JP2018181992A - Holding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve accuracy of temperature measurement of each segment of a ceramic plate.SOLUTION: A holding apparatus comprises: a ceramic plate: a heat generating resistor and a temperature measuring resistor that are disposed within each segment of the ceramic plate; and a power supply part constituting a power supply path to the heat generating resistor and the temperature measuring resistor. The power supply part includes: a driver including a line pair consisting of a first conductive line and a second conductive line; a power supply side via pair including a first power supply side via connecting the first conductive line to one power supply terminal and a second power supply side via connecting the second conductive line to the other power supply terminal; and a resistor side via pair including a first resistor side via connecting one end of the temperature measuring resistor to the first conductive line, and a second resistor side via connecting the other end of the temperature measuring resistor to the second conductive line. A line width of at least one of the first conductive line and the second conductive line is thicker than a line width of the temperature measuring resistor.SELECTED DRAWING: Figure 4

Description

  The technology disclosed herein relates to a holding device that holds an object.

  For example, an electrostatic chuck is used as a holding device for holding a wafer when manufacturing a semiconductor. The electrostatic chuck includes a ceramic plate and a chuck electrode provided inside the ceramic plate, and utilizes the electrostatic attractive force generated by applying a voltage to the chuck electrode to Hereinafter, the wafer is adsorbed and held on the “suction surface”).

  If the temperature distribution of the wafer held on the suction surface of the electrostatic chuck becomes uneven, the accuracy of each process (film formation, etching, etc.) on the wafer may be degraded. Performance is required to make as uniform as possible. Therefore, for example, a heating resistor is provided inside the ceramic plate. When a voltage is applied to the heat generating resistor, the heat generating resistor generates heat to heat the ceramic plate and heat the wafer held by the suction surface of the ceramic plate. By controlling the voltage applied to the heating resistor based on the temperature measured by a temperature sensor (for example, a thermocouple) provided inside the ceramic plate, the temperature control of the adsorption surface of the ceramic plate (ie, the wafer Temperature control is performed.

  In order to further improve the uniformity of the temperature distribution of the wafer, all or part of the ceramic plate is divided into a plurality of virtual regions (hereinafter referred to as "segments"), and a heating resistor is disposed in each segment. Configurations may be adopted. According to such a configuration, the temperature of each segment can be individually controlled by individually controlling the voltage applied to the heating resistor disposed in each segment of the ceramic plate, and as a result, the ceramic plate The uniformity of the temperature distribution of the adsorption surface (i.e., the uniformity of the temperature distribution of the wafer) can be further improved.

  In a configuration in which such a ceramic plate is virtually divided into a plurality of segments, it is difficult to dispose a dedicated temperature sensor in each segment. Therefore, a technology is known in which a temperature measuring resistor is disposed in each segment of the ceramic plate separately from the heating resistor (see, for example, Patent Document 1). Since the resistance value changes when the temperature changes, the temperature measuring resistor should measure the temperature of the segment in which each temperature measuring resistor is disposed by measuring the resistance value of each temperature measuring resistor. Can.

JP 2008-243990A

  However, in the above-described conventional technology in which the temperature measuring resistors are disposed in each segment of the ceramic plate, the resolution (sensitivity) of the temperature measurement based on the resistance value of the temperature measuring resistors is insufficient. There is room for improvement in terms of the accuracy of the temperature measurement of the segments, and in turn there is room for improvement in terms of the uniformity of the temperature distribution on the suction surface of the ceramic plate (the uniformity of the temperature distribution of the wafer).

  Such a problem is not limited to an electrostatic chuck that holds a wafer using electrostatic attraction, and is a common problem in general holding devices provided with a ceramic plate and holding an object on the surface of the ceramic plate. .

   The present specification discloses a technology that can solve the above-described problems.

  The technology disclosed in the present specification can be realized, for example, as the following form.

(1) A holding device disclosed in the present specification includes a ceramic plate having a first surface substantially orthogonal to a first direction, and at least a part of the ceramic plate in a direction orthogonal to the first direction. A heating resistor disposed in each of the segments when virtually divided into a plurality of juxtaposed segments, and a position in each of the first directions different from the heating resistor are disposed in each of the segments A holding device for holding an object on the first surface of the ceramic plate, comprising: a temperature measuring resistor; and a power feeding unit forming a power feeding path to the heat generating resistor and the temperature measuring resistor. In the above, the power supply unit includes a driver having a line pair formed of a first conductive line and a second conductive line, a pair of power supply terminals, and the first conductive line forming the line pair, on the other hand A first feed side via electrically connected to the feed terminal; and a second feed side via electrically connecting the second conductive line forming the pair of lines to the other feed terminal; A first resistor-side via electrically connecting one end of one of the temperature measuring resistors with the first conductive line constituting the line pair; A resistor-side via pair having a second resistor-side via electrically connecting the other end of the warming resistor to the second conductive line constituting the line pair; The line width of at least one of the first conductive line and the second conductive line constituting the line pair electrically connected to the specific temperature measuring resistor which is the temperature measuring resistor is the specific width It is thicker than the line width of the temperature measuring resistor. Therefore, according to the holding device, the resistance value of the line pair can be made relatively low, and the resistance value of the specific temperature measuring resistor can be made relatively high. As described above, according to the holding device, the resistance value of the specific temperature measurement resistor can be made relatively high. Therefore, the resolution (sensitivity) of temperature measurement based on the resistance value of the specific temperature measurement resistor can be obtained. By improving the temperature measurement accuracy of the segment in which the specific resistance for temperature measurement is arranged, it is possible to improve the uniformity of the temperature distribution on the first surface of the ceramic plate (that is, the first surface). The uniformity of the temperature distribution of the object held by Further, according to the holding device, since the resistance value of the line pair included in the driver can be relatively lowered, the resistance value of the electric circuit including the specific temperature measuring resistor and the line pair is It is possible to reduce the proportion of the resistance value of the line pair (affected by the temperature of the other segments). Therefore, according to the present holding device, it is possible to improve the temperature measurement accuracy of the segment using the specific temperature measuring resistor, and as a result, the uniformity of the temperature distribution on the first surface of the ceramic plate (ie, The uniformity of the temperature distribution of an object held on the first surface can be improved.

(2) In the holding device, the driver has the conductive line having a length L1 in the extending direction and a line width W1 and a length L2 in the extending direction (where L2> L1). The conductive line may have a line width of W2 (where W2> W1). According to the holding device, the resistance values of the conductive lines included in the driver can be made close to each other, and the variation in the resistance value of the conductive lines in the resistance value of the electric circuit including the temperature measuring resistor and the conductive line Can be reduced. Therefore, according to this holding device, it is possible to effectively improve the accuracy of the temperature measurement of the segment using the temperature measuring resistor, and as a result, the uniformity of the temperature distribution on the first surface of the ceramic plate ( That is, the uniformity of the temperature distribution of the object held on the first surface can be effectively improved.

  Note that the technology disclosed in the present specification can be realized in various forms, for example, forms such as a holding device, an electrostatic chuck, a heater device such as a CVD heater, a vacuum chuck, and a manufacturing method thereof. Can be realized by

It is a perspective view which shows roughly the external appearance structure of the electrostatic chuck 100 in 1st Embodiment. It is an explanatory view showing roughly the XZ section composition of electrostatic zipper 100 in a 1st embodiment. It is an explanatory view showing roughly the XY plane composition of electrostatic zipper 100 in a 1st embodiment. An explanatory view schematically showing a configuration of a heating resistor layer 50, a heating resistor driver 51, a temperature measuring resistor layer 60, and a temperature measuring resistor driver 70 of the electrostatic chuck 100 in the first embodiment. It is. FIG. 7 is an explanatory view schematically showing an XY cross-sectional configuration of one heating resistor 500 disposed in one segment SE. It is an explanatory view showing typically the XY section composition of the 1st resistor element 610 which constitutes one temperature measurement resistor 600 arranged in one segment SE. The configurations of the heating resistor layer 50, the heating resistor driver 51, the temperature measuring resistor layer 60, and the temperature measuring resistor driver 70 of the electrostatic chuck 100 in the modification of the first embodiment are schematically shown. FIG.

A. First embodiment:
A-1. Configuration of electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing an appearance configuration of the electrostatic chuck 100 in the first embodiment, and FIG. 2 is an explanatory view schematically showing an XZ sectional configuration of the electrostatic chuck 100 in the first embodiment. FIG. 3 is an explanatory view schematically showing an XY plane (upper surface) configuration of the electrostatic chuck 100 in the first embodiment. In each figure, mutually orthogonal XYZ axes for specifying the direction are shown. In this specification, for convenience, the positive direction of the Z-axis is referred to as the upward direction, and the negative direction of the Z-axis is referred to as the downward direction. However, the electrostatic chuck 100 is actually installed in an orientation different from such an orientation. It may be done.

  The electrostatic chuck 100 is a device for attracting and holding an object (for example, the wafer W) by electrostatic attraction, and is used, for example, to fix the wafer W in a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 100 includes a ceramic plate 10 and a base member 20 which are arranged in a predetermined arrangement direction (in the present embodiment, in the vertical direction (Z-axis direction)). The ceramic plate 10 and the base member 20 are arranged such that the lower surface S2 (see FIG. 2) of the ceramic plate 10 and the upper surface S3 of the base member 20 face each other in the arrangement direction.

  The ceramic plate 10 is a plate-like member having a substantially circular plane upper surface (hereinafter referred to as "adsorption surface") S1 substantially orthogonal to the above-mentioned arrangement direction (Z-axis direction), and is a ceramic (for example, alumina or aluminum nitride) Etc.). The diameter of the ceramic plate 10 is, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the thickness of the ceramic plate 10 is, for example, about 1 mm to 10 mm. The adsorption surface S1 of the ceramic plate 10 corresponds to the first surface in the claims, and the Z-axis direction corresponds to the first direction in the claims. Further, in the present specification, a direction orthogonal to the Z-axis direction is referred to as a “plane direction”.

  As shown in FIG. 2, a chuck electrode 40 formed of a conductive material (for example, tungsten, molybdenum, platinum or the like) is disposed inside the ceramic plate 10. The shape of the chuck electrode 40 in the Z-axis direction is, for example, substantially circular. When a voltage is applied to the chuck electrode 40 from a power source (not shown), an electrostatic attractive force is generated, and the wafer W is attracted and fixed to the adsorption surface S1 of the ceramic plate 10 by the electrostatic attractive force.

  Inside the ceramic plate 10, a heating resistor layer 50, a heating resistor driver 51, and a temperature measuring resistor, each formed of a conductive material (for example, tungsten, molybdenum, platinum, etc.) A layer 60, a temperature measuring resistor driver 70, and various vias are disposed. In the present embodiment, the heating resistor layer 50 is disposed below the chuck electrode 40, the heating resistor driver 51 is disposed below the heating resistor layer 50, and the temperature measuring resistor layer 60 is disposed. The temperature measuring resistor driver 70 is disposed below the heating resistor driver 51, and is disposed below the temperature measuring resistor layer 60. These configurations will be described in detail later. Note that, for example, a plurality of ceramic green sheets are produced, and processing such as formation of via holes and printing of metallized paste are performed on predetermined ceramic green sheets, and these ceramic green sheets are used as ceramic plates 10 having such a configuration. It can be produced by performing thermocompression bonding, processing such as cutting, and firing.

  The base member 20 is, for example, a circular flat plate member having the same diameter as the ceramic plate 10 or a larger diameter than the ceramic plate 10, and is made of, for example, a metal (aluminum, aluminum alloy or the like). The diameter of the base member 20 is, for example, about 220 mm to 550 mm (usually, 220 mm to 350 mm), and the thickness of the base member 20 is, for example, about 20 mm to 40 mm.

  The base member 20 is bonded to the ceramic plate 10 by an adhesive layer 30 disposed between the lower surface S2 of the ceramic plate 10 and the upper surface S3 of the base member 20. The adhesive layer 30 is made of, for example, an adhesive such as silicone resin, acrylic resin, or epoxy resin. The thickness of the adhesive layer 30 is, for example, about 0.1 mm to 1 mm.

  A refrigerant channel 21 is formed in the inside of the base member 20. When a refrigerant (for example, a fluorine-based inert liquid, water or the like) is allowed to flow through the refrigerant channel 21, the base member 20 is cooled, and the heat transfer between the base member 20 and the ceramic plate 10 via the adhesive layer 30 ( The ceramic plate 10 is cooled by the heat application, and the wafer W held on the suction surface S1 of the ceramic plate 10 is cooled. Thereby, temperature control of the wafer W is realized.

A-2. Configuration of heating resistor layer 50 and heating resistor driver 51:
As described above, the heating resistor layer 50 and the heating resistor driver 51 are disposed inside the ceramic plate 10 (see FIG. 2). FIG. 4 is an explanatory view schematically showing the configuration of the heating resistor layer 50 and the heating resistor driver 51 (and the configuration of the temperature measuring resistor layer 60 and the temperature measuring resistor driver 70). The XZ cross-sectional configuration of a part of the heating resistor layer 50 is schematically shown in the upper part of FIG. 4, and the XY plane configuration of a part of the heating resistor driver 51 is shown in the middle part of FIG. 4. It is shown schematically.

  Here, as shown in FIG. 3, in the electrostatic chuck 100 of the present embodiment, the ceramic plate 10 is virtually divided into a plurality of segments SE aligned in the plane direction (direction orthogonal to the Z-axis direction) . More specifically, as viewed in the Z-axis direction, the ceramic plate 10 has a plurality of virtual annular regions (but with a plurality of concentric first boundary lines BL1 centered on the center point P1 of the suction surface S1). Only the region including the center point P1 is divided into circular regions), and each annular region is further arranged in the circumferential direction of the suction surface S1 by the plurality of second boundary lines BL2 extending in the radial direction of the suction surface S1. It is divided into segments SE which are virtual areas.

  As shown in FIG. 4, the heating resistor layer 50 includes a plurality of heating resistors 500. Each of the plurality of heating resistors 500 is disposed in one of the plurality of segments SE set in the ceramic plate 10. That is, in the electrostatic chuck 100 of the present embodiment, one heating resistor 500 is disposed in each of the plurality of segments SE.

  FIG. 5 is an explanatory view schematically showing an XY cross-sectional configuration of one heating resistor 500 disposed in one segment SE. As shown in FIG. 5, the heating resistor 500 includes a pair of pad portions 504 constituting both ends of the heating resistor 500 and a linear resistance wire portion 502 connecting the pair of pad portions 504. . In the present embodiment, the resistance wire portion 502 is shaped so as to pass each position in the segment SE as evenly as possible in the Z-axis direction. The configuration of the heating resistor 500 disposed in the other segment SE is the same.

  Further, the electrostatic chuck 100 has a configuration for supplying power to each heating resistor 500. Specifically, the electrostatic chuck 100 is formed with a pair of terminal holes (not shown), and power supply terminals (not shown) are accommodated in the respective terminal holes.

  Further, the above-described heating resistor driver 51 is also a part of the configuration for supplying power to each heating resistor 500. As shown in FIG. 4, the heating resistor driver 51 includes a plurality of line pairs 510 formed of a first conductive line 511 and a second conductive line 512. In the example shown in FIG. 4, the second conductive line 512 is shared by the plurality of line pairs 510. A separate second conductive line 512 may be provided for each line pair 510. Each of the first conductive line 511 and the second conductive line 512 is electrically connected to mutually different feed terminals through a via, an electrode pad (both not shown), and the like.

  Also, as shown in FIGS. 4 and 5, the first conductive line 511 constituting one line pair 510 is one end of the heating resistor 500 (via the one via 531 constituting the via pair 53). The second conductive line 512, which is electrically connected to the pad portion 504) and which constitutes the line pair 510, is connected to the heating resistor 500 via the other via 532 which constitutes the via pair 53. The other end (pad portion 504) is electrically connected.

  When a voltage is applied from a power supply (not shown) to the heating resistor 500 through the feeding terminal, the electrode pad, the via, the line pair 510, and the pair of vias 53, the heating resistor 500 generates heat. As a result, the segment SE in which the heating resistor 500 is disposed is heated. By individually controlling the voltage applied to the heating resistor 500 disposed in each segment SE of the ceramic plate 10, the temperature of each segment SE can be controlled individually.

A-3. Configuration of temperature measuring resistor layer 60 and temperature measuring resistor driver 70:
As described above, the temperature measuring resistor layer 60 and the temperature measuring resistor driver 70 are disposed in the ceramic plate 10 (see FIG. 2). The upper part of FIG. 4 schematically shows the XZ cross-sectional configuration of a part of the temperature measuring resistor layer 60, and the lower part of FIG. 4 shows the XY plane of a part of the temperature measuring resistor driver 70. The configuration is shown schematically. The resistance temperature detector driver 70 corresponds to the driver in the claims.

  As shown in FIGS. 2 and 4, the temperature measuring resistor layer 60 includes three layers (a first resistor layer 61, a second resistor layer 62, in order from the top, The third resistor layer 63) is formed. As shown in FIG. 4, the temperature-measuring resistor layer 60 composed of such three layers includes a plurality of temperature-measuring resistors 600. Each of the plurality of temperature measuring resistors 600 is disposed in one of the plurality of segments SE set in the ceramic plate 10. That is, in the electrostatic chuck 100 of the present embodiment, one temperature measuring resistor 600 is disposed in each of the plurality of segments SE. As described above, in the electrostatic chuck 100 of the present embodiment, since the temperature measuring resistor layer 60 is positioned below the heating resistor layer 50, the temperature measuring resistor 600 is used in each segment SE. Is located lower than the heating resistor 500 (ie, closer to the base member 20 as compared to the heating resistor 500).

  As shown in FIG. 4, each temperature measuring resistor 600 includes a first resistor element 610 included in the first resistor layer 61 and a second resistor included in the second resistor layer 62. The element 620 and the third resistor element 630 included in the third resistor layer 63 are included. FIG. 6 is an explanatory view schematically showing an XY cross-sectional configuration of the first resistor element 610 configuring one temperature measuring resistor 600 disposed in one segment SE. In FIG. 6, the position in the surface direction of the heating resistor 500 disposed in the same segment SE is indicated by a broken line for reference. As shown in FIG. 6, the first resistor element 610 is a linear resistance wire portion connecting between a pair of pad portions 614 constituting both ends of the first resistor element 610 and the pair of pad portions 614. And 612. The configuration of the other resistor elements (the second resistor element 620 and the third resistor element 630) constituting the temperature measuring resistor 600 is the configuration of the first resistor element 610 shown in FIG. Is the same as That is, each of the second resistor element 620 and the third resistor element 630 includes a pair of pad portions and a linear resistance wire portion connecting between the pair of pad portions. The positions and shapes of the pad portions and resistance wire portions of the second resistor element 620 and the third resistor element 630 are not necessarily the positions and shapes of the pad portions and resistance wire portion of the first resistor element 610. It does not have to be identical.

  As shown in FIG. 4, one end P12 of the first resistor element 610 (specifically, the pad portion 614 described above) is connected to one of the second resistor elements 620 through the via 64. It is electrically connected to the end P22. Further, the other end P21 of the second resistor element 620 is electrically connected to one end P31 of the third resistor element 630 through the other via 65. That is, the three resistor elements (the first resistor element 610, the second resistor element 620, and the third resistor element 630) constituting the temperature measuring resistor 600 are connected in series with each other. .

  In addition, the electrostatic chuck 100 has a configuration for supplying power to each temperature measuring resistor 600. Specifically, as shown in FIG. 2, in the electrostatic chuck 100, a pair of terminal holes 22 extending from the lower surface S4 of the base member 20 to the inside of the ceramic plate 10 are formed. The feed terminal 12 is accommodated in the housing.

  Further, the temperature measuring resistor driver 70 described above is also a part of the configuration for supplying power to each temperature measuring resistor 600. As shown in FIG. 4, the resistance temperature detector driver 70 includes a plurality of line pairs 710 formed of a first conductive line 711 and a second conductive line 712. As shown in FIGS. 2 and 4, the first conductive line 711 constituting the line pair 710 is one of the feed via 751 constituting the feed via pair 75 and one constituting the electrode pad pair 77. The second conductive line 712 electrically connected to one of the feed terminals 12 via the electrode pad 771 and constituting the line pair 710 is the other feed via constituting the feed via pair 75. It is electrically connected to the other feed terminal 12 via the other electrode pad 772 constituting the electrode pad pair 77. In FIG. 4, the feed side via pair 75 for one line pair 710 is representatively shown, and the feed side via pair 75 for the other line pair 710 is omitted. The feed via 751 corresponds to a first feed via in the claims, and the feed via 752 corresponds to a second via in the claims.

  Further, as shown in FIGS. 2, 4 and 6, the first conductive line 711 constituting the line pair 710 is for temperature measurement via one resistor side via 731 constituting the resistor side via pair 73. The line is electrically connected to one end of the resistor 600 (more specifically, the pad portion 614 which is one end P11 of the first resistor element 610 constituting the temperature measuring resistor 600), and the line The second conductive line 712 constituting the pair 710 is the other end of the temperature measuring resistor 600 (more specifically, the temperature measurement through the other resistor side via 732 constituting the resistor side via pair 73). It is electrically connected to the pad part which is one end P32 of the 3rd resistor element 630 which constitutes the resistor 600. The resistor side via 731 corresponds to a first resistor side via in the claims, and the resistor side via 732 corresponds to a second resistor side via in the claims.

  When a voltage is applied from the power supply (not shown) to the temperature measuring resistor 600 via the pair of feed terminals 12, the electrode pad pair 77, the feed side via pair 75, the line pair 710, and the resistor side via pair 73 The current flows to the temperature measuring resistor 600. The temperature measuring resistor 600 is formed of a conductive material (e.g., tungsten, molybdenum, platinum, etc.) whose resistance value changes as the temperature changes. Specifically, the resistance value of the temperature measuring resistor 600 becomes higher as the temperature becomes higher. Further, the electrostatic chuck 100 is configured to measure a voltage applied to the temperature measuring resistor 600 and a current flowing to the temperature measuring resistor 600 (for example, a voltmeter or an ammeter (neither is shown)) )have. Therefore, in the electrostatic chuck 100 of the present embodiment, the temperature of the temperature measuring resistor 600 is measured based on the measured value of the voltage of the temperature measuring resistor 600 and the measured value of the current of the temperature measuring resistor 600 ( Identification).

  The temperature of each segment SE of the ceramic plate 10 can be separately measured in real time by individually measuring the temperature of each of the temperature measuring resistors 600 disposed on the ceramic plate 10 by the method described above. Therefore, in the electrostatic chuck 100 of the present embodiment, the voltage applied to the heating resistor 500 disposed in each segment SE is individually controlled based on the temperature measurement result of each segment SE of the ceramic plate 10. The temperature of each segment SE can be controlled with high accuracy. Therefore, according to the electrostatic chuck 100 of the present embodiment, the uniformity of the temperature distribution of the suction surface S1 of the ceramic plate 10 (that is, the uniformity of the temperature distribution of the wafer W) can be improved. In addition, the structure for forming the electric power feeding path with respect to the heating resistor 500 and the resistance 600 for temperature measurement mentioned above is collectively called the electric power feeding part 80 (refer FIG. 2).

  Here, in FIG. 6, a first resistor element constituting the temperature measuring resistor 600 in a virtual plane VS parallel to the Z-axis direction (more specifically, a virtual plane VS parallel to the X-axis). A projection 601 of the first resistor element 610 and a projection of the heating resistor 500 when projecting the heating resistor 600 disposed in the same segment SE as the temperature measuring resistor 600 are projected. 501 is shown. As shown in FIG. 6, the positions of both ends EP11 and EP12 of the projection 601 of the first resistor element 610 are located between the ends EP21 and EP22 of the projection 501 of the heating resistor 500. As described above, in the electrostatic chuck 100 according to the present embodiment, the first resistor element 610 and the segment SE identical to the temperature measuring resistor 600 are disposed in an arbitrary virtual plane VS parallel to the Z-axis direction. And the projection of the first resistor element 610 in a direction parallel to the virtual plane VS and orthogonal to the Z-axis direction (the X-axis direction in the example of FIG. 6). The positions of both ends of are the positions between the ends of the projection of the heating resistor 500.

  Similarly, with regard to the second resistor element 620 and the third resistor element 630, the positions of both ends of the projection of the second resistor element 620 (or the third resistor element 630) are for heat generation. The position between the ends of the projection of the resistor 500. Therefore, the temperature measuring resistor 600 including the three resistor elements (the first resistor element 610, the second resistor element 620, and the third resistor element 630) is also parallel to the Z-axis direction. When the temperature measuring resistor 600 and the heating resistor 500 disposed in the same segment SE as the temperature measuring resistor 600 are projected onto any arbitrary virtual plane, it is parallel to the virtual plane and In the direction orthogonal to the Z-axis direction, positions of both ends of the projection of the temperature measuring resistor 600 are positions between both ends of the projection of the heating resistor 500. Such a feature is compared with the heating resistor 500 disposed on the same segment SE as the temperature sensing resistor 600 in the Z-axis direction, as compared with the heating resistor 500. It means that it is disposed at an inner position (position farther from the boundary of the segment SE) in

Further, as shown in FIG. 4, in the electrostatic chuck 100 of the present embodiment, the line widths of the respective conductive lines (the first conductive line 711 or the second conductive line 712) included in the temperature measuring resistor driver 70. Are not identical to one another. More specifically, the line width W of the conductive lines 711 and 712 is thicker as the length L of the conductive lines 711 and 712 is longer. For example, let the lengths of the six conductive lines 711 and 712 included in the temperature measuring resistor driver 70 shown in FIG. 4 be L1, L2, L3, L4, L5 and L6 in the order from those shown on the upper side of the figure. Assuming that their line widths are W1, W2, W3, W4, W5, and W6 in the same order, the following relationships (1) and (2) hold. Therefore, the resistance values of the conductive lines 711 and 712 included in the temperature measuring resistor driver 70 are close to each other. The length L of the conductive lines 711 and 712 means the center of a via (a plurality of vias) for connection with one conductive member (for example, the temperature measuring resistor 600) in the conductive lines 711 and 712. In the center of a plurality of vias, and the center of the via for connection to another conductive member (for example, electrode pad 771) in the conductive lines 711 and 712. It means the dimension (size) along the stretching direction up to. Further, the width W of the conductive lines 711 and 712 means a dimension (size) along a direction orthogonal to the extension direction of the conductive lines 711 and 712.
L1 <L2 <L3 <L4 <L5 <L6 (1)
W1 <W2 <W3 <W4 <W5 <W6 (2)

  Further, as shown in FIG. 4, in the electrostatic chuck 100 according to the present embodiment, the lines of the first conductive line 711 and the second conductive line 712 constituting the line pair 710 included in the temperature measuring resistor driver 70. The width is the line width of the temperature measuring resistor 600 electrically connected to the line pair 710 (specifically, the first resistor element 610 constituting the temperature measuring resistor 600, the second resistance It is thicker than the line width of the resistance wire portion of the body element 620 and the third resistor element 630. For example, a first conductive line constituting a pair of lines 710 electrically connected to resistance temperature detector 600 disposed in the leftmost segment SE among the three segments SE shown in FIG. The line width W5 of 711 and the line width W6 of the second conductive line 712 are both thicker than the line width of the temperature measuring resistor 600.

A-4. Effects of the present embodiment:
As described above, the electrostatic chuck 100 according to the first embodiment includes the ceramic plate 10 having the substantially planar adsorption surface S1 substantially orthogonal to the Z-axis direction, and the object (the electrostatic chuck 100) For example, the holding device holds the wafer W). The electrostatic chuck 100 is a heating resistor 500 and a temperature measuring resistor 600 disposed in each segment SE when the ceramic plate 10 is virtually divided into a plurality of segments SE aligned in the surface direction, and a heating resistor A feed unit 80 is provided which constitutes a feed path to the resistor 500 and the temperature measuring resistor 600. In each segment SE, the position of the temperature measuring resistor 600 in the Z-axis direction is different from the position of the heating resistor 500. Further, in the electrostatic chuck 100 according to the first embodiment, the temperature measuring resistors 600 are three layers of resistor elements (first resistances) which are mutually different in position in the Z-axis direction and connected in series with each other. Body element 610, second resistor element 620, third resistor element 630). Therefore, in the electrostatic chuck 100 according to the first embodiment, the resistance value of the temperature measuring resistor 600 is contained in one segment SE, as compared with the mode in which the temperature measuring resistor 600 has a single layer configuration. Can be raised. When the resistance value of the temperature measuring resistor 600 is increased, the resolution (sensitivity) of temperature measurement based on the resistance value of the temperature measuring resistor 600 is improved. Therefore, according to the electrostatic chuck 100 of the first embodiment, the resolution of temperature measurement based on the resistance value of the temperature measuring resistor 600 is improved to improve the accuracy of temperature measurement of each segment SE of the ceramic plate 10 The temperature control accuracy of each segment SE can be improved using the heating resistor 500 disposed in each segment SE. As a result, the uniformity of the temperature distribution on the suction surface S1 of the ceramic plate 10 can be improved. That is, the uniformity of the temperature distribution of the wafer W can be improved.

  In addition, the electrostatic chuck 100 according to the first embodiment further includes the base member 20 disposed to face the surface S2 opposite to the suction surface S1 of the ceramic plate 10. Inside the base member 20, a refrigerant flow path 21 is formed. Each temperature measuring resistor 600 is disposed at a position closer to the base member 20 as compared to the heating resistor 500 disposed in the same segment SE. As described above, in the electrostatic chuck 100 according to the first embodiment, in addition to the heating by the heating resistor 500, the cooling (heating) by the refrigerant supplied to the refrigerant flow path 21 of the base member 20 is used. , Temperature control of the ceramic plate 10 is performed. In the electrostatic chuck 100 according to the first embodiment, each temperature measuring resistor 600 is disposed at a position between the heating resistor 500 for heating and the coolant channel 21 for cooling in the Z-axis direction. Therefore, it is possible to further improve the accuracy of temperature measurement of each segment SE using the temperature measuring resistor 600, and as a result, the uniformity of the temperature distribution of the adsorption surface S1 of the ceramic plate 10 (ie, The uniformity of the temperature distribution of the wafer W can be further improved.

  Further, in the electrostatic chuck 100 according to the first embodiment, the feeding portion 80 constituting a feeding path to the heating resistor 500 and the temperature measuring resistor 600 includes the temperature measuring resistor driver 70 and the pair of feeding terminals 12. , A feed side via pair 75, and a resistor side via pair 73. The resistance temperature detector driver 70 has a line pair 710 composed of a first conductive line 711 and a second conductive line 712. The feed-side via pair 75 includes a feed-side via 751 for electrically connecting the first conductive line 711 constituting the line pair 710 included in the resistance temperature detector driver 70 to one feed terminal 12. A feed side via 752 for electrically connecting the second conductive line 712 constituting the line pair 710 to the other feed terminal 12 is provided. The resistor-side via pair 73 includes a resistor-side via 731 electrically connecting one end of the temperature measuring resistor 600 to the first conductive line 711 constituting the line pair 710, and the temperature measuring resistor 600. And a resistor side via 732 electrically connecting the other end to the second conductive line 712 constituting the line pair 710. In the electrostatic chuck 100 according to the first embodiment, the line widths of the first conductive line 711 and the second conductive line 712 constituting the line pair 710 electrically connected to the temperature measuring resistor 600 are as follows: It is thicker than the line width of the resistor 600 for temperature measurement. Therefore, according to the electrostatic chuck 100 of the first embodiment, the resistance value of each of the conductive lines 711 and 712 constituting the line pair 710 included in the temperature measuring resistor driver 70 is made relatively low, The resistance value of the resistor 600 can be made relatively high.

  The temperature coefficient of resistance of each of the conductive lines 711 and 712 and the temperature measuring resistor 600 is approximately determined by the type of the forming material. The materials that can be used to form the conductive lines 711 and 712 and the temperature measuring resistor 600 are limited to a certain extent (materials that can be co-fired with ceramics, for example, tungsten, molybdenum, platinum, etc.), and their resistances Since there is almost no difference in temperature coefficients, it is difficult to relatively increase the resistance value of the temperature measuring resistor 600 by selecting the forming material. Therefore, in the present embodiment, it is realized to relatively increase the resistance value of the temperature measuring resistor 600 by adjusting the thickness of each of the conductive lines 711 and 712 and the temperature measuring resistor 600. It is Moreover, since the specific resistance can be increased by mixing an insulator (for example, alumina), such a specific resistance is used as a means for relatively increasing the resistance value of the temperature measuring resistor 600 described above. Changing means may be used in combination.

  Thus, according to the electrostatic chuck 100 of the first embodiment, the resistance value of the temperature measuring resistor 600 can be made relatively high. Therefore, the temperature measurement based on the resistance value of the temperature measuring resistor 600 The accuracy of temperature measurement of each segment SE of the ceramic plate 10 can be improved by improving the resolution of the substrate 10. As a result, the uniformity of the temperature distribution of the suction surface S1 of the ceramic plate 10 (ie, the temperature distribution of the wafer W Uniformity) can be improved. Moreover, since each temperature measuring resistor 600 is accommodated in the segment SE, there is little possibility that the resistance value of the temperature measuring resistor 600 will be affected by the temperature of the other segment SE, but for the temperature measuring resistor The conductive lines 711 and 712 constituting the line pair 710 included in the driver 70 do not fit in the segment SE in which the temperature measuring resistor 600 electrically connected to the conductive lines 711 and 712 is accommodated. The resistance values of the conductive lines 711 and 712 are influenced by the temperature of the other segment SE because they are arranged to pass through the other segment SE (see FIG. 4). As described above, according to the electrostatic chuck 100 of the first embodiment, the resistance values of the respective conductive lines 711 and 712 constituting the line pair 710 included in the resistance temperature detector driver 70 are relatively lowered. Can reduce the ratio of the resistance of the line pair 710 (which is affected by the temperature of the other segment SE) in the resistance value of the electric circuit including the temperature measuring resistor 600 and the line pair 710. . Therefore, according to the electrostatic chuck 100 of the first embodiment, the accuracy of the temperature measurement of each segment SE using the temperature measuring resistor 600 can be effectively improved, and the suction surface S1 of the ceramic plate 10 can be obtained. The uniformity of the temperature distribution (ie, the uniformity of the temperature distribution of the wafer W) can be effectively improved.

  Further, in the electrostatic chuck 100 according to the present embodiment, the lengths of the conductive lines 711 and 712 for the respective conductive lines (the first conductive line 711 and the second conductive line 712) included in the temperature measuring resistor driver 70. As the length L is longer, the line width W of the conductive lines 711 and 712 is thicker. Therefore, according to the electrostatic chuck 100 of the present embodiment, the resistance values of the conductive lines 711 and 712 included in the temperature measuring resistor driver 70 can be made close to each other, and the temperature measuring resistor 600 and the conductive line 711 , And 712, the variation in the resistance value of the conductive lines 711 and 712 can be reduced. Therefore, according to the electrostatic chuck 100 of the present embodiment, the accuracy of the temperature measurement of each segment SE using the temperature measuring resistor 600 can be effectively improved, and the temperature of the suction surface S1 of the ceramic plate 10 The uniformity of the distribution (ie, the uniformity of the temperature distribution of the wafer W) can be effectively improved.

  Further, in the electrostatic chuck 100 of the present embodiment, the temperature measuring resistor 600 and the segment SE which is the same as the temperature measuring resistor 600 are disposed in an arbitrary virtual plane VS parallel to the Z-axis direction. When the heating resistor 500 is projected, the positions of both ends EP11 and EP12 of the projection 601 of the temperature measuring resistor 600 in the direction parallel to the virtual plane VS and orthogonal to the Z-axis direction are the heating resistors. This is the position between both ends EP21 and EP22 of the projection 501 of the body 500. Therefore, in the electrostatic chuck 100 of the present embodiment, the temperature measuring resistor 600 is compared with the heating resistor 500 disposed in the same segment SE as the temperature measuring resistor 600 in the Z-axis direction. Thus, it can be arranged at a more inner position in the segment SE (a position farther from the boundary of the segment SE). Therefore, according to the electrostatic chuck 100 of the present embodiment, it is suppressed that the temperature (resistance value) of the temperature measuring resistor 600 disposed in a certain segment SE is affected by the temperature of the other segment SE. Therefore, the accuracy of the temperature measurement of each segment SE using the temperature measuring resistor 600 can be improved, and as a result, the uniformity of the temperature distribution of the adsorption surface S1 of the ceramic plate 10 (ie, the temperature of the wafer W The uniformity of the distribution can be improved.

A-5. Modification of the first embodiment:
FIG. 7 shows the configuration of the heating resistor layer 50, the heating resistor driver 51, the temperature measuring resistor layer 60, and the temperature measuring resistor driver 70 of the electrostatic chuck 100 according to the modification of the first embodiment. It is explanatory drawing which shows typically. The configuration of the electrostatic chuck 100 according to the modification of the first embodiment shown in FIG. 7 is different from the configuration of the electrostatic chuck 100 according to the first embodiment described above in that two conductive elements connected to the heating resistor 500 The difference is that one of the lines is shared with one of the two conductive lines connected to the temperature measuring resistor 600 disposed in the same segment SE as the heating resistor 500. For example, among the three segments SE shown in FIG. 7, one end of the heating resistor 500 disposed in the rightmost segment SE is a first conductive line 511 included in the heating resistor driver 51. , And the other end of the heat generating resistor 500 is a second conductive wire constituting a line pair 710 electrically connected to the temperature measuring resistor 600 disposed in the segment SE. It is electrically connected to the line 712 (so that the via 532 constituting the via pair 53 and the resistor side via 732 constituting the resistor side via pair 73 are made common). Even with such a configuration, the voltages applied to the heating resistor 500 and the temperature measuring resistor 600 can be individually controlled, and the temperature measurement result of each segment SE using the temperature measuring resistor 600 Temperature control of each segment SE using the heating resistor 500 based on the above can be realized.

B. Other variations:
The technology disclosed in the present specification is not limited to the above-described embodiment, and can be modified into various forms without departing from the scope of the present invention. For example, the following modifications are also possible.

  The configuration of the electrostatic chuck 100 in the above embodiment is merely an example, and various modifications are possible. For example, in the above embodiment, each temperature measuring resistor 600 has three resistor elements (a first resistor element 610, a second The resistance element 620, the third resistance element 630), but each of the temperature measuring resistors 600 are different from each other in the Z-axis direction and are connected in series with each other, or 2 or 4 It may be composed of two or more resistor elements. Even in such a configuration, the resolution of temperature measurement based on the resistance value of the temperature measuring resistor 600 can be improved by increasing the resistance value of the temperature measuring resistor 600, and the ceramic by the temperature measuring resistor 600 The accuracy of the temperature measurement of the segment SE of the plate 10 can be improved. Each temperature measuring resistor 600 does not necessarily have to be composed of a plurality of layers of resistor elements, and may be composed of a single layer of resistor elements.

  Further, in the above embodiment, the line widths of the first conductive line 711 and the second conductive line 712 constituting the line pair 710 included in the resistance temperature detector driver 70 are electrically connected to the line pair 710. Even if the line width of one of the first conductive line and the second conductive line is thicker than the line width of the temperature measuring resistor 600, Good. Even in such a configuration, the resolution of temperature measurement based on the resistance value of the temperature measuring resistor 600 can be improved by making the resistance value of the temperature measuring resistor 600 relatively high, and the temperature measuring resistor The accuracy of temperature measurement of the segment SE of the ceramic plate 10 by 600 can be improved, and measurement is performed by relatively lowering the resistance value of the conductive line (the first conductive line 711 or the second conductive line 712). The ratio of the resistance value of the line pair 710 to the resistance value of the electric circuit including the heating resistor 600 and the line pair 710 can be lowered, and the accuracy of the temperature measurement of each segment SE using the temperature measuring resistor 600 Can be effectively improved. Note that the line widths of the first conductive line 711 and / or the second conductive line 712 constituting the line pair 710 included in the resistance temperature detector driver 70 are necessarily connected to the line pair 710. It is not necessary to be thicker than the line width of the warming resistor 600, and there may be a point where the line widths of the first conductive line 711 and the second conductive line 712 are equal to or less than the line width of the temperature measuring resistor 600. .

  Further, in the above embodiment, the line width W of the conductive lines 711 and 712 is thicker as the length L of each of the conductive lines 711 and 712 included in the temperature measuring resistor driver 70 is longer. It is not necessary for the above-mentioned relationship to be established for all of the conductive lines 711 and 712 included in the driver 70, as long as the above-mentioned relationship is established for at least two of the conductive lines 711 and 712. That is, the temperature measuring resistor driver 70 has conductive lines 711 and 712 having a length L2 in the extending direction and a line width W1 and a length L2 in the extending direction (where L2> L1). And conductive lines 711 and 712 having a line width of W2 (where W2> W1). Even in such a configuration, variations in the resistance values of the conductive lines 711 and 712 can be reduced by bringing the resistance values of at least two conductive lines 711 and 712 close to each other, and each of the temperature measurement resistors 600 is used. The accuracy of the temperature measurement of the segment SE can be effectively improved. The temperature sensing resistor driver 70 does not necessarily have a conductive line with a length of L2 and a line width of W1 and a length of L2 (where L2> L1) and a line width of W2 (where W2> W1). It is not necessary to include the conductive line which is For example, the line widths of the conductive lines 711 and 712 included in the resistance temperature detector driver 70 may be substantially the same.

  Further, in the above embodiment, the temperature measuring resistor 600 and the heating resistor 500 disposed in the same segment SE as the temperature measuring resistor 600 are provided on any virtual plane VS parallel to the Z-axis direction. The positions of both ends EP11 and EP12 of the projection 601 of the temperature measuring resistor 600 in the direction parallel to the virtual plane VS and orthogonal to the Z axis direction are the projection 501 of the heating resistor 500. The position between the two ends EP21 and EP22 is not necessarily such a configuration.

  Further, in the above embodiment, with regard to the position in the Z-axis direction of each conductive member disposed inside the electrostatic chuck 100, the chuck electrode 40 and the heating resistor layer are sequentially from the upper side (side closer to the suction surface S1). 50, the heat generating resistor driver 51, the temperature measuring resistor layer 60, and the temperature measuring resistor driver 70 are arranged in this order, but the positional relationship between at least two of these layers may be reversed. . For example, in the above embodiment, the temperature measuring resistor layer 60 is located lower than the heating resistor layer 50 (as a result, the temperature measuring resistor 600 is lower than the heating resistor 500 in each segment SE). , But the temperature measuring resistor layer 60 is positioned above the heating resistor layer 50 (as a result, the temperature measuring resistor 600 is positioned above the heating resistor 500 in each segment SE). ) May be used.

  In the above embodiment, each temperature measuring resistor 600 is electrically connected to the pair of feed terminals 12 through the temperature measuring resistor driver 70, but each temperature measuring resistor 600 is a temperature measuring device. The pair of feed terminals 12 may be electrically connected without the resistor driver 70. Further, the electrostatic chuck 100 is provided with a plurality of resistance temperature sensor drivers 70, and a part of the plurality of temperature measurement resistance members 600 provided on the electrostatic chuck 100 is one temperature measurement resistance driver 70. , And another portion of the plurality of temperature measuring resistors 600 may be electrically connected to another temperature measuring resistor driver 70.

  In the above embodiment, a part of the configuration for feeding power to the temperature measuring resistor 600 (for example, a feeding terminal, a via, a conductive line, etc.) is also used for feeding power to the heating resistor 500. Conversely, part of the configuration for feeding power to the heating resistor 500 (for example, feed terminal, via, conductive line, etc.) is also used to feed the temperature measuring resistor 600. It may be done. Further, in the above embodiment, each via may be configured by a single via, or may be configured by a group of a plurality of vias.

 Moreover, the setting mode of the segment SE in the above embodiment can be arbitrarily changed. For example, in the above embodiment, the plurality of segments SE are set such that the segments SE are arranged in the circumferential direction of the suction surface S1, but the plurality of segments SE are set such that the segments SE are arranged in a grid. May be Also, for example, in the above embodiment, the entire electrostatic chuck 100 is virtually divided into a plurality of segments SE, but even if a portion of the electrostatic chuck 100 is virtually divided into a plurality of segments SE Good.

  Further, each configuration (each feature) of the temperature measuring resistor 600 described above does not have to be realized in all the temperature measuring resistors 600 included in the electrostatic chuck 100, and at least one temperature measuring resistor It may be realized at 600. Among the temperature measuring resistors 600 included in the electrostatic chuck 100, the temperature measuring resistor 600 including each configuration (each feature) of the above-described temperature measuring resistors 600 is a specific temperature measurement in the scope of the claims. It corresponds to a resistor.

  Further, in the above embodiment, the single-pole type in which one chuck electrode 40 is provided inside the ceramic plate 10 is adopted, but the bipolar type in which a pair of chuck electrodes 40 is provided inside the ceramic plate 10 is It may be adopted. Moreover, the material which forms each member in the electrostatic chuck 100 of the said embodiment is an illustration to the last, and each member may be formed with another material.

  Furthermore, the present invention is not limited to the electrostatic chuck 100 that holds the wafer W using electrostatic attraction, and another holding device that holds an object on the surface of a ceramic plate (for example, a heater device such as a CVD heater) And vacuum chuck etc.). In the case where the present invention is applied to a heater device, the specific temperature measuring resistor 600 is lower than the heating resistor 500 disposed in the same segment SE (that is, the side closer to the lead surface of the feed terminal). , The wiring from the feed terminal to the temperature measuring resistor 600 does not penetrate the heating resistor layer 50 (heating resistor 500) in the Z-axis direction, and the heating resistor layer 50 (heat generation) Since it can avoid that the design restrictions of the resistor 500) increase, it is preferable.

10: Ceramic plate 12: Power supply terminal 20: Base member 21: Refrigerant channel 22: Hole for terminal 30: Adhesive layer 40: Chuck electrode 50: Resistor layer for heat generation 51: Driver for heat generation resistor 53: Via pair 60: Temperature sensing resistor layer 61: first resistor layer 62: second resistor layer 63: third resistor layer 64: via 65: via 70: driver for resistance temperature detector 73: resistor side via pair 75: feed side via pair 77: electrode pad pair 80: feed portion 100: electrostatic chuck 500: resistor for heat generation 501: projection 502: resistance wire portion 504: pad portion 510: line pair 511: first conductive line 512 : Second conductive line 531: via 532: via 600: resistance temperature detector 601: projection 610: first resistor element 612: resistance wire portion 614: pad portion 620: second resistor element 630: third resistor element 710: line pair 711: first conductive line 712: second conductive line 731: resistor side via 732: resistor side via 751: feed side via 752 : Feeding side via 771: Electrode pad 772: Electrode pad

Claims (2)

A ceramic plate having a first surface substantially orthogonal to the first direction;
A heating resistor disposed in each of the segments when at least a portion of the ceramic plate is virtually divided into a plurality of segments arranged in a direction orthogonal to the first direction;
A temperature measuring resistor which is disposed in each of the segments and whose position in the first direction is different from that of the heating resistor;
A feeding portion that constitutes a feeding path for the heating resistor and the temperature measuring resistor;
A holding device for holding an object on the first surface of the ceramic plate,
The feeding unit is
A driver having a line pair comprised of a first conductive line and a second conductive line;
A pair of feed terminals,
A first feed-side via electrically connecting the first conductive line constituting the line pair to one of the feed terminals; and a second conductive line constituting the line pair; A feed side via pair having a second feed side via electrically connected to the feed terminal;
A first resistor-side via electrically connecting one end of one of the temperature measuring resistors to the first conductive line constituting the line pair, and the other end of the one temperature measuring resistor A resistor side via pair having a second resistor side via electrically connected to the second conductive line constituting the line pair;
Equipped with
Line widths of at least one of the first conductive line and the second conductive line constituting the line pair electrically connected to the specific temperature measuring resistor that is at least one temperature measuring resistor Is thicker than the line width of the resistor for specific temperature measurement. In the holding device according to claim 1,
The driver is
The conductive line whose length along the stretching direction is L1 and whose line width is W1;
The conductive line having a length along the stretching direction of L2 (where L2> L1) and a line width of W2 (where W2> W1),
A holding device, characterized in that it comprises:

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