TW201412449A - 無鉛焊球 - Google Patents

無鉛焊球 Download PDF

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Publication number
TW201412449A
TW201412449A TW102122957A TW102122957A TW201412449A TW 201412449 A TW201412449 A TW 201412449A TW 102122957 A TW102122957 A TW 102122957A TW 102122957 A TW102122957 A TW 102122957A TW 201412449 A TW201412449 A TW 201412449A
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TW
Taiwan
Prior art keywords
solder ball
solder
mass
electrode
lead
Prior art date
Application number
TW102122957A
Other languages
English (en)
Other versions
TWI535518B (zh
Inventor
Yoshie Yamanaka
Ken Tachibana
Shunsaku Yoshikawa
Hikaru NOMURA
Original Assignee
Senju Metal Industry Co
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Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of TW201412449A publication Critical patent/TW201412449A/zh
Application granted granted Critical
Publication of TWI535518B publication Critical patent/TWI535518B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
    • B23K35/0261—Rods, electrodes, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
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    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
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Abstract

本發明係提供一種焊球，其係可抑制焊球之接合界面的界面剝離，且可抑制焊球與焊糊間所產生的未熔合之焊球，且係可同時使用鍍Au等之Ni電極部與在Cu上塗佈有水溶性預助焊劑之Cu電極部的焊球。本發明係一種焊球，其係Ag 1.6~2.9質量%、Cu 0.7~0.8質量%、Ni 0.05~0.08質量%、殘餘部分Sn之BGA或CSP之電極用無鉛焊球，且係即使接合的印刷基板為Cu電極、表面處理使用鍍Au或鍍Au/Pd之Ni電極時，亦為耐熱疲勞性與耐落下衝擊性兩者均優異的無鉛焊球。另外，亦可在該組成中添加合計量為0.003~0.1質量%之選自Fe、Co、Pt中之1種以上的元素、或合計量為0.003~0.1質量%之選自Bi、In、Sb、P、Ge中之1種以上的元素。

Description

無鉛焊球
本發明係有關一種使用於半導體等之電子零件的電極之無鉛焊球。
特別是有關因未熔合而產生不良狀況少的無鉛焊球。
近年來，由於電子機器之小型化、電子信號之高速化等，使用於電子機器之電子零件亦被小型化、多機能化。被小型化、多機能化的電子零件，有BGA(Ball Grid Array)、CSP(Chip Size Package)、MCM(Multi Chip Module)(下述稱BGA作為代表)。BGA係於BGA基板之背面作為電極而被設置於基板凸塊位置上。
為了在印刷基板上安裝BGA，以焊劑接合BGA之電極與印刷基板之焊盤(land)，惟由於對每一電極供應焊劑予以焊接時，需耗費繁雜的手續，且無法自外部將焊劑提供給在基板中間的電極。因此，使用預先將焊劑積聚於BGA之電極的方法。此係稱為焊接凸塊。
於形成BGA之焊接凸塊時，係使用焊球、焊糊等。以焊球形成焊接凸塊時，係在BGA之電極上塗佈黏著性 助焊劑，在塗佈有助焊劑之電極上載置焊球。然後，藉由以迴焊爐等之加熱裝置使該BGA基板加熱，以使焊球熔融，藉以在電極上形成焊接凸塊。而且，BGA基板等之半導體基板係總稱為模組基板。
另外，於晶圓之焊盤以焊糊形成焊接凸塊時，係在與晶圓之焊盤一致的地方放置穿設有與焊盤相同程度的孔之金屬罩，以刮漿板(squeegee)自金屬罩的上方刮平焊糊，將焊糊印刷塗佈於晶圓之焊盤上。然後，藉由迴焊爐使晶圓加熱，且使焊糊熔融，以形成焊接凸塊。
習知的BGA，係使用作為焊接凸塊形成用之Sn-Pb合金之焊球。該Sn-Pb焊球不僅對BGA之電極而言焊接性優異，特別是Sn-Pb之共晶組成具有於焊接時對BGA或印刷基板等不會有熱影響的熔點。而且，由於具有柔軟的Pb，即使所使用的電子零件或電子機器等掉落時，可吸收衝擊，且對電子零件或電子機器等之壽命有很大的貢獻。現在逐漸以世界性規模限制對Pb之使用，同時於習知的焊接時所使用的Sn-Pb之共晶組成亦受到規定限制。
以往，BGA用之無鉛焊球之組成，係使用Sn-3.0Ag-0.5Cu或Sn-4.0Ag-0.5Cu等之Sn-Ag-Cu系焊接合金。此等之無鉛焊接合金，雖具有優異的耐疲勞性，惟使用此等焊接合金組成之焊球的攜帶型電子機器，由於掉落時容易產生自焊球連接界面剝離的界面剝離情形，而導致耐落下衝擊性不佳。為了改善該耐落下衝擊性，係開發添加有Ni之Sn-Ag-Cu-Ni系焊接合金。
然而，此等之焊球中所使用的Sn-Ag-Cu系或Sn-Ag-Cu-Ni系焊接組成，與習知的Sn-Pb系焊劑相比時，由於濕潤性不佳，使用焊糊將BGA搭載於印刷基板上時，熔融的焊球之焊接成分與焊糊之焊接成分沒有完全混熔在一起，而產生於焊球與焊糊之間呈現Sn之氧化皮膜層之稱為「未熔合」現象的問題。如第1圖係表示BGA與印刷基板之接合例作為未熔合現象之一例。接合BGA零件1與安裝基板2之焊接凸塊3雖有熔合，但焊接凸塊4產生未熔合現象。第2圖係於安裝加熱後產生未熔合現象的由焊球5與焊糊6所構成的焊接凸塊。可用經擴大第2圖之第3圖確認產生未熔合現象的接合部7，由於僅單純地接觸，受到外來衝擊時，接合部容易被破壞。此外，產生未熔合現象時，對搭載有BGA之電子機器於掉落等之受到外來衝擊時，容易產生故障。
為防止因未熔合而產生之不良狀況，電子機器之製造商藉由以測定電子機器之電阻值等的方法，於事前檢查產生有未熔合的接合，藉此來修正或交換產生有未熔合的印刷基板以將故障防範於未然。
申請人揭示在如BGA等之模組的電極部上塗佈後助焊劑的方法(WO2006-134891A公報、專利文獻1)，作為在接合如BGA之模組與印刷基板時產生的未熔合之解決法。
作為BGA等用之Sn-Ag-Cu-Ni系焊球之組成，係揭示有：由(1)Ag：0.8~2.0%、(2)Cu：0.05~0.3%、以及 (3)選自In：0.01%以上、未達0.1%、Ni：0.01~0.04%、Co：0.01~0.05%與Pt：0.01~0.1%中的1種或2種以上、殘餘部分為Sn所構成的無鉛焊接合金(WO2006-129713A公報、專利文獻2)；一種無鉛焊接合金，其特徵為由含有Ag：1.0~2.0質量%、Cu：0.3~1.5質量%，殘餘部分為Sn及不可避免的雜質所構成。另外，一種無鉛焊接合金，其係含有Sb：0.005~1.5質量%、Zn：0.05~1.5質量%、Ni：0.05~1.5質量%、Fe：0.005~0.5質量%之1種或2種以上，且Sb、Zn、Ni、Fe之合計含量為1.5質量%以下(特開2002-239780號公報、專利文獻3)；一種無鉛焊接合金，其係以mass%計、0.1~1.5%之Ag、0.5~0.75%之Cu、且滿足12.5≦Cu/Ni≦100之關係的Ni、殘餘部分為Sn及不可避免的雜質所構成(WO2007/081006A公報、專利文獻4)；一種無鉛焊接合金，其係含有Ag：1.0~2.0質量%、Cu：0.3~1.0質量%、Ni：0.005~0.10質量%、殘餘部分為Sn及不可避免的雜質所構成(WO2007/102588A公報、專利文獻5)。
[先前技術文獻] [專利文獻]
專利文獻1：WO2006/134891A公報
專利文獻2：WO2006/129713A公報
專利文獻3：日本特開2002-239780號公報
專利文獻4：WO2007/081006A公報
專利文獻5：WO2007/102588A公報
於使用BGA等之安裝中，一般而言係為藉由在安裝基板上印刷例如由Sn-Ag-Cu合金粉末與助焊劑所構成的焊糊，且在BGA等上搭載形成有Sn-Ag-Cu系焊接合金凸塊之電子零件且予以加熱熔解，進行焊接之步驟。最近，於該步驟中即使於充分超過焊接合金之熔點的溫度下進行安裝，仍會有BGA等之模組基板之焊接凸塊與焊糊、或導引構件與焊糊沒有熔合而引起導通不良之稱為「未熔合」現象的問題。未熔合當然會引起導通不良的情形，會造成無法滿足作為電子機器製品之機能，視其狀況會有發展成市場索賠(market claim)問題之可能性。模組與印刷基板之焊接，與焊接印刷基板與翹曲少的晶片零件不同，其特徵為模組與印刷基板同時因迴焊處理時之加熱而產生大幅的翹曲情形。該現象雖於零件電極被無鉛化之前亦有被確認，惟因零件電極之無鉛化而被確認產生者相當多，故今後主流之無鉛焊接電極之對策變為當務之急。
未熔合現象對於BGA等模組之焊接凸塊表面之腐蝕的影響、或基板或零件之翹曲而言為主要原因而作用。特別是焊接凸塊表面，於形成凸塊時使用的助焊劑之洗淨不良、零件暴露於高溫高濕下時等，在凸塊表面上會產生堅固的氧化皮膜。本來扮演使該表面氧化皮膜清潔之作用者，係以表面安裝方法印刷於印刷基板之焊糊中的助焊劑。然而，在如前述之表面氧化皮膜堅固，表面為不易被 還原的狀態之外，於加熱安裝時產生基板或零件翹曲時，被印刷的焊糊與零件之焊接凸塊有時亦會產生分離，提高產生未熔合的可能性。對市場上報告中所謂ppm水準而言，實驗中當暴露於會使球表面腐蝕的高溫高濕時，其產生率確認上昇至50~70%之水平。
此次，本發明人等發現未熔合的原因除上述原因外，因焊球之組成所致之形成於焊料內部的化合物、Cu6Sn5或(Cu,Ni)6Sn5會產生影響。將接合有焊球的零件搭載於安裝基板時，對印刷塗佈有焊糊之安裝基板而言，係將接合有BGA等之模組的焊球之電極側朝向下方進行搭載。然後，進行加熱，使焊糊熔融且同時使焊球亦熔融而達成熔合。然而，形成於焊球內部之化合物Cu6Sn5或(Cu,Ni)6Sn5大量生成時，於焊球熔融時產生化合物於焊球內部沉降，且析出於凸塊最表面附近的現象。藉由該現象可知，係阻礙與糊料之熔合且引起未熔合的要因。(第3圖)
作為未熔合對策，係考慮在零件或安裝基板上皆沒有產生翹曲，提高焊糊之活性等。然而，以現今的技術，實際上不可能使基板翹曲消失，焊糊中助焊劑之活性化因為會促進與焊接粉末之反應，且就經時性變化而言恐會損害糊料信賴性而不易進行，故沒有有效的熔合不良的對策。因此，最終導致步驟增加而使成本隨之提高，一般而言以專利文獻1之方法解決未熔合現象。
本發明欲解決的課題，係在沒有採用增加專利文獻1 之步驟的方式，發現僅藉由焊球之組成，可解決未熔合的方法。
本發明人等發現未熔合原因，係在於為了改善焊球的落下衝擊時所添加的Ni，與Sn與Cu形成金屬間化合物，析出於焊球表面上，因此妨礙焊球之焊接成分、焊糊與焊接成分互相混合。而且，焊球之濕潤性亦起因於與焊糊之未熔合現象，伴隨Ag量減低，濕潤性亦隨之降低，此亦成為產生未熔合現象的原因之一。
因此，於Sn-Ag-Cu中含有Ni之4元合金中，藉由將Sn與Cu與Ni之量設定於一定範圍內，除可抑制Sn與Cu與Ni之金屬間化合物的生成量，且使析出於焊球表面之化合物變少外，藉由於與焊糊之熔合時發揮充分的濕潤性，可戲劇性地減低未熔合現象，遂而完成本發明。
本發明係有關一種無鉛焊球，其係安裝於BGA或CSP用之模組基板上，使用作為電極用之焊球，其中其焊接組成係由Ag 1.6~2.9質量%、Cu 0.7~0.8質量%、Ni 0.05~0.08質量%、殘餘部分Sn所構成。
為了提高焊球之熱疲勞特性時，藉由於焊球中添加Ag或Cu或Ni，形成Sn與Ag、Sn與Cu與Ni等之金屬間化合物，且藉由該金屬間化合物形成網目狀網絡，形成堅固的焊接合金。此外，為提高耐落下衝擊性時，如專利文獻4中採用添加Ni以取代減低硬的Ag之含量的方法。然而，為了提高強度時所添加的Ni，由於容易與Cu形成金屬間化合物而容易形成化合物，析出於焊球表面上，導 致焊球之濕潤性惡化。在該焊球表面上產生的濕潤性不佳的部分，即使搭載於印刷基板上且與焊糊一起過熱，在迴焊之加熱時間內亦不會與焊糊熔合，而在產生境界線的狀態下變硬。此乃為未熔合。
本案申請人著眼於Sn-Ag-Cu-Ni組成之焊接合金中，為了減少析出於焊球表面上之Ni化合物的量，若減少與Ni反應的Cu之量時，在焊球表面上不會析出Sn與Cu與Ni之金屬間化合物。然而，減少Cu量時，與Cu電極之焊接中耐落下衝擊性會降低。因此，本案申請人發現藉由將添加於焊接合金中之Cu的量設定於共晶點附近之0.75質量%左右，因形成網絡所致之Cu消耗，與Cu與Ni之化合物形成所致之Cu消耗會達平衡，在焊球表面上不會析出多量的Cu與Ni之化合物，且不會產生未熔合的現象。
換言之，藉由焊球組成為1.6~2.9質量%之Ag、0.7~0.8質量%之Cu、0.05~0.08質量%之Ni的4元合金組成，由於有Sn-Ag-Cu之金屬間化合物的網絡，及於其中被消耗減低的Cu與Ni反應而成的Cu-Ni之金屬間化合物存在，故Cu與Ni不優先進行反應，在焊球表面上亦沒有Cu與Ni之金屬間化合物析出於焊球表面上。因此，即使印刷基板與焊糊焊接，仍呈現良好的濕潤性，且不會產生未熔合現象。
本發明之焊球，由於在焊球表面上沒有析出濕潤性不佳的Sn與Cu與Ni之金屬間化合物，故可進行良好的焊接，即使使用印刷基板與焊糊時焊接時，仍可進行不會引起未熔合的良好焊接。
此外，本發明之焊球於Cu電極與Ni電極兩者之焊接時，可得耐熱疲勞性及耐落下衝擊性兩者優異的BGA等之電極與印刷基板之焊接接合。
1‧‧‧BGA零件
2‧‧‧安裝基板
3‧‧‧焊接凸塊 熔合
4‧‧‧焊接凸塊 未熔合
5‧‧‧安裝加熱後之焊球
6‧‧‧安裝加熱後之焊糊
7‧‧‧未熔合處
8‧‧‧熔合阻礙要因之化合物
9‧‧‧BGA側電極
10‧‧‧Cu6Sn5之金屬間化合物層
[第1圖]BGA與印刷基板之接合例。
[第2圖]第1圖之4的擴大圖。
[第3圖]係表示第2圖之焊球與焊糊接合界面產生未熔合之圖。
[第4圖]係表示表1之實施例2的BGA側電極之圖。
[第5圖]係表示表1之引用例6的BGA側電極之圖。
[為實施發明之形態]
本發明之沒有產生未熔合、且耐熱疲勞性及耐落下衝擊性兩者優異的焊球，以使用於對具有下面電極之BGA等之封裝零件形成凸塊者較佳。
於本發明之焊球的Sn-Ag-Cu-Ni系焊接合金中，Ag 之含量未達1.6質量%時，因焊球之濕潤性降低，導致對焊糊之濕潤性亦不佳，熔合性惡化，且容易產生未熔合現象。此外，Ag之含量未達1.6質量%時，焊接的強度降低且耐疲勞性變得不佳。Ag之含量超過2.9質量%時，焊球變硬且耐落下衝擊性惡化。因此，本發明之焊球用合金，以Ag之含量為1.6~2.9質量%為宜。更佳者為1.9~2.3質量%。
於本發明之焊球的Sn-Ag-Cu-Ni系焊接合金中，Cu之含量未達0.7質量%時，由於脫離Sn-Ag-Cu之共晶點，使用於Cu電極時，因Cu自Cu電極擴散於焊劑中，在Cu電極界面上Cu6Sn5之金屬間化合物層變厚，耐落下衝擊性惡化。
其次，Sn-Ag-Cu-Ni系焊接合金之Cu的含量超過0.8質量%時，由於焊球中之Cu與Ni之金屬間化合物量增加，在焊球表面上會有Cu與Ni之金屬間化合物量析出，未熔合現象變多。此外，Cu之含量超過0.8質量%時，由於脫離Sn-Ag-Cu之共晶點，因此在焊接合金與Cu電極之反應層中容易形成Cu6Sn5之金屬間化合物，結果在Cu電極與焊接接合部界面上所形成的Cu6Sn5之金屬間化合物變厚。
因此，本發明中沒有產生未熔合且耐落下衝擊性優異的焊球之Sn-Ag-Cu-Ni系焊接合金中所含有的Cu之含量必須為0.7~0.8質量%。
本發明之焊球的Sn-Ag-Cu-Ni系焊接合金中，Ni之 含量未達0.05質量%時，耐落下衝擊性惡化。另外，Ni之含量未達0.05質量%時，由於沒有呈現添加有Ni之效果，Ni變得容易自Ni電極擴散，且在界面上容易形成金屬間化合物，故Sn-Ag-Cu-Ni系焊接合金中之Ni的含量必須為0.05質量%以上。
同樣地，Ni之含量超過0.08質量%時，由於焊球中之Sn與Cu與Ni之金屬間化合物量增加，因在焊球表面上會有Sn與Cu與Ni之金屬間化合物量析出，未熔合產生率變高。此外，Ni之含量超過0.08質量%時，除了形成於接合界面上的金屬間化合物中之Ni濃度上昇使接合強度降低外，伴隨焊接硬度上昇，故受衝擊負荷時，變得容易產生界面剝離。
因此，本發明中焊球的Sn-Ag-Cu-Ni系焊接合金中之Ni的含量必須為0.05~0.08質量%。
於本發明之焊球的Sn-Ag-Cu-Ni系焊接合金中，亦可更進一步添加合計為0.003~0.1質量%之選自Fe、Co、Pt中之1種以上的元素。在焊球用合金中添加Fe、Co、Pt元素時，可使形成於接合界面上的金屬間化合物層微細化，且因抑制厚度，故具有改善落下時之效果。選自Fe、Co、Pt之元素未達0.003質量%時，極為不易得到上述之效果，而若超過0.1質量%時，焊接凸塊硬度上昇，對於衝擊會產生界面剝離的弊害。
於本發明之焊球的Sn-Ag-Cu-Ni系焊接合金中，亦可更進一步添加合計為0.003~0.1質量%之選自Bi、In、 Sb、P、Ge中之1種以上的元素。將焊球搭載於模組基板後，藉由影像辨識來判斷是否被焊接。若焊球有黃色等之變色情形時，則於影像辨識中判斷為不良。因此，焊球以沒有被迴焊處理而變色者評估為佳。藉由添加Bi、In、Sb、P、Ge所致之效果，可藉由防止因熱等而產生變色，以避免凸塊品質檢查時產生錯誤。選自Bi、In、Sb、P、Ge之元素，未達0.003質量%時，極為不易得到上述之效果，而若超過0.1質量%時，恐會有焊接凸塊之硬度增加，且損害落下改善效果之虞。
本發明之焊球被使用作為電極用。焊球之直徑為0.1mm以上，較佳者為0.3mm以上，更佳者為0.5mm以上。近年來進行電子機器之小型化，亦持續進行搭載於電子零件之焊球微細化。於接合倒裝晶片時，一般使用0.1mm以下之焊球，如本發明中之焊球之內藏倒裝晶片之BGA或CSP為對象的電極用焊球，以0.1mm以上為主流。
[實施例]
製作表1之組成的焊接合金，且以氣體中造球法製作直徑0.3mm之焊球。使用該焊球，評估未熔合、熱疲勞試驗與落下衝擊試驗。
1.以下述順序進行評估未熔合的產生數。對所製作的各組成之焊球實施溫度110℃、濕度85%、時間24hr之時效處理。在尺寸36×50mm、厚度1.2mm之玻璃環氧基板(FR-4)上以焊糊依照電極圖型進行印刷，搭載施有時效處理之焊球，以220℃以上40秒、波峰溫度245℃之條件進行迴焊。使用實體顯微鏡，計算焊球與焊糊之未熔合數。
2.然後，以下述順序實施熱疲勞試驗與落下衝擊試驗。在尺寸12×12mm之CSP用模組基板上，將所製作的各組成之焊球使用千住金屬工業股份有限公司製助焊劑 WF-6400進行迴焊焊接，且製作使用各組成之焊劑作為電極用的CSP。
3.在尺寸30×120mm、厚度0.8mm之玻璃環氧基板(FR-4)上，以焊糊依照電極圖型進行印刷，搭載以1所製作的CSP，且以220℃以上40秒、波峰溫度245℃之條件進行迴焊，製作評估基板。
4.以下述條件實施熱疲勞試驗。使用以2製作的評估基板，藉由直列電路常時性地測定電阻。使用ESPEC製冷熱衝擊裝置TSA101LA，在-40℃、+125℃之環境中各重複進行負荷10分鐘，電阻值超過15Ω時當作斷裂，且記錄熱疲勞循環次數。
5.於落下衝擊時亦使用與熱疲勞試驗相同的評估基板，以下述條件實施落下衝擊試驗。試驗方法係使用專用夾具於自台座上浮出10mm之位置固定基板兩端。依照JEDEC規格重複實施加速度1500G之衝擊，自初期電阻值上昇1.5倍時當作斷裂，且記錄落下次數。
表1之實施例2中，由於Ag、Cu、Ni之含量在最適值之範圍內，故未熔合、耐熱疲勞性、耐落下衝擊性全部可得優異的結果。第4圖係實施例2之接合界面化合物層，可知在BGA電極9與焊球5之接合部上形成薄薄的Cu6Sn5之金屬間化合物層。
比較例1，4，11中含有Ag之含量超過2.9質量%的焊球合金組成，對熱疲勞或未熔合而言雖可發揮改善效果，惟由於無法得到對落下衝擊而言最適合的Ag含量而 無法得到耐性，將落下次數降為低於20次，改善仍不充分。
另外，有關比較例2，3，9，10，因為Ag含量低於1.6質量%，故對熱疲勞而言失去耐性之循環次數沒有達到1500次。因Ag含量不足亦導致濕潤性降低的起因，且未熔合產生數超過10，得到失去抑制效果的結果。
此外，比較例5，6，7，8中雖選擇最適合的Ag含量，惟由於沒有實現Cu與Ni含量最適化，故並非兼具對未熔合或落下衝擊之改善效果。第5圖係比較例6之接合界面化合物層，可知形成厚的Cu6Sn5之金屬間化合物層。
結論係由1.6~2.9質量%之Ag、0.7~0.8質量%之Cu、0.05~0.08質量%之Ni、殘餘部分Sn所構成的組成，可抑制未熔合且可得兼具熱疲勞與落下衝擊之焊接合金。
[產業上之利用價值]
藉由本發明提供一種具有抑制未熔合之效果，於Cu電極(Cu-OSP電極、在Cu上塗佈水溶性助焊劑者)、於Ni電極(電解Ni/Au電極、無電解Ni/Pd/Au電極)之耐熱疲勞性與耐落下衝擊性兩者皆優異的電極用焊球。藉由抑制未熔合，可減低製造上之初期不良情形。而且，直至目前雖必須視製品之要求特性來選擇焊接組成，藉由具有落下衝擊與熱疲勞等兩特性之耐性，故可自攜帶型機器至電腦機 器、車載等廣泛領域，及隨著現今急速發展的攜帶型PC等之新穎領域中大幅地擴展。

Claims (9)

  1. 一種無鉛焊球，其係安裝於BGA或CSP用之模組基板上，使用作為電極用之焊球，其焊接組成係由Ag 1.6~2.9質量%、Cu 0.7~0.8質量%、Ni 0.05~0.08質量%、殘餘部分Sn所構成。
  2. 如請求項1之無鉛焊球，其中前述焊接組成係由Ag 1.9~2.3質量%、Cu 0.7~0.8質量%、Ni 0.05~0.08質量%、殘餘部分Sn所構成之焊接組成。
  3. 如請求項1之無鉛焊球，其中前述焊接組成係由Ag 2.0質量%、Cu 0.75質量%、Ni 0.07質量%、殘餘部分Sn所構成之焊接組成。
  4. 如請求項1~3中任一項之焊球，其中在前述焊接組成中添加合計為0.003~0.1質量%之選自Fe、Co、Pt中之1種以上的元素。
  5. 如請求項1~3中任一項之焊球，其中在前述焊接組成中添加合計為0.003~0.1質量%之選自Bi、In、Sb、P、Ge中之1種以上的元素。
  6. 如請求項1~5中任一項之無鉛焊球，其中前述焊球具有直徑為0.1mm以上之直徑。
  7. 如請求項1~5中任一項之無鉛焊球，其中前述焊球具有直徑為0.3mm以上之直徑。
  8. 如請求項1~5中任一項之無鉛焊球，其中前述焊球具有直徑為0.5mm以上之直徑。
  9. 一種模組基板的焊接凸塊形成方法，其係對具有選 自電解Ni/Au電極、無電解Ni/Pd/Au電極、Cu-OSP電極之電極的模組基板形成焊接凸塊的方法，其中使用如請求項1~8中任一項之焊球予以焊接。
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US20190088611A1 (en) 2019-03-21
US20240363571A1 (en) 2024-10-31
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