TWI719075B - 基板保持裝置 - Google Patents

基板保持裝置 Download PDF

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TWI719075B
TWI719075B TW105135880A TW105135880A TWI719075B TW I719075 B TWI719075 B TW I719075B TW 105135880 A TW105135880 A TW 105135880A TW 105135880 A TW105135880 A TW 105135880A TW I719075 B TWI719075 B TW I719075B
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substrate
wafer
pillars
pillar
holding device
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TW201729334A (zh
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豊村直樹
宮充
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日商荏原製作所股份有限公司
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    • H—ELECTRICITY
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    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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Abstract

本發明提供一種基板保持裝置，即使基板直徑變大，可使因基板自體重量導致的可撓量做為最小限度，且抑制基板旋轉時的振動。本發明是保持基板W的周緣部並使基板旋轉的基板保持裝置，具備：複數個支柱2，被支持於基台1，可相對於基台1在上下方向相對移動；複數個夾頭3，分別設於複數個支柱2，保持基板W的周緣部；以及至少一支持銷4，支持被複數個夾頭3保持的基板W的下面。

Description

基板保持裝置
本發明是關於一種保持半導體晶圓等的基板的周緣部並使基板旋轉的基板保持裝置。。
半導體裝置的製造工序中，施加成膜、蝕刻、研磨等各種處理於半導體晶圓等的基板表面。這些施加各種處裡的基板，為了在處理後清淨化，進行基板的洗淨處理及乾燥處理。例如，基板的洗淨處理是保持基板並使基板旋轉，在此狀態下供給洗淨液於基板來洗淨。基板的乾燥處理是保持基板並使基板高速旋轉，使基板旋轉乾燥，或者是保持基板並使基板旋轉，同時將IPA蒸汽等吹向基板表面來使基板乾燥。
如此，為了進行基板的洗淨處理或乾燥處理，如在特開2009-295751號公報(專利文獻1)所揭露，已知以夾頭保持基板的周緣部並使基板旋轉的基板保持裝置。
【先前技術文獻】 【專利文獻】
【專利文獻1】 特開2009-295751號公報
半導體裝置的製造工序所使用的半導體晶圓(矽晶圓)的直徑大口徑化成300mm~450mm。使用如在專利文獻1所揭露的基板保持裝置，保持直徑450mm的晶圓並使晶圓高速旋轉來使基板乾燥的工序，有頻繁產生晶圓破裂的問題。
本發明人們，為了查明在大口徑晶圓頻繁產生的晶圓破裂的原因，以進行各種實驗的過程獲得以下見解。
也就是說，因為專利文獻1所揭露的基板保持裝置，以在晶圓周方向 間隔配置四個夾頭來保持晶圓的周緣部，並高速旋轉晶圓，所以在直徑為450mm的大口徑晶圓的情況下，相鄰接的夾頭間的距離變大，有因晶圓的自體重量導致的可撓量增加的問題。
又，當為了使晶圓旋轉乾燥進行高速旋轉，晶圓的旋轉速度接近在以四點等間隔支持晶圓周邊的情況下的晶圓固有振動數，有晶圓振動變大的問題。
本發明基於上述見解，其目的在於提供一種基板保持裝置，即使晶圓等基板直徑變大，能使因基板自體重量導致的可撓量在最小限度，且抑制基板旋轉時的振動。
為了達成上述目的，本發明的基板保持裝置是保持基板的周緣部並使基板旋轉的基板保持裝置，其特徵在於具備：複數個支柱，被支持於基台，可相對於該基台在上下方向相對移動；複數個夾頭，分別設於前述複數個支柱，保持基板的周緣部；以及至少一支持銷，支持被前述複數個夾頭保持的基板的下面。根據本發明，因為設置從下支持基板的支持銷，所以即使基板的直徑變大，也可以使因基板自體重量導致的可撓量在最小限度。又，處於以複數個夾頭保持基板周緣部的狀態的基板的固有振動數，可藉由以至少一支持銷支持基板下面來改變。
本發明的較佳態樣，其特徵在於前述至少一支持銷是在將前述基台的中心做為中心的圓的圓周方向於間隔設置的複數個支持銷所組成。
本發明的較佳態樣，其特徵在於前述複數個夾頭是在將前述基台的中心做為中心的圓的圓周方向於間隔配置，前述複數個支持銷各配置於相鄰接的兩個夾頭之間。
本發明的較佳態樣，其特徵在於前述支持銷的上端部成半球面形狀。
根據本發明，因為支持銷的上端部為半球面形狀，所以支持銷的半球面，其頂點以點接觸基板下面來支持基板。
本發明的較佳態樣，其特徵在於前述支持銷被固定於前述基 台。
本發明的較佳態樣，其特徵在於處於以前述複數個夾頭保持基板周緣部的狀態的基板的固有振動數，藉由以前述至少一支持銷支持基板的下面來改變。
根據本發明的基板保持裝置，即使晶圓等基板的直徑變大，能使因基板自體重量導致的可撓量做為最小限度，且抑制基板旋轉時的振動。因此，在使基板乾燥時即使高速旋轉基板，基板也不會破裂。
1‧‧‧基台
1a‧‧‧臂
1b‧‧‧保持部件
2‧‧‧支柱
2a‧‧‧支柱停止器
3‧‧‧夾頭
4‧‧‧支持銷
4a‧‧‧半球面
4b‧‧‧螺桿部
5‧‧‧旋轉軸
6‧‧‧軸承
7‧‧‧圓筒體
9‧‧‧架台
11、12‧‧‧滑輪
14‧‧‧帶
15‧‧‧馬達
20‧‧‧升降機
20a‧‧‧推動器
21‧‧‧第一氣體腔
22‧‧‧第二氣體腔
24‧‧‧第一氣體流路
25‧‧‧第二氣體流路
28:旋轉套
30:彈簧
31:外側蓋
32:內側凸緣
33:內側軸環
35:彈簧停止器
41:定位部
41a:側面
43:第一磁石
44:第二磁石
45:第三磁石
46:溝
47:突起部
50:連接環
W:晶圓
α:角度
第一圖表示關於本發明的基板保持裝置的整體結構的縱剖面圖。
第二圖表示第一圖所示的基板保持裝置的平面圖。
第三圖表示第一圖所示的基板保持裝置中，以升降機上昇支柱狀態的縱剖面圖。
第四圖是具備從下支持基板的支持銷的基板保持裝置的斜視圖。
第五圖是基板保持裝置的平面圖。
第六圖是基板保持裝置的主要部分縱剖面圖。
第七(a)圖表示夾頭的平面圖，第七(b)圖是夾頭的側面圖。
第八(a)圖表示夾頭把持晶圓狀態的平面圖，第八(b)圖表示夾頭解放晶圓的平面圖。
第九圖是第二圖的A-A線剖面圖。
第十圖是第九圖的B-B線剖面圖。
第十一圖是用來說明第二磁石與第三磁石的配置的概略圖，從支柱的軸方向來看的圖。
第十二圖是以升降機使支柱上昇時的第二圖所示的A-A線剖面圖。
第十三圖是第十二圖的C-C線剖面圖。
第十四圖是設有四個支柱的下端彼此連接的連接環的剖面圖。
第十五圖是設有四個支柱的下端彼此連接的連接環的平面圖。
以下，參照第一~十五圖來說明關於本發明的基板保持裝置的實施形態。
第一圖表示關於本發明的基板保持裝置的整體結構的縱剖面圖。第二圖表示第一圖所示的基板保持裝置的平面圖。
如第一及二圖所示，基板保持裝置具備：基台1，具有四個臂1a；四個支柱，被支持於各臂1a的前端；以及四個夾頭，分別設於這些支柱2的上端。各支柱2可相對於該基台在上下方向相對移動，且各支柱2被構成為可在其軸心周圍旋轉。支柱2具有：夾頭3，把持做為基板一例的晶圓W的周緣部。支柱2及夾頭3在將基台1的中心做為中心的圓的圓周上被等間隔地配置。也就是說，支柱2及夾頭3沿著晶圓W的周緣部被等間隔地配置。
基台1被固定於旋轉軸5的上端，此旋轉軸5被軸承6支持成自由旋轉。軸承6被固定於圓筒體7的內周面，圓筒體7被配置成包圍旋轉軸5。圓筒體7的下端被安裝於架台9，其位置被固定。旋轉軸5經由滑輪11、12以及帶14連接於馬達15。藉由驅動馬達15，基台1將其軸心作為中心來旋轉。晶圓W被夾頭3把持，被馬達15在晶圓W的中心軸線周圍旋轉。
使支柱2上昇的升降機20被配置成包圍圓筒體7。此升降機20被構成為可相對於圓筒體7在上下方向滑動。升降機20具有提昇四個支柱2的四個推動器20a。在圓筒體7的外周面與升降機20的內周面之間，形成有第一氣體腔21與第二氣體腔22。這些第一氣體腔21與第二氣體腔22分別連通第一氣體流路24及第二氣體流路25，這些第一氣體流路24及第二氣體流路25被連接於圖未顯示的加壓氣體供給源。
第三圖表示第一圖所示的基板保持裝置中，以升降機上昇支柱狀態的縱剖面圖。當第一氣體腔21內的壓力變得比第二氣體腔22內的壓力高時，如第三圖所示，升降機20上昇。另一方面，當第二氣體腔22內的壓力變得比第一氣體腔21內的壓力高時，如第一圖所示，升降機20下降。藉由升降機20，四個支柱2及四個夾頭3會同時上昇下降。
在基台1的上面，固定有旋轉套28。此旋轉套28接住因離心力從旋轉的晶圓W飛出的液體。如第一圖所示，旋轉套28被配置成包圍晶圓W全周。旋轉套28的縱剖面形狀向徑內側方向傾斜。又，旋轉套28的內周面是由平滑曲面所構成。旋轉套28的上端接近晶圓W，旋轉套28的上端的內徑比晶圓W的直徑略大。在旋轉套28的上端，形成有沿著支柱2的外周面形狀的缺口28a。在旋轉套28的底面形成有傾斜延伸的液體排出孔(圖未顯示)。如第三圖所示，當升降機20上昇，則支柱2及夾頭3上昇，晶圓W位於比旋轉套28的上端更上方。
第四至六圖表示具備在相鄰接的夾頭3、3間從下支持基板的支持銷的基板保持裝置的圖。第四圖是基板保持裝置的斜視圖，第五圖是基板保持裝置的平面圖，第六圖是基板保持裝置的主要部分縱剖面圖。
如第四及五圖所示，在基板保持裝置設置有：支持銷4，在相鄰接的夾頭3、3間從下支持晶圓W。也就是說，在四個夾頭3之間，在垂直方向延伸的四個支持銷4在以基台1的中心為中心的圓的圓周上於間隔配置。四個支持銷4位於比四個夾頭3位於的圓周上還略靠近半徑方向內側。
第六圖是設置於基板保持裝置的支持銷4之一的縱剖面圖。如第六圖所示，支持銷4整體被形成為棒狀，上端部成為半球面4a，下端部成為螺桿部4b。支持銷4藉由螺桿部4b螺合於基台1而被固定於基台1。支持銷4的半球面4a其頂點以點接觸於晶圓W的下面來支持晶圓W。支持銷4的半球面4a的頂點被設定成與以四個夾頭3保持在水平姿勢的晶圓W的外周部的下方略相同的高度，或略低的高度。具體來說，四個支持銷4的半球面4a的頂點被設定成比晶圓W的外周部的下面僅低0mm~0.1mm的高度。
根據本發明的基板保持裝置，如第四至六圖所示，因為在相鄰接的夾頭3、3間設置從下支持晶圓W的支持銷4，所以即使晶圓直徑變大，也可以使因晶圓自體重量導致的可撓量做為最小限度。
又，因為除了晶圓的周邊以四點等間隔支持以外，晶圓W的外周部的下面以支持消4支持，所以可改變晶圓的固有振動數。因此，為了使晶圓旋轉乾燥，即使在例如1500~3000min-1的速度下高速旋轉的情況下，不會 使晶圓的旋轉速度接近晶圓的固有振動數，可抑制晶圓的振動。
第七(a)圖表示夾頭3的平面圖，第七(b)圖是夾頭3的側面圖。夾頭3被形成於支柱2的上端的偏心位置。此夾頭3藉由抵接於晶圓W的周緣部來把持晶圓W的周緣部。在支柱2的上端，更形成有從夾頭3向支柱2的軸心延伸的定位部41。定位部41的一端被一體連接於夾頭3的側面，令一端位於支柱2的軸心上。此定位部41的中心側的端部具有沿著支柱2與同心的圓彎曲的側面41a。支柱2的上端成為向下方傾斜的錐形面。
第八(a)圖表示夾頭3把持晶圓W狀態的平面圖，第八(b)圖表示夾頭3解放晶圓W的平面圖。晶圓W被載置於支柱2的上端(錐形面)上，然後藉由使支柱2旋轉，使夾頭3抵接於晶圓W的周緣部。藉此，如第八(a)圖所示，晶圓W被夾頭3把持。當支柱2往相反方向旋轉時，如第八(b)圖所示，夾頭3離開晶圓W，藉此解放晶圓W。此時，晶圓W的周緣部接觸定位部41的中心側端部的側面41a。因此，藉由定位部41的側面41a，可限制支柱2旋轉時的晶圓W的移位，可以提昇之後的晶圓搬送的穩定性。
第九圖是第二圖的A-A線剖面圖，第十圖是第九圖的B-B線剖面圖。在第九及十圖省略旋轉套28的圖示。基台1的臂1a具有保持支柱2成可自由滑動的保持部件1b。此保持部件1b也可以與臂1a構成為一體。在保持部件1b，形成有上下延伸的貫穿孔，支柱2被插入此貫穿孔。貫穿孔的直徑比支柱2的直徑略大，因此，支柱2可相對於基台1在上下方向相對移動，再者，支柱2可在其軸心周圍旋轉。
基板保持裝置具有：彈簧30，將支柱2向其軸方向推抵。在基台1的保持部件1b的下面，安裝有外側蓋31。外側蓋31具有包圍彈簧30的上側部位的內周面。在本實施形態中，外側蓋31被配置成包圍彈簧30的上半部分。彈簧30的上端接觸形成於外側蓋31的上端的內側凸緣32。內側凸緣32也可以省略。在此情況下，彈簧30的上端接觸基台1的保持部件1b的下面。外側蓋31的內周面的直徑與彈簧30的外徑一樣，或略大。在本實施形態中，外側蓋31的內周面的直徑比彈簧30的外徑略大。
在支柱2的下部，安裝有內側軸環33。此內側軸環33是具有圓筒狀形狀的部件。彈簧30被配置成包圍支柱2及內側軸環33。內側軸環33被配置於彈簧30的內側，具有支持彈簧30的下側部位的外周面。內側軸環33的外周面的直徑與彈簧30的內徑相同或略小。在本實施形態中，內側軸環33的外周面的直徑與彈簧30的內徑相同，內側軸環33的外周面接觸彈簧30的下側部位。再者，內側軸環33的外周面的直徑比支柱2的外周面的直徑更大。外側蓋31與內側軸環33是由耐磨耗性高的樹脂所構成。例如，外側蓋31與內側軸環33是由PTFE(聚四氟乙烯)所構成。
在內側軸環33的下端，連接有彈簧停止器35。在本實施形態中，彈簧停止器35與內側軸環33被形成為一體，但內側軸環33與彈簧停止器35也可以是不同部件。支柱2被連接於內側軸環33成可在其軸心周圍旋轉。也就是說，支柱2可相對於內側軸環33及彈簧停止器35相對旋轉。
彈簧30的上端按壓基台1的保持部件1b，彈簧30的下端壓著連接於支柱2的彈簧停止器35。因此，本實施形態的彈簧30將支柱2向下方推抵。在支柱2的外周面，形成有支柱停止器2a，支柱停止器2a具有比保持部件1b的貫穿孔的直徑更大的徑。此支柱停止器2a位於基台1的保持部件1b的更上方。因此，如第九圖所示，支柱2向下方的移動被支柱停止器2a所限制。
在基台1的保持部件1b埋設有第一磁石43。在支柱2內配置有第二磁石44及第三磁石45。這些第二磁石44及第三磁石45在上下方向分離配列。做為這些第一~第三磁石43、44、45，較佳使用釹磁石。
第十一圖是用來說明第二磁石44與第三磁石45的配置的概略圖，從支柱2的軸方向來看的圖。如第十一圖所示，第二磁石44與第三磁石45在支柱2的周方向分離配置。也就是說，第二磁石44與支柱2的中心的連接線，及第三磁石45與支柱2的中心的連接線，從支柱2的軸方向來看相交為特定角度α。
支柱2位於第九圖所示的下降位置時，第二磁石44接近第三磁石45，第三磁石離開第一磁石43。此時，第一磁石43與第二磁石44 之間有吸引力運作。此引力將在支柱2軸心周圍旋轉的力施加於支柱2，其旋轉方向是夾頭3按壓晶圓W的周緣部的方向。因此，第九圖所示的下降位置成為保持晶圓W的夾鉗位置。
第十二圖是以升降機20使支柱2上昇時的第二圖所示的A-A線剖面圖，第十三圖是第十二圖的C-C線剖面圖。當以升降機20使支柱2上昇至第十二圖所示的上昇位置時，如第十二及十三圖所示，第三磁石45接近第一磁石43，第二磁石44離開第一磁石43。此時，第一磁石43與第三磁石45之間有吸引力運作。此引力將在支柱2軸心周圍旋轉的力施加於支柱2，其旋轉方向是夾頭3離開晶圓W的方向。因此，第十二圖所示的上昇位置是釋放基板的非夾鉗位置。
因為第二磁石44與第三磁石45在支柱2的周方向被配置在不同位置，所以隨著支柱2的上下移動，旋轉力作用於支柱2。藉此旋轉力，把持晶圓W的力與解放晶圓W的力被施加於夾頭3。因此，僅使支柱2上下移動，夾頭3可把持且解放晶圓W。如此，第一磁石43、第二磁石44及第三磁石45做為使夾頭3在支柱2的軸心周圍旋轉的旋轉機構來運作。此旋轉機構隨著支柱2的上下移動來動作。
支柱2被升降機20上昇時，升降機20的推動器20a接觸彈簧停止器35。因為支柱2獨立於彈簧停止器35自由旋轉，所以支柱2上昇並在其軸心周圍平穩地旋轉，另一方面，彈簧停止器35及內側軸環33不旋轉。如第十二圖所示，支柱2抵抗彈簧30的力上昇時，內側軸環33被收容於外側蓋31內。內側軸環33的外周面與外側蓋31的內周面之間形成有圓筒狀的空間，被壓縮的彈簧30被收容於此圓筒狀的空間內。升降機20是抵抗彈簧30的力使支柱2在其軸方向移動的移動機構。
在支柱2的側面，形成有沿著其軸心延伸的溝46。此溝46具有圓弧狀的水平剖面。在基台1的保持部件1b，形成有向著溝46突起的突起部47。此突起部47的前端位於溝46的內部，突起部47和緩地嚙合於溝46。此溝46及突起部47為了限制支柱2的旋轉角度而被設置。
如第三圖所示，當支柱2上昇，晶圓W上昇至比旋轉套28更高的位置，夾頭3離開晶圓W的周緣部。因此，搬送電動機等的搬送裝 置(圖未顯示)可從基板保持裝置取出晶圓W。
晶圓W如第一圖所示，在支柱2位於下降位置的狀態下，被馬達15旋轉。晶圓W被旋轉時，離心力作用於彈簧30。特別是在使晶圓W高速(例如1500~3000min-1)旋轉時，大離心力作用於彈簧30，彈簧30向外側變形。如此的彈簧30的變形使彈簧30疲勞，彈簧30比預期更快地破斷。
為了防止如此的彈簧30向外側變形，如第九圖所示，在彈簧30的外側設有外側蓋31，在彈簧30的內側設有內側軸環33。外側蓋31做為限制彈簧30的上側部位的，向相對於支柱2的軸方向為垂直方向的移動(移位)第一結構體來運作，內側軸環33做為限制彈簧30的下側部位的，向相對於支柱2的軸方向為垂直方向的移動(移位)第二結構體來運作。
旋轉晶圓W時，彈簧30的上側部位從外側被外側蓋31支持，彈簧30的下側部位從內側被內側軸環33。因此，即使強離心力作用於彈簧30，彈簧30向外側的變形，即彈簧30的往相對於支柱2的軸方向為垂直的方向的移動，被外側蓋31及內側軸環33所限制。因此，彈簧30幾乎沒有變形，也不會產生大的應力。結果，可防止非預期的彈簧30的破斷。又，如第三及十二圖所示，為了從夾頭3解放晶圓W，支柱2上昇時，因為內側軸環33被收容於外側蓋31，所以內側軸環33與外側蓋31不會妨礙支柱2的上昇，可以使機構緊密。
在晶圓W高速旋轉時，強離心力也作用於支柱2，有支柱2的端部向外側移位的狀況。結果，夾頭3保持晶圓W的力會有變得不穩定的可能性。因此，為了防止如此的支柱2的端部向外側移位，如第十四及十五圖所示，設有彼此連接四個支柱2的下端的連接環50。此連接環50被固定在各支柱2的下端所安裝的彈簧停止器35。因此，連接環50經由彈簧停止器35連接於各支柱2。連接環50與支柱2一起上下移動，連接環50也與藉由馬達15在晶圓W的軸心周圍旋轉的支柱2一體地旋轉。因為連接環50限制四個支柱2的相對位置，所以即使強的離心力施加於支柱2，也可以防止支柱2的端部向外側移位。因為支柱2被支持在臂1a與連接環 50的上下兩處，所以可防止晶圓W高速旋轉時的支柱2的變形。
上述實施形態是以本發明所屬技術領域的通常知識者能實施本發明為目的來記載者。所屬領域中具有通常知識者當然能完成上述實施形態的各種變形例，本發明的技術思想也可適用於其他實施形態。因此，本發明並非受限於所記載的實施形態，而是根據由申請專利範圍所定義的技術思想的最廣範圍來解釋者。
1:基台
2:支柱
3:夾頭
4:支持銷
4a:半球面
4b:螺桿部
28:旋轉套
W:晶圓

Claims (5)

  1. 一種基板保持裝置，保持基板的周緣部並使基板旋轉，其特徵在於具備：複數個支柱，被支持於基台，可相對於該基台在上下方向相對移動；升降機，使前述複數個支柱於上下方向上在上昇位置與下降位置間移動；複數個夾頭，分別設於前述複數個支柱，保持基板的周緣部；複數個支持銷，支持被前述複數個夾頭保持的基板的下面；以及；連接環，位於前述複數個支柱的下端，且連結前述複數個支柱的下端，前述複數個支柱處在前述上昇位置時，前述複數個支持銷從前述複數個支柱所載置的基板的下面離開，前述複數個支柱處在前述下降位置時，前述複數個夾頭保持基板的周緣部，且前述複數個支持銷支持基板外周部的下面，前述連接環係構成為與前述複數個支柱一起上下移動，且與前述複數個支柱一體地旋轉。
  2. 如申請專利範圍第1項所述之基板保持裝置，其中前述複數個持銷是在將前述基台的中心做為中心的圓的圓周方向上隔以間隔而設置。
  3. 如申請專利範圍第2項所述之基板保持裝置，其中前述複數個夾頭是在將前述基台的中心做為中心的圓的圓周方向於間隔配置，前述複數個支持銷各配置於相鄰接的兩個夾頭之間。
  4. 如申請專利範圍第1~3項中任一項所述之基板保持裝置，其中前述支持銷的上端部成半球面形狀。
  5. 如申請專利範圍第1~3項中任一項所述之基板保持裝置，其中前述支持銷被固定於前述基台。
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