TW201432839A - 運送裝置及處理裝置 - Google Patents

運送裝置及處理裝置 Download PDF

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Publication number
TW201432839A
TW201432839A TW102133851A TW102133851A TW201432839A TW 201432839 A TW201432839 A TW 201432839A TW 102133851 A TW102133851 A TW 102133851A TW 102133851 A TW102133851 A TW 102133851A TW 201432839 A TW201432839 A TW 201432839A
Authority
TW
Taiwan
Prior art keywords
wafer
transported
transport device
positioning
container
Prior art date
Application number
TW102133851A
Other languages
English (en)
Chinese (zh)
Inventor
小山勝彥
竹內靖
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201432839A publication Critical patent/TW201432839A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H10P72/1928—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier characterised by the presence of antistatic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
TW102133851A 2012-09-24 2013-09-18 運送裝置及處理裝置 TW201432839A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012209825A JP2014067744A (ja) 2012-09-24 2012-09-24 搬送装置及び処理装置

Publications (1)

Publication Number Publication Date
TW201432839A true TW201432839A (zh) 2014-08-16

Family

ID=50339012

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102133851A TW201432839A (zh) 2012-09-24 2013-09-18 運送裝置及處理裝置

Country Status (4)

Country Link
US (1) US20140086712A1 (https=)
JP (1) JP2014067744A (https=)
KR (1) KR20140040652A (https=)
TW (1) TW201432839A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105990196A (zh) * 2015-03-20 2016-10-05 东京毅力科创株式会社 夹持装置、基板输入输出装置以及基板处理装置
TWI905852B (zh) * 2024-04-01 2025-11-21 南亞科技股份有限公司 晶圓容器、晶圓容器的頂蓋及晶圓容器管理方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6211938B2 (ja) * 2014-01-27 2017-10-11 東京エレクトロン株式会社 基板熱処理装置、基板熱処理装置の設置方法
US10807948B2 (en) * 2015-03-11 2020-10-20 Peloton Therapeutics, Inc. Aromatic compounds and uses thereof
JP6772498B2 (ja) * 2016-03-18 2020-10-21 株式会社Sumco 基板収納容器
JP6693356B2 (ja) * 2016-09-09 2020-05-13 株式会社ダイフク 物品搬送装置
US11295973B2 (en) * 2020-02-11 2022-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for automated wafer carrier handling
KR102372514B1 (ko) * 2021-05-10 2022-03-10 주식회사 위존 Fims 시스템의 풉 고정장치
KR102372513B1 (ko) * 2021-05-10 2022-03-10 주식회사 위존 Fims 시스템
CN115184374A (zh) * 2022-06-28 2022-10-14 西安奕斯伟材料科技有限公司 晶圆片盒检测方法及装置、片盒清洗机

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2583253Y2 (ja) * 1992-07-09 1998-10-22 神鋼電機株式会社 搬送装置の帯電静電気放電装置
KR100221983B1 (ko) * 1993-04-13 1999-09-15 히가시 데쓰로 처리장치
JP2000100924A (ja) * 1998-09-18 2000-04-07 Seiko Epson Corp ウェハカセット及びハンドラー
US6591162B1 (en) * 2000-08-15 2003-07-08 Asyst Technologies, Inc. Smart load port with integrated carrier monitoring and fab-wide carrier management system
JP3939101B2 (ja) * 2000-12-04 2007-07-04 株式会社荏原製作所 基板搬送方法および基板搬送容器
US6875282B2 (en) * 2001-05-17 2005-04-05 Ebara Corporation Substrate transport container
JP2003092328A (ja) * 2001-09-18 2003-03-28 Dainippon Screen Mfg Co Ltd ロードポート装置
KR100481307B1 (ko) * 2001-11-08 2005-04-07 삼성전자주식회사 반도체 제조 설비의 카세트 테이블
US20050056441A1 (en) * 2002-10-01 2005-03-17 Rider Gavin Charles Reduction of electric-field-induced damage in field-sensitive articles
JP3962705B2 (ja) * 2003-06-05 2007-08-22 東京エレクトロン株式会社 処理装置
JP2005101241A (ja) * 2003-09-25 2005-04-14 Sumitomo Mitsubishi Silicon Corp 位置決め部材および容器の支持台
US7316325B2 (en) * 2003-11-07 2008-01-08 Entegris, Inc. Substrate container
TWI267483B (en) * 2004-08-16 2006-12-01 Ind Tech Res Inst Clean container module
US7922485B2 (en) * 2007-02-14 2011-04-12 Tokyo Electron Limited Vertical type heat processing apparatus and vertical type heat processing method
JP5134495B2 (ja) * 2008-10-16 2013-01-30 東京エレクトロン株式会社 処理装置及び処理方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105990196A (zh) * 2015-03-20 2016-10-05 东京毅力科创株式会社 夹持装置、基板输入输出装置以及基板处理装置
CN105990196B (zh) * 2015-03-20 2020-04-07 东京毅力科创株式会社 夹持装置、基板输入输出装置以及基板处理装置
TWI905852B (zh) * 2024-04-01 2025-11-21 南亞科技股份有限公司 晶圓容器、晶圓容器的頂蓋及晶圓容器管理方法

Also Published As

Publication number Publication date
JP2014067744A (ja) 2014-04-17
KR20140040652A (ko) 2014-04-03
US20140086712A1 (en) 2014-03-27

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