JP2014067744A - 搬送装置及び処理装置 - Google Patents

搬送装置及び処理装置 Download PDF

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Publication number
JP2014067744A
JP2014067744A JP2012209825A JP2012209825A JP2014067744A JP 2014067744 A JP2014067744 A JP 2014067744A JP 2012209825 A JP2012209825 A JP 2012209825A JP 2012209825 A JP2012209825 A JP 2012209825A JP 2014067744 A JP2014067744 A JP 2014067744A
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JP
Japan
Prior art keywords
storage container
wafer
positioning
transported body
positioning pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012209825A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014067744A5 (https=
Inventor
Katsuhiko Koyama
勝彦 小山
Yasushi Takeuchi
靖 竹内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2012209825A priority Critical patent/JP2014067744A/ja
Priority to US14/028,640 priority patent/US20140086712A1/en
Priority to TW102133851A priority patent/TW201432839A/zh
Priority to KR1020130112777A priority patent/KR20140040652A/ko
Publication of JP2014067744A publication Critical patent/JP2014067744A/ja
Publication of JP2014067744A5 publication Critical patent/JP2014067744A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H10P72/1928—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier characterised by the presence of antistatic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
JP2012209825A 2012-09-24 2012-09-24 搬送装置及び処理装置 Pending JP2014067744A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012209825A JP2014067744A (ja) 2012-09-24 2012-09-24 搬送装置及び処理装置
US14/028,640 US20140086712A1 (en) 2012-09-24 2013-09-17 Transportng apparatus and processing apparatus
TW102133851A TW201432839A (zh) 2012-09-24 2013-09-18 運送裝置及處理裝置
KR1020130112777A KR20140040652A (ko) 2012-09-24 2013-09-23 반송 장치 및 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012209825A JP2014067744A (ja) 2012-09-24 2012-09-24 搬送装置及び処理装置

Publications (2)

Publication Number Publication Date
JP2014067744A true JP2014067744A (ja) 2014-04-17
JP2014067744A5 JP2014067744A5 (https=) 2015-04-02

Family

ID=50339012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012209825A Pending JP2014067744A (ja) 2012-09-24 2012-09-24 搬送装置及び処理装置

Country Status (4)

Country Link
US (1) US20140086712A1 (https=)
JP (1) JP2014067744A (https=)
KR (1) KR20140040652A (https=)
TW (1) TW201432839A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160113013A (ko) 2015-03-20 2016-09-28 도쿄엘렉트론가부시키가이샤 클램프 장치 및 이것을 이용한 기판 반입출 장치, 및 기판 처리 장치

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6211938B2 (ja) * 2014-01-27 2017-10-11 東京エレクトロン株式会社 基板熱処理装置、基板熱処理装置の設置方法
US10807948B2 (en) * 2015-03-11 2020-10-20 Peloton Therapeutics, Inc. Aromatic compounds and uses thereof
JP6772498B2 (ja) * 2016-03-18 2020-10-21 株式会社Sumco 基板収納容器
JP6693356B2 (ja) * 2016-09-09 2020-05-13 株式会社ダイフク 物品搬送装置
US11295973B2 (en) * 2020-02-11 2022-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for automated wafer carrier handling
KR102372514B1 (ko) * 2021-05-10 2022-03-10 주식회사 위존 Fims 시스템의 풉 고정장치
KR102372513B1 (ko) * 2021-05-10 2022-03-10 주식회사 위존 Fims 시스템
CN115184374A (zh) * 2022-06-28 2022-10-14 西安奕斯伟材料科技有限公司 晶圆片盒检测方法及装置、片盒清洗机
US20250308963A1 (en) * 2024-04-01 2025-10-02 Nanya Technology Corporation Wafer container, top cover thereof, and method for managing wafer containers

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH069098U (ja) * 1992-07-09 1994-02-04 神鋼電機株式会社 搬送装置の帯電静電気放電装置
JP2000100924A (ja) * 1998-09-18 2000-04-07 Seiko Epson Corp ウェハカセット及びハンドラー
JP2002261159A (ja) * 2000-12-04 2002-09-13 Ebara Corp 基板搬送容器
JP2003092328A (ja) * 2001-09-18 2003-03-28 Dainippon Screen Mfg Co Ltd ロードポート装置
JP2003282672A (ja) * 2001-11-08 2003-10-03 Samsung Electronics Co Ltd 半導体製造設備のカセットテーブル
JP2004363363A (ja) * 2003-06-05 2004-12-24 Tokyo Electron Ltd 搬送装置及び処理装置並びに搬送方法
JP2005101241A (ja) * 2003-09-25 2005-04-14 Sumitomo Mitsubishi Silicon Corp 位置決め部材および容器の支持台

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100221983B1 (ko) * 1993-04-13 1999-09-15 히가시 데쓰로 처리장치
US6591162B1 (en) * 2000-08-15 2003-07-08 Asyst Technologies, Inc. Smart load port with integrated carrier monitoring and fab-wide carrier management system
US6875282B2 (en) * 2001-05-17 2005-04-05 Ebara Corporation Substrate transport container
US20050056441A1 (en) * 2002-10-01 2005-03-17 Rider Gavin Charles Reduction of electric-field-induced damage in field-sensitive articles
US7316325B2 (en) * 2003-11-07 2008-01-08 Entegris, Inc. Substrate container
TWI267483B (en) * 2004-08-16 2006-12-01 Ind Tech Res Inst Clean container module
US7922485B2 (en) * 2007-02-14 2011-04-12 Tokyo Electron Limited Vertical type heat processing apparatus and vertical type heat processing method
JP5134495B2 (ja) * 2008-10-16 2013-01-30 東京エレクトロン株式会社 処理装置及び処理方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH069098U (ja) * 1992-07-09 1994-02-04 神鋼電機株式会社 搬送装置の帯電静電気放電装置
JP2000100924A (ja) * 1998-09-18 2000-04-07 Seiko Epson Corp ウェハカセット及びハンドラー
JP2002261159A (ja) * 2000-12-04 2002-09-13 Ebara Corp 基板搬送容器
JP2003092328A (ja) * 2001-09-18 2003-03-28 Dainippon Screen Mfg Co Ltd ロードポート装置
JP2003282672A (ja) * 2001-11-08 2003-10-03 Samsung Electronics Co Ltd 半導体製造設備のカセットテーブル
JP2004363363A (ja) * 2003-06-05 2004-12-24 Tokyo Electron Ltd 搬送装置及び処理装置並びに搬送方法
JP2005101241A (ja) * 2003-09-25 2005-04-14 Sumitomo Mitsubishi Silicon Corp 位置決め部材および容器の支持台

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160113013A (ko) 2015-03-20 2016-09-28 도쿄엘렉트론가부시키가이샤 클램프 장치 및 이것을 이용한 기판 반입출 장치, 및 기판 처리 장치
JP2016178232A (ja) * 2015-03-20 2016-10-06 東京エレクトロン株式会社 クランプ装置及びこれを用いた基板搬入出装置、並びに基板処理装置
US9857124B2 (en) 2015-03-20 2018-01-02 Tokyo Electron Limited Clamp apparatus, substrate carry-in/out apparatus using the same, and substrate processing apparatus
TWI651802B (zh) * 2015-03-20 2019-02-21 日商東京威力科創股份有限公司 夾持裝置及使用此夾持裝置之基板運入運出裝置與基板處理裝置

Also Published As

Publication number Publication date
KR20140040652A (ko) 2014-04-03
TW201432839A (zh) 2014-08-16
US20140086712A1 (en) 2014-03-27

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