TW201525073A - 聚矽氧烷 - Google Patents

聚矽氧烷 Download PDF

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Publication number
TW201525073A
TW201525073A TW104108949A TW104108949A TW201525073A TW 201525073 A TW201525073 A TW 201525073A TW 104108949 A TW104108949 A TW 104108949A TW 104108949 A TW104108949 A TW 104108949A TW 201525073 A TW201525073 A TW 201525073A
Authority
TW
Taiwan
Prior art keywords
group
polyoxyalkylene
mol
integer
sio
Prior art date
Application number
TW104108949A
Other languages
English (en)
Chinese (zh)
Inventor
中西康二
田崎太一
長谷川公一
Original Assignee
Jsr股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr股份有限公司 filed Critical Jsr股份有限公司
Publication of TW201525073A publication Critical patent/TW201525073A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
TW104108949A 2011-04-21 2012-04-20 聚矽氧烷 TW201525073A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011094922 2011-04-21
JP2012034100A JP5505436B2 (ja) 2011-04-21 2012-02-20 硬化性組成物、硬化物、光半導体装置およびポリシロキサン

Publications (1)

Publication Number Publication Date
TW201525073A true TW201525073A (zh) 2015-07-01

Family

ID=47433784

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104108949A TW201525073A (zh) 2011-04-21 2012-04-20 聚矽氧烷
TW101114054A TWI499644B (zh) 2011-04-21 2012-04-20 硬化性組成物、硬化物以及光半導體裝置

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101114054A TWI499644B (zh) 2011-04-21 2012-04-20 硬化性組成物、硬化物以及光半導體裝置

Country Status (2)

Country Link
JP (2) JP5505436B2 (https=)
TW (2) TW201525073A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI811225B (zh) * 2017-07-24 2023-08-11 日商陶氏東麗股份有限公司 多成分固化型導熱性聚矽氧凝膠組合物、導熱性構件及散熱結構體

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101556274B1 (ko) 2012-12-28 2015-09-30 제일모직 주식회사 봉지재 조성물, 봉지재 및 전자 소자
US11028266B2 (en) 2016-08-12 2021-06-08 Wacker Chemie Ag Curable organopolysiloxane composition, encapsulant and semiconductor device
JP7574544B2 (ja) * 2020-03-31 2024-10-29 三菱ケミカル株式会社 樹脂組成物、電子機器用部材、樹脂添加剤、及び、樹脂添加用オルガノポリシロキサン組成物
JP7574543B2 (ja) * 2020-03-31 2024-10-29 三菱ケミカル株式会社 樹脂組成物、電子機器用部材、樹脂添加剤、及び樹脂添加用オルガノポリシロキサン組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062821B2 (ja) * 1989-11-28 1994-01-12 信越化学工業株式会社 エポキシ基含有シリコーンエラストマー微粉末の製造方法及びその方法により製造された微粉末
JP3469327B2 (ja) * 1994-08-03 2003-11-25 信越化学工業株式会社 オルガノポリシロキサンの製造方法
JP2003192790A (ja) * 2001-12-27 2003-07-09 Dow Corning Toray Silicone Co Ltd ラジカル重合性オルガノポリシロキサン混合物およびその製造方法
JP5060074B2 (ja) * 2006-05-11 2012-10-31 東レ・ダウコーニング株式会社 接着促進剤、硬化性オルガノポリシロキサン組成物、および半導体装置
JP4862032B2 (ja) * 2008-12-05 2012-01-25 信越化学工業株式会社 高屈折率を有する硬化物を与える付加硬化型シリコーン組成物、及び該組成物からなる光学素子封止材
JP4913858B2 (ja) * 2009-04-14 2012-04-11 日東電工株式会社 熱硬化性シリコーン樹脂用組成物
JP2011057755A (ja) * 2009-09-07 2011-03-24 Shin-Etsu Chemical Co Ltd シリコーン組成物及びその硬化物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI811225B (zh) * 2017-07-24 2023-08-11 日商陶氏東麗股份有限公司 多成分固化型導熱性聚矽氧凝膠組合物、導熱性構件及散熱結構體

Also Published As

Publication number Publication date
TWI499644B (zh) 2015-09-11
JP2012233153A (ja) 2012-11-29
JP5505436B2 (ja) 2014-05-28
JP2014074183A (ja) 2014-04-24
TW201247785A (en) 2012-12-01
JP5696798B2 (ja) 2015-04-08

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