TW201436097A - 基板把持裝置 - Google Patents

基板把持裝置 Download PDF

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TW201436097A
TW201436097A TW103100197A TW103100197A TW201436097A TW 201436097 A TW201436097 A TW 201436097A TW 103100197 A TW103100197 A TW 103100197A TW 103100197 A TW103100197 A TW 103100197A TW 201436097 A TW201436097 A TW 201436097A
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substrate
substrate holding
holding portion
rod
guiding member
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TWI626709B (zh
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Mitsuru Miyazaki
Naoki Matsuda
Junji Kunisawa
Manao Hoshina
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Ebara Corp
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    • H—ELECTRICITY
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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    • H—ELECTRICITY
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    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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    • H—ELECTRICITY
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    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

為了提供一種可確實地把持基板之基板把持裝置。基板把持裝置係具備：用來抬高複數個支柱(2)之昇降機構(20)、以及配置於各支柱(2)上之基板保持部(3)及基板導引構件(50)。支柱(2)具有：使基板保持部(3)及基板導引構件(50)彼此相對移動之相對移動機構。該相對移動機構，當支柱(2)上昇時使基板保持部(3)朝將基板(W)之周緣部釋放的方向移動，且使基板導引構件(50)相對於基板保持部(3)往上昇；當支柱(2)下降時使基板保持部(3)朝將基板(W)之周緣部把持的方向移動，且使基板導引構件(50)相對於基板保持部(3)往下降。

Description

基板把持裝置
本發明係關於基板把持裝置，特別是關於可適用於半導體晶圓等的基板之洗淨裝置、乾燥裝置之基板把持裝置。
在半導體元件製程，當研磨處理、鍍敷處理後須進行基板之洗淨處理、乾燥處理。例如，在基板的洗淨處理，將基板藉由基板把持裝置予以把持並使基板旋轉，在該狀態下對基板供給洗淨液。作為習知的基板把持裝置，藉由致動器等來驅動夾頭而把持基板的機構是已知的。
[專利文獻1]日本特開平10-59540號公報
[專利文獻2]日本特開2009-295751號公報
本發明是關於習知基板把持裝置之改良，其目的是為了提供一種可確實地把持基板之基板把持裝置。
為了達成上述目的，本發明的一態樣之基板把持裝置，其特徵在於，係具備：基台、藉由前述基台支承而能對於該基台朝上下方向相對移動之複數個支柱、用來抬高前述支柱之昇降機構、以及配置於前述各支柱上之基板保持部及基板導引構件；前述支柱具有：使前述基板保持部及前述基板導引構件彼此相對移動之相對移動機構；前述相對移動機構，當前述支柱上昇時使前述基板保持部朝將前述基板之周緣部釋放的方向移動，且使前述基板導引構件相對於前述基板保持部往上昇；當前述支柱下降時使前述基板保持部朝將前述基板之周緣部把持的方向移動，且使前述基板導引構件相對於前述基板保持部往下降。
本發明之較佳態樣，其特徵在於，前述相對移動機構係具備：第1桿件、配置成能相對於前述第1桿件上下移動且藉由前述昇降機構抬高之第2桿件、配置於前述基台和前述第1桿件之間而將前述第1桿件朝下彈壓之一次彈簧、配置於前述第1桿件和前述第2桿件之間而將前述第2桿件朝下彈壓之二次彈簧、固定於前述第1桿件而將前述基板保持部予以旋轉自如地支承之支承軸、以及用來連結前述第2桿件和前述基板保持部之連結機構。
本發明之較佳態樣，其特徵在於，前述一次彈簧具有比前述二次彈簧更小的彈簧常數。
本發明之較佳態樣，其特徵在於，前述一次彈簧具有比前述二次彈簧更大的彈簧常數。
本發明之較佳態樣，其特徵在於，前述基板導引構件固定於前述第2桿件。
本發明之較佳態樣，其特徵在於，前述相對移動機構，是使前述基板導引構件上昇至比前述基板保持部更高，使前述基板導引構件下降至比前述基板保持部更低。
本發明之較佳態樣，其特徵在於，前述基板保持部，是繞前述基台之中心軸線呈等間隔地配置，前述基板保持部藉由把持前述基板之周緣部而進行前述基板之定心。
本發明之較佳態樣，其特徵在於，前述基板保持部係具有：用來把持前述基板的周緣部之夾頭部、以及載置前述基板的周緣部之傾斜面，前述夾頭部是一體地形成於前述傾斜面上。
依據本發明，若支柱上昇，基板導引構件會相對於基板保持部往上昇。因此，搬運機構所搬運之基板，利用基板導引構件導引至基板保持部，藉此基板保持部能將基板確實地把持。當支柱下降而由基板保持部將基板把持時，使基板導引構件相對於基板保持部往下降。因 此，將本基板把持裝置運用於基板洗淨裝置等之處理液體的裝置時，可防止來自基板導引構件之液體飛濺。
1‧‧‧基台
2‧‧‧支柱
3‧‧‧基板保持部
5‧‧‧旋轉軸
6‧‧‧軸承
7‧‧‧圓筒體
9‧‧‧架台
11、12‧‧‧滑輪
14‧‧‧帶體
15‧‧‧馬達
20‧‧‧昇降機構
21‧‧‧第1氣體室
22‧‧‧第2氣體室
24‧‧‧第1氣體流路
25‧‧‧第2氣體流路
28‧‧‧旋轉杯
31‧‧‧輪環構件
35‧‧‧第1桿件
36‧‧‧第2桿件
41‧‧‧一次彈簧
42‧‧‧二次彈簧
44、45‧‧‧彈簧制動件
46‧‧‧支承軸
47‧‧‧銷
48‧‧‧長孔
50‧‧‧基板導引構件
51‧‧‧螺絲
54‧‧‧荷重傳遞構件
圖1係顯示本發明的第1實施形態之基板把持裝置的縱剖面圖。
圖2係顯示第1實施形態的基板把持裝置之俯視圖。
圖3係顯示昇降機構上昇的狀態。
圖4係支柱及基板保持部之放大圖。
圖5(a)係支柱及基板保持部的上面圖，圖5(b)係圖4所示的支柱及基板保持部從箭頭A所示方向觀察之剖面圖。
圖6係顯示支柱藉由昇降機構抬高的狀態。
圖7(a)係顯示支柱位於上昇位置時之基板保持部，圖7(b)係顯示支柱位於下降位置時之基板保持部。
圖8(a)係顯示支柱位於下降位置時之基板保持部及基板導引構件，圖8(b)係顯示支柱位於上昇位置時之基板保持部及基板導引構件。
圖9係顯示本發明的第2實施形態。
圖10係顯示支柱藉由昇降機構抬高的狀態。
以下，針對本發明的實施形態參照圖式作說明。
圖1係顯示本發明的第1實施形態之基板把持裝置的縱剖面圖。圖2係顯示第1實施形態的基板把持裝置之俯視圖。
如圖1及圖2所示般，基板把持裝置係具備：具有4個臂部1a之基台1、藉由各臂部1a的前端支承之4個支柱2、以及連結於支柱2之基板保持部3。基台1固定於旋轉軸5的上端，該旋轉軸5藉由軸承6支承成可旋轉自如。軸承6固定於圓筒體7的內周面，該圓筒體7配置成包圍旋轉軸5。圓筒體7的下端安裝於架台9而使其位置固定住。旋轉軸5透過滑輪11、12及帶體14連結於馬達15，藉由驅動馬達15，使基台1以其軸心為中心進行旋轉。符號W表示晶圓等的基板。晶圓W是藉由基板保持部3把持，藉由馬達15使晶圓W繞中心軸線旋轉。
以包圍圓筒體7周圍的方式配置將支柱2抬高的昇降機構20。該昇降機構20構成為可相對於圓筒體7朝上下方向滑動。昇降機構20具有：與4個支柱2的下端接觸而將該等支柱2抬高之4個推頂器20a。在圓筒體7的外周面和昇降機構20的內周面之間形成有第1氣體室21和第2氣體室22。第1氣體室21和第2氣體室22分別與第1氣體流路24及第2氣體流路25連通，該等第1氣體流路24及第2氣體流路25連結於未圖示之加 壓氣體供給源。若第1氣體室21內的壓力比第2氣體室22內的壓力更高，如圖3所示般昇降機構20會上昇。另一方面，若第2氣體室22內的壓力比第1氣體室21內的壓力更高，如圖1所示般昇降機構20會下降。藉由昇降機構20使4個支柱2同時上昇或下降。
4個支柱2的外周面固定於輪環構件31，使4個支柱2和輪環構件31一體地上下移動。輪環構件31是沿著支柱2的排列方向延伸，其位於基台1下方。輪環構件31、旋轉軸5、基台1、圓筒體7是配置成同心狀。
在基台1的上面固定著旋轉杯28。該旋轉杯28是用來擋止從旋轉中的晶圓W利用離心力甩出之液體。圖1及圖3顯示旋轉杯28的縱剖面。旋轉杯28配置成包圍晶圓W的全周。旋轉杯28的縱剖面形狀是朝徑向內側傾斜。此外，旋轉杯28的內周面是由平滑曲面所構成。旋轉杯28的上端靠近晶圓W，旋轉杯28之上端的內徑設定成比晶圓W直徑稍大。此外，在旋轉杯28的上端，對應於各支柱2而形成有沿著支柱2的外周面形狀之缺口28a。在旋轉杯28的底面形成有斜向延伸之液體排出孔(未圖示)。
4個支柱2及基板保持部3具有相同的構造。圖4為支柱2及基板保持部3的放大圖。圖5(a)為支柱2及基板保持部3的上面圖，圖5(b)為將圖4所示的支柱2及基板保持部3從箭頭A所示方向觀察之剖面圖。基台1的臂部1a具有：將支柱2可滑動自如地予以 保持之保持構件1b。又該保持構件1b是與臂部1a構成為一體亦可。保持構件1b形成有朝上下延伸之貫通孔，在該貫通孔插入支柱2。貫通孔的直徑比支柱2的直徑稍大，因此支柱2可對於基台1朝上下方向相對移動。
基板保持部3的上面成為朝向晶圓W的半徑方向內側向下傾斜之傾斜面3b。在傾斜面3b形成有與晶圓W之周緣部接觸的夾頭部3a。夾頭部3a是在基板保持部3的傾斜面3b上形成為一體。在本實施形態，如圖2所示般設有4個基板保持部3，藉由該等基板保持部3把持晶圓W的周緣部。晶圓W的周緣部先載置於傾斜面3b上，接著藉由夾頭部3a把持。基板保持部3是繞基台1及旋轉軸5的中心軸線呈等間隔地配置。因此，藉由基板保持部3把持晶圓W的周緣部，能自動進行晶圓W的定心。
支柱2係具備：藉由保持構件1b保持成可朝上下方向滑動自如之第1桿件35、及收容於該第1桿件35的內部之第2桿件36。基板保持部3連結於第1桿件35及第2桿件36的上端部。第1桿件35呈圓筒形狀，第2桿件36配置成可在第1桿件35內朝上下方向移動自如。亦即，第2桿件36對於第1桿件35可相對上下移動。第1桿件35固定於輪環構件31。
在基台1和第1桿件35之間配置一次彈簧41。更具體的說，是在第1桿件35的外周部固定著彈簧制動件44，在該彈簧制動件44和基台1的保持構件1b 之間裝設一次彈簧41。該一次彈簧41將第1桿件35向下彈壓。
在第1桿件35和第2桿件36之間配置二次彈簧42。更具體的說，是在第2桿件36的外周部固定著彈簧制動件45，在該彈簧制動件45和第1桿件35的下端之間裝設二次彈簧42。該二次彈簧42將第2桿件36向下彈壓。一次彈簧41具有比二次彈簧42的彈簧常數更小的彈簧常數。
若昇降機構20的推頂器20a將第2桿件36推頂，會透過二次彈簧42將朝上的力施加於第1桿件35。藉此，第1桿件35及第2桿件36會反抗一次彈簧41的反作用力而一體地上昇。如圖6所示般，若輪環構件31接觸基台1的下面，第1桿件35的上昇會停止，另一方面，第2桿件36會繼續上昇。當第2桿件36到達既定高度時，第2桿件36的上昇停止。如此般，在第1桿件35的上昇停止之後第2桿件36的上昇才停止。又取代輪環構件31而在各支柱2設置與基台1的下面接觸之制動件亦可。在此情況也是，能在第1桿件35的上昇停止之後才使第2桿件36的上昇停止。
基板保持部3，是藉由固定於第1桿件35之支承軸46予以可旋轉自如地支承。在基板保持部3的下部固定著銷47，該銷47插入形成於第2桿件36的上端之長孔48。亦即，基板保持部3是藉由銷47和長孔48之卡合來連結於第2桿件36。該銷47及長孔48是構成 用來連結基板保持部3和第2桿件36之連結機構。如上述般，在第1桿件35的上昇停止之後，使第2桿件36相對於第1桿件35稍微往上昇。若第2桿件36相對於第1桿件35往上昇，第2桿件36會將固定於基板保持部3之銷47推頂，藉此使基板保持部3以支承軸46為中心稍微旋轉。
圖7(a)顯示支柱2位於上昇位置時之基板保持部3，圖7(b)顯示支柱2位於下降位置時之基板保持部3。如圖7(a)所示般，若隨著支柱2的上昇而使基板保持部3繞支承軸46旋轉，夾頭部3a會從晶圓W的周緣部離開，藉此將晶圓W從基板保持部3釋放。如此般，僅藉由使支柱2上昇，就能朝夾頭部3a離開晶圓W的周緣部的方向使基板保持部3移動(旋轉)而將晶圓W釋放。從夾頭部3a釋放後的晶圓W，就那樣載置於基板保持部3的傾斜面3b上。在此狀態下，晶圓W藉由未圖示的搬運機構搬出。此外，若有其他晶圓被搬入，該晶圓會在支柱2上昇的狀態下載置於傾斜面3b上。
晶圓W的把持動作是如下述般進行。若在傾斜面3b上載置有晶圓W的狀態下使推頂器20a下降，利用一次彈簧41及二次彈簧42的反作用力使支柱2及基板保持部3下降。當支柱2下降時，第2桿件36比第1桿件35先開始下降。因此，如圖7(b)所示般，連結於第2桿件36之基板保持部3會繞支承軸46旋轉，使基板保持部3的夾頭部3a與晶圓W之周緣部接觸，如此使晶圓 W藉由基板保持部3予以把持。這時基板保持部3的旋轉方向，是使夾頭部3a接近晶圓W之周緣部的方向。
4個基板保持部3同時動作，而藉由4個基板保持部3各自的夾頭部3a來把持晶圓W的周緣部，即完成晶圓W的定心。如此般，僅藉由使支柱2下降，就能朝夾頭部3a接近晶圓W之周緣部的方向使基板保持部3移動(旋轉)而將晶圓W把持，並進一步進行晶圓W的定心。設置輪環構件31的主要目的是為了使4個支柱2同步下降。例如，縱使是4個支柱2當中幾個因某些原因而變得無法順利上下移動的情況，藉由輪環構件31予以保持之4個支柱2仍能同步下降。
如圖5(b)所示般，在第2桿件36的上端，藉由螺絲51固定著基板導引構件50，該基板導引構件50是用來將搬運裝置所搬運的晶圓W導引至基板保持部3。該基板導引構件50是與第2桿件36一體地上下移動。因此，基板導引構件50可相對於第1桿件35上下移動。更具體的說，當支柱2上昇時，朝夾頭部3a離開晶圓W之周緣部的方向使基板保持部3旋轉，與此同步地使基板導引構件50相對於基板保持部3往上昇，如圖7(a)所示般使其上端比基板保持部3更往上突出。在基板導引構件50的上端，形成有用來將晶圓W的周緣部導引至基板保持部3的傾斜面(上面)3b之錐面50a。當基板導引構件50相對於基板保持部3往上昇時，該錐面50a會移動到傾斜面3b的上方。因此，晶圓W的周緣部會被錐面50a 導引而移動到基板保持部3的傾斜面3b。
當支柱2下降時，第2桿件36會比第1桿件35先開始下降。因此，與長孔48卡合之銷47會和第2桿件36一起下降，藉此使基板保持部3以支承軸46為中心進行旋轉。這時基板保持部3的旋轉方向，是使夾頭部3a接近晶圓W之周緣部的方向。與該基板保持部3的旋轉同步地使基板導引構件50相對於基板保持部3往下降，如圖7(b)所示般使其上端變得比基板保持部3更低。如此般，當晶圓W藉由基板保持部3把持時，基板導引構件50變得比基板保持部3更低。依據這種構造，供應給旋轉中的晶圓W的上面之液體，不致被基板導引構件50干擾而能從晶圓W的周緣部利用離心力排出。例如，將本實施形態的基板把持裝置運用於晶圓(基板)的洗淨裝置的情況，是對藉由馬達15進行旋轉之晶圓W上面供給洗淨液。該洗淨液利用離心力而從晶圓W的周緣部甩出。這時，若基板導引構件50從基板保持部3往上方突出，洗淨液可能從基板導引構件50飛濺而附著於晶圓W的上面。依據本實施形態，可防止如此般的液體飛濺。
圖8(a)顯示支柱2位於下降位置時之基板保持部3及基板導引構件50，圖8(b)顯示支柱2位於上昇位置時之基板保持部3及基板導引構件50。如圖8(a)所示般，當支柱2位於下降位置時，基板導引構件50的錐面50a位於基板保持部3的傾斜面3b之外側。如 圖8(b)所示般，當支柱2位於上昇位置時，基板導引構件50的錐面50a位於基板保持部3的傾斜面3b正上方。因此，搬運機構所搬運之晶圓W，一旦藉由基板導引構件50的錐面50a接收，再沿著該錐面50a往下方搬運，而載置於基板保持部3的傾斜面3b上。依據這種構造，基板保持部3可確實地把持晶圓W。
圖9顯示本發明的第2實施形態。沒有特別說明的構造及動作是與第1實施形態相同，因此省略其重複的說明。在本實施形態，一次彈簧41具有比二次彈簧42的彈簧常數更大的彈簧常數。因此，昇降機構20之推頂器20a將支柱2抬高，第2桿件36先上昇，然後接著使第1桿件35上昇。
圖10顯示支柱2藉由昇降機構20抬高的狀態。在第1桿件35的下端設置有與推頂器20a接觸之荷重傳遞構件54。該荷重傳遞構件54貫穿第2桿件36的彈簧制動件45而往下方延伸。當二次彈簧42被壓縮時，推頂器20a與荷重傳遞構件54接觸，藉由推頂器20a使第1桿件35及第2桿件36一體地上昇。又本發明並不限定於此例，例如，構成為使彈簧制動件45之一部分與第1桿件35的下端接觸亦可。在本實施形態並未設置輪環構件31。
在上述第1實施形態，是在支柱2上昇即將停止之前使基板保持部3朝將晶圓W的周緣部釋放的方向旋轉(移動)，相對於此，在本實施形態，是在支柱2 的上昇開始時，使基板保持部3朝將晶圓W之周緣部釋放的方向旋轉(移動)。因此，在本實施形態，是在基板保持部3的夾頭部3a離開晶圓W之周緣部的狀態下使晶圓W和支柱2一起上昇。基板導引構件50的動作則和第1實施形態相同。亦即，基板導引構件50是與基板保持部3的移動(旋轉)同步而相對於基板保持部3進行上下移動。
記載上述實施形態的目的，是為了讓本發明所屬技術領域具有通常知識者可實施本發明。上述實施形態之各種變形例，所屬技術領域具有通常知識者當然可完成，本發明的技術思想也能適用於其他實施形態。因此，本發明並不限定於所記載的實施形態，而應是依據申請專利範圍所界定的技術思想之最廣範圍。
2‧‧‧支柱
3‧‧‧基板保持部
3a‧‧‧夾頭部
3b‧‧‧傾斜面
28‧‧‧旋轉杯
35‧‧‧第1桿件
36‧‧‧第2桿件
46‧‧‧支承軸
47‧‧‧銷
48‧‧‧長孔
50‧‧‧基板導引構件
50a‧‧‧錐面
W‧‧‧晶圓

Claims (8)

  1. 一種基板把持裝置，其特徵在於，係具備：基台、藉由前述基台支承而能對於該基台朝上下方向相對移動之複數個支柱、用來抬高前述支柱之昇降機構、以及配置於前述各支柱上之基板保持部及基板導引構件，前述支柱具有：使前述基板保持部及前述基板導引構件彼此相對移動之相對移動機構；前述相對移動機構，當前述支柱上昇時使前述基板保持部朝將前述基板之周緣部釋放的方向移動，且使前述基板導引構件相對於前述基板保持部往上昇；當前述支柱下降時使前述基板保持部朝將前述基板之周緣部把持的方向移動，且使前述基板導引構件相對於前述基板保持部往下降。
  2. 如申請專利範圍第1項所述之基板把持裝置，其中，前述相對移動機構係具備：第1桿件、配置成能相對於前述第1桿件上下移動且藉由前述昇降機構抬高之第2桿件、配置於前述基台和前述第1桿件之間而將前述第1桿件朝下彈壓之一次彈簧、配置於前述第1桿件和前述第2桿件之間而將前述第 2桿件朝下彈壓之二次彈簧、固定於前述第1桿件而將前述基板保持部予以旋轉自如地支承之支承軸、以及用來連結前述第2桿件和前述基板保持部之連結機構。
  3. 如申請專利範圍第2項所述之基板把持裝置，其中，前述一次彈簧具有比前述二次彈簧更小的彈簧常數。
  4. 如申請專利範圍第2項所述之基板把持裝置，其中，前述一次彈簧具有比前述二次彈簧更大的彈簧常數。
  5. 如申請專利範圍第2項所述之基板把持裝置，其中，前述基板導引構件是固定於前述第2桿件。
  6. 如申請專利範圍第1項所述之基板把持裝置，其中，前述相對移動機構，是使前述基板導引構件上昇至比前述基板保持部更高，使前述基板導引構件下降至比前述基板保持部更低。
  7. 如申請專利範圍第1項所述之基板把持裝置，其中，前述基板保持部，是繞前述基台之中心軸線呈等間隔地配置，前述基板保持部藉由把持前述基板之周緣部而進行前述基板之定心。
  8. 如申請專利範圍第1項所述之基板把持裝置，其中，前述基板保持部係具有：用來把持前述基板的周緣部之夾頭部、以及載置前述基板的周緣部之傾斜面，前述夾頭部是一體地形成於前述傾斜面上。
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US20140197610A1 (en) 2014-07-17
US9892953B2 (en) 2018-02-13
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