JP7213656B2 - holding device - Google Patents

Description

The technology disclosed in this specification relates to a holding device.

2. Description of the Related Art A heating device (also called a “susceptor”) is known that holds an object (eg, a semiconductor wafer) and heats it to a predetermined processing temperature (eg, about 400 to 800° C.). A heating apparatus is used as part of a semiconductor manufacturing apparatus such as, for example, a film forming apparatus (CVD film forming apparatus, sputtering film forming apparatus, etc.) or an etching apparatus (plasma etching apparatus, etc.).

In general, a heating device includes a plate-shaped holder having a holding surface and a back surface substantially orthogonal to a predetermined direction (hereinafter referred to as "first direction"), and a columnar holder extending in the first direction. and a columnar support bonded to the back surface. A heating resistor is arranged inside the holder. When a voltage is applied to the heating resistor, the heating resistor generates heat to heat an object (eg, semiconductor wafer) held on the holding surface of the holder.

In such a configuration in which the heating resistor is arranged inside the holder, the temperature measuring resistor is placed between the heating resistor and the rear surface of the holder in order to measure the temperature of the holding surface of the holder. A technique of arranging between them is known (see Patent Document 1, for example). Since the resistance value of the temperature-measuring resistor changes as the temperature changes, the temperature of the holding surface can be measured by measuring the resistance value of the temperature-measuring resistor.

JP-A-2008-243990

However, in the above-described conventional technology in which the temperature measuring resistor is arranged between the heat generating resistor and the back surface of the holder, a heat generating resistor is placed between the holding surface and the temperature measuring resistor, which is the target of temperature measurement. Since the resistor is interposed, there is a problem that the temperature of the holding surface cannot be accurately measured by the temperature measuring resistor due to the heat generated by the heating resistor.

Note that such a problem is not limited to the heating device. This is a common problem in general.

This specification discloses a technology capable of solving at least part of the above-described problems.

The technology disclosed in this specification can be implemented as the following modes.

(1) A holding device disclosed in the present specification includes a plate-like member having a first surface substantially orthogonal to a first direction, a heating resistor disposed inside the plate-like member, and the a temperature-measuring resistor disposed inside a plate-like member, the holding device for holding an object on the first surface of the plate-like member, wherein the temperature-measuring resistor 1 direction, the heating resistor is arranged closer to the first surface than the heating resistor. In this holding device, the temperature-measuring resistor is arranged closer to the first surface than the heat-generating resistor in the first direction. That is, no heating resistor is interposed between the temperature measuring resistor and the first surface. For this reason, in this holding device, compared to the configuration in which the temperature-measuring resistor is arranged on the opposite side of the first surface from the heat-generating resistor in the first direction, the heat generation of the heat-generating resistor is It is possible to suppress the decrease in the accuracy of temperature measurement of the first surface by the temperature measuring resistor. Therefore, according to the present holding device, it is possible to improve the accuracy of temperature measurement of the first surface of the plate-shaped member by the temperature measuring resistor, thereby improving the controllability of the temperature distribution of the first surface. be able to.

(2) In the above-described holding device, a terminal portion for temperature measurement disposed on a second surface side opposite to the first surface of the plate-like member; A temperature-measuring via having one end electrically connected to the temperature-measuring resistor and the other end of the temperature-measuring via electrically connecting the temperature-measuring terminal portion to the temperature-measuring via. and a conductive portion, wherein the temperature-measuring via and the temperature-measuring terminal portion are positioned at different positions from each other when viewed in the first direction. In this holding device, the temperature-measuring via and the temperature-measuring terminal are positioned at different positions in the planar direction when viewed in the first direction. Therefore, in this holding device, the degree of freedom in arranging the temperature-measuring resistor is greater than in a structure in which the temperature-measuring via and the temperature-measuring terminal are positioned at the same position when viewed from the first direction. Restriction by the position of the warm terminal can be suppressed.

(3) In the holding device, the conductive portion is disposed between the heating resistor and the second surface in the first direction, and is electrically connected to the other end of the temperature-measuring via. A configuration may be adopted in which a temperature measurement driver electrode is connected and electrically connected to the temperature measurement terminal portion. In this holding device, the temperature-measuring driver electrode is arranged between the heating resistor and the second surface in the first direction. Therefore, compared to the configuration in which the temperature measuring driver electrode is arranged between the temperature measuring resistor and the heat generating resistor in the first direction, the temperature measuring driver electrode On the imaginary plane on which the resistor is arranged, the formation position of the non-heat-generating part where the heating resistor is not arranged to ensure continuity between the temperature-measuring resistor and the temperature-measuring terminal is the temperature-measuring terminal. It is possible to suppress being restricted by the position of the part.

(4) In the above-described holding device, a heat-generating terminal portion disposed on the second surface side of the plate-like member is disposed at a position different from the heat-generating resistor in the first direction, a heat generation driver electrode electrically connected to the heat generation resistor and the heat generation terminal portion, wherein the temperature measurement driver electrode is arranged in the first direction between the heat generation driver electrode and the heat generation driver electrode; It is good also as a structure arrange|positioned between 2 surfaces. In this holding device, the temperature-measuring driver electrode is arranged between the heat-generating driver electrode and the first surface in the first direction. Therefore, compared to the configuration in which the temperature measurement driver electrodes are arranged between the heat generation driver and the first surface in the first direction, the heat generation driver electrodes are substantially orthogonal to the first direction and On the virtual plane where is arranged, the formation position of the non-driver part where the heat generation driver electrode is not arranged to ensure continuity between the temperature measuring resistor and the temperature measuring terminal part is the temperature measuring terminal part Positional restrictions can be suppressed.

(5) In the above-described holding device, the plate-like member is formed with a gas flow path extending in a second direction substantially orthogonal to the first direction, and the gas flow path extends in the first direction. may be arranged between the temperature-measuring resistor and the heat-generating resistor in the direction of . In this holding device, the gas flow path is arranged between the temperature-measuring resistor and the heat-generating resistor in the first direction. For this reason, according to the present holding device, compared to a configuration in which the gas flow path is arranged between the first surface and the temperature measuring resistor, for example, the presence of the gas flow path causes the temperature measuring resistor to It is possible to suppress deterioration in the accuracy of temperature measurement of the first surface by the body.

The technology disclosed in this specification can be implemented in various forms, for example, holding devices, electrostatic chucks, heating devices such as CVD heaters, vacuum chucks, and manufacturing methods thereof. It is possible to realize by

1 is a perspective view schematically showing an external configuration of a heating device 100 according to this embodiment; FIG. It is an explanatory view showing roughly the XZ section composition of heating device 100 in this embodiment. It is an explanatory view showing roughly the XY section composition of heating device 100 in this embodiment. It is an explanatory view showing roughly the XY section composition of heating device 100 in this embodiment. It is an explanatory view showing roughly the XY section composition of heating device 100 in this embodiment. It is an explanatory view showing roughly the XY section composition of heating device 100 in this embodiment.

A. Embodiment:
A-1. Configuration of heating device 100:
FIG. 1 is a perspective view schematically showing the external configuration of a heating device 100 according to the present embodiment, and FIG. 2 is an explanatory view schematically showing the XZ cross-sectional configuration of the heating device 100 according to the present embodiment. 2 shows the XZ cross-sectional configuration of the heating device 100 at the position II-II in FIGS. 3 to 6, which will be described later. Each figure shows mutually orthogonal XYZ axes for specifying directions. In this specification, for the sake of convenience, the positive direction of the Z-axis is referred to as the upward direction, and the negative direction of the Z-axis is referred to as the downward direction. may

The heating device 100 is a device that holds an object (eg, a semiconductor wafer W) and heats it to a predetermined processing temperature (eg, about 400 to 800° C.), and is also called a susceptor. The heating apparatus 100 is used as part of a semiconductor manufacturing apparatus such as, for example, a film forming apparatus (CVD film forming apparatus, sputtering film forming apparatus, etc.) or an etching apparatus (plasma etching apparatus, etc.).

As shown in FIGS. 1 and 2, the heating device 100 includes a holder 10 and a columnar support 20. As shown in FIG.

(Holding body 10)
The holding body 10 is a substantially disc-shaped member having a holding surface S1 and a rear surface S2 substantially perpendicular to a predetermined direction (vertical direction in this embodiment). The holder 10 is made of ceramics containing, for example, Al ₂ O ₃ (alumina) or AlN (aluminum nitride) as a main component. In addition, the main component here means the component with the highest content ratio (weight ratio). The diameter of the holder 10 is, for example, about 100 mm or more and 500 mm or less, and the thickness (length in the vertical direction) of the holder 10 is, for example, about 3 mm or more and 30 mm or less.

As shown in FIG. 2, a heater electrode 50 configured by a resistance heating element for heating the holder 10 is arranged inside the holder 10 . The heater electrode 50 is made of a conductive material such as tungsten or molybdenum.

Further inside the holder 10 are an RF (radio frequency) electrode 40 for generating plasma, an RTD (Resistance Temperature Detector) electrode 60 for measuring the temperature of the holding surface S1 of the holder 10, and a heater driver 54. , an RTD driver 64, and various vias extending in the vertical direction are arranged. The RF electrode 40, the RTD electrode 60, the heater driver 54, the RTD driver 64, and various vias are each made of a conductive material (eg, tungsten, molybdenum, platinum, etc.).

A gas flow path 14 is further formed inside the holder 10 (see FIG. 2). The gas flow path 14 is formed on the holding surface S1 side with respect to the heater electrode 50 . The gas flow path 14 is a path (space) extending in a planar direction orthogonal to the vertical direction (Z-axis direction), and, for example, extends substantially concentrically when viewed in the vertical direction. Gas channel 14 is a gas channel or a vacuum channel. The gas flow path 14 communicates with a gas through hole 24 formed in the columnar support 20 to be described later through a gas communication hole (not shown), and has a plurality of gas discharge holes (not shown) opened in the holding surface S1. not). In addition, the holding body 10 having such a structure can be obtained, for example, by manufacturing a plurality of ceramic green sheets, forming via holes in predetermined ceramic green sheets, filling the metallized paste, printing, and the like, and producing these ceramic green sheets. It can be produced by bonding a sheet by thermocompression, performing processing such as cutting, and then firing.

(Column support 20)
The columnar support 20 is a substantially cylindrical member extending in the vertical direction (Z-axis direction). Like the holder 10, the columnar support 20 is made of ceramics containing, for example, alumina or AlN as a main component. The outer diameter of the columnar support 20 is, for example, about 30 mm or more and 100 mm or less, and the height (vertical length) of the columnar support 20 is, for example, about 100 mm or more and 300 mm or less.

The holder 10 and the columnar support 20 face each other in the above-described vertical direction, with the vicinity of the central portion of the back surface S2 of the holder 10 and the upper surface S3 of the columnar support 20 sandwiching a bonding layer 30 formed of a bonding agent. are arranged as That is, the columnar support 20 is arranged such that the upper surface S3 of the columnar support 20 is located on the rear surface S2 side of the holder 10 .

As shown in FIG. 2, the columnar support 20 is formed with a through hole 22 that opens toward the rear surface S2 of the holder 10 . The through hole 22 is a hole having a substantially circular cross section that extends in substantially the same direction as the vertical direction (Z-axis direction) and has a substantially constant inner diameter over the entire length in the vertical direction. A plurality of terminals, which will be described later, are accommodated in the through hole 22 . In this embodiment, the plurality of terminals are one RF terminal 48, four heater terminals 58 (only one is shown in FIG. 2), and four RTD terminals 68 (only one is shown in FIG. 2). and Nine recesses 12 (only three are shown in FIG. 2) are formed in the vicinity of the center of the back surface S2 of the holder 10, and each recess 12 has one upper end of each of the terminals 48, 58, and 68. are placed. The upper ends of the terminals 48, 58, 68 are connected to the respective electrode pads (one RF electrode pad 46, four heater electrode pads 56, 4) via a joint portion 11 containing a metal brazing material (for example, gold brazing material). are joined to one RTD electrode pad 66).

A-2. Configuration of RF electrode 40:
The RF electrode 40 is a substantially flat plate-shaped conductor extending in the plane direction (XY plane direction). The shape of the RF electrode 40 when viewed in the vertical direction (Z-axis direction) is, for example, substantially circular. The vicinity of the center of the RF electrode 40 is electrically connected to an RF electrode pad 46 via an RF via 42 . Thereby, the RF electrode 40 and the RF terminal 48 are electrically connected. Plasma is generated from the RF electrode 40 when a voltage is applied to the RF electrode 40 from a power source (not shown) through the RF terminal 48 .

Here, as shown in FIG. 2, the RF electrode 40 is arranged closer to the holding surface S1 of the holder 10 than the conductive members such as the heater electrode 50 and the RTD electrode 60 in the vertical direction (Z-axis direction). . That is, no conductive member exists between the RF electrode 40 and the holding surface S1. As a result, according to the present embodiment, the magnetic field of the plasma generated from the RF electrode 40 can be stabilized compared to a configuration in which a conductive member exists between the RF electrode 40 and the holding surface S1.

A-3. Configuration of heater electrode 50:
FIG. 3 is an explanatory view schematically showing the XY cross-sectional configuration of the heating device 100 in this embodiment. FIG. 3 shows the XY cross-sectional configuration of the heating device 100 at the position III-III in FIG. In FIG. 3, four heater drivers 54 are indicated by two-dot chain lines.

As shown in FIG. 3 , the heating device 100 includes multiple heater electrodes 50 . The plurality of heater electrodes 50 are arranged on the back surface S2 side of the gas flow path 14 inside the holder 10 (see FIG. 2). The plurality of heater electrodes 50 are arranged at approximately the same positions in the vertical direction (Z-axis direction) inside the holder 10 . In other words, the plurality of heater electrodes 50 are arranged on one (common) imaginary plane (XY plane) substantially perpendicular to the vertical direction. In addition, the plurality of heater electrodes 50 are arranged in different regions (segments) of the holder 10 when viewed in the vertical direction.

Specifically, as shown in FIG. 3, in this embodiment, the heating device 100 includes three heater electrodes 50 (50A, 50B, 50C). The first heater electrode 50A is arranged in the first region Zo1 near the center of the holder 10 when viewed in the vertical direction (Z-axis direction), and the second heater electrode 50B is arranged in the first region Zo1. It is arranged in the second region Zo<b>2 positioned on the outer peripheral side of the holder 10 . Also, the third heater electrode 50C is arranged in a third region Zo3 located on the outer peripheral side of the holder 10 from the second region Zo2. The shape of the first region Zo1 when viewed in the vertical direction is substantially circular, and the shape of the second region Zo2 and the third region Zo3 when viewed in the vertical direction is substantially annular.

Each heater electrode 50 is a linear heating resistor when viewed in the vertical direction (Z-axis direction). In this embodiment, the shape of the heater electrode 50 when viewed in the vertical direction is substantially circular or substantially spiral.

3, four heater terminals 58 are indicated by two-dot chain lines. Since the four heater terminals 58 are accommodated in the through holes 22 of the columnar support 20, they are positioned near the center of the rear surface S2 of the holder 10 (within the first region Zo1) when viewed from the vertical direction. are placed. FIG. 3 also shows a communication path 18 that is a path (space) extending in the vertical direction (the Z-axis direction) and communicates with the gas flow path 14, for example. Further, FIG. 3 shows a first RTD via 62, which will be described later. Each heater electrode 50 has a bypass portion 53 that bypasses the communicating path 18 and the first RTD via 62 .

A-4. Configuration for electrically connecting heater electrode 50 and heater terminal 58:
FIG. 4 is an explanatory view schematically showing the XY cross-sectional configuration of the heating device 100 in this embodiment. FIG. 4 shows the XY cross-sectional configuration of the heating device 100 at the position IV-IV in FIG.

As shown in FIG. 4 , the heating device 100 includes a plurality of heater drivers 54 . Each heater driver 54 is a conductor pattern of a predetermined shape substantially parallel to the surface direction (XY plane direction). Note that the heater driver 54 is different from the heater electrode 50 in that it satisfies at least one of the following (1) and (2).
(1) The cross-sectional area of the heater driver 54 in the direction perpendicular to the direction of current flow is five times or more the similar cross-sectional area of the heater electrode 50 .
(2) In the heater electrode 50, the resistance between one via connected to the heater driver 54 (a first heater via 52 or the like described later) and the other via is It is five times or more the resistance between the connecting via and the via connecting to the heater terminal 58 (the second heater via 55 or the like).

A plurality of heater drivers 54 are arranged inside the holder 10 between the heater electrode 50 and the rear surface S2 (see FIG. 2). In addition, the plurality of heater drivers 54 are arranged at substantially the same positions in the vertical direction (Z-axis direction) inside the holding body 10 . In other words, the plurality of heater drivers 54 are arranged in different regions on one (common) imaginary plane (XY plane) substantially perpendicular to the vertical direction.

Specifically, as shown in FIG. 4, in this embodiment, the heating device 100 includes four heater drivers 54 (54A, 54B, 54C, 54D). The four heater drivers 54 are arranged in each of four regions formed by equally dividing the holder 10 into the same number of heater drivers 54 (four regions) as viewed in the vertical direction (Z-axis direction). ing. The shape of each heater driver 54 when viewed in the vertical direction is a substantially fan-like shape of a quarter of a circle. Note that the four heater drivers 54 are arranged apart from each other in the planar direction to prevent short circuits.

One ends of the three heater electrodes 50 (50A to 50C) are individually electrically connected to three heater drivers 54 (54A to 54C), respectively. Specifically, one end of the first heater electrode 50A and the first heater driver 54A located just below the one end of the first heater electrode 50A are connected to the first heater electrode 50A. They are electrically connected through vias 52 (see FIG. 2). One end of the second heater electrode 50B and the second heater driver 54B located just below the one end of the second heater electrode 50B are connected to a first heater via (not shown). are electrically connected via One end of the third heater electrode 50C and the third heater driver 54C positioned just below the one end of the third heater electrode 50C are connected to a first heater via (not shown). are electrically connected via Further, the other ends of the first heater electrode 50A, the second heater electrode 50B, and the third heater electrode 50C are connected to each other through a first heater via (not shown). are electrically connected to a common fourth heater driver 54D located immediately below the unit.

With the above configuration, one ends of the three heater electrodes 50 (50A to 50C) are individually connected to the three heater terminals 58 via the three heater drivers 54 (54A to 54C), respectively. are electrically connected to each of the Each of the other ends of the three heater electrodes 50 is electrically connected to the remaining one heater terminal 58 via a fourth heater driver 54D. The four heater drivers 54 (54A to 54D) are electrically connected to the four heater terminals 58 through the second heater vias 55 (see FIG. 2). With the above configuration, when a voltage is applied to each of the plurality of heater electrodes 50 from a power source (not shown) through each heater terminal 58, each heater driver 54, and the like, each heater electrode 50 generates heat, and the holder 10 An object (eg, a semiconductor wafer W) held on the holding surface S1 of is heated to a predetermined temperature (eg, about 400 to 800.degree. C.).

Note that FIG. 4 shows the communication path 18 and the first RTD via 62 . A notch 57 and a through hole 59 are formed in each heater driver 54 so as to avoid the communication path 18 and the first RTD via 62 .

A-5. Configuration of RTD electrode 60:
FIG. 5 is an explanatory view schematically showing the XY cross-sectional configuration of the heating device 100 in this embodiment. FIG. 5 shows the XY cross-sectional configuration of the heating device 100 at the position of VV in FIG. In FIG. 5, four RTD drivers 64 are indicated by two-dot chain lines.

As shown in FIG. 5, the heating device 100 comprises multiple RTD electrodes 60 . The plurality of RTD electrodes 60 are arranged inside the holder 10 closer to the holding surface S1 than the heater electrodes 50 are. In other words, the RTD electrode 60 is arranged between the holding surface S1 and the heater electrode 50 in the vertical direction (Z-axis direction) (see FIG. 2). Also, the plurality of RTD electrodes 60 are arranged closer to the holding surface S1 than the gas flow path 14 is. That is, the gas flow path 14 is arranged between the RTD electrode 60 and the heater electrode 50 . The RTD electrode 60 is preferably arranged above the center position of the holder 10 in the vertical direction, and the heater electrode 50 is arranged below the center position of the holder 10 in the vertical direction. preferably.

In addition, the plurality of RTD electrodes 60 are arranged at substantially the same positions in the vertical direction inside the holder 10 . In other words, the plurality of RTD electrodes 60 are arranged on one (common) imaginary plane (XY plane) substantially perpendicular to the vertical direction. In addition, the plurality of RTD electrodes 60 are arranged in different regions of the holder 10 when viewed in the vertical direction. The plurality of RTD electrodes 60 are arranged so as to correspond to the plurality of heater electrodes 50, respectively. , one heater electrode 50 and one electrode 60 are arranged.

Specifically, as shown in FIG. 5, in this embodiment, the heating device 100 includes three RTD electrodes 60 (60A, 60B, 60C). The first RTD electrode 60A is arranged in the first region Zo1 where the first heater electrode 50A is arranged when viewed in the vertical direction (Z-axis direction), and the second RTD electrode 60B is arranged in the second region Zo1. It is arranged in the second region Zo2 where the heater electrode 50B is arranged. Also, the third RTD electrode 60C is arranged in the third region Zo3 where the third heater electrode 50C is arranged.

Each RTD electrode 60 is a linear temperature-measuring resistor when viewed in the vertical direction (Z-axis direction). Since the current flowing through each RTD electrode 60 is very small compared to the current flowing through the heater electrode 50, the amount of heat generated when the RTD electrode 60 is energized is extremely small compared to the amount of heat generated when the heater electrode 50 is energized. . In this embodiment, the shape of the RTD electrode 60 as viewed in the vertical direction is substantially circular or substantially spiral.

Also, in FIG. 5, four RTD terminals 68 are indicated by two-dot chain lines. Since the four RTD terminals 68 are accommodated in the through holes 22 of the columnar support 20 in the same manner as the heater terminals 58 described above, they are positioned closer to the center of the back surface S2 of the holder 10 when viewed in the vertical direction. 1 area Zo1).

A-6. Configuration for electrically connecting the RTD electrode 60 and the RTD terminal 68:
FIG. 6 is an explanatory view schematically showing the XY cross-sectional configuration of the heating device 100 in this embodiment. FIG. 6 shows the XY cross-sectional configuration of the heating device 100 at the position VI-VI in FIG.

As shown in FIG. 6, the heating device 100 includes multiple RTD drivers 64 . Each RTD driver 64 is a conductor pattern of a predetermined shape substantially parallel to a surface direction perpendicular to the vertical direction (Z-axis direction). Each RTD driver 64 differs from the RTD electrode 60 in that it satisfies at least one of (1) and (2) below.
(1) The cross-sectional area of the RTD driver 64 perpendicular to the direction of current flow is at least five times larger than the similar cross-sectional area of the RTD electrode 60 .
(2) In each RTD electrode 60, the resistance between one via connected to each RTD driver 64 (such as a first RTD via 62 to be described later) and the other via is It is five times or more the resistance from the via connecting to the RTD electrode 60 to the via connecting to the RTD terminal 68 (second RTD via 65, etc.).

A plurality of RTD drivers 64 are arranged between the RTD electrodes 60 and the rear surface S2 inside the holder 10 (see FIG. 2). In addition, each of the plurality of RTD drivers 64 is arranged closer to the rear surface S2 side of the holder 10 than the heater driver 54 in the vertical direction (Z-axis direction). In other words, each of the plurality of RTD drivers 64 is arranged between the heater driver 54 and the rear surface S2 in the vertical direction. In addition, the plurality of RTD drivers 64 are arranged at substantially the same positions in the vertical direction inside the holder 10 . In other words, the plurality of RTD drivers 64 are arranged in different regions on one (common) virtual plane (XY plane) substantially perpendicular to the vertical direction.

Specifically, as shown in FIG. 6, in this embodiment, the heating device 100 includes four RTD drivers 64 (64A, 64B, 64C, 64D). Each of the four RTD drivers 64 is arranged in each of four regions formed by equally dividing the holder 10 into the number of RTD drivers 64 (four regions) when viewed in the vertical direction (Z-axis direction). It is The shape of each RTD driver 64 when viewed in the up-down direction is a substantially fan-like shape of a quarter of a circle. Note that the four RTD drivers 64 are arranged apart from each other in the planar direction to prevent short circuits.

One end of each of the three RTD electrodes 60 (60A-60C) is individually electrically connected to each of the three RTD drivers 64 (64A-64C). Specifically, one end of the first RTD electrode 60A and the first RTD driver 64A located immediately below the one end of the first RTD electrode 60A are connected to the first RTD electrode 60A. They are electrically connected via vias (not shown). One end of the second RTD electrode 60B and the second RTD driver 64B positioned immediately below the one end of the second RTD electrode 60B are connected to a first RTD via (not shown). are electrically connected via One end of the third RTD electrode 60C and the third RTD driver 64C positioned just below the one end of the third RTD electrode 60C are connected to a first RTD via (not shown). are electrically connected via Further, the other end of each of the first RTD electrode 60A, the second RTD electrode 60B, and the third RTD electrode 60C is directly below the other end through the first RTD via 62. It is electrically connected to a common fourth RTD driver 64D located (see FIG. 2).

Here, as shown in FIGS. 2 and 5, the first RTD vias 62 and the RTD terminals 68 are arranged at different positions when viewed in the vertical direction (Z-axis direction). In the present embodiment, the first RTD via 62 electrically connected to one end of each RTD driver 64 is the first RTD via 62 electrically connected to the other end when viewed in the vertical direction. It is arranged at a position spaced apart from the RTD terminal 68 (on the outer peripheral side of the holder 10) from the RTD via 62. As shown in FIG.

With the above configuration, one ends of the three RTD electrodes 60 (60A to 60C) are individually connected to the three RTD terminals 68 via the three RTD drivers 64 (64A to 64C), respectively. are electrically connected to each of the Also, the other ends of the three RTD electrodes 60 are electrically connected to the remaining one RTD terminal 68 via a fourth RTD driver 64D. The four RTD drivers 64 (64A to 64D) are electrically connected to the four heater terminals 58 through the second RTD vias 65 (see FIG. 2). With the above configuration, when a plurality of RTD electrodes 60 are electrically connected to a resistance measuring device (not shown) through each RTD terminal 68, each RTD driver 64, etc., a slight current is applied to each RTD electrode 60. The temperature around each RTD electrode 60 is individually measured by the flow resistance meter based on the resistance change of each RTD electrode 60 .

Note that the heating device 100 corresponds to a holding device in the claims. The holder 10 corresponds to a plate member in the claims, and the vertical direction (Z-axis direction) corresponds to the first direction in the claims. Further, the holding surface S1 corresponds to the first surface in the claims, and the back surface S2 corresponds to the second surface in the claims. The heater electrode 50 corresponds to the heating resistor in the claims, and the RTD electrode 60 corresponds to the temperature measuring resistor in the claims. The heater driver 54 corresponds to the heating driver electrode in the claims, and the RTD driver 64 corresponds to the temperature measurement driver electrode in the claims. The heater terminal 58 corresponds to the heat generation terminal in the claims, and the RTD terminal 68 corresponds to the temperature measurement terminal in the claims. The first RTD via 62 corresponds to the temperature measurement via in the claims. The first RTD via 62, the RTD driver 64, the second RTD via 65, the RTD electrode pad 66, and the joint 11 correspond to conductive portions in the claims. A portion of the gas channel 14 extending in the plane direction corresponds to the gas channel in the claims.

A-7. Effect of this embodiment:
As described above, in the heating device 100 of the present embodiment, the RTD electrode 60 is arranged closer to the holding surface S1 of the holder 10 than the heater electrode 50 in the vertical direction (Z-axis direction) (see FIG. 2). ). That is, the heater electrode 50 is not interposed between the RTD electrode 60 and the holding surface S1. Therefore, in the present embodiment, compared to the configuration in which the RTD electrode 60 is arranged on the back surface S2 side of the heater electrode 50 in the vertical direction, it is difficult to measure the temperature of the holding surface S1 by the electrode 60 due to the heat generated by the heater electrode 50. A decrease in accuracy can be suppressed. Therefore, according to this holding device, it is possible to improve the accuracy of the temperature measurement of the holding surface S1 of the holding body 10 by the RTD electrode 60, thereby improving the controllability of the temperature distribution of the holding surface S1.

In the present embodiment, when viewed in the vertical direction (Z-axis direction), the first RTD via 62 and the RTD terminal 68 are positioned at different positions in the planar direction (XY plane direction) (FIGS. See Figure 5). Therefore, in the present embodiment, compared to the configuration in which the first RTD via 62 and the RTD terminal 68 are positioned at the same position, the RTD electrode 60 can be arranged more freely depending on the position of the RTD terminal 68. Restrictions can be suppressed. As described above, each heater electrode 50 has a bypass portion 53 that bypasses the communication path 18 and the first RTD via 62 (see FIG. 3). However, in this embodiment, the plurality of first RTD vias 62 are arranged in a wide range without being restricted by the RTD terminals 68 . Therefore, the detour portion 53 of the heater electrode 50 (the portion where the distance between the heater electrodes 50 is shortened due to the detour portion 53) is a specific portion of the holder 10 (for example, a portion where a plurality of terminals are concentratedly arranged). It is possible to suppress the occurrence of a temperature singularity on the holding surface S1, for example, due to the concentration of the temperature near the center.

In this embodiment, the RTD driver 64 is arranged vertically between the heater electrode 50 and the holding surface S1 (see FIG. 2). Therefore, according to the present embodiment, the heater electrode 50 is not arranged on the virtual plane (see FIG. 3) on which the heater electrode 50 is arranged in order to ensure electrical continuity between the RTD electrode 60 and the RTD terminal 68. It is possible to prevent the formation position of the non-heat generating portion (the detour portion 53 ) from being restricted by the position of the RTD terminal 68 . That is, assuming that the RTD driver 64 is arranged between the RTD electrode 60 and the heater electrode 50, it is arranged near the center of the holder 10 to ensure conduction between the RTD electrode 60 and the RTD terminal 68. A plurality of second RTD vias 65 are arranged so as to vertically penetrate the portion where the first heater electrode 50A is arranged. Then, due to the formation of many detour portions 53 in the first heater electrode 50A arranged in the relatively narrow first region Zo1, for example, a temperature singularity tends to occur on the holding surface S1. . In contrast, in the present embodiment, the formation position of the detour portion 53 of the heater electrode 50 is not restricted by the position of the RTD terminal 68 (see FIGS. 3 and 5). Therefore, according to the present embodiment, it is possible to suppress the occurrence of a temperature singularity, for example, on the holding surface S1 due to the concentration of the detour portions 53 of the heater electrode 50 at a specific portion of the holding body 10. can be done.

In this embodiment, the RTD driver 64 is arranged vertically between the heater driver 54 and the rear surface S2 of the holder 10 (see FIG. 2). Therefore, compared to the configuration in which the RTD driver 64 is arranged between the holding surface S1 and the heater driver 54, the RTD electrode 60 and The formation position of the non-driver portion (the notch 57 and the through hole 59) where the heater driver 54 is not arranged in order to ensure conduction with the RTD terminal 68 is suppressed from being restricted by the position of the RTD terminal 68. can do. That is, in this embodiment, the plurality of non-driver portions are arranged so as to be scattered over a wide range without being restricted by the RTD terminals 68 . Therefore, the non-driver portion (the portion where the current path is narrowed due to the non-driver portion) in the heater driver 54 is a specific portion (for example, the center where a plurality of terminals are concentrated) in the holder 10. It is possible to suppress the occurrence of a temperature singularity on the holding surface S1, for example, due to the concentration of the temperature in the vicinity of the holding surface S1.

In the present embodiment, a plurality of non-driver portions (notches) where the RTD driver 64 is not formed are provided near the center of the RTD driver 64 in order to avoid the plurality of second heater vias 55 and the like. and through holes (not shown in FIG. 6) are concentrated. Note that the heater driver 54, unlike the RTD driver 64, flows a large current required for heat generation, so the concentration of non-driver portions narrows the current path, and the concentration of current tends to cause a high temperature singular point. On the other hand, since only a very small amount of current flows through the RTD driver 64, even if a plurality of non-driver portions concentrate at a specific location, the temperature singularity is less likely to occur.

In this embodiment, the gas flow path 14 is arranged between the RTD electrode 60 and the heater electrode 50 in the vertical direction. For this reason, according to the present embodiment, the RTD electrode 60 is prevented from moving due to the presence of the gas flow path 14 and the like, compared to the configuration in which the gas flow path 14 and the like are arranged between the holding surface S1 and the heater electrode 50, for example. It is possible to suppress the decrease in the accuracy of the temperature measurement of the holding surface S1 due to

B. Variant:
The technology disclosed in this specification is not limited to the above-described embodiments, and can be modified in various forms without departing from the scope of the invention. For example, the following modifications are possible.

The configuration of the heating device 100 in the above embodiment is merely an example, and various modifications are possible. For example, in the above-described embodiment, the holding surface S1 (first surface) of the holder 10 is flat, but it may be, for example, a gently concave surface. In short, the holding surface S1 should just be substantially planar. Further, in the above-described embodiment, as the terminal portions (heat generating terminal portion, temperature measuring terminal portion), rod-shaped heater terminals 58 and RTD terminals 68 (hereinafter referred to as "heater terminals 58 and the like") extending in the vertical direction are provided. was exemplified, it may be a flat terminal, for example. In the above-described embodiment, the heater terminal 58 and the like are arranged on the bottom surface of the recess 12 formed on the back surface S2 of the holder 10. It may be arranged on a convex portion. In short, the terminals (heater terminals 58 and the like) need only be arranged on the rear surface S2 side of the holder 10 .

In the above embodiment, the heating device 100 may be configured without at least one of the RF electrode 40 , the heater electrode 50 and the RTD electrode 60 . Moreover, the heating device 100 may be configured to include other conductive members such as thermocouples. Moreover, the heating device 100 may have a configuration in which the gas flow path 14 is not formed in the holder 10 . Further, the heating device 100 may have a configuration in which a hole for a lift pin is formed that penetrates the holder 10 in the vertical direction and into which the lift pin is inserted.

In the above embodiment, the number of heater electrodes 50, the number of RTD electrodes 60, the number of heater drivers 54, and the number of RTD drivers 64 can be changed as appropriate. Further, in the above embodiment, the heating device 100 may be configured without the second RTD via 65 . Specifically, the RTD driver 64 may be joined to the RTD electrode pad 66 without a via. Moreover, the heating device 100 may be configured to include a plurality of heater layers in which the plurality of heater electrodes 50 are arranged at different positions in the vertical direction. Moreover, the heating device 100 may be configured to include a plurality of RTD layers in which the plurality of RTD electrodes 60 are arranged at different positions in the vertical direction. Further, the heating device 100 may be configured to include a plurality of heater driver layers in which the plurality of heater drivers 54 are arranged at different positions in the vertical direction. Alternatively, a plurality of heater electrodes 50 may be connected in parallel within one segment of the holder 10 .

In the above embodiment, the first RTD via 62 is directly connected (joined) to the RTD electrode 60, but the first RTD via 62 is connected (bonded) to the RTD electrode via another conductor. 60 may be indirectly connected. Each of the vias 42, 52, 55, 62, 65, etc. may be composed of a single via, or may be composed of a group of multiple vias arranged in parallel at the same position in the vertical direction. . In the above-described embodiments, each of the vias 42, 52, 55, 62, 65, etc. may have a single-layer structure consisting only of the via portion, or may have a multi-layer structure (for example, a via portion, a pad portion, and a via portion). may be stacked).

Further, the materials forming each member in the heating device 100 of the above-described embodiment are merely examples, and each member may be formed of another material. For example, in the above-described embodiment, the holder 10 formed of ceramics was exemplified as the plate-like member, but the plate-like member is assumed to be a member formed of a material other than ceramics (for example, an insulating material such as resin). good too.

Further, the present invention is not limited to the heating apparatus 100 that includes the holder 10 and the columnar support 20 and holds and heats the semiconductor wafer W. The present invention is not limited to the heating apparatus 100 that includes a plate-like member and an object is placed on the surface of the plate-like member. It can also be applied to other holding devices (for example, electrostatic chucks, vacuum chucks, etc.).

10: Holder 11: Joint 12: Recess 14: Gas channel 18: Communication path 20: Columnar support 22: Through hole 24: Gas through hole 30: Joint layer 40: RF electrode 42: RF via 46: RF electrode pad 48: RF terminal 50: heater electrode 50A: first heater electrode 50B: second heater electrode 50C: third heater electrode 52: first heater via 53: bypass portion 54: for heater Driver 54A: First heater driver 54B: Second heater driver 54C: Third heater driver 54D: Fourth heater driver 55: Second heater via 57: Notch 58: Heater terminal 59: Through hole 60: RTD electrode 60A: First RTD electrode 60B: Second RTD electrode 60C: Third RTD electrode 62: First RTD via 64: RTD driver 64A: First RTD driver 64B: second RTD driver 64C: third RTD driver 64D: fourth RTD driver 65: second RTD via 66: RTD electrode pad 68: RTD terminal 100: heating device S1: holding Surface S2: Back surface S3: Top surface W: Semiconductor wafer Zo1: First region Zo2: Second region Zo3: Third region

Claims (4)

a plate-like member having a first surface substantially perpendicular to the first direction;
a heating resistor disposed inside the plate-shaped member;
a temperature-measuring resistor disposed inside the plate-shaped member;
a temperature-measuring terminal portion disposed on a second surface side opposite to the first surface of the plate-like member;
a temperature-measuring via extending in the first direction, one end of which is electrically connected to the temperature-measuring resistor;
a conductive portion electrically connecting the other end of the temperature-measuring via and the temperature-measuring terminal portion;
A holding device for holding an object on the first surface of the plate member,
the temperature-measuring resistor is arranged closer to the first surface than the heat-generating resistor in the first direction ;
The temperature-measuring via and the temperature-measuring terminal are positioned at different positions when viewed from the first direction,
A holding device characterized by: A holding device according to claim 1 , wherein
The conductive part is
disposed between the heat-generating resistor and the second surface in the first direction, electrically connected to the other end of the temperature-measuring via, and electrically connected to the temperature-measuring terminal portion; including temperature-measuring driver electrodes electrically connected to
A holding device characterized by: 3. The retaining device of claim 2 , further comprising:
a heat generating terminal portion disposed on the second surface side of the plate-like member;
a heating driver electrode disposed at a position different from the heating resistor in the first direction and electrically connected to the heating resistor and the heating terminal,
The temperature-measuring driver electrode is arranged between the heat-generating driver electrode and the second surface in the first direction,
A holding device characterized by: a plate-like member having a first surface substantially perpendicular to the first direction;
a heating resistor disposed inside the plate-shaped member;
a temperature-measuring resistor disposed inside the plate-shaped member;
A holding device for holding an object on the first surface of the plate member,
the temperature-measuring resistor is arranged closer to the first surface than the heat-generating resistor in the first direction;
a gas flow path extending in a second direction substantially orthogonal to the first direction is formed in the plate member;
The gas flow path is arranged between the temperature measuring resistor and the heat generating resistor in the first direction,
A holding device characterized by:

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