JP7278049B2 - holding device - Google Patents

Description

The technology disclosed in this specification relates to a holding device that holds an object.

For example, an electrostatic chuck is used as a holding device for holding a wafer when manufacturing semiconductors. The electrostatic chuck is formed of, for example, ceramics, and includes a plate-like member having a surface (hereinafter referred to as "attraction surface") substantially perpendicular to a predetermined direction (hereinafter referred to as "first direction") and a metal, for example. a base member formed by: a joining portion for joining the plate-like member and the base member; and a chuck electrode arranged inside the plate-like member. An electrostatic chuck utilizes electrostatic attraction generated by applying a voltage to a chuck electrode to attract and hold a wafer on an attraction surface of a plate member.

If the temperature of the wafer held on the attraction surface of the electrostatic chuck does not reach the desired temperature, the precision of each process (film formation, etching, etc.) on the wafer may decrease. The ability to control the distribution is required. Therefore, when the electrostatic chuck is used, heating by a plurality of heater electrodes arranged on the plate-like member and cooling by supplying a coolant to the coolant flow path formed in the base member cause the adsorption surface of the plate-like member to move. Control of the temperature distribution (and thus control of the temperature distribution of the wafer held on the attraction surface) is performed. The electrostatic chuck is provided with a power supply terminal for supplying power to each heater electrode arranged on the plate member. The power supply terminal is accommodated in a terminal hole formed by a through hole formed in the base member and the joint.

In the electrostatic chuck, in order to improve the controllability of the temperature distribution on the attracting surface, at least a portion of the plate-like member is divided into a plurality of virtual portions (hereinafter referred to as "segments"), each segment having a heater electrode. may be adopted. According to such a configuration, the temperature of each segment can be individually controlled by individually controlling the voltage applied to the heater electrodes arranged in each segment of the plate-like member. Controllability of temperature distribution can be improved (see, for example, Patent Document 1).

JP 2018-120910 A

A coolant flow path cannot be arranged in a portion of the base member where the through hole forming the terminal hole is formed. Therefore, the portion of the plate-like member that overlaps the terminal hole when viewed in the first direction is less likely to be cooled by supplying the coolant to the coolant flow path formed in the base member than the other portions. , tends to be a high-temperature temperature singularity. In the configuration of a conventional electrostatic chuck, it is not possible to suppress the occurrence of a high-temperature singular point caused by the presence of the terminal holes, and as a result, the controllability of the temperature distribution on the attraction surface (and thus the retention on the attraction surface) controllability of the temperature distribution of the target object) may be degraded.

Note that such a problem is not limited to electrostatic chucks that hold a wafer using electrostatic attraction. , is a problem common to all holding devices that hold an object on the surface of a plate member.

This specification discloses a technology capable of solving the above-described problems.

The technology disclosed in this specification can be implemented, for example, in the following forms.

(1) The holding device disclosed herein is a plate having a substantially circular first surface substantially orthogonal to a first direction and a second surface opposite to the first surface. and at least a portion of the plate-like member, as viewed in the first direction, are divided into a plurality of annular portions by a plurality of concentric dividing lines extending in a circumferential direction around a center point of the first surface. The heater is arranged in each of a plurality of segments set by virtually dividing each annular portion into a plurality of portions arranged in the circumferential direction, and is composed of a resistance heating element. A base member having a heater electrode having a line portion, a third surface, and a fourth surface opposite to the third surface, wherein the third surface is the plate member. a base member disposed so as to be positioned on the second surface side, having coolant flow paths formed therein, and having a plurality of first through-holes extending from the third surface to the fourth surface; a joining portion disposed between the second surface of the plate-like member and the third surface of the base member to join the plate-like member and the base member; a joint part in which a plurality of second through holes forming terminal holes are formed in communication with each of the through holes; and a power supply terminal configured to hold an object on the first surface of the plate-like member, wherein the terminal hole overlapping one of the segments when viewed in the first direction includes the It overlaps an imaginary centerline, which is an imaginary straight line extending radially through the center point of the first surface and bisecting the one segment in the circumferential direction. In this holding device, when viewed from the first direction, the terminal hole is located at a position relatively distant from the boundary between the other segments arranged in the circumferential direction in one segment, that is, the influence of the temperature of the adjacent other segment It is placed in a position where it is difficult to receive Therefore, in the present holding device, by controlling the amount of heat generated by the heater electrode arranged in one segment, a high temperature singular point caused by the presence of the terminal hole overlapping the one segment when viewed from the first direction. can be suppressed. Therefore, according to the present holding device, deterioration of the controllability of the temperature distribution on the first surface (and thus the controllability of the temperature distribution of the object held on the first surface) due to the existence of the terminal hole can be prevented. can be suppressed.

(2) In the above-described holding device, the terminal hole overlapping one of the segments when viewed in the first direction is located at the heater line portion of the heater electrode arranged in the one segment in the radial direction. It may be configured to be spaced apart from the boundary of the one segment as compared to a portion. In this holding device, when viewed in the first direction, the portion between the boundary and the terminal hole in one segment can be heated by the heat generated by the heater line portion located in that portion. As a result, in the present holding device, by controlling the amount of heat generated by the heater electrode arranged in one segment, a high temperature peculiarity due to the presence of the terminal hole overlapping the one segment in the first direction view. The generation of dots can be effectively suppressed. Therefore, according to this holding device, it is possible to effectively suppress deterioration in the controllability of the temperature distribution on the first surface.

(3) In the above-described holding device, when viewed in the first direction, two of the terminal holes that overlap two of the plurality of segments that are aligned in the circumferential direction are formed on the first surface. It may overlap with one imaginary circle centered on the center point. In this holding device, the positions in the radial direction of the two terminal holes respectively overlapping the two segments arranged in the circumferential direction are close to each other. Therefore, in the present holding device, the shape design of the heater line portion for suppressing the occurrence of a high-temperature singular point caused by the presence of the terminal hole can be made common in the two segments arranged in the circumferential direction. As a result, it is possible to realize a good shape of the heater line portion that effectively suppresses the occurrence of a high-temperature temperature singularity. Therefore, according to this holding device, it is possible to effectively suppress deterioration in the controllability of the temperature distribution on the first surface.

(4) The above-described holding device may further include a temperature detection element arranged in each of a plurality of recesses formed on the second surface of the plate-like member, wherein when viewed in the first direction, one of the The temperature sensing element that overlaps the segment may be configured to overlap the imaginary center line of the one segment. In this holding device, when viewed from the first direction, the temperature sensing element is positioned relatively far from the boundary between the other segments arranged in the circumferential direction in one segment, i.e., the influence of the temperature of the other adjacent segments It is placed in a position where it is difficult to receive Therefore, in this holding device, it is possible to suppress the temperature detection result of the temperature detection element overlapping the one segment when viewed from the first direction from being affected by the temperature of the other segments arranged in the circumferential direction with the one segment. can. Thus, in the present holding device, by controlling the amount of heat generated by the heater electrode arranged in the one segment based on the temperature detection result by the temperature detection element, the controllability of the temperature distribution in the segment is effectively improved. be able to. Therefore, according to this holding device, it is possible to effectively suppress deterioration in the controllability of the temperature distribution on the first surface.

(5) In the above-described holding device, when viewed from the first direction, two of the temperature sensing elements that overlap two of the segments that are arranged in the circumferential direction of the plurality of segments are located on the first surface. It may overlap with one imaginary circle centered on the center point. In this holding device, the positions in the radial direction of the two temperature sensing elements that respectively overlap the two segments that are arranged in the circumferential direction are close to each other. Therefore, in this holding device, it is possible to share the shape design of the heater line part in consideration of the position of the temperature detection element in the two segments arranged in the circumferential direction. Controllability of the heater electrode can be improved. Therefore, according to this holding device, it is possible to more effectively suppress deterioration in the controllability of the temperature distribution on the first surface.

(6) In the above-described holding device, when viewed from the first direction, one segment is virtually divided into a first portion, a second portion, and a third portion arranged in order along the radial direction. When divided, the center point of the terminal hole that overlaps the one segment is located in the first portion, and the center point of the temperature sensing element that overlaps the one segment is located in the third portion. may be configured. In this holding device, the terminal hole and the temperature sensing element are arranged relatively apart in the radial direction. Therefore, in this holding device, the accuracy of temperature detection by the temperature detection element is lowered due to the presence of the terminal hole, and the presence of the recess for accommodating the temperature detection element located near the terminal hole causes Even if the amount of heat generated by the heater electrode is controlled, the occurrence of a high temperature singular point can be suppressed. Therefore, according to this holding device, it is possible to further effectively improve the controllability of the temperature distribution on the first surface.

(7) In the holding device, the heater electrode may not overlap the terminal hole when viewed from the first direction. In this holding device, the amount of heat generated in the portion of the segment where the heater electrode is arranged, which overlaps with the terminal hole when viewed from the first direction, can be suppressed, and a high temperature singular point caused by the existence of the terminal hole can be suppressed. The occurrence can be suppressed. Therefore, according to this holding device, it is possible to further effectively improve the controllability of the temperature distribution on the first surface.

(8) In the holding device, a portion of the heater line portion of the heater electrode that overlaps the terminal hole when viewed in the first direction is compared with a portion of the heater line portion that does not overlap the terminal hole. It is good also as a structure with a wide width. In this holding device, it is possible to suppress the amount of heat generated by the heater electrode arranged in the portion of the segment that overlaps the terminal hole when viewed in the first direction. The occurrence can be suppressed. Therefore, according to this holding device, it is possible to further effectively improve the controllability of the temperature distribution on the first surface.

(9) In the above holding device, when viewed in the first direction, the terminal hole overlaps one of the segments, and the terminal hole overlaps the other segment aligned radially with the one segment. The configuration may be characterized in that the coolant channel is positioned between them. In this holding device, the portion sandwiched between the two terminal holes in the base member can be effectively cooled, and the occurrence of a high temperature singular point caused by the existence of the terminal holes can be effectively suppressed. can be done. Therefore, according to this holding device, it is possible to further effectively improve the controllability of the temperature distribution on the first surface.

It should be noted that the technology disclosed in this specification can be implemented in various forms, for example, in the form of a holding device, an electrostatic chuck, a vacuum chuck, manufacturing methods thereof, and the like. be.

1 is a perspective view schematically showing an external configuration of an electrostatic chuck 100 according to this embodiment; FIG. It is an explanatory view showing roughly the XZ section composition of electrostatic chuck 100 in this embodiment. It is an explanatory view showing roughly the XY plane (upper surface) composition of electrostatic chuck 100 in this embodiment. 4 is an explanatory diagram schematically showing a heater electrode layer 50 and a configuration for power supply to the heater electrode layer 50. FIG. FIG. 3 is an explanatory diagram showing an enlarged XY cross-sectional configuration of a portion of the plate member 10; 6 is an explanatory diagram schematically showing a thermistor 600 and a configuration for supplying power to the thermistor 600; FIG.

A. This embodiment:
A-1. Configuration of electrostatic chuck 100:
FIG. 1 is a perspective view schematically showing the external configuration of an electrostatic chuck 100 according to the present embodiment, and FIG. 2 is an explanatory view schematically showing the XZ cross-sectional configuration of the electrostatic chuck 100 according to the present embodiment. 3 is an explanatory view schematically showing the XY plane (upper surface) configuration of the electrostatic chuck 100 in this embodiment. Each figure shows mutually orthogonal XYZ axes for specifying directions. In this specification, for the sake of convenience, the positive direction of the Z-axis is referred to as the upward direction, and the negative direction of the Z-axis is referred to as the downward direction. may be

The electrostatic chuck 100 is a device that attracts and holds an object (for example, a wafer W) by electrostatic attraction, and is used, for example, to fix the wafer W within a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 100 includes a plate-like member 10 and a base member 20 arranged side by side in a predetermined arrangement direction (vertical direction (Z-axis direction) in this embodiment). The plate-like member 10 and the base member 20 are arranged so that the lower surface S2 (see FIG. 2) of the plate-like member 10 and the upper surface S3 of the base member 20 face each other in the arrangement direction with a joint portion 30 to be described later interposed therebetween. be done. That is, the base member 20 is arranged such that the upper surface S3 of the base member 20 is located on the lower surface S2 side of the plate-shaped member 10 . The lower surface S2 of the plate member 10 corresponds to the second surface in the claims, and the upper surface S3 of the base member 20 corresponds to the third surface in the claims.

The plate-like member 10 is a substantially circular plate-like member when viewed in the Z-axis direction, and is made of, for example, ceramics (for example, alumina, aluminum nitride, or the like). More specifically, the plate-like member 10 is composed of an outer peripheral portion OP, which is a portion having a notch formed on the upper side along the outer periphery, and an inner portion IP located inside the outer peripheral portion OP. The thickness of the inner portion IP (thickness in the Z-axis direction, the same applies hereinafter) of the plate-like member 10 is thicker than the thickness of the outer peripheral portion OP by the notch formed in the outer peripheral portion OP. . That is, the thickness of the plate-like member 10 changes at the position of the boundary between the outer peripheral portion OP and the inner portion IP of the plate-like member 10 .

The diameter of the inner portion IP of the plate member 10 is, for example, about 50 mm to 500 mm (usually about 200 mm to 350 mm), and the diameter of the outer peripheral portion OP of the plate member 10 is, for example, about 60 mm to 510 mm (usually, about 210 mm to 360 mm). ) (where the diameter of the outer peripheral portion OP is larger than the diameter of the inner portion IP). Further, the thickness of the inner portion IP of the plate-like member 10 is, for example, about 1 mm to 10 mm, and the thickness of the outer peripheral portion OP of the plate-like member 10 is, for example, about 0.5 mm to 9.5 mm (however, the outer peripheral portion The thickness of OP is less than the thickness of inner part IP).

Among the upper surfaces S1 of the plate-like member 10, the upper surface (hereinafter also referred to as "attraction surface") S11 at the inner portion IP is a substantially circular surface substantially perpendicular to the Z-axis direction. A continuous wall-shaped protrusion (not shown) is formed near the outer edge of the adsorption surface S11 of the plate-shaped member 10, and the region inside the wall-shaped protrusion of the adsorption surface S11 of the plate-shaped member 10 is formed. is formed with a plurality of independent columnar protrusions (not shown). The wafer W is supported by the wall-shaped protrusions and the plurality of columnar protrusions on the suction surface S11 of the plate member 10 . The attraction surface S11 corresponds to the first surface in the claims, and the Z-axis direction corresponds to the first direction in the claims. Further, in this specification, the direction perpendicular to the Z-axis direction is referred to as the "plane direction", and as shown in FIG. A direction orthogonal to the circumferential direction CD (that is, a direction passing through the center point CP of the attraction surface S11) among the surface directions is referred to as a "radial direction RD".

Of the upper surface S1 of the plate-like member 10, an upper surface S12 at the outer peripheral portion OP (hereinafter also referred to as "peripheral upper surface") is a substantially annular surface that is substantially orthogonal to the Z-axis direction. A jig (not shown) for fixing the electrostatic chuck 100 , for example, is engaged with the outer peripheral upper surface S<b>12 of the plate member 10 .

As shown in FIG. 2, a chuck electrode 40 made of a conductive material (eg, tungsten, molybdenum, platinum, etc.) is arranged inside the plate member 10 . The shape of the chuck electrode 40 as viewed in the Z-axis direction is, for example, a substantially circular shape. When a voltage is applied to the chuck electrode 40 from a chucking power source (not shown), an electrostatic attraction is generated, and the wafer W is attracted and fixed to the attraction surface S11 of the plate member 10 by this electrostatic attraction.

Further, inside the plate member 10, a heater electrode layer 50 and a heater driver 51 for supplying power to the heater electrode layer 50 are formed of a conductive material (for example, tungsten, molybdenum, platinum, etc.). and various vias 53 and 54 are arranged. In this embodiment, the heater electrode layer 50 is arranged below the chuck electrode 40 , and the heater driver 51 is arranged below the heater electrode layer 50 . These configurations will be described in detail later.

The base member 20 is, for example, a substantially circular planar plate-like member having the same diameter as the outer peripheral portion OP of the plate-like member 10 or having a larger diameter than the outer peripheral portion OP of the plate-like member 10. etc.). The diameter of the base member 20 is, for example, approximately 220 mm to 550 mm (usually 220 mm to 350 mm), and the thickness of the base member 20 is, for example, approximately 20 mm to 40 mm. The lower surface S4 of the base member 20 corresponds to the fourth surface in the claims.

The base member 20 is joined to the plate member 10 by a joining portion 30 arranged between the lower surface S2 of the plate member 10 and the upper surface S3 of the base member 20. As shown in FIG. The joint portion 30 is made of an adhesive such as silicone resin, acrylic resin, or epoxy resin. The thickness of the joint portion 30 is, for example, about 0.1 mm to 1 mm.

A coolant channel 21 is formed inside the base member 20 . When a coolant (for example, a fluorine-based inert liquid, water, or the like) is caused to flow through the coolant channel 21 , the base member 20 is cooled, and heat is transferred between the base member 20 and the plate-like member 10 via the joint portion 30 . The plate-like member 10 is cooled by (thermal drawing), and the wafer W held on the adsorption surface S11 of the plate-like member 10 is cooled. Thereby, control of the temperature distribution of the wafer W is realized.

A-2. Heater electrode layer 50 and configuration for power supply to heater electrode layer 50:
Next, the configuration of the heater electrode layer 50 and the configuration for power supply to the heater electrode layer 50 will be described in detail. As described above, the plate-shaped member 10 is provided with the heater electrode layer 50 , the heater driver 51 for supplying power to the heater electrode layer 50 , and various vias 53 and 54 . Further, the electrostatic chuck 100 is provided with other components (such as a heater power supply terminal 72 accommodated in a heater terminal hole Ht1 described later) for supplying power to the heater electrode layer 50 . FIG. 4 is an explanatory view schematically showing the heater electrode layer 50 and the configuration for power supply to the heater electrode layer 50. As shown in FIG. The upper part of FIG. 4 schematically shows the YZ cross-sectional structure of a part of the heater electrode layer 50 arranged on the plate member 10, and the middle part of FIG. The XY plane configuration of part of the heater driver 51 is schematically shown, and the YZ cross-sectional configuration of another configuration for power supply to the heater electrode layer 50 is schematically shown in the lower part of FIG. ing. 5 is an explanatory view showing an enlarged XY cross-sectional configuration of a portion of the plate member 10. As shown in FIG. FIG. 5 shows the XY cross-sectional configuration of a portion of the plate member 10 (X1 portion in FIG. 3) at the position VV in FIG.

Here, as shown in FIG. 3, in the electrostatic chuck 100 of the present embodiment, segments SE ( 3) is set. More specifically, as viewed in the Z-axis direction, the inner portion IP of the plate-like member 10 is divided into a plurality by a plurality of concentric first dividing lines DL1 extending in the circumferential direction CD about the center point CP of the attracting surface S11. (However, only the portion containing the center point CP is a circular portion), and each annular portion is arranged in the circumferential direction CD by a plurality of second dividing lines DL2 extending in the radial direction RD. It is divided into segments SE, which are virtual parts. The upper part of FIG. 4 shows, as an example, three segments SE set on the plate member 10 .

As shown in the upper part of FIG. 4 , the heater electrode layer 50 includes multiple heater electrodes 500 . Each of the plurality of heater electrodes 500 included in the heater electrode layer 50 is arranged in one of the plurality of segments SE set on the plate member 10 . That is, in the electrostatic chuck 100 of this embodiment, one heater electrode 500 is arranged for each of the plurality of segments SE. In other words, in the plate member 10, the portion where one heater electrode 500 is arranged (the portion mainly heated by the heater electrode 500) becomes one segment SE.

As shown in FIG. 5, each heater electrode 500 has a heater line portion 502, which is a linear resistance heating element as viewed in the Z-axis direction, and heater pad portions 504 connected to both ends of the heater line portion 502. . In this embodiment, the heater line portion 502 is shaped so as to pass through each position in the segment SE as evenly as possible when viewed in the Z-axis direction.

As described above, in the electrostatic chuck 100 of the present embodiment, one heater electrode 500 is arranged for each of the plurality of segments SE. It refers to a unit of controllable heater electrodes 500 and is not necessarily limited to a single heater electrode 500 . For example, a plurality of heater electrodes 500 that are commonly controlled may be arranged in one segment SE. Further, it is assumed that the heater line portion 502 of the heater electrode 500 arranged in one segment SE is configured such that portions of a plurality of layers of the heater line portion 502 having different positions in the Z-axis direction are connected in series. good too.

Further, as shown in the middle part of FIG. 4 , the heater driver 51 arranged on the plate member 10 has a plurality of conductive line portions 510 . For each of the plurality of heater electrodes 500, one end of the heater electrode 500 is electrically connected to one conductive line portion 510 of the heater driver 51 through the via 53, and the other end of the heater electrode 500 is , is electrically connected to another conductive line portion 510 of the heater driver 51 through the via 53 . One end of each heater electrode 500 may be electrically connected to the same conductive line portion 510 as in the example shown in FIG.

2 and 4, the electrostatic chuck 100 is formed with a plurality of heater terminal holes Ht1. As shown in FIG. 4, each heater terminal hole Ht1 includes a through hole 22 penetrating through the base member 20 from the upper surface S3 to the lower surface S4, a through hole 32 penetrating the joint portion 30 in the vertical direction, and the plate member 10. The heater terminal concave portion 12 formed on the lower surface S2 side of is an integrated hole formed by communicating with each other. The cross-sectional shape orthogonal to the extending direction of the heater terminal hole Ht1 can be arbitrarily set, and may be, for example, a circle, a square, a fan shape, or the like. At positions corresponding to the heater terminal holes Ht1 on the lower surface S2 of the plate member 10 (positions overlapping the heater terminal holes Ht1 in the Z-axis direction), one or more heaters made of a conductive material are provided. A power supply pad 70 is formed. Each heater power supply pad 70 is electrically connected to the conductive line portion 510 of the heater driver 51 through the via 54 . The through hole 22 formed in the base member 20 corresponds to the first through hole in the claims, and the through hole 32 formed in the joint portion 30 corresponds to the second through hole in the claims. The heater terminal hole Ht1 corresponds to the terminal hole in the claims.

One or a plurality of heater power supply terminals 72 made of a conductive material are accommodated in each heater terminal hole Ht1. Each heater power supply terminal 72 is joined to the heater power supply pad 70 by, for example, brazing. In each heater terminal hole Ht1, each heater power supply terminal 72 is electrically connected via a heater connector 90 to a heater wiring 80 connected to a heater power source (not shown). . The heater power supply terminal 72 corresponds to the power supply terminal in the claims.

In such a configuration, each heater electrode 500 is connected in parallel with the heater power supply. A voltage is applied from the heater power supply to the heater electrode 500 through the heater wiring 80, the heater connector 90, the heater power supply terminal 72, the heater power supply pad 70, the via 54, the conductive line portion 510 of the heater driver 51, and the via 53. is applied, the heater electrode 500 generates heat. As a result, the segment SE in which the heater electrode 500 is arranged is heated, and the temperature distribution of the attraction surface S11 of the plate member 10 is controlled (and the temperature distribution of the wafer W held on the attraction surface S11 of the plate member 10 is controlled). control) is realized. In this embodiment, since the heater electrodes 500 are connected in parallel to the heater power source, the amount of heat generated by the heater electrodes 500 can be controlled for each heater electrode 500 (that is, for each segment SE). , and control of the temperature distribution of the attracting surface S11 of the plate-like member 10 in segment SE units (that is, temperature distribution control in finer units) can be realized.

A-3. Configuration for thermistor 600 and power supply to thermistor 600:
As shown in FIG. 2, the electrostatic chuck 100 of the present embodiment includes a thermistor 600 and a configuration for supplying power to the thermistor 600 (for example, a thermistor driver 61). FIG. 6 is an explanatory diagram schematically showing the thermistor 600 and the configuration for supplying power to the thermistor 600. As shown in FIG. The upper part of FIG. 6 schematically shows the YZ cross-sectional structure of a part of the heater electrode layer 50 arranged on the plate-like member 10, similarly to the upper part of FIG. 4, and the middle part of FIG. The XY plane configuration of a part of the thermistor driver 61 arranged on the plate member 10 is schematically shown, and the lower part of FIG. A YZ cross-sectional configuration of the configuration is shown schematically.

As shown in FIGS. 2 and 6, in the electrostatic chuck 100 of the present embodiment, a plurality of thermistor recesses 14 are formed in the lower surface S2 of the plate member 10, and each thermistor recess 14 has one thermistor. 600 are arranged. 2 and 6, only one of the plurality of thermistor recesses 14 and thermistor 600 is shown. The thermistor 600 is made of a conductive material (for example, tungsten, molybdenum, platinum, etc.) whose resistance value changes as the temperature changes, and the temperature can be measured based on the resistance value. The thermistor 600 is joined by soldering, for example, to a pair of thermistor electrodes 604 arranged on the bottom surface of the thermistor recess 14 . The inside of each thermistor concave portion 14 may be filled with a filler made of resin adhesive (for example, epoxy resin or silicone resin) or ceramics (for example, alumina). The thermistor 600 corresponds to the temperature detection element in the claims.

In addition, as shown in the middle part of FIG. 6, the thermistor driver 61 arranged on the plate member 10 has a plurality of conductive line portions 610 . For each of the plurality of thermistors 600, one thermistor electrode 604 connected to the thermistor 600 is electrically connected to one conductive line portion 610 of the thermistor driver 61 through the via 63, and the thermistor The other thermistor electrode 604 connected to 600 is electrically connected to another conductive line portion 610 of the thermistor driver 61 through via 63 . One thermistor electrode 604 connected to each thermistor 600 may be electrically connected to the same conductive line portion 610 .

2 and 6, the electrostatic chuck 100 is formed with a plurality of thermistor terminal holes Ht2. 2 and 6 show only one of the plurality of thermistor terminal holes Ht2. As shown in FIG. 6, each thermistor terminal hole Ht2 includes a through hole 23 penetrating the base member 20 from the upper surface S3 to the lower surface S4, a through hole 33 penetrating the joint portion 30 in the vertical direction, and the plate member 10. The thermistor terminal concave portion 13 formed on the lower surface S2 side of is an integral hole formed by communicating with each other. The cross-sectional shape orthogonal to the extending direction of the thermistor terminal hole Ht2 can be arbitrarily set, and is, for example, circular or rectangular. In this embodiment, each thermistor terminal hole Ht2 is formed at a position overlapping the outer peripheral portion OP of the plate member 10 when viewed in the Z-axis direction. One or a plurality of thermistors made of a conductive material are provided at positions corresponding to the thermistor terminal holes Ht2 on the lower surface S2 of the plate member 10 (positions overlapping the thermistor terminal holes Ht2 in the Z-axis direction). A power supply pad 170 is formed. Each thermistor power supply pad 170 is electrically connected to the conductive line portion 610 of the thermistor driver 61 via the via 64 .

Each thermistor terminal hole Ht2 accommodates one or a plurality of thermistor power supply terminals 172 made of a conductive material. Each thermistor power supply terminal 172 is joined to the thermistor power supply pad 170 by, for example, brazing. Further, in each thermistor terminal hole Ht2, each thermistor power supply terminal 172 is electrically connected via a thermistor connector 190 to a thermistor wiring 180 connected to a thermistor power source (not shown). .

In such a configuration, each thermistor 600 is connected in parallel with the thermistor power supply. From the thermistor power supply through thermistor wiring 180, thermistor connector 190, thermistor power supply terminal 172, thermistor power supply pad 170, via 64, conductive line portion 610 of thermistor driver 61, via 63, and thermistor electrode 604, When voltage is applied to thermistor 600 , current flows through thermistor 600 . The electrostatic chuck 100 has a configuration (for example, a voltmeter and an ammeter (both not shown)) for measuring the voltage applied to each thermistor 600 and the current flowing through each thermistor 600. The temperature of each thermistor 600, that is, the temperature of the portion of the plate-shaped member 10 where each thermistor 600 is arranged, is individually measured in real time from the resistance value of each thermistor 600 based on the measured values of the voltage and current of the thermistor 600. be able to. Therefore, in the electrostatic chuck 100 of the present embodiment, the temperature of each portion of the plate-like member 10 can be accurately controlled by individually controlling the voltage applied to each heater electrode 500 based on the temperature measurement result. It is possible to improve the controllability of the temperature distribution of the attraction surface S11 of the plate member 10 (and the controllability of the temperature distribution of the wafer W held on the attraction surface S11 of the plate member 10).

A-4. Arrangement of heater terminal hole Ht1 and thermistor 600:
Next, the arrangement of the heater terminal hole Ht1 and the thermistor 600 in the electrostatic chuck 100 of this embodiment will be described in more detail. In FIG. 5, in addition to the heater electrode 500 arranged in each segment SE of the plate member 10, the positions of the heater terminal hole Ht1 and the thermistor 600 (thermistor concave portion 14) in the Z-axis direction are indicated by dashed lines. It is shown. Although the heater terminal hole Ht1 and the thermistor 600 are shown circular in FIG. 5 for convenience, the actual shapes of the heater terminal hole Ht1 and the thermistor 600 are not limited to circular. As shown in FIG. 5, in the electrostatic chuck 100 of the present embodiment, not all the segments SE overlap the heater terminal holes Ht1 and the thermistor 600 when viewed in the Z-axis direction. There are also segments SE that do not overlap the terminal hole Ht1 and/or the thermistor 600. FIG. In addition, in FIG. 5, the positions of the coolant flow paths 21 as viewed in the Z-axis direction are indicated by thick broken lines. Further, FIG. 5 shows an imaginary straight line extending in the radial direction RD passing through the center point CP (see FIG. 3) of the attracting surface S11 for each segment SE and bisecting the segment SE in the circumferential direction CD. A virtual center line CL, and a first virtual circumference VC1 and a second virtual circumference VC2, which are virtual circumferences centered on the center point CP of the attraction surface S11, are shown.

As shown in FIG. 5, in the electrostatic chuck 100 of the present embodiment, the heater terminal hole Ht1 that overlaps with one segment SE as viewed in the Z-axis direction overlaps with the imaginary center line CL of the one segment SE. . As described above, the virtual center line CL of one segment SE is a virtual straight line that bisects the one segment SE in the circumferential direction CD. Therefore, in the electrostatic chuck 100 of the present embodiment, the heater terminal hole Ht1 is arranged at a position relatively distant from the boundary between one segment SE and another segment SE aligned in the circumferential direction CD as viewed in the Z-axis direction. It can be said that Note that, in the electrostatic chuck 100 of the present embodiment, the center point P1 of the heater terminal hole Ht1 that overlaps with one segment SE as viewed in the Z-axis direction overlaps with the imaginary center line CL of the one segment SE.

In addition, in the electrostatic chuck 100 of the present embodiment, the heater terminal hole Ht1 overlapping one segment SE as viewed in the Z-axis direction corresponds to the heater terminal hole Ht1 of the heater electrode 500 arranged in the one segment SE in the radial direction RD. It is spaced apart from the boundary of the one segment SE as compared to a portion of the line portion 502 . For example, of the nine segments SE shown in FIG. 5, focusing on the upper center segment SE (first segment SE1), the heater terminal hole Ht1 overlapping the first segment SE1 in the radial direction RD. Two heater line portions 502 are arranged between the upper boundary of the first segment SE1. The same is true for other segments SE.

In addition, in the electrostatic chuck 100 of the present embodiment, two (or more) segments that overlap each of the two (or more) segments SE that are aligned in the circumferential direction CD among the plurality of segments SE when viewed in the Z-axis direction. ) overlaps the first imaginary circumference VC1. As described above, the first virtual circumference VC1 is a virtual circumference around the center point CP of the attraction surface S11. Therefore, in the electrostatic chuck 100 of the present embodiment, the positions in the radial direction RD of the two (or more) heater terminal holes Ht1 overlapping the two (or more) segments SE arranged in the circumferential direction CD are said to be close to each other. Note that, in the electrostatic chuck 100 of the present embodiment, two (or more) heater terminal holes Ht1 overlap with each of the two (or more) segments SE arranged in the circumferential direction CD as viewed in the Z-axis direction. center point P1 overlaps the first virtual circumference VC1.

In addition, in the electrostatic chuck 100 of the present embodiment, the thermistor 600 that overlaps one segment SE as viewed in the Z-axis direction overlaps the imaginary center line CL of the one segment SE. As described above, the virtual center line CL of one segment SE is a virtual straight line that bisects the one segment SE in the circumferential direction CD. Therefore, in the electrostatic chuck 100 of the present embodiment, the thermistor 600 is arranged at a position relatively distant from the boundary between one segment SE and another segment SE aligned in the circumferential direction CD as viewed in the Z-axis direction. I can say. In the electrostatic chuck 100 of the present embodiment, the center point P2 of the thermistor 600 that overlaps one segment SE overlaps the imaginary center line CL of the one segment SE when viewed in the Z-axis direction.

In addition, in the electrostatic chuck 100 of the present embodiment, two (or more) segments that overlap each of the two (or more) segments SE that are aligned in the circumferential direction CD among the plurality of segments SE when viewed in the Z-axis direction. ) overlaps the second virtual circumference VC2. As described above, the second virtual circumference VC2 is a virtual circumference around the center point CP of the attraction surface S11. Therefore, in the electrostatic chuck 100 of the present embodiment, the positions in the radial direction RD of the two (or more) thermistors 600 overlapping each of the two (or more) segments SE arranged in the circumferential direction CD can be said to be close. Note that in the electrostatic chuck 100 of the present embodiment, the center points of the two (or more) thermistors 600 that overlap each of the two (or more) segments SE that are aligned in the circumferential direction CD when viewed in the Z-axis direction P2 overlaps the second virtual circle VC2.

In the electrostatic chuck 100 of the present embodiment, one segment SE (segment SE overlapping both the heater terminal hole Ht1 and the thermistor 600 when viewed in the Z-axis direction) is arranged in the radial direction RD when viewed in the Z-axis direction. The center point P1 of the heater terminal hole Ht1 that overlaps with the one segment SE when the first portion R1, the second portion R2, and the third portion R3 arranged in order along the line is virtually divided into three equal parts. A center point P2 of the thermistor 600 located in the first portion R1 and overlapping the one segment SE is located in the third portion R3. For example, of the nine segments SE shown in FIG. 5, focusing on the lower center segment SE (second segment SE2), the center point P1 of the heater terminal hole Ht1 that overlaps with the second segment SE2 is the second segment SE2. The center point P2 of the thermistor 600, which is located in the portion R1 of 1 and overlaps the second segment SE2, is located in the third portion R3. The same applies to other segments SE that overlap both the heater terminal hole Ht1 and the thermistor 600 when viewed in the Z-axis direction. That is, in the electrostatic chuck 100 of the present embodiment, the heater terminal hole Ht1 and the thermistor 600 are arranged relatively apart in the radial direction RD.

Further, in the electrostatic chuck 100 of the present embodiment, the heater electrode 500 does not overlap the heater terminal hole Ht1 in a certain segment SE (eg, the first segment SE1) as viewed in the Z-axis direction.

Further, in the electrostatic chuck 100 of the present embodiment, in a certain segment SE (for example, the second segment SE2), as viewed in the Z-axis direction, the portion overlapping the heater terminal hole Ht1 in the heater line portion 502 of the heater electrode 500 is The width W1 is wider than the width W0 of the portion of the heater line portion 502 that does not overlap with the heater terminal hole Ht1.

Further, in the electrostatic chuck 100 of the present embodiment, when viewed in the Z-axis direction, the heater terminal holes Ht1 overlapping one segment SE (for example, the first segment SE1) and the heater terminal holes Ht1 aligned with the one segment in the radial direction RD. A coolant channel 21 is positioned between the heater terminal hole Ht1 overlapping another segment SE (for example, the second segment SE2). Note that one segment and another segment SE are aligned in the radial direction RD may be a state in which the one segment and the other segment SE are adjacent to each other in the radial direction RD. and the other segment SE may be in a state in which one or a plurality of segments SE intervene.

A-5. Manufacturing method of electrostatic chuck 100:
A method for manufacturing the electrostatic chuck 100 of the present embodiment is, for example, as follows. First, a plurality of ceramic green sheets are produced, and predetermined ceramic green sheets are processed in a predetermined manner. The predetermined processing includes, for example, printing of metallization paste for forming the heater electrode layer 50, heater driver 51, heater power supply pad 70, thermistor driver 61, thermistor power supply pad 170, thermistor electrode 604, etc. Drilling for forming various vias 53, 54, 63, 64, filling of metallizing paste, and the like are included. By stacking these ceramic green sheets, thermocompression bonding, and processing such as cutting, a laminate of ceramic green sheets is produced. The plate-like member 10 is manufactured by firing the manufactured laminate of the ceramic green sheets and finishing the precise shape by polishing.

Next, the heater power supply terminal 72 and the thermistor power supply terminal 172 are respectively joined to the heater power supply pad 70 and the thermistor power supply pad 170 formed on the plate member 10 by, for example, brazing. Next, the thermistor 600 is joined to the thermistor electrode 604 formed in the thermistor concave portion 14 of the plate member 10 by soldering, for example. Next, the plate-like member 10 and the base member 20 are joined using, for example, a sheet-like joining portion 30, and filled with a filler. The electrostatic chuck 100 of the present embodiment is manufactured mainly through the above steps.

A-6. Effect of this embodiment:
As described above, the electrostatic chuck 100 of this embodiment includes the plate member 10, the base member 20, and the joint portion 30. As shown in FIG. The plate-shaped member 10 is a member having a substantially circular attracting surface S11 substantially orthogonal to the Z-axis direction and a lower surface S2 opposite to the attracting surface S11. A plurality of segments SE are set on the plate member 10 . The plurality of segments SE are arranged at least a portion (for example, the inner portion IP) of the plate member 10 as a plurality of concentric circles extending in the circumferential direction CD around the center point CP of the attraction surface S11 as viewed in the Z-axis direction. It is set by virtually dividing it into a plurality of annular portions by the division line DL1, and further, by virtually dividing each annular portion into a plurality of portions arranged in the circumferential direction CD. A heater electrode 500 having a heater line portion 502 composed of a resistance heating element is arranged in each of the plurality of segments SE. The base member 20 is a member having an upper surface S3 and a lower surface S4 opposite to the upper surface S3. A coolant channel 21 is formed inside the base member 20 . Further, the base member 20 is formed with a plurality of through holes 22 penetrating from the upper surface S3 to the lower surface S4. The joining portion 30 is arranged between the lower surface S2 of the plate member 10 and the upper surface S3 of the base member 20 to join the plate member 10 and the base member 20 together. The joint portion 30 is formed with a plurality of through holes 32 that communicate with the plurality of through holes 22 formed in the base member 20 to constitute the heater terminal holes Ht1. A heater power supply terminal 72 electrically connected to the heater electrode 500 is arranged in each heater terminal hole Ht1.

In addition, in the electrostatic chuck 100 of the present embodiment, the heater terminal hole Ht1 overlapping one segment SE as viewed in the Z-axis direction overlaps the virtual center line CL of the one segment SE. The virtual center line CL of one segment SE is a virtual straight line that extends in the radial direction RD passing through the center point CP of the attraction surface S11 and bisects the one segment SE in the circumferential direction CD. That is, in the electrostatic chuck 100 of the present embodiment, the heater terminal hole Ht1 is positioned relatively away from the boundary between one segment SE and another segment SE aligned in the circumferential direction CD as viewed in the Z-axis direction. It can be said that they are arranged.

Here, the coolant channel 21 cannot be arranged in the portion of the base member 20 where the through hole 22 forming the heater terminal hole Ht1 is formed. Therefore, the portion of the plate-like member 10 that overlaps with the heater terminal hole Ht1 as viewed in the Z-axis direction has a cooling effect due to the coolant supply to the coolant flow path 21 formed in the base member 20 compared to other portions. is difficult to reach, and tends to become a high-temperature temperature singularity. Also, the temperature near the boundary (including the boundary) of one segment SE in the plate member 10 is susceptible to the temperature of other adjacent segments SE.

However, as described above, in the electrostatic chuck 100 of the present embodiment, when viewed in the Z-axis direction, the heater terminal hole Ht1 in one segment SE is compared from the boundary with other segments SE aligned in the circumferential direction CD. It is arranged at a position away from the target, that is, at a position that is not easily affected by the temperature of other adjacent segments SE. Therefore, in the electrostatic chuck 100 of the present embodiment, by controlling the amount of heat generated by the heater electrode 500 arranged in one segment SE, the heater terminal hole Ht1 overlapping the one segment SE in the Z-axis direction is It is possible to suppress the occurrence of a high temperature singularity due to its existence. Therefore, according to the electrostatic chuck 100 of the present embodiment, the controllability of the temperature distribution of the attraction surface S11 caused by the presence of the heater terminal hole Ht1 (and the controllability of the temperature distribution of the object held on the attraction surface S11) is improved. It is possible to suppress the deterioration of High controllability of the temperature distribution of the attraction surface S11 of the plate member 10 means that the temperature distribution of the entire attraction surface S11 is nearly uniform and that the temperature distribution of the attraction surface S11 is nearly uniform for each segment SE. and at least one meaning of

In addition, in the electrostatic chuck 100 of the present embodiment, the center point P1 of the heater terminal hole Ht1 that overlaps with one segment SE as viewed in the Z-axis direction overlaps with the imaginary center line CL of the one segment SE. , the heater terminal hole Ht1 can be arranged at a position that is hardly affected by the temperature of the other adjacent segment SE, and the above effect can be further enhanced.

In addition, in the electrostatic chuck 100 of the present embodiment, the heater terminal hole Ht1 overlapping one segment SE as viewed in the Z-axis direction corresponds to the heater terminal hole Ht1 of the heater electrode 500 arranged in the one segment SE in the radial direction RD. It is spaced apart from the boundary of the one segment SE as compared to a portion of the line portion 502 . Therefore, in the electrostatic chuck 100 of the present embodiment, as viewed in the Z-axis direction, the portion between the boundary of one segment SE and the heater terminal hole Ht1 is heated by the heat generated by the heater line portion 502 located in this portion. can do. As a result, in the electrostatic chuck 100 of the present embodiment, by controlling the amount of heat generated by the heater electrode 500 arranged in one segment SE, the heater terminal hole Ht1 overlapping the one segment SE in the Z-axis direction view. It is possible to effectively suppress the occurrence of a high-temperature temperature singularity due to the existence of Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to effectively suppress deterioration in the controllability of the temperature distribution of the attraction surface S11.

In addition, in the electrostatic chuck 100 of the present embodiment, two (or more) segments that overlap each of the two (or more) segments SE that are aligned in the circumferential direction CD among the plurality of segments SE when viewed in the Z-axis direction. ) overlaps the first imaginary circumference VC1. The first virtual circumference VC1 is a virtual circumference around the center point CP of the attraction surface S11. That is, in the electrostatic chuck 100 of the present embodiment, the positions in the radial direction RD of the two (or more) heater terminal holes Ht1 overlapping the two (or more) segments SE arranged in the circumferential direction CD are said to be close to each other. Therefore, in the electrostatic chuck 100 of the present embodiment, in the two (or more) segments SE arranged in the circumferential direction CD, the occurrence of a high temperature singular point due to the presence of the heater terminal hole Ht1 is suppressed. The shape design of the heater line portion 502 can be made common, and as a result, it is possible to realize a good shape of the heater line portion 502 that effectively suppresses the occurrence of a high-temperature temperature singular point. Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to effectively suppress deterioration in the controllability of the temperature distribution of the attraction surface S11.

Note that in the electrostatic chuck 100 of the present embodiment, two (or more) segments SE that overlap each of the two (or more) segments SE that are aligned in the circumferential direction CD when viewed in the Z-axis direction ( or more) overlaps the first imaginary circumference VC1, the positions of the heater terminal holes Ht1 in the radial direction RD can be made very close to each other, The above effects can be further enhanced.

The electrostatic chuck 100 of the present embodiment further includes thermistors 600 arranged in each of the plurality of thermistor concave portions 14 formed in the lower surface S<b>2 of the plate member 10 . In addition, in the electrostatic chuck 100 of the present embodiment, the thermistor 600 that overlaps one segment SE as viewed in the Z-axis direction overlaps the imaginary center line CL of the one segment SE. That is, in the electrostatic chuck 100 of the present embodiment, the thermistor 600 is positioned relatively away from the boundary between the other segments SE arranged in the circumferential direction CD in one segment SE as viewed in the Z-axis direction. It can be said that it is arranged at a position that is not easily affected by the temperature of the other segment SE. Therefore, in the electrostatic chuck 100 of the present embodiment, the temperature detection result by the thermistor 600 that overlaps one segment SE when viewed in the Z-axis direction does not influence the temperature of the one segment SE and the other segments SE arranged in the circumferential direction CD. You can restrain yourself from receiving it. Accordingly, in the electrostatic chuck 100 of the present embodiment, the temperature distribution of the segment SE is controlled by controlling the amount of heat generated by the heater electrode 500 arranged in the segment SE based on the result of temperature detection by the thermistor 600. can effectively improve sexuality. Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to effectively suppress deterioration in the controllability of the temperature distribution of the attraction surface S11.

In the electrostatic chuck 100 of the present embodiment, since the center point P2 of the thermistor 600 that overlaps with one segment SE as viewed in the Z-axis direction overlaps with the imaginary center line CL of the one segment SE, the thermistor 600 can be placed in a position that is very unlikely to be affected by the temperature of other adjacent segments SE, further enhancing the above effect.

In addition, in the electrostatic chuck 100 of the present embodiment, two (or more) segments that overlap each of the two (or more) segments SE that are aligned in the circumferential direction CD among the plurality of segments SE when viewed in the Z-axis direction. ) overlaps the second virtual circumference VC2. The second virtual circumference VC2 is a virtual circumference around the center point CP of the attraction surface S11. That is, in the electrostatic chuck 100 of the present embodiment, the positions in the radial direction RD of the two (or more) thermistors 600 overlapping each of the two (or more) segments SE arranged in the circumferential direction CD can be said to be close. Therefore, in the electrostatic chuck 100 of the present embodiment, the shape design of the heater line portion 502 in consideration of the position of the thermistor 600 can be shared in two (or more) segments SE arranged in the circumferential direction CD. As a result, the controllability of the heater electrode 500 based on the temperature detection result by the thermistor 600 can be improved. Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to more effectively suppress deterioration in the controllability of the temperature distribution of the attraction surface S11.

Note that in the electrostatic chuck 100 of the present embodiment, two (or more) segments SE that overlap each of the two (or more) segments SE that are aligned in the circumferential direction CD when viewed in the Z-axis direction ( or more) of the thermistors 600 overlaps the second virtual circumference VC2, the positions of the thermistors 600 in the radial direction RD can be made very close to each other, and the above effects can be further enhanced. can be done.

In the electrostatic chuck 100 of the present embodiment, one segment SE (segment SE overlapping both the heater terminal hole Ht1 and the thermistor 600 when viewed in the Z-axis direction) is arranged in the radial direction RD when viewed in the Z-axis direction. The center point P1 of the heater terminal hole Ht1 that overlaps with the one segment SE when the first portion R1, the second portion R2, and the third portion R3 arranged in order along the line is virtually divided into three equal parts. A center point P2 of the thermistor 600 located in the first portion R1 and overlapping the one segment SE is located in the third portion R3. That is, in the electrostatic chuck 100 of the present embodiment, the heater terminal hole Ht1 and the thermistor 600 are arranged relatively apart in the radial direction RD. Therefore, in the electrostatic chuck 100 of the present embodiment, the accuracy of temperature detection by the thermistor 600 is lowered due to the presence of the heater terminal hole Ht1, and the thermistor 600 located near the heater terminal hole Ht1 is accommodated. Due to the presence of the thermistor concave portion 14, even if the amount of heat generated by the heater electrode 500 is controlled, the occurrence of a high-temperature temperature singular point can be suppressed. Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to further effectively improve the controllability of the temperature distribution of the attraction surface S11.

In addition, in the electrostatic chuck 100 of the present embodiment, the heater electrode 500 does not overlap the heater terminal hole Ht1 in a certain segment SE as viewed in the Z-axis direction. Therefore, in the electrostatic chuck 100 of the present embodiment, the amount of heat generated in the portion of the segment SE that overlaps the heater terminal hole Ht1 as viewed in the Z-axis direction can be suppressed. temperature singularity can be suppressed. Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to further effectively improve the controllability of the temperature distribution of the attraction surface S11.

In the electrostatic chuck 100 of the present embodiment, the width W1 of the portion of the heater line portion 502 of the heater electrode 500 that overlaps the heater terminal hole Ht1 in a certain segment SE as viewed in the Z-axis direction is equal to that of the heater line portion 502. is wider than the width W0 of the portion that does not overlap with the heater terminal hole Ht1. Therefore, in the electrostatic chuck 100 of the present embodiment, the amount of heat generated by the heater electrode 500 disposed in the portion of the segment SE that overlaps the heater terminal hole Ht1 when viewed in the Z-axis direction can be suppressed. It is possible to suppress the occurrence of a high-temperature singularity due to the presence of Ht1. Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to further effectively improve the controllability of the temperature distribution of the attraction surface S11.

In addition, in the electrostatic chuck 100 of the present embodiment, the heater terminal hole Ht1 overlapping one segment SE and the heater terminal hole Ht1 overlapping another segment SE aligned with the one segment SE in the Z-axis direction. A coolant channel 21 is located between the hole Ht1. Therefore, in the electrostatic chuck 100 of the present embodiment, the portion sandwiched between the two heater terminal holes Ht1 in the base member 20 can be effectively cooled. It is possible to effectively suppress the occurrence of temperature singularities. Therefore, according to the electrostatic chuck 100 of the present embodiment, it is possible to further effectively improve the controllability of the temperature distribution of the attraction surface S11.

B. Variant:
The technology disclosed in this specification is not limited to the above-described embodiments, and can be modified in various forms without departing from the scope of the invention. For example, the following modifications are possible.

The configuration of the electrostatic chuck 100 in the above embodiment is merely an example, and various modifications are possible. For example, in the above-described embodiment, the plate member 10 is composed of the outer peripheral portion OP, which is a portion in which a notch is formed on the upper side along the outer periphery, and the inner portion IP located inside the outer peripheral portion OP. However, the plate-like member 10 may have no notch and the thickness of the plate-like member 10 in the Z-axis direction may be uniform throughout.

Further, the arrangement of the heater terminal hole Ht1 and the thermistor 600 in the above-described embodiment is merely an example, and various modifications are possible. For example, in the above embodiment, the center point P1 of the heater terminal hole Ht1, which overlaps with one segment SE as viewed in the Z-axis direction, overlaps with the imaginary center line CL of the one segment SE. , a position other than the center point P1 in the heater terminal hole Ht1 may overlap with the imaginary center line CL when viewed in the Z-axis direction. Further, in the above embodiment, the center point P1 of the two (or more) heater terminal holes Ht1 overlapping each of the two (or more) segments SE arranged in the circumferential direction CD as viewed in the Z-axis direction is , overlaps the first imaginary circumference VC1, but instead of this, positions other than the center point P1 of the heater terminal hole Ht1 may overlap the first imaginary circumference VC1. In the above embodiment, the center point P2 of the thermistor 600, which overlaps with one segment SE when viewed in the Z-axis direction, overlaps with the imaginary center line CL of the one segment SE. A position other than the center point P2 of the thermistor 600 may overlap the imaginary center line CL when viewed from the direction. Further, in the above embodiment, the center point P2 of the two (or more) thermistors 600 overlapping each of the two (or more) segments SE arranged in the circumferential direction CD as viewed in the Z-axis direction is the second However, instead of this, positions other than the center point P2 of the thermistor 600 may overlap the second virtual circumference VC2. Further, the arrangement of the heater terminal holes Ht1 and the thermistors 600 in the above embodiment does not necessarily apply to all the heater terminal holes Ht1 and the thermistors 600 provided in the electrostatic chuck 100. At least part of the use hole Ht1 and the thermistor 600 need only correspond.

Further, in the above-described embodiment, regarding the position of the heater driver 51 in the Z-axis direction, the entire heater driver 51 is at the same position (that is, the heater driver 51 has a single-layer structure). Portions of the driver 51 may be in different locations (ie, the heater driver 51 may be multi-layered). In the above-described embodiment, each heater electrode 500 is electrically connected to the heater power supply terminal 72 via the heater driver 51 , but each heater electrode 500 is electrically connected to the heater power supply terminal 72 without the heater driver 51 . It may be electrically connected to terminal 72 . These points also apply to the thermistor driver 61 .

In addition, although the thermistor 600 is used as the temperature detection element in the above embodiment, other temperature detection elements may be used instead of the thermistor 600 . However, if a temperature detection element such as the thermistor 600 that does not need to form a through hole at a position directly below the temperature detection element in the base member 20 is used, the coolant channel 21 can be arranged at that position. Therefore, it is preferable.

Further, the configurations of the heater power supply terminal 72, the heater connector 90, and the heater wiring 80 in the above-described embodiment are merely examples, and various modifications are possible. Similarly, the configurations of the thermistor power supply terminal 172, the thermistor connector 190, and the thermistor wiring 180 in the above-described embodiment are merely examples, and various modifications are possible. Also, the electrostatic chuck 100 does not necessarily have to include the thermistor 600 and a configuration for supplying power to the thermistor 600 .

Also, the manner of setting the segments SE (the number of segments SE, the shape of each segment SE, etc.) in the above embodiment can be modified in various ways. For example, in the above embodiment, the entire inner IP of the electrostatic chuck 100 is virtually divided into a plurality of segments SE, but only a portion of the inner IP of the electrostatic chuck 100 is virtually divided into a plurality of segments SE. may be divided

Further, in the above embodiments, each via may be composed of a single via, or may be composed of a group of multiple vias. In the above embodiments, each via may have a single-layer structure consisting only of a via portion, or may have a multi-layer structure (for example, a structure in which a via portion, a pad portion, and a via portion are laminated). good too.

Further, in the above-described embodiment, a monopolar system in which one chuck electrode 40 is provided inside the plate-like member 10 is adopted. method may be employed.

In addition, the material forming each member (the plate-like member 10, the base member 20, the joint portion 30, the heater electrode 500, the thermistor 600, etc.) of the electrostatic chuck 100 of the above-described embodiment is merely an example, and various changes are possible. . For example, in the above-described embodiment, the electrostatic chuck 100 includes the plate member 10 made of ceramics, but the electrostatic chuck 100 may be made of a material other than ceramics (for example, a resin material). A plate-shaped member may be provided.

Further, the present invention is not limited to the electrostatic chuck 100 that includes the plate-like member 10 and the base member 20 and holds the wafer W using electrostatic attraction. The present invention can also be applied to other holding devices (for example, heater devices such as CVD heaters, vacuum chucks, etc.) that hold an object on the surface of a plate-shaped member.

10: Plate-shaped member 12: Heater terminal recess 13: Thermistor terminal recess 14: Thermistor recess 20: Base member 21: Refrigerant channel 22: Through hole 23: Through hole 30: Joint 32: Through hole 33: Through hole 40: chuck electrode 50: heater electrode layer 51: heater driver 53, 54, 63, 64: via 61: thermistor driver 70: heater power supply pad 72: heater power supply terminal 80: heater wiring 90: heater Connector 100: Electrostatic chuck 170: Thermistor power supply pad 172: Thermistor power supply terminal 180: Thermistor wiring 190: Thermistor connector 500: Heater electrode 502: Heater line section 504: Heater pad section 510: Conductive line section 600: Thermistor 604: Electrode for thermistor 610: Conductive line portion CD: Circumferential direction CL: Imaginary center line CP: Center point DL1: First dividing line DL2: Second dividing line Ht1: Heater terminal hole Ht2: Thermistor terminal hole IP : inner portion OP: outer peripheral portion P1: center point P2: center point R1: first portion R2: second portion R3: third portion RD: radial direction S11: adsorption surface S12: outer peripheral upper surface S1: upper surface S2: Lower surface S3: Upper surface S4: Lower surface SE: Segment VC1: First virtual circumference VC2: Second virtual circumference W: Wafer

Claims (10)

a plate-shaped member having a substantially circular first surface substantially orthogonal to a first direction and a second surface opposite to the first surface;
At least part of the plate-like member is virtually divided into a plurality of annular portions by a plurality of concentric dividing lines extending in a circumferential direction around the center point of the first surface as viewed in the first direction. Further, each of the annular portions is arranged in each of a plurality of segments set by virtually dividing each of the annular portions into a plurality of portions arranged in the circumferential direction, and the heater line portion configured by a resistance heating element and the a heater electrode having a heater pad portion connected to an end portion of the heater line portion;
A base member having a third surface and a fourth surface opposite to the third surface, the third surface being located on the second surface side of the plate member a base member having a coolant channel formed therein and having a plurality of first through-holes penetrating from the third surface to the fourth surface;
A joint portion disposed between the second surface of the plate-like member and the third surface of the base member to join the plate-like member and the base member, wherein the plurality of first a joint portion in which a plurality of second through holes forming terminal holes are formed in communication with each of the through holes;
a power supply terminal disposed in each of the terminal holes and electrically connected to the heater electrode;
A holding device for holding an object on the first surface of the plate member,
When viewed from the first direction, the terminal hole overlapping one of the segments extends in a radial direction passing through the center point of the first surface and bisects the one segment in the circumferential direction. It overlaps with the virtual center line, which is a virtual straight line that
the terminal hole that overlaps with one of the segments when viewed in the first direction does not overlap with the heater pad portion that is arranged on the one segment;
When viewed in the first direction, a portion of the heater line portion of the heater electrode that overlaps the terminal hole is wider than a portion of the heater line portion that does not overlap the terminal hole,
A holding device characterized by: a plate-shaped member having a substantially circular first surface substantially orthogonal to a first direction and a second surface opposite to the first surface;
At least part of the plate-like member is virtually divided into a plurality of annular portions by a plurality of concentric dividing lines extending in a circumferential direction around the center point of the first surface as viewed in the first direction. Further, each of the annular portions is divided into a plurality of virtual portions arranged in the circumferential direction, and a heater line portion is arranged in each of the plurality of segments and configured by a resistance heating element. a heater electrode;
A base member having a third surface and a fourth surface opposite to the third surface, the third surface being located on the second surface side of the plate member a base member having a coolant channel formed therein and having a plurality of first through-holes penetrating from the third surface to the fourth surface;
A joint portion disposed between the second surface of the plate-like member and the third surface of the base member to join the plate-like member and the base member, wherein the plurality of first a joint portion in which a plurality of second through holes forming terminal holes are formed in communication with each of the through holes;
a power supply terminal disposed in each of the terminal holes and electrically connected to the heater electrode;
A holding device for holding an object on the first surface of the plate member,
When viewed from the first direction, the terminal hole overlapping one of the segments extends in a radial direction passing through the center point of the first surface and bisects the one segment in the circumferential direction. It overlaps with the virtual center line, which is a virtual straight line that
When viewed from the first direction, the terminal hole that overlaps with one of the segments does not overlap with the central position of the one segment.
A holding device characterized by: a plate-shaped member having a substantially circular first surface substantially orthogonal to a first direction and a second surface opposite to the first surface;
At least part of the plate-like member is virtually divided into a plurality of annular portions by a plurality of concentric dividing lines extending in a circumferential direction around the center point of the first surface as viewed in the first direction. Further, each of the annular portions is arranged in each of a plurality of segments set by virtually dividing each of the annular portions into a plurality of portions arranged in the circumferential direction, and the heater line portion configured by a resistance heating element and the a heater electrode having a heater pad portion connected to an end portion of the heater line portion;
A base member having a third surface and a fourth surface opposite to the third surface, the third surface being located on the second surface side of the plate member a base member having a coolant channel formed therein and having a plurality of first through-holes penetrating from the third surface to the fourth surface;
A joint portion disposed between the second surface of the plate-like member and the third surface of the base member to join the plate-like member and the base member, wherein the plurality of first a joint portion in which a plurality of second through holes forming terminal holes are formed in communication with each of the through holes;
a power supply terminal disposed in each of the terminal holes and electrically connected to the heater electrode;
A holding device for holding an object on the first surface of the plate member,
When viewed from the first direction, the terminal hole overlapping one of the segments extends in a radial direction passing through the center point of the first surface and bisects the one segment in the circumferential direction. It overlaps with the virtual center line, which is a virtual straight line that
When viewed from the first direction, the terminal hole overlapping one segment
do not overlap with the heater pad portion disposed on the top, and
a temperature sensing element arranged in each of a plurality of recesses formed on the second surface of the plate-shaped member;
When viewed from the first direction, the temperature sensing element that overlaps one of the segments overlaps the imaginary center line of the one segment.
A holding device characterized by: A holding device according to claim 3 , wherein
When viewed from the first direction, the two temperature sensing elements that overlap each of the two segments that are arranged in the circumferential direction among the plurality of segments are located at one point centered on the center point of the first surface. overlaps the virtual circumference of
A holding device characterized by: In the holding device according to claim 3 or claim 4 ,
When viewed from the first direction, the one segment is virtually divided into three equal parts into a first portion, a second portion, and a third portion arranged in order along the radial direction. A center point of the terminal hole that overlaps with the segment is located in the first portion, and a center point of the temperature sensing element that overlaps with the one segment is located in the third portion,
A holding device characterized by: a plate-shaped member having a substantially circular first surface substantially orthogonal to a first direction and a second surface opposite to the first surface;
At least part of the plate-like member is virtually divided into a plurality of annular portions by a plurality of concentric dividing lines extending in a circumferential direction around the center point of the first surface as viewed in the first direction. Further, each of the annular portions is divided into a plurality of virtual portions arranged in the circumferential direction, and a heater line portion is arranged in each of the plurality of segments and configured by a resistance heating element. a heater electrode;
A base member having a third surface and a fourth surface opposite to the third surface, the third surface being located on the second surface side of the plate member a base member having a coolant channel formed therein and having a plurality of first through-holes penetrating from the third surface to the fourth surface;
A joint portion disposed between the second surface of the plate-like member and the third surface of the base member to join the plate-like member and the base member, wherein the plurality of first a joint portion in which a plurality of second through holes forming terminal holes are formed in communication with each of the through holes;
a power supply terminal disposed in each of the terminal holes and electrically connected to the heater electrode;
A holding device for holding an object on the first surface of the plate member,
When viewed from the first direction, the terminal hole overlapping one of the segments extends in a radial direction passing through the center point of the first surface and bisects the one segment in the circumferential direction. It overlaps with the virtual center line, which is a virtual straight line that
moreover,
a temperature sensing element arranged in each of a plurality of recesses formed on the second surface of the plate-shaped member;
When viewed from the first direction, the temperature sensing element that overlaps with one of the segments overlaps with the imaginary center line of the one segment,
When viewed from the first direction, the one segment is virtually divided into three equal parts into a first portion, a second portion, and a third portion arranged in order along the radial direction. A center point of the terminal hole that overlaps with the segment is located in the first portion, and a center point of the temperature sensing element that overlaps with the one segment is located in the third portion,
A holding device characterized by: In a holding device according to any one of claims 1 to 6 ,
When viewed from the first direction, the terminal hole that overlaps with one of the segments is larger than a part of the heater line portion of the heater electrode arranged in the one segment in the radial direction. away from the segment boundaries of
A holding device characterized by: In a holding device according to any one of claims 1 to 7 ,
When viewed from the first direction, the two terminal holes that overlap the two segments that are arranged in the circumferential direction among the plurality of segments are aligned with the center point of the first surface as the center. overlaps the virtual circumference of
A holding device characterized by: In a holding device according to any one of claims 2 to 8 ,
When viewed from the first direction, the heater electrode does not overlap the terminal hole,
A holding device characterized by: In a holding device according to any one of claims 1 to 9,
When viewed in the first direction, between the terminal hole overlapping one segment and the terminal hole overlapping another segment aligned in the radial direction with the one segment, the coolant flow path is located in
A holding device characterized by:

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