JP2008047657A - Electrostatic chuck device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent an occurrence of an excessive bending moment to a chuck side terminal when the chuck side terminal on the back side of an electrostatic chuck is joined to the other side terminal of a processing device side, even though there is a planar displacement between the both terminals. <P>SOLUTION: The chuck side terminal 31 is formed with a base end member 32 joined to the back side 4 of the electrostatic chuck 1a, and a front edge member 36 joined to a front edge 35 of the base substance member 32. Both a plug terminal 32b of the front edge 35 of the base substance member 32 and a socket terminal 37 of the base edge of the front edge member 36 are fit and joined. An elastically deformable metallic intermediary joining member 61 is interposed between the inner periphery surface and the outer circumference surface of the socket termianl 37 and the plug terminal 32b, and the front edge member 36 is joined to the base edge member 32 eccentrically and sideling by the deformation. The front edge member 36 is screwed down to a screw 56 of the inner periphery surface of an insulating member 51 fixed within a through-hole 26 of a base member 21 through a screw 38 of the outer circumference surface of the socket terminal 37. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electrostatic chuck device used for fixing a semiconductor wafer, correcting flatness, or transporting it in an etching apparatus, ion implantation apparatus, electron beam exposure apparatus or the like used in semiconductor manufacturing.

  In a semiconductor manufacturing process, in order to perform processing (processing) such as film formation and dry etching with high accuracy on a semiconductor wafer (for example, a silicon wafer), the processing apparatus maintains the flatness of the semiconductor wafer. It is necessary to fix (hold) it. A typical example of such fixing means is an electrostatic chuck that chucks a semiconductor wafer by electrostatic force (Patent Document 1). For example, in a bipolar electrostatic chuck, a pair of electrodes (electrostatic electrodes) are formed inside a ceramic substrate, and a semiconductor wafer or the like is generated by electrostatic force generated by applying a voltage between the electrodes. A member to be attracted (hereinafter also simply referred to as a wafer) is configured to be attracted and fixed. This electrostatic chuck is usually joined to the surface (upper surface) of a metal base member made of a metal such as aluminum or aluminum alloy via an adhesive means such as silicon resin to constitute an electrostatic chuck device. The semiconductor wafer is attached to a processing apparatus according to the processing purpose of the semiconductor wafer and used for the use.

  An electrostatic chuck constituting such an electrostatic chuck device has a terminal (metallized layer for the chuck terminal) applied to the electrostatic electrode on the back surface, and a resistance heating heater built in the substrate. A plurality of terminals (metallized layers for heater terminals) to be applied to the heater are formed by firing. Each of the terminals (metallized layer) is usually joined by a brazing (or soldering) via a base end portion of a chuck side terminal (feeding terminal) made of one shaft material (pin material). The protrusion is provided on the back surface of the electrostatic chuck (Patent Document 2). Such an electrostatic chuck is joined to a metal base member having a through-hole formed corresponding to the arrangement of the chuck-side terminal to form an electrostatic chuck device, and each chuck-side terminal is placed in the through-hole. Arranged to retain insulation.

  Conventionally, each chuck side terminal is a terminal on the counterpart processing apparatus side provided in the electrostatic chuck apparatus mounting portion on the processing apparatus side when the electrostatic chuck apparatus is attached to each processing apparatus of the semiconductor wafer. It is electrically joined to each (mating terminal). Then, the mutual connection between the chuck-side terminal and the mating terminal on the processing apparatus side has conventionally been such that the tip surface of the chuck-side terminal on the electrostatic chuck apparatus side is the tip surface of the mating terminal on the processing apparatus, The tip surfaces are simply joined by contact or pressure contact in a form in which the end surfaces are pressed in a butting manner. For this reason, the electrical connection is usually a point or contact in a very small area.

However, in such a terminal joint structure using both terminals, a sufficient contact area between the two terminals may not be ensured. For this reason, when a relatively large current is required, such as a heater terminal for applying a voltage to a heater composed of a resistance heating element built in the electrostatic chuck device, the contact resistance is increased, and the reliability of bonding is increased. There was an indication that there were things that could not be obtained. As measures against this, as shown in FIG. 7, the chuck side terminal 31 of the electrostatic chuck device 1 is projected in the through hole of the base member 21, and the mating terminal on the processing device side is used as the socket terminal 131. A terminal joining structure has been adopted in which the contact between both terminals is multifaceted so as to ensure a large contact area so that the side terminal 31 is deeply press-fitted into the socket terminal 131.
JP 2004-6505 A JP 2004-31599 A

  By the way, in the terminal joining structure in which the chuck side terminal on the electrostatic chuck device side is press-fitted into the socket terminal (inside) that forms the mating terminal on the processing device side, the plurality of chuck side terminals on the electrostatic chuck device side are connected. The arrangement and the arrangement of the plurality of socket terminals on the processing apparatus side are required to correspond with high precision on a plane. However, due to the tolerance given to the dimensional accuracy between both terminals, there is a planar mismatch (positional deviation) between the corresponding terminals between the chuck-side terminals and the socket terminals. There are things to do. Further, the chuck-side terminal should be bonded perpendicularly to the back surface (terminal thereof) of the ceramic substrate, but a slight inclination may occur due to an error.

  For this reason, when the electrostatic chuck device is attached to the electrostatic chuck device mounting portion on the processing device side, when the chuck side terminal on the electrostatic chuck device side is press-fitted into the socket terminal on the processing device side, the chuck side terminal is In some cases, it could not be smoothly inserted to the normal depth. That is, when inserting and joining between both terminals, each chuck side terminal is not press-fitted into the center of the socket terminal due to misalignment due to a mismatch in arrangement of the corresponding terminals on the plane. In some cases, a lateral load in a direction different from the press-fitting direction was applied. More specifically, when attaching the electrostatic chuck device to the processing device side mounting portion due to a planar error (center misalignment) between both terminals or the inclination of the chuck side terminal, a plurality of chuck side terminals This is because a lateral force acts on the chuck-side terminal protruding from the back surface of the electrostatic chuck when press-fitting into the corresponding socket terminal. When such a lateral force is applied to the chuck-side terminal, a large bending moment is applied to the base of the chuck-side terminal, and the brazed portion of the base end surface is peeled off from the terminal (metallized layer) on the ceramic substrate. There are problems such as separation in the form of cracks and breakage or cracks in the wax.

  The present invention has been made in view of such problems, and the object thereof is to generate the above problems when the chuck side terminal of the electrostatic chuck apparatus is joined to a counterpart terminal such as a socket terminal on the processing apparatus side. It is an object of the present invention to provide an electrostatic chuck device having a chuck-side terminal that is not caused to occur.

The invention described in claim 1 for solving the above-described problems includes an electrostatic chuck in which an electrostatic electrode is formed on a ceramic substrate, and a metal base member bonded to the back surface of the electrostatic chuck. An electrostatic chuck device comprising a chuck-side terminal formed so as to protrude from the back surface of the electrostatic chuck, with insulation being provided in a through-hole formed in the metal base member In
The chuck-side terminal is formed by a base end member having a base end bonded to the back surface of the electrostatic chuck, and a tip member bonded to the tip of the base end member, and the tip end of the base end member A terminal structure in which either one of the proximal ends of the distal end member is a socket terminal and the other is a plug terminal to fit and join both terminals,
An elastically deformable metal relay joining member is interposed between the inner and outer peripheral surfaces of the socket terminal and the plug terminal, and the distal end member is eccentric and inclined with respect to the base end member by deformation of the metal relay joining member. It is characterized in that at least one of the above is joined.

The invention according to claim 2 is an electrostatic chuck device comprising an electrostatic chuck having an electrostatic electrode formed on a ceramic substrate and a metal base member bonded to the back surface of the electrostatic chuck. A chuck-side terminal projecting from the back surface of the electrostatic chuck is disposed inside an annular insulating member fixed to an inner peripheral surface of a through-hole formed in the metal base member. In what
The chuck side terminal is formed by a base end member whose base end is joined to the back surface of the electrostatic chuck and a tip member joined to the tip of the base end member, and the tip of the base end member is plugged. A terminal structure in which both terminals are fitted and joined as a terminal with the base end of the tip member as a terminal,
An elastically deformable metal relay joining member is interposed between the inner and outer peripheral surfaces of the socket terminal and the plug terminal, and the distal end member is eccentric and inclined with respect to the base end member by deformation of the metal relay joining member. It is possible to join at least one of
The tip member is fixed to the inner peripheral surface of the insulating member fixed to the inner peripheral surface of the through hole of the metal base member via the outer peripheral surface of the socket terminal or the portion near the socket terminal. Features.

  The invention according to claim 3 is the electrostatic chuck device according to claim 2, wherein the insulating member is fixed to the inner peripheral surface of the through-hole by adhesion. According to a fourth aspect of the present invention, the insulating member has a female screw on its inner peripheral surface, while the outer peripheral surface of the socket member or the portion near the socket terminal of the tip member is screwed into the female screw. A screw is provided, and the tip member is fixed by screwing into the insulating member with these screws, and the tip member is joined to the base end member. It is an electrostatic chuck apparatus of description.

  The invention according to claim 5 is characterized in that the tip member is fixed to the inner peripheral surface of the insulating member by adhesion via the outer peripheral surface of the socket terminal or a portion near the socket terminal. It is an electrostatic chuck apparatus of any one of 2-4. And the invention of Claim 6 is an electrostatic chuck apparatus of any one of Claims 1-5 which made the front-end | tip of the said front-end | tip member the male terminal shape. Furthermore, the invention described in claim 7 is characterized in that the electrostatic chuck is provided with a heater made of a resistance heating element, and the chuck side terminal is for supplying power to the heater. It is an electrostatic chuck apparatus of any one of Claims 1-6.

  In the electrostatic chuck device of the present invention, the chuck-side terminal is not made of a single metal shaft member (pin material) as in the prior art, but is based on the above-described joining structure of the base end member and the tip end member. It is supposed to be. Therefore, when the electrostatic chuck apparatus having such a tip member is attached to the attachment portion on the processing apparatus side, the following operational effects can be obtained. That is, in this mounting, when the tip member forming the chuck side terminal in the electrostatic chuck apparatus of the present invention and the mating terminal on the processing apparatus side are joined by fitting, a planar error is generated between both terminals. Even if there is (position shift), the tip member is joined to the base end member so as to be at least one of eccentric and inclined by deformation (crushed) of the metal relay joining member. Therefore, it is joined by absorbing the error. That is, if there is an error in the plane with the counterpart terminal, the tip member of the chuck side terminal receives a lateral force from the counterpart terminal, but in the electrostatic chuck device of the invention, Even if a force is applied, the distal end member is deformed by the metal relay joining member relative to the proximal end member, and accordingly, eccentricity and inclination are allowed. It can be joined by absorbing errors. Therefore, even when the tip member is deeply fitted to the mating terminal, the base end (root portion) of the base end member joined to the terminal on the back surface of the electrostatic chuck is made of a conventional metal. Compared with the case of using a chuck-side terminal made of a single shaft member, a large force or bending moment does not act. Therefore, even if the base end of the base end member is joined to the terminal on the back surface of the electrostatic chuck by joining means such as brazing, it is possible to effectively prevent the occurrence of problems such as breakage of the joint.

  According to the second aspect of the present invention, since the tip member is fixed to the inner peripheral surface of the insulating member fixed to the inner peripheral surface of the through hole, the stability of the tip member itself can be improved. On the other hand, even when a lateral force as described above acts on the distal end member, the distal end member is allowed to be at least one of eccentricity and inclination by deforming the metal relay joining member relative to the proximal end member. Therefore, it is possible to join by absorbing an error such as a flat surface with the counterpart terminal without applying a large force or bending moment to the base end of the base end member. The insulating member may be any material that has electrical insulation, but a material having a certain degree of elasticity or flexibility (for example, resin) so that the distal end member can be eccentric and inclined with respect to the proximal end member. It is preferable to form by.

  The insulating member only needs to be attached so as not to drop or separate from the through hole of the metal base member. As a means for this, the insulating member may be adhered to the inner peripheral surface of the through hole with silicon resin or the like, or fixed by press-fitting. May be. Moreover, while forming a screw in the inner peripheral surface of a through-hole, a screw can also be formed by forming a screw in the outer peripheral surface of an insulating member. However, by bonding as in the third aspect of the present invention, the assembly of the electrostatic chuck device can be simplified and speeded up.

  According to the fourth aspect of the present invention, when the distal end member is fixed to the inner peripheral surface of the insulating member with a screwed structure, the configuration is easy, and the mounting reliability of the distal end member to the proximal end member is simple and simple. Sex is obtained. However, the distal end member may be fixed to the inner peripheral surface of the insulating member as long as there is no risk that the distal end member is separated from the proximal end member. Further, as described in claim 5, the fixing means of the tip member with respect to the inner peripheral surface of the insulating member may be bonded. In addition, when the tip of the tip member has a male terminal shape as described in claim 6, the counterpart terminal on the processing apparatus side can cope with a female terminal shape.

  The chuck side terminal of the electrostatic chuck device according to the present invention is not limited to a power supply for the electrostatic chuck. As in the seventh aspect of the present invention, the present invention can also be applied to a power supply to a heater. When a large current flows, such as a heater made of a resistance heating element, it is necessary to ensure a sufficient contact area between the tip member forming the chuck side terminal and the counterpart terminal on the processing apparatus side. The pressure input at the junction between the children increases. Therefore, in such a case, an excessive lateral load is likely to be applied to the chuck side terminal, and a large bending moment is applied to the base of the chuck side terminal. However, in the present invention, since a large force is not applied to the proximal end of the proximal end member, it is effective. It is.

  The best mode for carrying out the present invention will be described in detail with reference to FIGS. FIG. 1 is a central longitudinal sectional view of an electrostatic chuck device 1 including an electrostatic chuck 1a according to the present invention and an enlarged view of a main part thereof, and FIG. 2 is a further enlarged view of the main part. Hereinafter, with reference to drawings, it demonstrates centering around FIG.1 and FIG.2. The electrostatic chuck device 1 in this embodiment is configured by adhering a ceramic substrate 2 forming an electrostatic chuck 1a to an aluminum alloy base member 21 with an adhesive (for example, silicon resin) layer (not shown).

The electrostatic chuck 1a constituting the electrostatic chuck device 1 is formed of a ceramic substrate 2 having a constant thickness and a substantially circular flat plate shape. In this example, alumina (Al ₂ O ₃ ) is a main component. The sintered body has a ceramic multilayer (laminated) structure. For example, the thickness is 5 mm and the diameter is 300 mm, 200 mm, or 150 mm. The ceramic substrate 2 has a surface (upper surface) 3 that is a suction surface made of a flat surface that sucks and holds a member to be sucked such as a semiconductor wafer (not shown), and a back surface (lower surface) 4 that is a surface (upper surface) that is a plane of the base member 21 ) 23 to be bonded to 23. The ceramic substrate 2 is embedded in the ceramic substrate 2 so that electrostatic electrodes 5 and 5 for attracting the member to be attracted by electrostatic force form a pair. The electrostatic electrodes 5 and 5 are illustrated as bipolar types that generate negative power by applying a voltage between the electrodes. Further, in the electrostatic chuck device 1 of this embodiment, a heater 15 made of a resistance heating element that generates heat when a voltage is applied is embedded inside the ceramic substrate 2, and the electrostatic chuck 1 a is heated to a temperature. It is set to control.

  At an appropriate position on the back surface 4 of the electrostatic chuck 1 a (ceramic substrate 2), a recess 6 opening in the back surface 4 is formed corresponding to the electrostatic electrode 5 and the heater 15. An electrode terminal 7 made of a metallized layer is formed on the bottom surface in each recess 6 by simultaneous firing with the ceramic substrate 2, and is electrically connected to each electrostatic electrode 5, 5 or resistance heating element 15 through a via 8. Are joined together. The recess 6 has a diameter (inner diameter) of φ10 mm and a depth of 4 mm. In addition, after firing, the front and back surfaces 3 and 4 of the ceramic substrate 2 are planarly polished, and thereafter, the exposed metallized layer including the terminals 7 is plated with Ni. In each terminal (electrode terminal) 7, a base end member 32 constituting the chuck side terminal 31 in a state of projecting from the back surface 4 is, for example, a base end face (base end face) 34 by silver brazing (not shown). (See FIGS. 3 and 4). A plurality of chuck-side terminals 31 for the electrostatic electrodes 5 and 5 or the resistance heating element 15 are provided in a predetermined arrangement on the back surface 4 of the substrate 2 although not shown in detail. However, in this embodiment, since any chuck-side terminal 31 and the surrounding configuration are the same, description will be made based on one of them.

  In this embodiment, the base end member 32 constituting the chuck side terminal 31 is a round bar (circular shaft member) having a constant thickness (for example, φ3 mm) made of, for example, iron cobalt alloy (other than 42 alloy or copper). The portion closer to the tip 35 forms a plug terminal 32b. The distal end (lower end in FIGS. 1 and 2) 35 of the base end member 32 is set so as to be positioned at an intermediate portion of the through hole 26 of the base member 21 as shown in FIGS. The distal end member 36 is fitted and joined to the plug terminal 32b including the distal end (lower end in FIGS. 1 and 2) 35 of the proximal end member 32 via the proximal end 36b side (upper end side in FIG. 1). The chuck side terminal 31 is configured. Details of the structure of the distal end member 36 and the structure in which it is joined to the proximal end member 32 will be described later. The tip member 36 is made of a conductive metal (for example, copper or copper alloy). In addition, although not shown, the He gas fed into the gas flow path formed in the base member 21 is supplied to the suction surface of the wafer, which is the surface 3 of the ceramic substrate 2, inside the ceramic substrate 2. In addition, a gas flow path is provided.

  The electrostatic chuck 1a (ceramic substrate 2) to which the above-mentioned base end member 32 is brazed has its back surface 4 on the surface (upper surface) 23 of the base member 21 and an adhesive layer (for example, an adhesive made of silicone resin). ) Is glued through. In this example, the base member 21 is made of aluminum, has a larger diameter than the ceramic substrate 2 and has a disk shape with a constant thickness. The ceramic substrate 2 is concentrically arranged on the surface 23 and bonded. ing. The base member 21 is provided with an appropriate number of through holes 26 penetrating in the thickness direction at positions corresponding to the arrangement of the base end members 32 of the electrostatic chuck 1a (see FIG. 3). And the base end member 32 is located concentrically in the center of each through hole 26 (see FIG. 4). The through hole 26 has a circular columnar cross section. However, the portion close to the ceramic substrate 2 is formed in a different diameter shape having a small diameter.

  Inside the through hole 26 in the base member 21, a cylindrical insulating member 51 made of an insulating material such as a synthetic resin is fitted to surround the chuck-side terminal 31. It is fixed to the surface by bonding or the like. The insulating member 51 has a cylindrical shape whose outer peripheral surface is different in diameter along the inner peripheral surface of the through hole 26. The inner peripheral surfaces thereof are concentric, and are the small diameter holes 53 that circumscribe the outer peripheral surface of the base end member 32 from the back surface 4 of the ceramic substrate 2 to the intermediate portion of the base end member 32, and the length of the base end member 32. A medium diameter hole 54 larger than the outer diameter of the base end member 32 is formed from the intermediate part in the direction to a part beyond the distal end 35 of the base end member 32, and the large diameter hole 55 is formed to the back surface 24 side of the remaining base member 21. There is no. Note that a socket terminal 37 forming the tip member 36 described below is formed on the inner peripheral surface of the medium diameter hole 54, but a large diameter hole 55 on the inner peripheral surface of the medium diameter hole 54. A female screw 56 is formed at the side portion, and the tip member 36 is screwed through a male screw 38 formed on the outer peripheral surface of the socket terminal 37.

  Next, the details of the structure of the distal end member 36 constituting the chuck-side terminal 31 constituting the main part of the present invention and the structure in which it is fitted to the proximal end member 32 will be described. That is, the distal end member 36 in this embodiment forms a cylindrical socket terminal 37 whose base end 36b is fitted in a portion close to the distal end 35 of the base end member 32 (plug terminal 32b). In other words, the proximal end 36b of the distal end member 36 has a columnar hole 39 that is perforated so as to open toward the proximal end 36b. However, the inner peripheral surface of the hole 39 is provided with a metal relay joining member 61 having a spring property and elastically deformable. The details of the metal relay joining member 61 will be described later.

  A cylindrical shaft portion 42 that extends concentrically toward the distal end is integrally provided on the distal end side of the socket terminal 37. As described above, a male screw 38 that is screwed into a female screw 56 formed on the inner peripheral surface of the medium diameter hole 54 of the insulating member 51 is formed at a position near the tip of the outer peripheral surface of the socket terminal 37. The male screw 38 is screwed into the female screw 56, so that the plug terminal 32b, which is a portion closer to the distal end 35 of the base end member 32, is fitted into the hole 39 of the socket terminal 37 of the distal end member 36. The member 36 is attached so as to be fixed to the inner peripheral surface of the insulating member 51. In this attached state, the columnar shaft portion 42 extending to the tip end side of the socket terminal 37 is arranged with a gap K around the large-diameter hole 55 of the insulating member 51. The cylindrical shaft portion 42 forms a terminal to be joined to a mating terminal provided in the electrostatic chuck device mounting portion of the wafer processing apparatus, and may be a female terminal, but in this embodiment, it forms a male terminal ( (See FIG. 2). The tip of this male terminal is formed in a hemispherical shape.

  On the other hand, the inner peripheral surface (inner wall surface) of the hole 39 of the socket terminal 37 constituting the tip member 36 is provided with the metal relay joining member 61 that can be elastically deformed as described above. In this embodiment, the metal relay joining member 61 is formed by bending a metal plate having a spring property into a cylindrical shape, and on the cylindrical wall surface, a large number of convex portions 63 bulging inwardly in an arc shape are formed in the circumferential direction. Have. This metal relay joining member 61 is fitted in a recess 43 formed in the inner peripheral surface 41 of the hole 39 along the circumferential direction in a retaining manner by its own spring property (FIG. 2, (See FIG. 6). And the convex part 63 of the metal relay joining member 61 bulges greatly as shown in FIG. 6 before the plug terminal 32b of the base end member 32 is inserted into the hole 39 in the fitted state. However, by being inserted and fitted, the outer peripheral surface of the base end member 32 is deformed so as to be crushed radially outward by its own spring property. That is, in this embodiment, the metal relay joining member 61 is disposed in advance in the hole 39 of the socket terminal 37 forming the distal end member 36, and the plug terminal 32 b of the base end member 32 is press-fitted into the hole 39. Thus, a metal relay joining member 61 is interposed between the inner and outer peripheral surfaces of both terminals 37 and 32b. In this press-fitted state, an appropriate gap (for example, 1 mm in diameter) is generated between the inner peripheral surface 41 of the hole 39 of the socket terminal 37 and the outer peripheral surface of the plug terminal 32b of the base end member 32. Is set to Thus, in this press-fitted state, the distal end member 36 is joined to the base end member 32 by an appropriate amount, eccentricity, or inclination by deformation of the convex portion 63 in the metal relay joining member 61.

  In this embodiment, the insulating member 51 is fixed to the inner peripheral surface of the through hole 26 formed in the base member 21, and the tip member 36 is connected to the male screw 38 formed on the outer peripheral surface of the socket terminal 37. Then, the tip member 36 is fixed by screwing into a female screw 56 formed on the inner peripheral surface of the insulating member 51. At the same time, the base end member 32 is press-fitted into the hole 39 of the socket terminal 37. Therefore, the attachment of the distal end member 36 to the proximal end member 32 is inserted while rotating around its axis.

  As described above, in the present embodiment, when the base end member 32 is press-fitted into the hole 39 of the socket terminal 37, the inner peripheral surface 41 of the hole 39 hole and the portion near the tip of the base end member 32 (plug terminal). A metal relay joining member 61 is interposed between the outer peripheral surface and the outer peripheral surface. The relay joining member 51 has a large number of convex portions 63 on the peripheral wall surface, and the large number of convex portions 63 are crushed by the outer peripheral surface of the proximal end portion 32 (plug terminal). It touches in form. As described above, in this embodiment, the outer peripheral surface near the tip of the base end member 32 and the inner peripheral surface of the hole 39 of the socket terminal 37 are multifaceted (many surfaces) via the numerous protrusions 63 in the relay joining member 51. Point) Electrically joined in contact. The distal end of the cylindrical shaft portion 42 at the distal end of the distal end member 36 is set to slightly protrude from the back surface 24 of the base member 21 in a state where the distal end member 36 is joined to the proximal end member 32.

  Thus, in the electrostatic chuck device 1 of this embodiment, the chuck-side terminal 31 is not made of a single shaft made of metal as in the prior art, but the proximal end member 32, the distal end member 36, and the like. Therefore, even when a lateral force (shearing force) is applied to the tip member 36 or a lateral force is applied to the tip of the tip member 36, a bending moment is applied. The distal end member 36 is deformed by the convex portion 63 of the metal relay joining member 61 with respect to the proximal end member 32, so that an appropriate amount of eccentricity or inclination (or eccentricity and inclination) as shown by a two-dot chain line in FIG. (Tilt) is allowed. Accordingly, when the tip member 36 forming the chuck side terminal 31 in the electrostatic chuck apparatus 1 and the mating terminal 131 on the processing apparatus side are joined by fitting, a planar error is generated between both terminals. Even if there exists, since the convex part 63 of a metal relay joining member can deform | transform, it will join, absorbing the error.

  As a result, in this embodiment, the chuck side terminal 31 is not formed by brazing a pin made of one shaft body to the terminal on the back surface of the ceramic substrate 2 at the base end face unlike the conventional case. The lateral force and bending moment acting on the brazing portion at the base 31 can be reduced. Accordingly, it is possible to suppress the occurrence of breakage of the brazed brazing or peeling of the brazed portion. In particular, in this embodiment, since the distal end member 36 is fixed to the inner peripheral surface of the insulating member 51 fixed to the inner peripheral surface of the through hole 26 of the base member 21, the distal end member 36 itself is relative to the proximal end member 32. And stable.

  In the said form, the front-end | tip member 36 which makes the chuck | zipper side terminal 31 is formed in the inner peripheral surface of the through-hole 26 of the metal base member 21 through the male screw formed in the outer peripheral surface of the socket terminal 37 or the socket terminal side part. Although the case where it screwed and fixed to the female screw formed in the inner peripheral surface of the fixed insulating member 51 was illustrated, this fixation may be fixed by adhesion as described above. However, the distal end member 36 constituting the chuck side terminal 31 is joined to the proximal end member 32 in a retaining manner, and the distal end member 36 itself is perpendicular to the back surface of the electrostatic chuck 1a in the joining. Is stably held, the tip member 36 may not be fixed to the inner peripheral surface of the insulating member 51.

  Further, in the above-described embodiment, in the terminal structure in which both terminals are fitted, the chuck-side terminal 31 is configured such that the distal end of the proximal end member 32 is a plug terminal and the proximal end of the distal end member 36 is a socket terminal. However, this may be reversed in the present invention. That is, the embodiment can be embodied in which the distal end of the proximal end member 32 is a socket terminal and the proximal end of the distal end member 36 is a plug terminal. Further, in the above embodiment, the tip of the tip member 36 that forms the chuck side terminal 31 is embodied as a male terminal shape, but the present invention is not limited to this. What is necessary is just to set it as the terminal shape (structure) corresponding to the other party terminal by the side of the processing apparatus to which an electrostatic chuck apparatus is attached.

  Further, in the above embodiment, the metal relay joining member 61 is disposed in advance in the hole 39 of the socket terminal 37 that forms the tip member 36, and the base end member 32 is press-fitted into the hole 39, thereby It is embodied as a configuration in which a metal relay joining member 61 is interposed between the inner and outer peripheral surfaces of the children 37 and 32b. However, in the present invention, an elastically deformable metal relay joining member is interposed between the inner and outer peripheral surfaces of the socket terminal and the plug terminal, and the distal end member is eccentric with respect to the base end member due to the deformation of the metal relay joining member. In addition, at least one of the inclination and the inclination may be joined, and therefore the metal relay joining member may be provided in advance on the outer peripheral surface of the plug terminal.

The center longitudinal cross-sectional view of the electrostatic chuck apparatus of this invention and its principal part enlarged view. The further enlarged view of the principal part enlarged view of FIG. The exploded view (sectional drawing) of the electrostatic chuck apparatus of FIG. 1 and the expanded sectional view of a front-end | tip member. It is a figure explaining the manufacture middle of the electrostatic chuck apparatus of FIG. 1, Comprising: Sectional drawing of the stage which bonded the base member to what brazed the base end member to the ceramic substrate, and the principal part enlarged view. In FIG. 4, sectional drawing of the step which fixed the insulating member to the through-hole of the base member, and the principal part enlarged view. In FIG. 5, the partial expanded sectional view explaining the state which joins a front-end | tip member to the base end member which makes a chuck | zipper side terminal, and the further further enlarged view of the part. Explanatory drawing which made the other party terminal by the side of a processing apparatus a socket terminal, and made the chuck | zipper side terminal of an electrostatic chuck apparatus the thing of a projection shape in a through-hole.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electrostatic chuck apparatus 1a Electrostatic chuck 2 Ceramic substrate 4 Back surface of electrostatic chuck 5 Electrostatic electrode 15 Heater 21 Metal base member 26 Base member through hole 31 Chuck side terminal 32 Base end member 32b Plug terminal 34 Base end member The proximal end 35 of the proximal end member 36 The distal end member 36b The proximal end 37 of the distal end member Socket terminal 38 The male screw 51 on the outer peripheral surface of the socket terminal of the distal end member Insulating member 56 The female screw 61 on the inner peripheral surface of the insulating member 61 Metal relay Joining member

Claims (7)

An electrostatic chuck device comprising: an electrostatic chuck having an electrostatic electrode formed on a ceramic substrate; and a metal base member joined to the back surface of the electrostatic chuck. In the case where the chuck-side terminal formed in a protruding shape is disposed while maintaining insulation in the through-hole formed in the metal base member,
The chuck-side terminal is formed by a base end member having a base end bonded to the back surface of the electrostatic chuck, and a tip member bonded to the tip of the base end member, and the tip end of the base end member A terminal structure in which either one of the proximal ends of the distal end member is a socket terminal and the other is a plug terminal to fit and join both terminals,
An elastically deformable metal relay joining member is interposed between the inner and outer peripheral surfaces of the socket terminal and the plug terminal, and the distal end member is eccentric and inclined with respect to the base end member by deformation of the metal relay joining member. An electrostatic chuck device characterized in that at least one of the above can be joined. An electrostatic chuck device comprising: an electrostatic chuck having an electrostatic electrode formed on a ceramic substrate; and a metal base member joined to the back surface of the electrostatic chuck. The chuck-side terminal formed in a protruding shape is arranged inside an insulating member that forms an annular shape fixed to the inner peripheral surface of the through hole formed in the metal base member.
The chuck side terminal is formed by a base end member whose base end is joined to the back surface of the electrostatic chuck and a tip member joined to the tip of the base end member, and the tip of the base end member is plugged. A terminal structure in which both terminals are fitted and joined as a terminal with the base end of the tip member as a terminal,
An elastically deformable metal relay joining member is interposed between the inner and outer peripheral surfaces of the socket terminal and the plug terminal, and the distal end member is eccentric and inclined with respect to the base end member by deformation of the metal relay joining member. It is possible to join at least one of
The tip member is fixed to the inner peripheral surface of the insulating member fixed to the inner peripheral surface of the through hole of the metal base member via the outer peripheral surface of the socket terminal or the portion near the socket terminal. An electrostatic chuck device.   The electrostatic chuck apparatus according to claim 2, wherein the insulating member is fixed to an inner peripheral surface of the through hole by adhesion.   The insulating member is provided with a female screw on the inner peripheral surface thereof, while the outer peripheral surface of the tip terminal member near the socket terminal or the socket terminal is provided with a male screw that is screwed into the female screw. 4. The electrostatic chuck device according to claim 2, wherein the distal end member is fixed by screwing into the insulating member, and the distal end member is joined to the base end member.   The said front end member is being fixed to the inner peripheral surface of the said insulating member by adhesion | attachment via the outer peripheral surface of the socket terminal or the part near a socket terminal. The electrostatic chuck apparatus described.   The electrostatic chuck device according to claim 1, wherein the tip of the tip member has a male terminal shape.   The electrostatic chuck is provided with a heater made of a resistance heating element, and the chuck-side terminal is for supplying power to the heater. The electrostatic chuck device according to the item.

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