TW201614616A - Curved display device - Google Patents

Curved display device

Info

Publication number
TW201614616A
TW201614616A TW104128015A TW104128015A TW201614616A TW 201614616 A TW201614616 A TW 201614616A TW 104128015 A TW104128015 A TW 104128015A TW 104128015 A TW104128015 A TW 104128015A TW 201614616 A TW201614616 A TW 201614616A
Authority
TW
Taiwan
Prior art keywords
semiconductor chip
chip package
display device
wire unit
driving chips
Prior art date
Application number
TW104128015A
Other languages
English (en)
Other versions
TWI694423B (zh
Inventor
Man-Bok Jeon
Original Assignee
Samsung Display Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Display Co Ltd filed Critical Samsung Display Co Ltd
Publication of TW201614616A publication Critical patent/TW201614616A/zh
Application granted granted Critical
Publication of TWI694423B publication Critical patent/TWI694423B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00—Aspects of the constitution of display devices
    • G09G2300/04—Structural and physical details of display devices
    • G09G2300/0404—Matrix technologies
    • G09G2300/0408—Integration of the drivers onto the display substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Wire Bonding (AREA)
TW104128015A 2014-09-23 2015-08-26 彎曲顯示裝置 TWI694423B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0127053 2014-09-23
KR1020140127053A KR102241248B1 (ko) 2014-09-23 2014-09-23 곡면형 표시 장치

Publications (2)

Publication Number Publication Date
TW201614616A true TW201614616A (en) 2016-04-16
TWI694423B TWI694423B (zh) 2020-05-21

Family

ID=55527130

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104128015A TWI694423B (zh) 2014-09-23 2015-08-26 彎曲顯示裝置

Country Status (4)

Country Link
US (2) US9713256B2 (zh)
KR (1) KR102241248B1 (zh)
CN (1) CN105448252B (zh)
TW (1) TWI694423B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI711177B (zh) * 2018-08-01 2020-11-21 創王光電股份有限公司 顯示裝置

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015087498A1 (ja) * 2013-12-11 2017-03-16 株式会社Ｊｏｌｅｄ 表示装置
KR102173356B1 (ko) * 2013-12-31 2020-11-03 엘지디스플레이 주식회사 곡면표시장치
KR20150080878A (ko) * 2014-01-02 2015-07-10 삼성전자주식회사 디스플레이 모듈 및 이를 갖춘 디스플레이 장치
KR102340738B1 (ko) * 2014-09-02 2021-12-17 삼성디스플레이 주식회사 곡면 표시장치
DE102015117486A1 (de) * 2015-10-14 2017-04-20 Osram Oled Gmbh Organische Leuchtdiode und Anordnung mit einer organischen Leuchtdiode
KR102492104B1 (ko) * 2015-12-10 2023-01-27 삼성디스플레이 주식회사 인쇄회로기판 및 이를 포함하는 표시 장치
CN105679770B (zh) * 2016-01-28 2019-02-26 京东方科技集团股份有限公司 阵列基板及其制造方法
JP6856068B2 (ja) * 2016-04-08 2021-04-07 Ａｇｃ株式会社 印刷層を備える屈曲基材の製造方法
KR102618354B1 (ko) * 2016-04-15 2023-12-28 삼성디스플레이 주식회사 디스플레이 장치
KR102587229B1 (ko) 2016-04-22 2023-10-12 삼성디스플레이 주식회사 표시 장치
KR102555407B1 (ko) * 2016-06-30 2023-07-14 엘지디스플레이 주식회사 플렉서블 유기발광 다이오드 표시장치
KR102595086B1 (ko) * 2016-07-08 2023-10-27 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
KR102026829B1 (ko) * 2016-07-11 2019-10-01 보에 테크놀로지 그룹 컴퍼니 리미티드 칩 온 필름, 이를 갖는 플렉시블 디스플레이 장치, 및 그 제조 방법
CN105931572A (zh) * 2016-07-11 2016-09-07 京东方科技集团股份有限公司 柔性显示设备及其制造方法
KR102638304B1 (ko) * 2016-08-02 2024-02-20 삼성디스플레이 주식회사 표시장치
KR102638982B1 (ko) 2016-11-25 2024-02-23 삼성디스플레이 주식회사 표시 장치
KR20180090926A (ko) * 2017-02-03 2018-08-14 삼성디스플레이 주식회사 센서 및 이를 포함하는 표시 장치
US10468470B2 (en) * 2017-02-27 2019-11-05 Wuhan China Star Optoelectronics Technology Co., Ltd OLED display module and method of forming the same
JP2018194632A (ja) * 2017-05-16 2018-12-06 株式会社ジャパンディスプレイ 表示装置、及び表示装置の製造方法
KR102316563B1 (ko) * 2017-05-22 2021-10-25 엘지디스플레이 주식회사 금속으로 형성된 상부 기판을 포함하는 유기 발광 표시 장치 및 이의 제조 방법
KR102330537B1 (ko) * 2017-07-14 2021-11-23 엘지디스플레이 주식회사 Cof 패키지 및 이를 포함하는 표시 장치
USD824903S1 (en) * 2017-07-21 2018-08-07 Solved By Technology Co., Limited Reflective surround display system
KR102482833B1 (ko) * 2017-07-26 2022-12-29 삼성전자주식회사 폴리머 층이 포함된 장치 및 상기 폴리머 층을 이용한 장치 제조방법
KR102341412B1 (ko) * 2017-08-29 2021-12-22 삼성디스플레이 주식회사 표시 장치
KR102313698B1 (ko) * 2017-09-01 2021-10-15 매그나칩 반도체 유한회사 유연성 있는 반도체 패키지 및 이의 제조 방법
CN107621736A (zh) * 2017-09-05 2018-01-23 昆山龙腾光电有限公司 一种液晶显示装置及其制造方法
CN107561764A (zh) * 2017-10-30 2018-01-09 上海天马微电子有限公司 一种显示面板及其显示装置
KR102466918B1 (ko) * 2017-12-27 2022-11-15 삼성디스플레이 주식회사 칩 온 필름 패키지 및 칩 온 필름 패키지를 포함하는 표시 장치
KR102631153B1 (ko) * 2018-01-08 2024-02-01 삼성디스플레이 주식회사 표시 장치
KR102543688B1 (ko) * 2018-04-02 2023-06-14 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조방법
KR102603399B1 (ko) * 2018-08-09 2023-11-17 삼성디스플레이 주식회사 표시장치 및 그 제조방법
CN109817680B (zh) * 2019-01-31 2021-03-16 武汉华星光电半导体显示技术有限公司 柔性基板以及显示面板
CN111755620A (zh) * 2019-03-27 2020-10-09 力晶积成电子制造股份有限公司 半导体封装
CN112234084A (zh) * 2020-10-14 2021-01-15 京东方科技集团股份有限公司 一种显示模组、显示装置以及制作方法
CN113066383B (zh) * 2021-03-31 2023-04-07 深圳创维－Rgb电子有限公司 一种显示装置
TWI801996B (zh) * 2021-09-08 2023-05-11 友達光電股份有限公司 切換曲率結構及顯示裝置
TWI824863B (zh) * 2022-12-01 2023-12-01 友達光電股份有限公司 元件基板及其製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335696A (ja) 1992-05-29 1993-12-17 Nippon Mektron Ltd 折曲げ容易な可撓性回路基板及びその製造法
JP2001284751A (ja) 2000-01-26 2001-10-12 Casio Micronics Co Ltd フレキシブル配線基板およびそれを備えた表示モジュール
JP3996535B2 (ja) * 2003-03-20 2007-10-24 Ｎｅｃ液晶テクノロジー株式会社 液晶表示装置
KR20060064960A (ko) 2004-12-09 2006-06-14 삼성전자주식회사 연성 인쇄회로기판, 이를 갖는 표시패널 및 표시장치
KR100623724B1 (ko) 2005-02-18 2006-09-14 삼성에스디아이 주식회사 유기 전계발광 표시장치의 연성인쇄회로기판
US7785938B2 (en) * 2006-04-28 2010-08-31 Semiconductor Energy Laboratory Co., Ltd Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit
KR20080016271A (ko) * 2006-08-18 2008-02-21 삼성전자주식회사 유기 발광 표시 장치 및 그 제조 방법
CN101246287B (zh) * 2007-02-16 2012-07-11 奇美电子股份有限公司 用于柔性显示装置的显示面板的制造方法
CN101435964A (zh) * 2007-11-16 2009-05-20 胜华科技股份有限公司 光学补偿弯曲型液晶显示器
KR100903623B1 (ko) * 2007-11-16 2009-06-18 삼성에스디아이 주식회사 플라즈마 표시 장치, 그 구동 장치 및 그 구동 방법
KR20110048678A (ko) * 2009-11-03 2011-05-12 주식회사 크라텍 곡면패널 및 곡면패널의 제조 방법
KR101174882B1 (ko) * 2010-06-15 2012-08-17 주식회사 엔씰텍 평판 표시 장치, 평판 표시 장치용 원장 기판, 평판 표시 장치 제조 방법 및 평판 표시 장치용 원장 기판 제조 방법
TWI447851B (zh) * 2011-01-19 2014-08-01 Macronix Int Co Ltd 多層連線結構及製造方法
KR101951956B1 (ko) * 2012-11-13 2019-02-26 매그나칩 반도체 유한회사 반도체 패키지용 연성회로기판

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI711177B (zh) * 2018-08-01 2020-11-21 創王光電股份有限公司 顯示裝置

Also Published As

Publication number Publication date
KR102241248B1 (ko) 2021-04-16
US9713256B2 (en) 2017-07-18
US20170318677A1 (en) 2017-11-02
US20160088726A1 (en) 2016-03-24
KR20160035696A (ko) 2016-04-01
CN105448252B (zh) 2020-01-14
TWI694423B (zh) 2020-05-21
CN105448252A (zh) 2016-03-30
US10034378B2 (en) 2018-07-24

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