JP5134495B2 - 処理装置及び処理方法 - Google Patents
処理装置及び処理方法 Download PDFInfo
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- JP5134495B2 JP5134495B2 JP2008267584A JP2008267584A JP5134495B2 JP 5134495 B2 JP5134495 B2 JP 5134495B2 JP 2008267584 A JP2008267584 A JP 2008267584A JP 2008267584 A JP2008267584 A JP 2008267584A JP 5134495 B2 JP5134495 B2 JP 5134495B2
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- 238000012545 processing Methods 0.000 title claims description 16
- 238000003672 processing method Methods 0.000 title claims description 7
- 238000003825 pressing Methods 0.000 claims description 64
- 230000007246 mechanism Effects 0.000 claims description 61
- 238000012546 transfer Methods 0.000 claims description 55
- 238000003860 storage Methods 0.000 claims description 52
- 238000005192 partition Methods 0.000 claims description 39
- 239000011261 inert gas Substances 0.000 claims description 10
- 238000000638 solvent extraction Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 26
- 238000010438 heat treatment Methods 0.000 description 24
- 230000003028 elevating effect Effects 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 229910001873 dinitrogen Inorganic materials 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 230000007723 transport mechanism Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Description
1 熱処理装置
2 筐体
3 フープ(収納容器)
5 隔壁
7 移載ステージ(載置部)
11 取出し口
12 蓋
13 蓋開閉機構
14 フランジ部
25 開口部
27 扉
32 移載機構
39 押圧機構
40 収納位置
41 押圧アーム
42 駆動部
43 支軸
45 リンク
Claims (4)
- 複数の被処理体が収納され、上部にフランジ部が設けられ、前面の取出し口に蓋が着脱可能に取付けられた収納容器を搬入する搬入領域と、該搬入領域とは異なる雰囲気に維持された移載領域と、前記搬入領域と移載領域を区画する隔壁と、該隔壁に形成された開口部と、該開口部を開閉する扉と、前記収納容器を搬入領域側に配置する載置部とを備え、前記収納容器を載置部に載置して保持した後開口部に当接させ、前記扉及び蓋を開いて収納容器内の被処理体を移載領域側に搬送して処理する処理装置において、
前記開口部に当接された収納容器の前記フランジ部を前記開口部側に押圧する押圧機構を設け、該押圧機構は、搬入領域の一側の収納位置に支軸を介して水平に旋回可能に設けられ前記フランジ部の後部を押圧する押圧アームと、該押圧アームを駆動すべく前記収納位置に上下方向に設けられた駆動シリンダと、該駆動シリンダの出力部と前記押圧アームの長手方向略中間部との間に掛け渡され、前記出力部の上下方向の力を押圧アームの旋回方向の力に変換するリンクとを有することを特徴とする処理装置。 - 前記搬入領域側の雰囲気は大気であり、前記移載領域側の雰囲気は不活性ガス又は清浄乾燥空気であることを特徴とする請求項1記載の処理装置。
- 複数の被処理体が収納され、上部にフランジ部が設けられ、前面の取出し口に蓋が着脱可能に取付けられた収納容器を搬入する搬入領域と、該搬入領域とは異なる雰囲気に維持された移載領域と、前記搬入領域と移載領域を区画する隔壁と、該隔壁に形成された開口部と、該開口部を開閉する扉と、前記収納容器を搬入領域側に配置する載置部とを備え、前記収納容器を載置部に載置して保持した後開口部に当接させ、前記扉及び蓋を開いて収納容器内の被処理体を移載領域側に搬送して処理する処理方法において、
前記開口部に当接された収納容器の前記フランジ部を押圧機構により前記開口部側に押圧した後、前記扉及び蓋を開き、前記押圧機構は、搬入領域の一側の収納位置に支軸を介して水平に旋回可能に設けられ前記フランジ部の後部を押圧する押圧アームと、該押圧アームを駆動すべく前記収納位置に上下方向に設けられた駆動シリンダと、該駆動シリンダの出力部と前記押圧アームの長手方向略中間部との間に掛け渡され、前記出力部の上下方向の力を押圧アームの旋回方向の力に変換するリンクとを有することを特徴とする処理方法。 - 前記搬入領域側の雰囲気は大気であり、前記移載領域側の雰囲気は不活性ガス又は清浄乾燥空気であることを特徴とする請求項3記載の処理方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008267584A JP5134495B2 (ja) | 2008-10-16 | 2008-10-16 | 処理装置及び処理方法 |
TW098134859A TWI464822B (zh) | 2008-10-16 | 2009-10-15 | 處理裝置及處理方法 |
KR1020090097961A KR101302812B1 (ko) | 2008-10-16 | 2009-10-15 | 처리 장치 및 처리 방법 |
US12/579,519 US8414242B2 (en) | 2008-10-16 | 2009-10-15 | Processing apparatus and processing method |
CN200910179979.2A CN101728238B (zh) | 2008-10-16 | 2009-10-16 | 处理装置及处理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008267584A JP5134495B2 (ja) | 2008-10-16 | 2008-10-16 | 処理装置及び処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010098121A JP2010098121A (ja) | 2010-04-30 |
JP5134495B2 true JP5134495B2 (ja) | 2013-01-30 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2008267584A Active JP5134495B2 (ja) | 2008-10-16 | 2008-10-16 | 処理装置及び処理方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8414242B2 (ja) |
JP (1) | JP5134495B2 (ja) |
KR (1) | KR101302812B1 (ja) |
CN (1) | CN101728238B (ja) |
TW (1) | TWI464822B (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5617708B2 (ja) * | 2011-03-16 | 2014-11-05 | 東京エレクトロン株式会社 | 蓋体開閉装置 |
NL1038714C2 (nl) * | 2011-03-30 | 2012-10-02 | Ferdar Automation Technology Nederland B V | Opslag- en/of orderverzamelsysteem. |
US9387787B1 (en) * | 2011-08-26 | 2016-07-12 | McClinton Energy Group, LLC | Portable storage unit for storing fluid particulates |
JP5894825B2 (ja) * | 2012-03-21 | 2016-03-30 | 東京エレクトロン株式会社 | プローブ装置及びウエハ搬送ユニット |
TWI518832B (zh) * | 2012-04-26 | 2016-01-21 | 因特瓦克公司 | 真空處理系統架構 |
JP2014067744A (ja) * | 2012-09-24 | 2014-04-17 | Tokyo Electron Ltd | 搬送装置及び処理装置 |
JP6111171B2 (ja) * | 2013-09-02 | 2017-04-05 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
CN104576461A (zh) * | 2014-12-31 | 2015-04-29 | 上海新阳半导体材料股份有限公司 | 晶圆存储盒开盖装置 |
NL1041164B1 (nl) | 2015-01-30 | 2016-10-12 | I-Collector Holding B V | Inrichting en werkwijze voor het beheren van de opslag van artikelen. |
CN106128990A (zh) * | 2016-08-25 | 2016-11-16 | 深圳市捷佳伟创新能源装备股份有限公司 | 一种用于扩散炉内的石英舟传送机构 |
KR20180045316A (ko) * | 2016-10-25 | 2018-05-04 | 삼성전자주식회사 | 설비 전방 단부 모듈 및 이를 포함하는 반도체 제조 장치 |
CN108962804B (zh) * | 2017-05-19 | 2021-08-10 | 沈阳芯源微电子设备股份有限公司 | 一种不间断式进片回片装置及控制方法 |
JP6939335B2 (ja) * | 2017-09-27 | 2021-09-22 | Tdk株式会社 | ロードポート装置、ロードポート装置の駆動方法 |
JP7422577B2 (ja) | 2020-03-23 | 2024-01-26 | 平田機工株式会社 | ロードポート及び制御方法 |
CN112885759A (zh) * | 2021-01-14 | 2021-06-01 | 上海新昇半导体科技有限公司 | 圆传送盒顶部连接件的拆除装置及拆除方法 |
KR102372514B1 (ko) * | 2021-05-10 | 2022-03-10 | 주식회사 위존 | Fims 시스템의 풉 고정장치 |
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2008
- 2008-10-16 JP JP2008267584A patent/JP5134495B2/ja active Active
-
2009
- 2009-10-15 KR KR1020090097961A patent/KR101302812B1/ko active IP Right Grant
- 2009-10-15 TW TW098134859A patent/TWI464822B/zh not_active IP Right Cessation
- 2009-10-15 US US12/579,519 patent/US8414242B2/en active Active
- 2009-10-16 CN CN200910179979.2A patent/CN101728238B/zh active Active
Also Published As
Publication number | Publication date |
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JP2010098121A (ja) | 2010-04-30 |
KR20100042601A (ko) | 2010-04-26 |
TWI464822B (zh) | 2014-12-11 |
US8414242B2 (en) | 2013-04-09 |
TW201029096A (en) | 2010-08-01 |
CN101728238B (zh) | 2013-04-10 |
KR101302812B1 (ko) | 2013-09-02 |
US20100098517A1 (en) | 2010-04-22 |
CN101728238A (zh) | 2010-06-09 |
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