10 is the second position in the claims. corresponds to Also, hereinafter, the first upper driver electrode 61, the second upper driver electrode 62, the first lower driver electrode 71, and the second lower driver electrode 72 are collectively referred to as the driver electrodes 61, 62, 71, and 72. Say. The configuration of each lower driver electrode pair 70 included in the lower driver electrode layer 700 will be further detailed later.

As shown in FIGS. 2 to 4, the first upper driver electrode 61 forming each upper driver electrode pair 60 is connected to the heater electrode layer 500 and the upper driver electrode layer 600 at the first heater side connection point 65 . It is electrically connected to the first heater pad portion 51 of each heater electrode 50 arranged in the corresponding segment SE via the via 85 connecting between them. Further, as shown in FIGS. 2, 4 and 5, the first upper driver electrode 61 constituting each upper driver electrode pair 60 is connected to the upper driver electrode layer 600 and the lower driver electrode layer 600 at the first terminal side connection point 63 . a via 84 connecting between the driver electrode layer 700, a first lower driver electrode 71 constituting the lower driver electrode pair 70, a via 83 connecting between the lower driver electrode layer 700 and the electrode pad 82; It is electrically connected to the first power supply terminal 811 via the electrode pad 82 . Similarly, as shown in FIGS. 2 to 4, the second upper layer driver electrodes 62 forming each upper layer driver electrode pair 60 are connected to the corresponding segments via vias 85 at the second heater side connection points 66 . It is electrically connected to the second heater pad portion 52 of each heater electrode 50 arranged on the SE. Further, as shown in FIGS. 2, 4 and 5, the second upper driver electrode 62 forming each upper driver electrode pair 60 has a via 84 and a lower driver electrode at the second terminal side connection point 64 . It is electrically connected to the second power supply terminal 812 through the second lower layer driver electrode 72 forming the pair 70 , the via 83 and the electrode pad 82 .

Power supply terminals 811 and 812 forming each power supply terminal pair 81 are connected to a power supply (not shown). The voltage from the power supply is applied to the power supply terminals 811 and 812, the electrode pad 82 and the via 83 that constitute the power supply terminal pair 81, the lower driver electrodes 71 and 72 that constitute the lower driver electrode pair 70, the via 84, and the upper driver electrode pair 60. It is applied to each heater electrode 50 via the upper layer driver electrodes 61 and 62 and the via 85 . When a voltage is applied to each heater electrode 50, each heater electrode 50 generates heat to heat the ceramics member 10, thereby controlling the temperature distribution of the attraction surface S1 of the ceramics member 10 (that is, holding it on the attraction surface S1). control of the temperature distribution of the wafer W that has been processed) is realized. In the present embodiment, since the voltage is applied to the heater electrode 50 through an independent path for each segment SE, the amount of heat generated by the heater electrode 50 can be controlled independently for each segment SE. Highly accurate control of temperature distribution can be achieved.

The driver electrodes 61, 62, 71, and 72 are different from the heater electrode 50 in that at least one of the following (1) to (3) is satisfied.
(1) The cross-sectional area of the driver electrodes 61 , 62 , 71 , 72 in the direction perpendicular to the direction of current flow is ten times or more the similar cross-sectional area of the heater electrode 50 .
(2) In the plane direction, the driver electrodes 61, 62, 71, 72 have an area larger than one segment SE.
(3) In the driver electrodes 61, 62, 71, 72, the resistance between the vias connected to the heater electrode 50 side and the vias connected to the power supply terminals 811, 812 is the driver electrodes 61, 62 in the heater electrode 50. Less than one-fifth of the resistance from one via to the other.

A-3. Detailed configuration of each upper driver electrode pair 60 included in the upper driver electrode layer 600 and each lower driver electrode pair 70 included in the lower driver electrode layer 700:
Next, the configuration of each upper driver electrode pair 60 included in the upper driver electrode layer 600 and the configuration of each lower driver electrode pair 70 included in the lower driver electrode layer 700 will be described in more detail.

As described above, each upper driver electrode pair 60 included in the upper driver electrode layer 600 is composed of the first upper driver electrode 61 and the second upper driver electrode 62 . As shown in FIG. 4, in this embodiment, the shape of the first upper layer driver electrode 61 is approximately one shape along the virtual circle VC centered at the center point P0 of the ceramic member 10 as viewed in the Z-axis direction. The shape of the second upper layer driver electrode 62 is the other semi-annular shape obtained by dividing the ring in half. Therefore, the first upper layer driver electrode 61 has a first arc-shaped portion extending along a part of the circumference of the virtual circle VC as viewed in the Z-axis direction, and the second upper layer driver electrode 62 has a , has a second arcuate portion extending along another portion of the circumference of the virtual circle VC as viewed in the Z-axis direction. In this embodiment, the entire first upper layer driver electrode 61 corresponds to the above-described first arc-shaped portion, and the entire second upper layer driver electrode 62 corresponds to the above-described second arc-shaped portion. Therefore, hereinafter, they are also referred to as the first arcuate portion 61 and the second arcuate portion 62 . Note that the first arcuate portion 61 and the second arcuate portion 62 may be linear, or may have a solid shape with a width in the radial direction, as viewed in the Z-axis direction.

As described above, the first arcuate portion (first upper layer driver electrode) 61 includes the first heater side connection point 65 electrically connected to the heater electrode 50, the first lower layer driver electrode 71, and the first lower layer driver electrode 71. and a first terminal side connection point 63 electrically connected to a first power supply terminal 811 via an electrode pad 82 or the like. In the first arc-shaped portion 61, the first terminal-side connection point 63 is separated from the first heater-side connection point 65 in the circumferential direction of the virtual circle VC. In the present embodiment, in the first arcuate portion 61, the first heater-side connection point 65 is positioned at one end along the circumferential direction of the virtual circle VC as viewed in the Z-axis direction. One terminal-side connection point 63 is positioned at the other end along the circumferential direction of the virtual circle VC.

Further, as described above, the second arc-shaped portion (second upper layer driver electrode) 62 includes the second heater side connection point 66 electrically connected to the heater electrode 50 and the second lower layer driver electrode. 72 and a second terminal side connection point 64 electrically connected to the second power supply terminal 812 via the electrode pad 82 or the like. In the second arc-shaped portion 62, the second terminal-side connection point 64 is separated from the second heater-side connection point 66 in the circumferential direction of the virtual circle VC. In the present embodiment, in the second arc-shaped portion 62, the second heater-side connection point 66 is positioned at one end along the circumferential direction of the virtual circle VC as viewed in the Z-axis direction. 2 terminal side connection point 64 is positioned at the other end along the circumferential direction of the virtual circle VC.

As described above, in the present embodiment, when viewed in the Z-axis direction, the shape of the first upper layer driver electrode 61 is approximately one half of a circular ring along the virtual circle VC. The shape of the second upper layer driver electrode 62 is the other semi-annular shape obtained by dividing the ring in half. Therefore, in the present embodiment, the first upper layer driver electrode 61 and the second upper layer driver electrode 62 forming the upper layer driver electrode pair 60 are arranged on the virtual circle VC overlapping the first arcuate portion 61 as viewed in the Z-axis direction. and the length of the portion of the circumference of the virtual circle VC that overlaps the second arc-shaped portion 62 is substantially equal to the total length of the circumference of the virtual circle VC. . The term "substantially equal" as used herein means that the total length of each circumferential portion is 90% or more of the total length of the circumference.

Note that the virtual circle VC has a different diameter for each of the plurality of upper driver electrode pairs 60 included in the upper driver electrode layer 600 . More specifically, the diameter of the virtual circle VC is larger in the upper layer driver electrode pair 60 electrically connected to the heater electrode 50 arranged in the segment SE located on the outer peripheral side.

Further, in the present embodiment, when viewed in the Z-axis direction, the first terminal side connection point 63 on the first upper driver electrode 61 constituting one upper driver electrode pair 60 (for example, the upper driver electrode pair 60a) and the A virtual line segment VL (for example, a virtual line segment VLa) connecting the center point P0 of the ceramic member 10 is a first upper-layer driver constituting another upper-layer driver electrode pair 60 (for example, an upper-layer driver electrode pair 60b). It does not overlap with the virtual line segment VL (for example, virtual line segment VLb) connecting the first terminal-side connection point 63 on the electrode 61 and the center point P0 of the ceramic member 10 . This means that the position of the first terminal-side connection point 63 on the first upper driver electrode 61 constituting one upper driver electrode pair 60 (for example, upper driver electrode pair 60a) and the position of the other upper driver electrode pair 60 (for example, the upper layer driver electrode pair 60b) and the position of the first terminal side connection point 63 on the first upper layer driver electrode 61 are spaced apart in the circumferential direction around the center point P0 of the ceramics member 10. means that In this embodiment, the positions of the first terminal-side connection points 63 on the first upper driver electrodes 61 of all the upper driver electrode pairs 60 are separated from each other in the circumferential direction.

Similarly, in the present embodiment, the second terminal side connection point 64 on the second upper layer driver electrode 62 constituting one upper layer driver electrode pair 60 and the center point P0 of the ceramic member 10 when viewed in the Z-axis direction. is a virtual line segment connecting the second terminal side connection point 64 on the second upper layer driver electrode 62 constituting another upper layer driver electrode pair 60 and the center point P0 of the ceramic member 10 does not overlap with In the present embodiment, the positions of the second terminal-side connection points 64 on the second upper driver electrodes 62 of all the upper driver electrode pairs 60 are mutually aligned in the circumferential direction around the center point P0 of the ceramic member 10. away.

Further, as shown in FIG. 5, in the present embodiment, the first lower driver electrode 71 constituting each lower driver electrode pair 70 is the first upper driver electrode 61 via the via 84 when viewed in the Z-axis direction. (that is, the position of the first terminal side connection point 63 in the first upper layer driver electrode 61) closer to the center point P0 of the ceramic member 10 via the via 83 and the electrode pad 82, the first is electrically connected to the power supply terminal 811 of the . Similarly, in the present embodiment, the second lower driver electrode 72 constituting each lower driver electrode pair 70 is connected to the second upper driver electrode 62 through the via 84 (that is, when viewed in the Z-axis direction). , the position of the second terminal-side connection point 64 in the second upper layer driver electrode 62 ), the second power supply terminal 812 and the second power supply terminal 812 are electrically connected through the via 83 and the electrode pad 82 at a position closer to the center point P 0 of the ceramic member 10 . properly connected.

A-4. Effect of this embodiment:
As described above, the electrostatic chuck 100 of the first embodiment includes the ceramic member 10 having the substantially planar attraction surface S1 substantially perpendicular to the Z-axis direction. It is a holding device that holds (for example, a wafer W). The electrostatic chuck 100 includes at least one heater electrode 50 arranged inside the ceramic member 10 , a power supply terminal pair 81 including a first power supply terminal 811 and a second power supply terminal 812 , and the ceramic member 10 . and an upper layer driver electrode pair 60 arranged inside a predetermined position in the Z-axis direction of the . The upper layer driver electrode pair 60 is electrically connected to the first upper layer driver electrode 61 electrically connected to the first power supply terminal 811 and the heater electrode 50 and to the second power supply terminal 812 and the heater electrode 50 . and the second upper layer driver electrode 62 . The first upper layer driver electrode 61 includes a first arc-shaped portion 61 extending along a portion of the circumference of a virtual circle VC centered at the center point P0 of the ceramic member 10 as viewed in the Z-axis direction. The first arc-shaped portion 61 is separated from the first heater-side connection point 65 electrically connected to the heater electrode 50 and the first heater-side connection point 65 in the circumferential direction of the virtual circle VC. and a first terminal-side connection point 63 electrically connected to the first power supply terminal 811 . Also, the second upper layer driver electrode 62 includes a second arcuate portion 62 extending along another portion of the circumference of the virtual circle VC as viewed in the Z-axis direction. The second arc-shaped portion 62 is separated from the second heater side connection point 66 electrically connected to the heater electrode 50 and the second heater side connection point 66 in the circumferential direction of the virtual circle VC. and a second terminal-side connection point 64 electrically connected to the second power supply terminal 812 . Since the electrostatic chuck 100 of the present embodiment has such a configuration, as described below, the controllability of the temperature distribution of the attraction surface S1 of the ceramic member 10 (and the temperature distribution of the wafer W) is improved. controllability) can be improved.

FIG. 6 is an explanatory diagram schematically showing an XY cross-sectional configuration of an electrostatic chuck 100X in a comparative example. FIG. 6 shows an XY cross-sectional configuration of an electrostatic chuck 100X of a comparative example corresponding to the XY cross-sectional configuration of the electrostatic chuck 100 of this embodiment shown in FIG. In the electrostatic chuck 100X of the comparative example shown in FIG. 6, similarly to the electrostatic chuck 100 of this embodiment, the upper driver electrode layer 600 has a plurality of upper driver electrode pairs 60 corresponding to a plurality of segments SE. Each upper layer driver electrode pair 60 is composed of a first upper layer driver electrode 61 and a second upper layer driver electrode 62 . However, in the electrostatic chuck 100X of the comparative example, the number of segments SE set in the ceramic member 10 is two, and the upper driver electrode layer 600 includes two upper driver electrode pairs 60 ( 60a, 60c). Also, in the electrostatic chuck 100X of the comparative example, the configurations of each first upper layer driver electrode 61 and each second upper layer driver electrode 62 are different from the electrostatic chuck 100 of this embodiment. Specifically, in the electrostatic chuck 100X of the comparative example, the first upper driver electrode 61 is fan-shaped with the vertex near the center point P0 of the ceramic member 10, and the first upper driver electrode 61 has a heater electrode A first heater-side connection point 65 electrically connected to 50 and a first terminal-side connection point 63 electrically connected to a first power supply terminal 811 align the center point P0 of the ceramics member 10. They are spaced apart in the radial direction of the ceramics member 10 (the direction from the center point P0 of the ceramics member 10 toward the outer peripheral side), not in the circumferential direction of the virtual circle as the center. That is, in the electrostatic chuck 100X of the comparative example, the first upper layer driver electrode 61 is the first arc-shaped portion (the portion extending along a part of the circumference of the virtual circle as viewed in the Z-axis direction) in the present embodiment. A first heater-side connection point 65 electrically connected to the heater electrode 50, and the first heater-side connection point 65 are spaced apart in the circumferential direction of the virtual circle and portion including the first terminal side connection point 63 electrically connected to the power supply terminal 811). Similarly, in the electrostatic chuck 100X of the comparative example, the second upper driver electrode 62 is fan-shaped with the vertex near the center point P0 of the ceramic member 10. The electrically connected second heater side connection point 66 and the second terminal side connection point 64 electrically connected to the second power supply terminal 812 are arranged around the center point P0 of the ceramic member 10. They are spaced apart in the radial direction of the ceramics member 10, not in the circumferential direction of the virtual circle. That is, in the electrostatic chuck 100X of the comparative example, the second upper layer driver electrode 62 is the second arc-shaped portion (the portion extending along a part of the circumference of the virtual circle when viewed in the Z-axis direction) in the present embodiment. , a second heater-side connection point 66 electrically connected to the heater electrode 50, a second portion including the second terminal side connection point 64 electrically connected to the power supply terminal 812).

Since the electrostatic chuck 100X of the comparative example has the above configuration, as indicated by the white arrow in FIG. A current flows, and the regions near the current paths in the upper layer driver electrodes 61 and 62 locally generate heat. Such local heat generation along the radial direction of the ceramic member 10 in the upper layer driver electrodes 61 and 62 causes the generation of a local temperature singularity on the attraction surface S1 of the ceramic member 10 . Also, the occurrence of local temperature singularities on the attraction surface S1 caused by local heat generation along the radial direction of the ceramic member 10 in the upper layer driver electrodes 61 and 62 can be prevented by the arrangement and shape of the heater electrode 50. It is not easy to suppress it by devising Therefore, in the electrostatic chuck 100X of the comparative example, the controllability of the temperature distribution on the attracting surface S1 of the ceramic member 10 may deteriorate. Although FIG. 6 shows a comparative example in which the upper driver electrode layer 600 has two upper driver electrode pairs 60 corresponding to two segments SE, the upper driver electrode layer 600 has three or more segments SE. Even in the configuration having three or more upper layer driver electrode pairs 60 corresponding to the SE, the first upper layer driver electrode 61 does not have the first arcuate portion in this embodiment, and the second upper layer driver electrode 61 does not have the first arcuate portion. Similarly, if the upper driver electrode 62 does not have the second arc-shaped portion of the present embodiment, the controllability of the temperature distribution on the attracting surface S1 of the ceramic member 10 may deteriorate.

On the other hand, since the electrostatic chuck 100 of the present embodiment has the configuration described above, as indicated by the white arrow in FIG. In the first arcuate portion 61 of the driver electrode 61, the current path connecting the first terminal-side connection point 63 and the first heater-side connection point 65 extends along the above virtual The second heater-side connection point 66 and the second terminal-side connection point 64 are connected at the second arc-shaped portion 62 of the second upper layer driver electrode 62 which is substantially parallel to the circumferential direction of the circle VC. The connecting current path is also substantially parallel to the circumferential direction of the virtual circle VC. Therefore, in the electrostatic chuck 100 of the present embodiment, heat is locally generated along the circumferential direction of the virtual circle VC in the arcuate portions of the upper layer driver electrodes 61 and 62. The occurrence of a local temperature singularity on the attracting surface S1 due to local heat generation along the surface can be facilitated by devising the arrangement and shape of the heater electrodes 50 extending substantially parallel to the circumferential direction of the virtual circle VC. can be suppressed to Therefore, according to the electrostatic chuck 100 of the present embodiment, the controllability of the temperature distribution of the attraction surface S1 of the ceramic member 10 (and the controllability of the temperature distribution of the wafer W) can be improved. High controllability of the temperature distribution of the attraction surface S1 of the ceramic member 10 means that the temperature distribution of the entire attraction surface S1 is nearly uniform and that the temperature distribution of the attraction surface S1 is nearly uniform for each segment SE. includes at least one meaning of

In addition, in the electrostatic chuck 100 of the present embodiment, the first heater-side connection point 65 in the first arcuate portion 61 of the first upper layer driver electrode 61 extends along the circumferential direction of the virtual circle VC. Positioned at one end, the first terminal-side connection point 63 is positioned at the other end along the circumferential direction of the virtual circle VC. In the second arcuate portion 62 of the second upper layer driver electrode 62, the second heater side connection point 66 is located at one end of the virtual circle VC along the circumferential direction, The terminal-side connection point 64 of is positioned at the other end along the circumferential direction of the virtual circle VC. In addition, in the electrostatic chuck 100 of the present embodiment, the upper driver electrode pair 60 (the first upper driver electrode 61 and the second upper driver electrode 62) is the first arc-shaped portion 61 and The sum of the length of the portion of the circumference of the virtual circle VC that overlaps and the length of the portion of the circumference of the virtual circle VC that overlaps with the second arcuate portion 62 is substantially equal to the total length of the circumference of the virtual circle VC. is configured to be Therefore, in the electrostatic chuck 100 of the present embodiment, when power is supplied to the heater electrode 50, the arc-shaped portions 61 and 62 of the upper layer driver electrodes 61 and 62 are driven along substantially the entire circumference of the virtual circle VC. current will flow. Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to effectively suppress variations in heat generation in the circumferential direction of the virtual circle VC in the arcuate portions 61 and 62 of the upper layer driver electrodes 61 and 62. Therefore, it is possible to effectively suppress the occurrence of a local temperature singularity on the attraction surface S1 caused by variations in heat generation along the circumferential direction. Controllability can be effectively improved.

Further, the electrostatic chuck 100 of the present embodiment includes a plurality of power supply terminal pairs 81 and a plurality of upper layer driver electrode pairs 60 provided corresponding to the plurality of power supply terminal pairs 81, and the plurality of upper layer driver electrode pairs 60, the diameter of the virtual circle VC is different from each other. Therefore, in the electrostatic chuck 100 of the present embodiment, current flows through the arc-shaped portions 61 and 62 of the upper layer driver electrodes 61 and 62 for each of the plurality of upper layer driver electrode pairs 60 to which voltages are independently applied. The arrangement and shape of the heater electrodes 50 extending substantially parallel to the circumferential direction of the virtual circles VC having different diameters are devised to prevent the occurrence of a local temperature singularity on the attracting surface S1 of the ceramic member 10 due to the heat generation due to the heat generation. By doing so, the temperature distribution of the attraction surface S1 of the ceramic member 10 can be easily controlled, and the controllability of the temperature distribution can be improved.

In addition, in the electrostatic chuck 100 of the present embodiment, the first terminal side connection point 63 on the first upper driver electrode 61 constituting one of the plurality of upper driver electrode pairs 60 and the ceramic contact point 63 when viewed in the Z-axis direction. A virtual line segment VL connecting the center point P0 of the member 10 is a first terminal side connection point 63 on the first upper layer driver electrode 61 constituting the other one of the plurality of upper layer driver electrode pairs 60 and the ceramic member. It does not overlap with the virtual line segment VL connecting the center point P0 of 10. Therefore, in the electrostatic chuck 100 of the present embodiment, each of the plurality of upper layer driver electrode pairs 60 to which a voltage is independently applied is connected to the first terminal side connection point connected to the first power supply terminal 811. It can be said that the locations of 63 are circumferentially spaced from each other. Therefore, according to the electrostatic chuck 100 of the present embodiment, occurrence of a local temperature singularity on the attraction surface S1 of the ceramic member 10 due to concentration of the positions of the first terminal-side connection points 63 is suppressed. It is possible to effectively improve the controllability of the temperature distribution on the attracting surface S1 of the ceramic member 10 . In addition, in the electrostatic chuck 100 of the present embodiment, the second upper layer driver electrode 62 also has the same configuration. That is, as viewed in the Z-axis direction, a virtual point connecting the second terminal side connection point 64 on the second upper layer driver electrode 62 constituting one of the plurality of upper layer driver electrode pairs 60 and the center point P0 of the ceramic member 10 The line segment is an imaginary line segment connecting the second terminal side connection point 64 on the second upper layer driver electrode 62 constituting the other one of the plurality of upper layer driver electrode pairs 60 and the center point P0 of the ceramic member 10. does not overlap with Therefore, according to the electrostatic chuck 100 of the present embodiment, occurrence of a local temperature singularity on the attraction surface S1 of the ceramic member 10 due to concentration of the positions of the second terminal-side connection points 64 is suppressed. It is possible to effectively improve the controllability of the temperature distribution on the attracting surface S1 of the ceramic member 10 .

In addition, the electrostatic chuck 100 of the present embodiment further includes a lower driver electrode pair 70 arranged inside a position different from the position where the upper driver electrode pair 60 is arranged in the Z-axis direction of the ceramic member 10 . The first lower layer driver electrode 71 constituting the lower layer driver electrode pair 70 is electrically connected to the first terminal side connection point 63 of the first arcuate portion 61 of the first upper layer driver electrode 61 . , is electrically connected to the first power supply terminal 811 at a position closer to the center point P0 of the ceramic member 10 than the first terminal side connection point 63 when viewed in the Z-axis direction. Therefore, according to the electrostatic chuck 100 of the present embodiment, the first power supply terminal 811 is arranged near the center point P0 of the ceramic member 10 while improving the controllability of the temperature distribution on the attracting surface S1 of the ceramic member 10. be able to. In addition, in the electrostatic chuck 100 of the present embodiment, the second lower layer driver electrode 72 also has the same configuration. That is, the second lower layer driver electrode 72 constituting the lower layer driver electrode pair 70 is electrically connected to the second terminal side connection point 64 of the second arcuate portion 62 of the second upper layer driver electrode 62 . In addition, it is electrically connected to the second power supply terminal 812 at a position closer to the center point P0 of the ceramic member 10 than the second terminal side connection point 64 when viewed in the Z-axis direction. Therefore, according to the electrostatic chuck 100 of the present embodiment, the second power supply terminal 812 is arranged near the center point P0 of the ceramic member 10 while improving the controllability of the temperature distribution on the attracting surface S1 of the ceramic member 10. be able to. The position of the lower driver electrode pair 70 is preferably closer to the lower surface S2 (opposite to the attraction surface S1) than the upper driver electrode pair 60 is positioned. In the lower layer driver electrode pair 70, current flows in the radial direction of the ceramic member 10, and heat is locally generated in a region near the current path. By arranging the lower driver electrode pair 70 at a position farther from the attraction surface S1 than the upper driver electrode pair 60, the local heat generated in the lower driver electrode pair 70 is reduced to the attraction surface S1. This is because the adsorption surface S1 can be prevented from generating a local temperature peculiarity because the heat generated by the upper-layer driver electrode pair 60 can also be used.

B. Second embodiment:
FIG. 7 is an explanatory diagram schematically showing the XY cross-sectional configuration of the electrostatic chuck 100 according to the second embodiment. FIG. 7 shows the XY cross-sectional configuration of the electrostatic chuck 100 of the second embodiment corresponding to the XY cross-sectional configuration of the electrostatic chuck 100 of the first embodiment shown in FIG. In the following, among the configurations of the electrostatic chuck 100 of the second embodiment, the same configurations as those of the electrostatic chuck 100 of the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. .

As shown in FIG. 7, in the electrostatic chuck 100 of the second embodiment, the upper driver electrode layer 600 has two upper driver electrode pairs 60 (60a, 60b). The configuration of the two upper layer driver electrode pairs 60a and 60b is the same as the configuration of the two upper layer driver electrode pairs 60a and 60b in the first embodiment described above.

In the electrostatic chuck 100 of the second embodiment, an upper driver electrode is placed near the center point P0 of the ceramic member 10 at the position (the position shown in FIG. 7) where the upper driver electrode pair 60 is arranged in the Z-axis direction of the ceramic member 10. There is an area in which the pair 60 is not arranged. In the electrostatic chuck 100 of the second embodiment, a dummy electrode 69 is arranged in this area (area not overlapping the virtual circle VC corresponding to each upper layer driver electrode pair 60 described above). The dummy electrode 69 is an electrode that is not electrically connected to the power supply terminal pair 81 (the first power supply terminal 811 and the second power supply terminal 812) (i.e., to which power is not supplied). made of high modulus material (eg, tungsten, molybdenum, platinum, etc.). In this embodiment, the dummy electrode 69 has a substantially circular shape centered on the center point P0 of the ceramic member 10 as viewed in the Z-axis direction, and fills almost the entire area where the upper layer driver electrode pair 60 described above is not arranged. are arranged as

Thus, the electrostatic chuck 100 of the second embodiment includes the dummy electrode 69 arranged inside the position where the upper layer driver electrode pair 60 is arranged in the Z-axis direction of the ceramic member 10 . The dummy electrode 69 is made of a material having a higher thermal conductivity than the ceramic member 10, and does not overlap the virtual circle VC corresponding to each upper layer driver electrode pair 60 as viewed in the Z-axis direction. Therefore, according to the electrostatic chuck 100 of the second embodiment, the presence of the dummy electrode 69 effectively reduces the heat generation caused by the current flowing through the upper driver electrodes 61 and 62 constituting each upper driver electrode pair 60 in the planar direction. transmitted. Therefore, according to the electrostatic chuck 100 of the second embodiment, it is possible to effectively prevent the occurrence of a local temperature singularity on the attracting surface S1 of the ceramic member 10 due to the heat generated by the current flowing through the upper driver electrodes 61 and 62. , and the controllability of the temperature distribution on the attracting surface S1 of the ceramic member 10 can be effectively improved.

C. Third embodiment:
FIG. 8 is an explanatory diagram schematically showing the XY cross-sectional configuration of the electrostatic chuck 100 according to the third embodiment. FIG. 8 shows the XY cross-sectional configuration of the electrostatic chuck 100 of the third embodiment corresponding to the XY cross-sectional configuration of the electrostatic chuck 100 of the first embodiment shown in FIG. In the following, among the configurations of the electrostatic chuck 100 of the third embodiment, the configurations that are the same as those of the electrostatic chuck 100 of the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted as appropriate. .

As shown in FIG. 8, in the electrostatic chuck 100 of the third embodiment, an upper driver electrode layer 600 has four upper driver electrode pairs 60 (60a, 60b, 60c, 60d). Of the four upper layer driver electrode pairs 60, the configuration of the three upper layer driver electrode pairs 60b, 60c, and 60d other than the upper layer driver electrode pair 60a corresponding to the segment SEa located on the outermost side is the same as in the first embodiment described above. It is the same as the configuration of the three upper layer driver electrode pairs 60b, 60c and 60d.

In the electrostatic chuck 100 of the third embodiment, the upper-layer driver electrode pair 60a is located at the portion of the circumference of the virtual circle VCa that overlaps the first arcuate portion 61 of the first upper-layer driver electrode 61 as viewed in the Z-axis direction. The sum of the length and the length of the portion of the circumference of the virtual circle VCa that overlaps the second arcuate portion 62 of the second upper layer driver electrode 62 is not substantially equal to the total length of the circumference of the virtual circle VC. That is, there is a region on the virtual circle VCa where neither the first arcuate portion 61 of the first upper layer driver electrode 61 nor the second arcuate portion 62 of the second upper layer driver electrode 62 is arranged. . In the electrostatic chuck 100 of the third embodiment, a dummy electrode 69 is arranged in this region. The dummy electrode 69 is an electrode that is not electrically connected to the power supply terminal pair 81 (the first power supply terminal 811 and the second power supply terminal 812) (i.e., to which power is not supplied). made of high modulus material (eg, tungsten, molybdenum, platinum, etc.). In this embodiment, the dummy electrode 69 has a substantially arc shape centered on the center point P0 of the ceramic member 10 as viewed in the Z-axis direction, and the first upper layer driver electrode 61 and the second upper layer driver electrode 62 are placed so as to fill almost all of the area where no

Thus, the electrostatic chuck 100 of the third embodiment includes the dummy electrode 69 arranged inside the position where the upper layer driver electrode pair 60 is arranged in the Z-axis direction of the ceramic member 10 . The dummy electrode 69 is made of a material having a higher thermal conductivity than the ceramic member 10, and overlaps the virtual circle VCa corresponding to the upper layer driver electrode pair 60a when viewed in the Z-axis direction. Therefore, according to the electrostatic chuck 100 of the third embodiment, the heat generated by the current flowing through the upper driver electrodes 61 and 62 constituting the upper driver electrode pair 60a is reduced to the circle of the virtual circle VCa due to the presence of the dummy electrode 69. Good transmission along the circumferential direction. Therefore, according to the electrostatic chuck 100 of the third embodiment, the localized magnetic field on the attracting surface S1 of the ceramic member 10 is caused by the heat generated by the current flowing through the upper driver electrodes 61 and 62 constituting the upper driver electrode pair 60a. The generation of the temperature singularity can be effectively suppressed, and the controllability of the temperature distribution on the attracting surface S1 of the ceramic member 10 can be effectively improved.

D. Variant:
The technology disclosed in this specification is not limited to the above-described embodiments, and can be modified in various forms without departing from the scope of the invention. For example, the following modifications are possible.

The configuration of the electrostatic chuck 100 in the above embodiment is merely an example, and various modifications are possible. For example, the electrostatic chuck 100 of the above embodiment includes the upper driver electrode layer 600 and the lower driver electrode layer 700 , but the electrostatic chuck 100 may include only the upper driver electrode layer 600 .

In the above embodiment, the number and shape of the segments SE set in the ceramic member 10, the number and shape of the heater electrodes 50, the number and shape of the feed terminal pairs 81, the number and shape of the upper driver electrode pairs 60, the lower driver The number, shape, and the like of the electrode pairs 70 are merely examples, and can be changed in various ways. For example, 100 or more segments SE may be set in the ceramic member 10, or only one segment SE may be set in the ceramic member 10 (in other words, the ceramic member 10 is divided into segments). not). In the above embodiment, the entire first upper driver electrode 61 constituting the upper driver electrode pair 60 is a part of the circumference of the virtual circle VC centered at the center point P0 of the ceramic member 10 as viewed in the Z-axis direction. However, a portion of the first upper layer driver electrode 61 may correspond to the first arcuate portion. Similarly, in the above-described embodiment, the entire second upper layer driver electrode 62 constituting the upper layer driver electrode pair 60 is the circumference of the virtual circle VC centered at the center point P0 of the ceramic member 10 as viewed in the Z-axis direction. Although described as a second arc-shaped portion extending along a portion, a portion of the second upper layer driver electrode 62 may correspond to the second arc-shaped portion.

In the above-described embodiment, in the first arc-shaped portion of the first upper layer driver electrode 61, the first heater-side connection point 65 is located on one side of the virtual circle VC along the circumferential direction when viewed in the Z-axis direction. , the first terminal-side connection point 63 is located at the other end along the circumferential direction of the virtual circle VC, and is located at the second arc-shaped portion of the second upper layer driver electrode 62 . , the second heater-side connection point 66 is positioned at one end along the circumferential direction of the virtual circle VC, and the second terminal-side connection point 64 is positioned along the circumferential direction of the virtual circle VC. The first upper-layer driver electrode 61 and the second upper-layer driver electrode 62 are located at the other end of the virtual circle VC overlapping the first arc-shaped portion when viewed in the Z-axis direction. The sum of the length of the portion and the length of the portion of the circumference of the virtual circle VC that overlaps with the second arcuate portion is substantially equal to the total length of the circumference of the virtual circle VC. However, it is not always necessary to adopt such a configuration. Adopting a configuration having a portion corresponding to the second arcuate portion described above has the effect of improving the controllability of the temperature distribution of the attracting surface S1 of the ceramic member 10, as described above. However, when viewed in the Z-axis direction, in the first arcuate portion of the first upper layer driver electrode 61, the first heater-side connection point 65 is positioned at one end along the circumferential direction of the virtual circle VC. The first terminal-side connection point 63 is positioned at the other end along the circumferential direction of the virtual circle VC. The heater-side connection point 66 is located at one end along the circumferential direction of the virtual circle VC, and the second terminal-side connection point 64 is located at the other end along the circumferential direction of the virtual circle VC. , and the first upper driver electrode 61 and the second upper driver electrode 62 overlap the first arc-shaped portion with respect to the entire circumference of the virtual circle VC as viewed in the Z-axis direction. If a configuration is adopted in which the total ratio of the length of the circumference of the circle VC to the length of the circumference of the virtual circle VC that overlaps with the second arc-shaped portion is 1/2 or more, the virtual This is preferable because it is possible to suppress variations in heat generation in the circumferential direction of the circle VC and suppress the occurrence of local temperature singularities on the attraction surface S1. Furthermore, with such a configuration, and as in the above-described embodiment, the first upper layer driver electrode 61 and the second upper layer driver electrode 62 overlap the first arc-shaped portion when viewed in the Z-axis direction. If a configuration is adopted in which the sum of the length of the portion of the circumference of the virtual circle VC and the length of the portion of the circumference of the virtual circle VC that overlaps with the second arc-shaped portion is approximately equal to the total length of the circumference of the virtual circle VC. , since it is possible to effectively suppress variations in heat generation in the circumferential direction of the virtual circle VC, thereby effectively suppressing occurrence of a local temperature singularity on the attraction surface S1.

Further, in the above embodiment, the first terminal side connection point 63 on the first upper driver electrode 61 constituting one upper driver electrode pair 60 and the center point P0 of the ceramic member 10 are aligned as viewed in the Z-axis direction. A connecting virtual line segment VL connects the first terminal side connection point 63 on the first upper layer driver electrode 61 constituting another upper layer driver electrode pair 60 and the center point P0 of the ceramic member 10. A configuration that does not overlap with VL is adopted, but such a configuration does not necessarily have to be adopted.

Further, the number, shape, etc. of the dummy electrodes 69 in the above-described second and third embodiments are only examples, and can be changed in various ways.

Further, the material for forming each member in the electrostatic chuck 100 of the above-described embodiment is merely an example, and can be arbitrarily changed. For example, in the above-described embodiment, the electrostatic chuck 100 includes the ceramic member 10 made of ceramics. It may have a member.

Further, in the above embodiments, each via may be composed of a single via, or may be composed of a group of multiple vias. In the above embodiments, each via may have a single-layer structure consisting only of a via portion, or may have a multi-layer structure (for example, a structure in which a via portion, a pad portion, and a via portion are laminated). good too.

Further, in the above-described embodiment, a monopolar system in which one chuck electrode 40 is provided inside the ceramic member 10 is adopted, but a bipolar system in which a pair of chuck electrodes 40 are provided inside the ceramic member 10 is adopted. may be adopted.

In addition, the present invention is not limited to the electrostatic chuck 100 that includes the ceramic member 10 and the chuck electrode 40 and holds the wafer W using electrostatic attraction. The present invention can also be applied to other holding devices that hold objects (for example, heater devices such as CVD heaters, vacuum chucks, etc.).

Reference Signs List 10: Ceramic member 12: Concave portion 20: Base member 21: Coolant channel 22: Through hole 30: Adhesive layer 32: Through hole 40: Chuck electrode 50: Heater electrode 51: First heater pad portion 52: Second heater Pad portion 56: Heater line portion 60: Upper layer driver electrode pair 61: First arc-shaped portion (first upper layer driver electrode) 62: Second arc-shaped portion (second upper layer driver electrode) 63: First Terminal side connection point 64: Second terminal side connection point 65: First heater side connection point 66: Second heater side connection point 69: Dummy electrode 70: Lower layer driver electrode pair 71: First lower layer driver electrode 72 : second lower layer driver electrode 81: feeding terminal pair 82: electrode pad 83: via 84: via 85: via 100: electrostatic chuck 110: terminal hole 500: heater electrode layer 600: upper driver electrode layer 700: lower driver Electrode layer 811: first power supply terminal 812: second power supply terminal BL: boundary line P0: center point S1: attraction surface S2: lower surface S3: upper surface S4: lower surface SE: segment VC: virtual circle VL: virtual line segment W : Wafer

Claims (8)

a plate-like member having a substantially planar first surface substantially orthogonal to the first direction;
at least one heater electrode disposed inside the plate-like member;
a power supply terminal pair composed of a first power supply terminal and a second power supply terminal;
A driver electrode pair disposed inside a first position in the first direction of the plate-like member, the first driver being electrically connected to the first power supply terminal and the heater electrode. a driver electrode pair including an electrode and a second driver electrode electrically connected to the second power supply terminal and the heater electrode;
A holding device for holding an object on the first surface of the plate member,
The first driver electrode is a first arc-shaped portion extending along a portion of a circumference of an imaginary circle centered on the center point of the plate-shaped member when viewed in the first direction, and a first heater-side connection point electrically connected to the electrode; and a first heater-side connection point separated from the first heater-side connection point in the circumferential direction of the virtual circle and electrically connected to the first power supply terminal. A first arc-shaped portion including a first terminal-side connection point connected to
The second driver electrode is a second arc-shaped portion extending along another part of the circumference of the virtual circle when viewed in the first direction, and is electrically connected to the heater electrode. a second heater-side connection point, and a second terminal spaced from the second heater-side connection point in the circumferential direction of the virtual circle and electrically connected to the second power supply terminal; a second arcuate portion comprising a side connection point;
A holding device characterized by: A holding device according to claim 1, wherein
When viewed from the first direction,
In the first arc-shaped portion of the first driver electrode, the first heater-side connection point is located at one end along the circumferential direction of the virtual circle and is located on the first terminal side. The connection point is located at the other end along the circumferential direction of the virtual circle,
In the second arc-shaped portion of the second driver electrode, the second heater-side connection point is located at one end along the circumferential direction of the virtual circle and is located on the second terminal side. The connection point is located at the other end along the circumferential direction of the virtual circle,
When viewed in the first direction, the driver electrode pair has a length of a portion of the circumference of the virtual circle that overlaps the first arc-shaped portion and a length of the second arc-shaped portion with respect to the total length of the circumference of the virtual circle. The ratio of the total length of the portion of the circumference of the virtual circle that overlaps with the portion is configured to be 1/2 or more,
A holding device characterized by: A holding device according to claim 2, wherein
The driver electrode pair has a length of a portion of the circumference of the virtual circle that overlaps with the first arc-shaped portion and a circumference of the virtual circle that overlaps with the second arc-shaped portion when viewed in the first direction. The total length of the portion is configured to be approximately equal to the total length of the circumference of the virtual circle.
A holding device characterized by: In the holding device according to any one of claims 1 to 3,
a plurality of the power supply terminal pairs;
a plurality of driver electrode pairs provided corresponding to the plurality of power supply terminal pairs;
with
For each of the plurality of driver electrode pairs, the diameters of the virtual circles are different from each other.
A holding device characterized by: A holding device according to claim 4, wherein
An imaginary line connecting the first terminal-side connection point on the first driver electrode forming one of the plurality of driver electrode pairs and the center point of the plate-like member when viewed from the first direction. is overlapped with an imaginary line segment connecting the first terminal-side connection point on the first driver electrode constituting the other one of the plurality of driver electrode pairs and the center point of the plate member. don't
A holding device characterized by: The holding device according to any one of claims 1 to 5, further comprising
A dummy electrode disposed inside the first position in the first direction of the plate-like member, the dummy electrode being formed of a material having higher thermal conductivity than the plate-like member, when viewed in the first direction A dummy electrode that does not overlap the circumference of the virtual circle and is not electrically connected to the power supply terminal,
A holding device characterized by: The holding device according to claim 1 or claim 2, further comprising:
A dummy electrode disposed inside the first position in the first direction of the plate-like member, the dummy electrode being formed of a material having higher thermal conductivity than the plate-like member, when viewed in the first direction A dummy electrode that overlaps the circumference of the virtual circle and is not electrically connected to the power supply terminal,
A holding device characterized by: A holding device according to any one of claims 1 to 7, further comprising:
Another layer driver electrode arranged inside a second position different from the first position in the first direction of the plate-like member, wherein the first arc shape of the first driver electrode is electrically connected to the first terminal-side connection point of the portion, and is closer to the center point of the plate-like member than the first terminal-side connection point when viewed in the first direction. A multi-layer driver electrode electrically connected to the first power supply terminal,
A holding device characterized by:

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