EP1894667A4 - METHOD FOR SOLDERING ELECTROLESS Ni PLATING PART - Google Patents

METHOD FOR SOLDERING ELECTROLESS Ni PLATING PART

Info

Publication number
EP1894667A4
EP1894667A4 EP05750722A EP05750722A EP1894667A4 EP 1894667 A4 EP1894667 A4 EP 1894667A4 EP 05750722 A EP05750722 A EP 05750722A EP 05750722 A EP05750722 A EP 05750722A EP 1894667 A4 EP1894667 A4 EP 1894667A4
Authority
EP
European Patent Office
Prior art keywords
electroless
soldering
plating part
plating
soldering electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05750722A
Other languages
German (de)
French (fr)
Other versions
EP1894667A1 (en
Inventor
Ryoichi Kurata
Daisuke Souma
Hiroshi Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
Original Assignee
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Publication of EP1894667A1 publication Critical patent/EP1894667A1/en
Publication of EP1894667A4 publication Critical patent/EP1894667A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Chemically Coating (AREA)
EP05750722A 2005-06-10 2005-06-10 METHOD FOR SOLDERING ELECTROLESS Ni PLATING PART Withdrawn EP1894667A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/010660 WO2006131979A1 (en) 2005-06-10 2005-06-10 METHOD FOR SOLDERING ELCTROLESS Ni PLATING PART

Publications (2)

Publication Number Publication Date
EP1894667A1 EP1894667A1 (en) 2008-03-05
EP1894667A4 true EP1894667A4 (en) 2009-12-02

Family

ID=37498191

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05750722A Withdrawn EP1894667A4 (en) 2005-06-10 2005-06-10 METHOD FOR SOLDERING ELECTROLESS Ni PLATING PART

Country Status (4)

Country Link
US (1) US8887980B2 (en)
EP (1) EP1894667A4 (en)
JP (1) JP4811403B2 (en)
WO (1) WO2006131979A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103299406A (en) * 2007-09-21 2013-09-11 艾格瑞系统有限公司 Soldering method and related device for improved resistance to brittle fracture
JP5470816B2 (en) * 2008-11-26 2014-04-16 富士通株式会社 Manufacturing method of electronic device
JP5903625B2 (en) * 2012-03-16 2016-04-13 パナソニックＩｐマネジメント株式会社 Solder material
KR20140100585A (en) * 2012-06-30 2014-08-14 센주긴조쿠고교 가부시키가이샤 Lead-Free Solder Ball
WO2014013632A1 (en) 2012-07-19 2014-01-23 ハリマ化成株式会社 Solder alloy, solder paste, and electronic circuit board
EP2977421B1 (en) 2013-03-19 2018-10-24 Nippon A&L Inc. Copolymer latex for adhesive and adhesive composition
KR101941831B1 (en) * 2013-04-18 2019-01-23 센주긴조쿠고교 가부시키가이샤 Solder joint and substrate
KR101514529B1 (en) * 2013-07-09 2015-04-22 삼성전기주식회사 Printed circuit board and manufacturing method thereof
US20150037087A1 (en) * 2013-08-05 2015-02-05 Senju Metal Industry Co., Ltd. Lead-Free Solder Alloy
JP6369994B2 (en) * 2015-09-02 2018-08-08 田中電子工業株式会社 Copper alloy thin wire for ball bonding
CN111052510B (en) * 2018-03-16 2021-05-25 富士电机株式会社 Semiconductor device with a plurality of semiconductor chips

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1382413A1 (en) * 2002-07-09 2004-01-21 Senju Metal Industry Co., Ltd. Lead-free solder alloy
EP1402988A1 (en) * 2002-09-25 2004-03-31 Senju Metal Industry Co., Ltd. The use of a solder on surfaces coated with nickel by electroless plating
EP1410871A1 (en) * 2002-10-17 2004-04-21 Senju Metal Industry Co., Ltd. Lead-free solder ball
WO2005035180A1 (en) * 2003-10-07 2005-04-21 Senju Metal Industry Co., Ltd. Lead-free solder ball

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3021718A (en) * 1959-06-04 1962-02-20 King Donald Mayer Chains for use in conveyor systems
JP3719624B2 (en) 1997-06-07 2005-11-24 内橋エステック株式会社 Solder for mounting electronic components and mounting method of electronic components
JP3833829B2 (en) * 1998-07-07 2006-10-18 内橋エステック株式会社 Solder alloy and electronic component mounting method
JP4667637B2 (en) 2001-05-02 2011-04-13 古河電気工業株式会社 Bonding method of electronic parts
JP2002336988A (en) 2001-05-15 2002-11-26 Tokyo Daiichi Shoko:Kk Lead-free solder alloy
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
JP2003303842A (en) * 2002-04-12 2003-10-24 Nec Electronics Corp Semiconductor device and manufacturing method therefor
JP3879582B2 (en) * 2002-04-26 2007-02-14 千住金属工業株式会社 Solder paste, electronic component and step soldering method
JP2003326384A (en) * 2002-05-13 2003-11-18 Star Seiki Co Ltd Device for emitting laser beam for cutting synthetic resin
JP2003326386A (en) 2002-05-13 2003-11-18 Matsushita Electric Ind Co Ltd Leadless solder alloy
JP2004154864A (en) 2002-10-15 2004-06-03 Senju Metal Ind Co Ltd Lead-free soldering alloy
JP2004141910A (en) 2002-10-23 2004-05-20 Senju Metal Ind Co Ltd Lead-free solder alloy
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1382413A1 (en) * 2002-07-09 2004-01-21 Senju Metal Industry Co., Ltd. Lead-free solder alloy
EP1402988A1 (en) * 2002-09-25 2004-03-31 Senju Metal Industry Co., Ltd. The use of a solder on surfaces coated with nickel by electroless plating
EP1410871A1 (en) * 2002-10-17 2004-04-21 Senju Metal Industry Co., Ltd. Lead-free solder ball
WO2005035180A1 (en) * 2003-10-07 2005-04-21 Senju Metal Industry Co., Ltd. Lead-free solder ball

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
M. O. ALAM, Y. C. CHAN, K. C. HUNG: "Reliability study of the electroless Ni?P layer against solder alloy", MICROELECTRONICS RELIABILITY, vol. 42, no. 7, 1 July 2002 (2002-07-01), Elsevier BV, pages 1065 - 1073, XP002552005, Retrieved from the Internet <URL:doi:10.1016/S0026-2714(02)00068-9> *
See also references of WO2006131979A1 *

Also Published As

Publication number Publication date
US8887980B2 (en) 2014-11-18
EP1894667A1 (en) 2008-03-05
US20090218387A1 (en) 2009-09-03
JPWO2006131979A1 (en) 2009-01-08
WO2006131979A1 (en) 2006-12-14
JP4811403B2 (en) 2011-11-09

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20080110

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
RIN1 Information on inventor provided before grant (corrected)

Inventor name: OKADA, HIROSHI

Inventor name: KURATA, RYOICHI

Inventor name: SOUMA, DAISUKE

A4 Supplementary search report drawn up and despatched

Effective date: 20091104

17Q First examination report despatched

Effective date: 20100331

STAA Information on the status of an ep patent application or granted ep patent

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18D Application deemed to be withdrawn

Effective date: 20101012