KR20140040652A - 반송 장치 및 처리 장치 - Google Patents

반송 장치 및 처리 장치 Download PDF

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Publication number
KR20140040652A
KR20140040652A KR1020130112777A KR20130112777A KR20140040652A KR 20140040652 A KR20140040652 A KR 20140040652A KR 1020130112777 A KR1020130112777 A KR 1020130112777A KR 20130112777 A KR20130112777 A KR 20130112777A KR 20140040652 A KR20140040652 A KR 20140040652A
Authority
KR
South Korea
Prior art keywords
storage container
wafer
positioning
positioning pin
grounding element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020130112777A
Other languages
English (en)
Korean (ko)
Inventor
가츠히코 오야마
야스시 다케우치
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20140040652A publication Critical patent/KR20140040652A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H10P72/1928—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier characterised by the presence of antistatic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
KR1020130112777A 2012-09-24 2013-09-23 반송 장치 및 처리 장치 Withdrawn KR20140040652A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-209825 2012-09-24
JP2012209825A JP2014067744A (ja) 2012-09-24 2012-09-24 搬送装置及び処理装置

Publications (1)

Publication Number Publication Date
KR20140040652A true KR20140040652A (ko) 2014-04-03

Family

ID=50339012

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130112777A Withdrawn KR20140040652A (ko) 2012-09-24 2013-09-23 반송 장치 및 처리 장치

Country Status (4)

Country Link
US (1) US20140086712A1 (https=)
JP (1) JP2014067744A (https=)
KR (1) KR20140040652A (https=)
TW (1) TW201432839A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160113013A (ko) * 2015-03-20 2016-09-28 도쿄엘렉트론가부시키가이샤 클램프 장치 및 이것을 이용한 기판 반입출 장치, 및 기판 처리 장치
KR102372513B1 (ko) * 2021-05-10 2022-03-10 주식회사 위존 Fims 시스템
KR102372514B1 (ko) * 2021-05-10 2022-03-10 주식회사 위존 Fims 시스템의 풉 고정장치

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6211938B2 (ja) * 2014-01-27 2017-10-11 東京エレクトロン株式会社 基板熱処理装置、基板熱処理装置の設置方法
US10807948B2 (en) * 2015-03-11 2020-10-20 Peloton Therapeutics, Inc. Aromatic compounds and uses thereof
JP6772498B2 (ja) * 2016-03-18 2020-10-21 株式会社Sumco 基板収納容器
JP6693356B2 (ja) * 2016-09-09 2020-05-13 株式会社ダイフク 物品搬送装置
US11295973B2 (en) * 2020-02-11 2022-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for automated wafer carrier handling
CN115184374A (zh) * 2022-06-28 2022-10-14 西安奕斯伟材料科技有限公司 晶圆片盒检测方法及装置、片盒清洗机
US20250308963A1 (en) * 2024-04-01 2025-10-02 Nanya Technology Corporation Wafer container, top cover thereof, and method for managing wafer containers

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2583253Y2 (ja) * 1992-07-09 1998-10-22 神鋼電機株式会社 搬送装置の帯電静電気放電装置
KR100221983B1 (ko) * 1993-04-13 1999-09-15 히가시 데쓰로 처리장치
JP2000100924A (ja) * 1998-09-18 2000-04-07 Seiko Epson Corp ウェハカセット及びハンドラー
US6591162B1 (en) * 2000-08-15 2003-07-08 Asyst Technologies, Inc. Smart load port with integrated carrier monitoring and fab-wide carrier management system
JP3939101B2 (ja) * 2000-12-04 2007-07-04 株式会社荏原製作所 基板搬送方法および基板搬送容器
US6875282B2 (en) * 2001-05-17 2005-04-05 Ebara Corporation Substrate transport container
JP2003092328A (ja) * 2001-09-18 2003-03-28 Dainippon Screen Mfg Co Ltd ロードポート装置
KR100481307B1 (ko) * 2001-11-08 2005-04-07 삼성전자주식회사 반도체 제조 설비의 카세트 테이블
US20050056441A1 (en) * 2002-10-01 2005-03-17 Rider Gavin Charles Reduction of electric-field-induced damage in field-sensitive articles
JP3962705B2 (ja) * 2003-06-05 2007-08-22 東京エレクトロン株式会社 処理装置
JP2005101241A (ja) * 2003-09-25 2005-04-14 Sumitomo Mitsubishi Silicon Corp 位置決め部材および容器の支持台
US7316325B2 (en) * 2003-11-07 2008-01-08 Entegris, Inc. Substrate container
TWI267483B (en) * 2004-08-16 2006-12-01 Ind Tech Res Inst Clean container module
US7922485B2 (en) * 2007-02-14 2011-04-12 Tokyo Electron Limited Vertical type heat processing apparatus and vertical type heat processing method
JP5134495B2 (ja) * 2008-10-16 2013-01-30 東京エレクトロン株式会社 処理装置及び処理方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160113013A (ko) * 2015-03-20 2016-09-28 도쿄엘렉트론가부시키가이샤 클램프 장치 및 이것을 이용한 기판 반입출 장치, 및 기판 처리 장치
KR102372513B1 (ko) * 2021-05-10 2022-03-10 주식회사 위존 Fims 시스템
KR102372514B1 (ko) * 2021-05-10 2022-03-10 주식회사 위존 Fims 시스템의 풉 고정장치

Also Published As

Publication number Publication date
JP2014067744A (ja) 2014-04-17
TW201432839A (zh) 2014-08-16
US20140086712A1 (en) 2014-03-27

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PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PC1202 Submission of document of withdrawal before decision of registration

St.27 status event code: N-1-6-B10-B11-nap-PC1202

WITB Written withdrawal of application
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000