SG11201408766YA - Lead-free solder ball - Google Patents
Lead-free solder ballInfo
- Publication number
- SG11201408766YA SG11201408766YA SG11201408766YA SG11201408766YA SG11201408766YA SG 11201408766Y A SG11201408766Y A SG 11201408766YA SG 11201408766Y A SG11201408766Y A SG 11201408766YA SG 11201408766Y A SG11201408766Y A SG 11201408766YA SG 11201408766Y A SG11201408766Y A SG 11201408766YA
- Authority
- SG
- Singapore
- Prior art keywords
- lead
- solder ball
- free solder
- free
- ball
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K35/0261—Rods, electrodes, wires
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- C22C—ALLOYS
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- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
- H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
- H01L2924/2076—Diameter ranges equal to or larger than 100 microns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/066822 WO2014002283A1 (en) | 2012-06-30 | 2012-06-30 | Lead-free solder ball |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201408766YA true SG11201408766YA (en) | 2015-02-27 |
Family
ID=49782506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201408766YA SG11201408766YA (en) | 2012-06-30 | 2012-06-30 | Lead-free solder ball |
Country Status (13)
Country | Link |
---|---|
US (3) | US9780055B2 (en) |
EP (1) | EP2886243B1 (en) |
JP (1) | JP5633837B2 (en) |
KR (5) | KR20140015242A (en) |
CN (2) | CN104602862B (en) |
BR (1) | BR112014032941A2 (en) |
ES (1) | ES2665854T3 (en) |
HK (1) | HK1204779A1 (en) |
MX (1) | MX347776B (en) |
PH (1) | PH12014502831B1 (en) |
SG (1) | SG11201408766YA (en) |
TW (1) | TWI535518B (en) |
WO (1) | WO2014002283A1 (en) |
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JP2015077601A (en) | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | Lead-free solder alloy |
CN105047247B (en) * | 2015-07-13 | 2018-01-23 | 东莞市同亚电子科技有限公司 | A kind of tin plating tin composition and its production and use of electric wire |
JP6536306B2 (en) * | 2015-09-10 | 2019-07-03 | 千住金属工業株式会社 | Lead-free solder alloy and automotive electronics |
JP6052381B2 (en) * | 2015-12-24 | 2016-12-27 | 千住金属工業株式会社 | Lead-free solder alloy |
JP2016107343A (en) * | 2015-12-24 | 2016-06-20 | 千住金属工業株式会社 | Lead-free solder alloy, and on-vehicle electronic circuit |
US11577343B2 (en) * | 2017-11-09 | 2023-02-14 | Alpha Assembly Solutions Inc. | Low-silver alternative to standard SAC alloys for high reliability applications |
US11732330B2 (en) | 2017-11-09 | 2023-08-22 | Alpha Assembly Solutions, Inc. | High reliability lead-free solder alloy for electronic applications in extreme environments |
CN108044254A (en) * | 2017-12-13 | 2018-05-18 | 柳州智臻智能机械有限公司 | A kind of electronic component welding solder alloy and preparation method thereof |
JP6967726B2 (en) * | 2018-01-31 | 2021-11-17 | パナソニックIpマネジメント株式会社 | Solder paste and mounting structure |
US20190304805A1 (en) * | 2018-03-30 | 2019-10-03 | Intel Corporation | Electronic device and method for manufacturing the same |
JP6439893B1 (en) * | 2018-05-25 | 2018-12-19 | 千住金属工業株式会社 | Solder ball, solder joint and joining method |
JP2018171656A (en) * | 2018-05-28 | 2018-11-08 | 千住金属工業株式会社 | Lead-free solder alloy and on-vehicle electronic circuit |
JP6493610B1 (en) * | 2018-07-24 | 2019-04-03 | 千住金属工業株式会社 | Solder alloys and solder joints |
JP2019072770A (en) * | 2018-12-05 | 2019-05-16 | 千住金属工業株式会社 | Lead-free solder alloy and on-vehicle electronic circuit |
JP6928284B1 (en) * | 2020-02-14 | 2021-09-01 | 千住金属工業株式会社 | Lead-free and antimony-free solder alloys, solder balls, and solder fittings |
JP7068370B2 (en) | 2020-03-19 | 2022-05-16 | 千住金属工業株式会社 | Solder alloys, solder balls and solder fittings |
JP6836040B1 (en) | 2020-07-31 | 2021-02-24 | 千住金属工業株式会社 | Solder alloy |
CN116746292A (en) * | 2021-02-24 | 2023-09-12 | 株式会社富士 | Foreign matter detection device and foreign matter detection method |
JP7381980B1 (en) | 2023-04-28 | 2023-11-16 | 千住金属工業株式会社 | Solder alloys, solder balls, solder preforms, solder joints, and circuits |
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JP2007237252A (en) * | 2006-03-09 | 2007-09-20 | Nippon Steel Materials Co Ltd | Lead-free solder alloy for electronic member to be mounted on automobile, solder ball and electronic member |
WO2007102589A1 (en) * | 2006-03-09 | 2007-09-13 | Nippon Steel Materials Co., Ltd. | Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member |
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KR100833113B1 (en) * | 2007-12-31 | 2008-06-12 | 덕산하이메탈(주) | Lead free solder alloy and manufacturing method thereof |
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-
2012
- 2012-06-30 KR KR1020137004268A patent/KR20140015242A/en active Application Filing
- 2012-06-30 WO PCT/JP2012/066822 patent/WO2014002283A1/en active Application Filing
- 2012-06-30 KR KR1020147020908A patent/KR101455966B1/en active IP Right Grant
- 2012-06-30 CN CN201280075513.8A patent/CN104602862B/en active Active
- 2012-06-30 EP EP12879828.7A patent/EP2886243B1/en active Active
- 2012-06-30 KR KR1020147027283A patent/KR20150016208A/en not_active Application Discontinuation
- 2012-06-30 KR KR1020147020911A patent/KR20140100585A/en not_active Application Discontinuation
- 2012-06-30 CN CN201610934617.XA patent/CN106964917B/en active Active
- 2012-06-30 US US14/409,412 patent/US9780055B2/en active Active
- 2012-06-30 ES ES12879828.7T patent/ES2665854T3/en active Active
- 2012-06-30 KR KR1020147027281A patent/KR101455967B1/en active IP Right Grant
- 2012-06-30 MX MX2015000222A patent/MX347776B/en active IP Right Grant
- 2012-06-30 BR BR112014032941A patent/BR112014032941A2/en not_active Application Discontinuation
- 2012-06-30 JP JP2014503897A patent/JP5633837B2/en active Active
- 2012-06-30 SG SG11201408766YA patent/SG11201408766YA/en unknown
-
2013
- 2013-06-27 TW TW102122957A patent/TWI535518B/en active
-
2014
- 2014-12-18 PH PH12014502831A patent/PH12014502831B1/en unknown
-
2015
- 2015-06-05 HK HK15105350.6A patent/HK1204779A1/en unknown
-
2017
- 2017-07-06 US US15/642,894 patent/US20180005970A1/en not_active Abandoned
-
2018
- 2018-11-16 US US16/193,357 patent/US20190088611A1/en active Pending
Also Published As
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PH12014502831A1 (en) | 2015-02-02 |
CN104602862B (en) | 2017-05-17 |
JP5633837B2 (en) | 2014-12-03 |
JPWO2014002283A1 (en) | 2016-05-30 |
CN104602862A (en) | 2015-05-06 |
WO2014002283A1 (en) | 2014-01-03 |
KR20140015242A (en) | 2014-02-06 |
US20190088611A1 (en) | 2019-03-21 |
US20180005970A1 (en) | 2018-01-04 |
KR20150016208A (en) | 2015-02-11 |
KR20140117707A (en) | 2014-10-07 |
KR20140100584A (en) | 2014-08-14 |
US20150221606A1 (en) | 2015-08-06 |
MX2015000222A (en) | 2015-06-23 |
CN106964917A (en) | 2017-07-21 |
PH12014502831B1 (en) | 2015-02-02 |
KR101455967B1 (en) | 2014-10-31 |
CN106964917B (en) | 2019-07-05 |
KR20140100585A (en) | 2014-08-14 |
EP2886243B1 (en) | 2018-03-14 |
MX347776B (en) | 2017-05-12 |
BR112014032941A2 (en) | 2017-06-27 |
US9780055B2 (en) | 2017-10-03 |
EP2886243A1 (en) | 2015-06-24 |
KR101455966B1 (en) | 2014-10-31 |
TW201412449A (en) | 2014-04-01 |
TWI535518B (en) | 2016-06-01 |
EP2886243A4 (en) | 2016-05-11 |
ES2665854T3 (en) | 2018-04-27 |
HK1204779A1 (en) | 2015-12-04 |
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