JP6586345B2 - Substrate holding device - Google Patents

Description

  The present invention relates to a substrate holding apparatus that holds a substrate such as a wafer on a holding surface of a base body in which a conductor is embedded.

  In order to apply a voltage to the electrostatic chuck electrode embedded in the base of the electrostatic chuck, a connection terminal having the following configuration has been proposed (for example, see Patent Documents 1 to 3). That is, a vertical hole that is continuous in the vertical direction (thickness direction of the substrate) is formed from the back surface of the substrate opposite to the surface on which the substrate is attracted to the electrostatic chuck electrode. A substantially cylindrical metal power receiving terminal is fitted into the vertical hole, and its upper end (tip) is joined to the electrostatic chuck electrode by brazing.

JP 09-267233 A JP-A-10-189696 JP 2009-188394 A

  However, when an external force is applied to the power receiving terminal, an excessive force is applied to the joint between the power receiving terminal and the electrostatic chuck electrode to break the joint, and the electrical connection between the two is broken. there's a possibility that. The same applies to the case where thermal stress acts on the electrostatic chuck electrode due to the difference in thermal expansion coefficient between the substrate and the electrostatic chuck electrode.

  In view of this, the present invention relates to the influence of an external force acting on a power receiving terminal or a thermal stress acting on a conductor such as an electrostatic chuck electrode embedded in a substrate on an electrical connection state between the power receiving terminal and the conductor. An object of the present invention is to provide a substrate holding device capable of reducing the above.

The present invention includes a base made of a flat ceramic sintered body whose surface is a holding surface of a substrate, a conductor embedded in the base, and a vertical direction from the back surface of the base to a part of the conductor. It is related with the board | substrate holding apparatus provided with the power receiving terminal arrange | positioned in the vertical hole formed so that it may continue, and is electrically connected to the said conductor.

In the substrate holding device of the present invention, the power receiving terminal is provided between the first element, the second element that is displaceable with respect to the first element, and between the first element and the second element. A biasing element that exerts a force, the first element is fixed to the base, and the second element is pressed against the conductor by a biasing force of the biasing element , A part of each of the first element and the second element is disposed in the vertical hole .

  According to the substrate holding device of the present invention, the first element is fixed to the base body, and the second element is pressed against the conductor by the urging force of the urging element acting between the first element. ing. As a result, the power receiving terminal (configured by the first element, the second element, and the urging element) arranged in the vertical hole of the base is electrically connected to the conductor embedded in the base. Yes. Even when an external force acts on the first element of the power receiving terminal and a corresponding force acts on the second element from the first element, the second element can be displaced relative to the conductor. The same applies to the case where thermal stress acts on the conductor according to the difference in thermal expansion coefficient between the substrate and the conductor. Therefore, while the electrical connection state between the power receiving terminal or the second element which is a component of the power receiving terminal and the conductor is maintained, the force acting between the power receiving terminal (second element) and the conductor is prevented from being excessive. It is possible to prevent damage to the power receiving terminal and the conductor. Thus, the influence of the external force acting on the power receiving terminal or the thermal stress acting on the conductor embedded in the base body on the electrical connection state between the power receiving terminal and the conductor can be reduced.

  In this state, a voltage is applied to the conductor embedded in the substrate through the power supply terminal connected to the external power source and the power receiving terminal connected to the power supply terminal. When the conductor constitutes an electrostatic chuck electrode, a substrate such as a wafer placed on one end surface side of the substrate is attracted and held on the substrate by a Coulomb force or the like by applying a voltage to the conductor. In the case where the conductor constitutes a resistance heating element, the voltage is applied to the conductor to make the substrate temperature uniform regardless of the location of the substrate. When the conductor constitutes a high-frequency voltage application electrode (or grounding electrode), the grounding electrode (which is embedded in the base 1 or arranged outside the base 1 and is paired with the conductor and the grounding electrode) Further, when a high frequency voltage is applied between the high frequency voltage application electrodes), plasma such as halogen gas is generated around the substrate.

  In the substrate holding device of one aspect of the present invention, the power receiving terminal is configured such that a gap for partially separating the first element and the second element exists between the first element and the second element. And an intermediate element disposed in the gap and in contact with each of the first element and the second element.

  According to the substrate holding device having such a configuration, when an external force is applied to the first element, the first element is directly connected to the second element in a portion where there is no gap with the first element (the portion in contact). In addition to applying a force to the gap, a force can be applied indirectly from the first element via the intermediate element even in a portion where the gap exists. In this way, the force acting on the second element due to the external force acting on the first element is distributed, so that the force acting between the power receiving terminal (second element) and the conductor is prevented from being excessively increased. The terminal and the conductor are prevented from being damaged.

  In the substrate holding device of one aspect of the present invention, the power receiving terminal is configured such that the gap extends in an annular shape between the peripheral surfaces of the first element and the second element, and the intermediate terminal Elements are arranged all around the gap.

  According to the substrate holding device having the above configuration, when a force is applied to the second element from the first element through a part of the intermediate element due to an external force applied to the first element, the force is opposite to the force. Can be applied to the second element from the first element through the part of the intermediate element opposite to the part. In this way, it is possible to prevent a situation in which a force is deflected from acting on the second element due to an external force acting on the first element, and to prevent an excessive force acting between the power receiving terminal (second element) and the conductor. As a result, damage to the power receiving terminal and the conductor can be prevented.

  In the substrate holding device of one embodiment of the present invention, at least a part of the intermediate element has conductivity.

  According to the substrate holding device having the configuration, as described above, the first element that abuts against a part of the intermediate element that can prevent excessive force acting between the power receiving terminal (second element) and the conductor, and The conduction of the second element is ensured. “Part of the intermediate element” means a part of the single intermediate element or a part or all of at least one intermediate element among the plurality of intermediate elements.

  In the substrate holding apparatus of one aspect of the present invention, a male screw is formed on the outer peripheral surface of the first element, while a female screw is formed on the inner peripheral surface of the vertical hole of the base, and the male screw of the first element The first element is fixed to the base body by screwing the female screw in the vertical hole.

  According to the substrate holding device having the above configuration, the power receiving terminal (first element) is rotated with respect to the base body around the axis thereof, whereby the power receiving terminal and the base body are attached and mechanically fixed, and the fixing is released and removed. Therefore, the work can be facilitated.

  In the substrate holding device according to one aspect of the present invention, the first element is formed in a cylindrical shape or a bottomed cylindrical shape, and the second element partially protrudes from the hollow space of the first element into the hollow space. Arranged movably, the biasing element is disposed in the hollow space of the first element and biases the second element in the axial direction of the first element.

  According to the substrate holding device having the configuration, the handling of the power receiving terminal can be facilitated by the amount that the biasing element constituting the power receiving terminal is not exposed.

  In the substrate holding device according to one aspect of the present invention, the first element is detachable from the cylindrical or bottomed cylindrical main body, and the main body, and the hollow space of the first element is used. And a lid having an opening for limiting the protruding amount of the second element.

  According to the substrate holding device having such a configuration, the lid constituting the first element whose mechanical fixation to the base body has been released can be removed from the main body, so that the second element or the like is disposed in the hollow space of the first element. The work such as inspection, repair, or replacement of the parts is facilitated.

The fragmentary sectional view of the substrate holding device as a 1st embodiment of the present invention. The fragmentary sectional view of the substrate holding device as a 2nd embodiment of the present invention.

(First embodiment)
(Constitution)
The substrate holding apparatus according to the first embodiment of the present invention shown in FIG. 1 is configured as an electrostatic chuck including a base 1, a conductor 2, and a power receiving terminal 4.

  The substrate 1 is made of an insulating dielectric such as a ceramic sintered body, and is formed in a flat plate shape having a surface 101 as an adsorption surface on which a substrate (not shown) such as a wafer is adsorbed and held. The substrate 1 in the present embodiment has a substantially disc shape, but may have various shapes such as a polygonal plate shape or an elliptical plate shape.

  A plurality of pins (not shown) having a substantially cylindrical shape, a substantially hemispherical shape, or a substantially truncated cone shape protruding from the suction surface are formed on the suction surface of the base 1 so as to be arranged in a triangular lattice shape. In addition, the arrangement | positioning aspect of a pin may be changed, such as a square lattice form or concentric form, and a pin may be abbreviate | omitted partially or entirely. A vertical hole 10 having a substantially circular cross section is formed from the back surface 102 to the conductor 2 in the vertical direction (thickness direction) of the substrate 1. A female screw 112 is formed on the inner peripheral surface of the vertical hole 10.

  The conductor 2 is made of a thin plate-like or thin-film metal embedded in the base 1 in a posture parallel to the attracting surface, and constitutes an electrostatic chuck electrode.

  The power receiving terminal 4 is at least partially disposed in the vertical hole 10 of the base 1 and is electrically connected to the conductor 2. When the conductors 2 constituting a plurality of independent electrostatic chuck electrodes are embedded in the base body 1, a plurality of power receiving terminals 4 corresponding to the respective conductors 2 are provided on the base body 1. The power receiving terminal 4 is formed in a substantially cylindrical shape provided with a first element 41 made of a conductor (for example, metal) formed in a substantially cylindrical shape, and displaceable in the axial direction with respect to the first element 41. And a biasing element 43 for applying a biasing force between the first element 41 and the second element 42.

  The first element 41 includes a substantially cylindrical main body 410 and a substantially cylindrical lid body 420 that is detachably attached to the upper portion of the main body 410. A female screw 401 is formed on the inner peripheral surface of the lower end portion of the main body 410, and a female screw 412 is formed on the inner peripheral surface of the upper end portion of the main body 410. The lid body 420 is composed of an upper portion formed in a substantially disc shape and a lower portion formed in a substantially cylindrical shape having a smaller diameter than the upper portion. That is, the outer diameter of the lid 420 is larger at the upper part than at the lower part. A male screw 402 is formed on the outer peripheral surface of the upper portion of the lid body 420, and a male screw 422 is formed on the outer peripheral surface of the lower portion of the lid body 420. When the upper end portion of the main body 410 is disposed in the vertical hole 10, a male screw may be formed on the upper end portion of the main body 410 in addition to or instead of the upper outer peripheral surface of the lid body 420. The hollow space (opening) of the lid 420 is divided into a substantially cylindrical upper hollow space and a substantially cylindrical lower hollow space having a larger diameter than the upper hollow space. That is, the inner diameter of the lid 420 (the diameter of the hollow space) is smaller on the upper side than on the lower side. In the present embodiment, the upper and lower boundary positions in the axial direction of the lid body 420 are above the boundary position between the upper hollow space and the lower hollow space, but both boundary positions may be the same. The vertical relationship may be reversed.

  The main body 410 and the lid body 420 are screwed together by the female screw 412 formed on the inner peripheral surface of the upper end portion of the main body 410 and the male screw 422 formed on the lower outer peripheral surface of the lid body 420, thereby the first. Element 41 is configured. At this time, the annular upper end surface 413 of the main body 410 is in contact with the annular lower end surface 423 of the upper portion of the lid body 420. The hollow space of the first element 41 is constituted by four substantially cylindrical hollow spaces having a common axis. The four hollow spaces are, in order from the top, a first hollow space constituted by an upper hollow space and a lower hollow space of the lid body 420, and a second hollow space having a larger diameter than the lower hollow space of the lid body 420. The third hollow space having the same diameter as the lower hollow space of the lid 420 and the fourth hollow space in which the female screw 401 is formed as described above.

  The second element 42 has an upper portion formed in a substantially cylindrical shape having the same diameter as or slightly smaller in diameter than the upper hollow space of the lid body 420, and a slightly smaller diameter than the lower hollow space of the lid body 420. It is comprised by the lower part currently formed in the large diameter substantially cylindrical shape. The upper end portion of the second element 42 is formed in a columnar shape or a disc shape having a smaller diameter than the upper portion. The upper part of the second element 42 protrudes upward from the first element 41 through the upper hollow space (opening) of the lid body 420, and the lower part of the second element 42 projects from the lower hollow space of the lid body 420 and the first element 41. The first element 41 is disposed in the hollow space in a state of being inserted into the second hollow space and the third hollow space. The annular upper end surface 414 of the lower part of the second element 42 abuts on the annular lower end surface 424 of the lid body 420 constituting the first element 41, so that the protruding amount of the upper part of the second element 42 from the first element 41 is increased. Limited. A substantially annular or substantially cylindrical gap exists between the inner peripheral surface of the first element 41 defining the second hollow space and the lower outer peripheral surface of the second element 42.

  In the present embodiment, the biasing element 43 is configured by a coil spring, and is disposed in the third hollow space of the first element 41, and biases the second element 42 upward with respect to the first element 41. The biasing element 43 may or may not have conductivity. In addition to the coil spring, the biasing element 43 may be constituted by a disc spring, a leaf spring, a bellows air spring, a pair or a plurality of pairs of magnets facing the same pole, and the like.

  A substantially annular gap existing between the inner peripheral surface of the first element 41 that defines the second hollow space and the lower outer peripheral surface of the second element 42 has a first annular spacer. A first intermediate element 441 and a second intermediate element 442 made of a coil spring formed in an annular shape are arranged. The second intermediate element 442 is slidably in contact with the inner peripheral surface of the first element 41 and the lower outer peripheral surface of the second element 42 that define the second hollow space over the entire periphery. In the present embodiment, with the two second intermediate elements 442 interposed between the three first intermediate elements 441, the intermediate elements are arranged so as to overlap in the axial direction. The number of the first intermediate elements 441 and the second intermediate elements 442 and the arrangement order in the axial direction may be arbitrarily changed according to the axial length of the second hollow space of the first element 41 and the like. The first intermediate element 441 and the second intermediate element 442 are preferably conductors, but the first intermediate element 441 may be an insulator. Further, the first intermediate element 441 may have a structure integrated with the second element 42.

  A male screw 402 formed on the first element 41 constituting the power receiving terminal 4 (specifically, an upper outer peripheral surface of the lid 420), and a female screw 112 formed on the inner peripheral surface of the vertical hole 10 of the base 1 Thus, the power receiving terminal 4 is screwed to the base body 1. Thereby, the power receiving terminal 4 is fixed to the base 1. At this time, the upper end portion of the second element 42 constituting the power receiving terminal 4 is pressed against the conductor 2 by the biasing force of the biasing element 43. Thereby, the electrical connection between the power receiving terminal 4 and the conductor 2 is established.

  A power receiving terminal is formed by a female screw 401 formed at the lower end portion of the first element 41 constituting the power receiving terminal 4 and a male screw formed on the outer peripheral surface of the substantially cylindrical upper end portion of the power feeding terminal (not shown). 4 and the power supply terminal are screwed together. That is, the upper end portion of the power supply terminal is disposed in the fourth hollow space of the first element 41. An electric wire that connects the power supply terminal to an external power source is connected to the rear end of the power supply terminal (not shown).

(Production method)
The substrate holding device (electrostatic chuck) having the above-described configuration is manufactured by the following procedure, for example. That is, the raw material powder compact in which the conductor 2 (electrostatic chuck electrode) is embedded is hot-press sintered. As the raw material powder, for example, high purity (for example, purity 99.9% or more) aluminum nitride powder, and mixed raw material powder to which a sintering aid such as an appropriate amount of yttrium oxide powder is added as necessary are used. In addition, other ceramic powders such as alumina powder may be used as the raw material powder. As the conductor 2, for example, a Mo foil (for example, a thickness of 0.1 [mm]) is used. In addition, a plurality of pins and vertical holes 10 are formed in the sintered body according to an appropriate processing method such as blasting or milling.

  The number of power receiving terminals 4 corresponding to the number of vertical holes 10 is prepared. Specifically, a main body 410 and a lid 420, a second element 42, a biasing element 43, a first intermediate element 441, and a second intermediate element 442 constituting the first element 41 are formed. The biasing element 43 is inserted into the hollow space from above the main body 410 of the first element 41, and the second element 42 is further inserted thereon. Furthermore, annular first intermediate element 441 and second intermediate element 442 are inserted and arranged in the gap between the outer peripheral surface of second element 42 and the inner peripheral surface of main body 410. Then, the power receiving terminal 4 is manufactured by screwing the lid 420 to the main body 410.

  The power receiving terminal 4 is screwed onto the base 1 by a male screw 402 formed on the first element 41 constituting the first power receiving terminal 4 and a female screw 112 formed on the inner peripheral surface of the vertical hole 10 of the base 1. Worn. The upper end portion of the second element 42 constituting the power receiving terminal 4 is pressed against the conductor 2 by the urging force of the urging element 43. The substrate holding apparatus having the above structure is manufactured by the above process.

  The main body 410 and the lid 420, the second element 42, the biasing element 43, the first intermediate element 441, and the second intermediate element 442 constituting the first element 41 are mainly composed of nickel or an alloy based on nickel, such as Inconel. The heat resistance can be used up to 750 ° C. by using the prepared material. Further, by applying gold plating to these, it is possible to improve the corrosion resistance under the semiconductor manufacturing process environment.

  By combining these materials and the structure of the present invention, the influence on the electrical connection state between the power receiving terminal and the conductor can be reduced even when exposed to thermal stress due to use in a high temperature environment.

(function)
According to the substrate holding device (electrostatic chuck) configured as described above, the first element 41 is fixed to the base body 1 by screwing, and the second element 42 acts between the first element 41 and the urging force. It is pressed against the conductor 2 by the biasing force of the element 43. As a result, the power receiving terminal 4 disposed in the vertical hole 10 of the base 1 and the conductor 2 embedded in the base 1 are electrically connected. Even when an external force acts on the first element 41 of the power receiving terminal 4 and a corresponding force acts on the second element 42 from the first element 41, the second element 42 is displaced relative to the conductor 2. Is possible. The same applies to the case where thermal stress is applied to the conductor 2 according to the difference in thermal expansion coefficient between the base 1 and the conductor 2. Therefore, while the electrical connection state between the power receiving terminal 4 (or the second element 42) and the conductor 2 is maintained, the difference between the external force acting on the first element 41 or the thermal expansion coefficient between the base 1 and the conductor 2 is maintained. Accordingly, the force acting between the power receiving terminal 4 (second element 42) and the conductor 2 due to the thermal stress acting on the conductor 2 is prevented, and thus the power receiving terminal 4 and the conductor 2 are prevented from being damaged. Is planned.

  When an external force is applied to the first element 41, the first element is in contact with the second element 42 in contact with the first element 41 (the inner peripheral surface defining the first hollow space and the third hollow space). In addition to applying a force directly from 41, a force is applied indirectly from the first element 41 via the first intermediate element 441 and the second intermediate element 442 disposed in the gap in the second hollow space. be able to. When a force is applied to the second element 42 from the first element 41 through a part of each of the annular first intermediate element 441 and the second intermediate element 442 due to an external force applied to the first element 41, A drag force in the direction opposite to this force can be applied to the second element 42 from the first element 41 through the part of the first intermediate element 441 and the second intermediate element 442 opposite to each part. As described above, the second element 42 is concentrated or deflected due to the external force acting on the first element 41 or the thermal stress acting on the conductor 2 according to the difference in thermal expansion coefficient between the base 1 and the conductor 2. Thus, it is possible to prevent a situation where force is applied, and to prevent excessive force acting between the power receiving terminal 4 (second element 42) and the conductor 2.

(Second Embodiment)
(Constitution)
The substrate holding device as the second embodiment of the present invention shown in FIG. 2 is the substrate holding device (electrostatic chuck (see FIG. 1)) as the first embodiment of the present invention except for the configuration of the power receiving terminal 4. ), The same reference numerals are used for common or corresponding components, and the description including the manufacturing method is omitted.

  The first element 41 includes an upper portion formed in a substantially cylindrical shape and a lower portion formed in a substantially cylindrical shape having a diameter larger than that of the upper portion and substantially the same as or slightly smaller than the vertical hole 10 of the base body 1. ing. A vertical hole extending in the axial direction from the lower bottom surface of the first element 41 to a certain depth is formed, and a female screw 401 is formed on the inner peripheral surface of the vertical hole. A male screw 402 is formed on the outer peripheral surface of the lower end of the first element 41. The second element 42 includes a substantially columnar upper portion and a lower portion formed in a substantially covered cylindrical shape having an outer diameter larger than that of the upper portion and smaller than the vertical hole 10 of the base body 1. The lower portion of the second element 42 has an inner diameter (a diameter of a vertical hole continuing from the lower end surface of the lower portion to a certain depth in the axial direction) larger than the upper portion of the first element 41.

  A bias that biases the second element 42 upward with respect to the first element 41 in a substantially cylindrical gap existing between the upper outer peripheral surface of the first element 41 and the lower inner peripheral surface of the second element 42. An element 43 (for example, a coil spring) is arranged. The biasing element 43 may or may not have conductivity, but also serves as an intermediate element.

(function)
According to the substrate holding device (electrostatic chuck) configured as described above, the electrical connection state between the power receiving terminal 4 (or the second element 42) and the conductor 2 is the same as that of the substrate holding device of the first embodiment. Is maintained, the power receiving terminal 4 (second element) is caused by an external force acting on the first element 41 or a thermal stress acting on the conductor 2 according to the difference in thermal expansion coefficient between the base 1 and the conductor 2. 42) and the force acting between the conductors 2 can be prevented from being excessive, and the power receiving terminal 4 and the conductor 2 can be prevented from being damaged.

(Other embodiments of the present invention)
The mechanical fixing method of the first element 41 to the base body 1 is not limited to the screwing of the female screw 112 formed on the inner peripheral surface of the vertical hole 10 and the male screw 402 formed on the outer peripheral surface of the first element 41. Other fixing methods may be employed.

  For example, the first element 41 may be fixed to the base body 1 by press-fitting the first element 41 into the vertical hole 10 of the base body 1. The outer peripheral surface of the first element 41 and the inner peripheral surface of the vertical hole 10 may be bonded with an adhesive. Generally, since the thermal conductivity of the adhesive is lower than that of metal, the amount of heat flowing from the substrate 1 through the first element 41 can be reduced. For this reason, the situation where the local low-temperature location (cold spot) arises in the location corresponding to the power receiving terminal 4 in the surface 101 (substrate adsorption surface) of the base 1 is suppressed.

  A portion extended radially outward may be provided at the lower end portion of the first element 41, a vertical through hole may be provided in the portion, and the portion may be screwed to the lower end of the base body 1 through the vertical through hole. . In this case, the first element 41 is configured such that a gap exists between the outer peripheral surface of the first element 41 and the inner peripheral surface of the vertical hole 10, thereby reducing the amount of heat flowing from the base 1 through the first element 41. For this reason, a situation in which a cold spot is generated at a position corresponding to the power receiving terminal 4 on the surface 101 of the base 1 is suppressed.

  A range in which the second element 42 is electrically connected to the conductor 2 embedded in the base body 1 by the biasing force of the biasing element 43 with respect to the first element 41 fixed to the base body 1. Thus, the power receiving terminal 4 may be configured in a different form from the above embodiment. In the substrate holding device of the first embodiment, one or both of the first intermediate element 441 and the second intermediate element 442 may be omitted.

  In the substrate holding device in the embodiment, in addition to the conductor 2 constituting the electrostatic chuck electrode, a conductor constituting a heating resistor made of a thin plate or thin film metal is embedded in the substrate 1. Also good. The conductor constituting the heating resistor is embedded in the base body 1 in a posture parallel to the front surface 101 at a position closer to the back surface 102 than the conductor 2 in the longitudinal direction of the base body 1. The conductor constituting the heating resistor is also connected to an external power source via a power receiving terminal and a power feeding terminal having the same configuration as that of the conductor 2 constituting the electrostatic chuck electrode.

  In this case, the substrate holding device is manufactured, for example, according to a method described in JP2013-157570A. That is, a first raw material powder compact in which the first conductor 2 (electrostatic chuck electrode) is embedded and a second raw material powder compact in which the second conductor (heating resistor) is embedded. In the state of being superposed, they are hot-press sintered together. Then, a pin and a vertical hole 10 are formed in the sintered body according to an appropriate processing method, whereby a substrate holding device (electrostatic chuck with a heater) is manufactured. In addition to or instead of the conductor 2 constituting the electrostatic chuck electrode, a conductor made of a thin plate-like or thin-film metal and constituting a high-frequency voltage application electrode or a grounding electrode is embedded in the substrate 1. Also good.

  In addition, the first conductor 2 and a pair of first raw material powder compacts sandwiching the first conductor 2 and the second conductor and a pair of second raw material powder compacts sandwiching the first conductor 2 are put together. The substrate holding device may be manufactured by hot press sintering. In addition, the first raw material powder compact in which the first conductor 2 is embedded and the second raw material powder compact in which the second conductor is embedded are separately hot-press-sintered. After the first base portion and the second base portion are fabricated, the substrate holding device may be manufactured by bonding both base portions. In this case, an alumina-yttrium oxide-based bonding material may be used as the bonding material for the aluminum nitride sintered body, and a glass-based bonding material may also be used. Quartz, soda-lime glass, borosilicate glass, etc. are employed as the glass material.

DESCRIPTION OF SYMBOLS 1 ... Base | substrate 2 ... Conductor (electrostatic chuck electrode), 4 ... Power receiving terminal, 10 ... Vertical hole, 41 ... 1st element, 42 ... 2nd element, 43 ... Coil spring (biasing element), 410 ... Main body, 420 ··· lid, 441 ··· first intermediate element, 442 ··· second intermediate element.

Claims (7)

A base made of a plate-like ceramic sintered body whose surface is the holding surface of the substrate, a conductor embedded in the base, and a continuous surface in the vertical direction from the back surface of the base to a part of the conductor. A power receiving terminal that is disposed in a vertical hole formed in and electrically connected to the conductor,
The power receiving terminal includes a first element, a second element provided so as to be displaceable with respect to the first element, and a biasing element that applies a biasing force between the first element and the second element. With
The first element is fixed to the base body, and the second element is pressed against the conductor by the biasing force of the biasing element ;
A part of each of the first element and the second element is disposed in the vertical hole . The substrate holding apparatus according to claim 1, wherein
The power receiving terminal is configured such that a gap that partially separates the first element and the second element exists between the first element and the second element, and disposed in the gap. The substrate holding apparatus further comprising an intermediate element in contact with each of the first element and the second element. The substrate holding apparatus according to claim 2, wherein
The power receiving terminal is configured such that the gap extends annularly between the peripheral surfaces of the first element and the second element, and the intermediate element is disposed over the entire circumference of the gap. A substrate holding device. The substrate holding apparatus according to claim 2 or 3,
At least a part of the intermediate element is conductive. In the substrate holding device according to any one of claims 1 to 4,
A male screw is formed on the outer peripheral surface of the first element, while a female screw is formed on the inner peripheral surface of the vertical hole of the base, and the male screw of the first element and the female screw of the vertical hole are screwed together. Thus, the first element is fixed to the base body. In the substrate holding device according to any one of claims 1 to 5,
The first element is formed in a cylindrical shape or a bottomed cylindrical shape,
The second element partially protrudes from the hollow space of the first element and is movably disposed in the hollow space;
The substrate holding apparatus, wherein the biasing element is disposed in a hollow space of the first element and biases the second element in an axial direction of the first element. The substrate holding apparatus according to claim 6, wherein
The first element has a cylindrical or bottomed cylindrical main body, an opening that is detachable with respect to the main body, and restricts a protruding amount of the second element from the hollow space of the first element. A substrate holding device.