JP2002336988A - Lead-free solder alloy - Google Patents
Lead-free solder alloyInfo
- Publication number
- JP2002336988A JP2002336988A JP2001145474A JP2001145474A JP2002336988A JP 2002336988 A JP2002336988 A JP 2002336988A JP 2001145474 A JP2001145474 A JP 2001145474A JP 2001145474 A JP2001145474 A JP 2001145474A JP 2002336988 A JP2002336988 A JP 2002336988A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- solder alloy
- free solder
- weight
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、Ｐｂを全く含まな
い無鉛半田合金に関する。The present invention relates to a lead-free solder alloy containing no Pb.
【０００２】[0002]
【従来の技術】従来、例えば、特開平９−１５５５８６
号公報及び特開平９−３２７７９０号、特開平９−３２
７７９１号公報で、ＰまたはＧａを添加した無鉛半田合
金が示されている。2. Description of the Related Art Conventionally, for example, Japanese Patent Application Laid-Open No. 9-155586.
JP-A-9-327790, JP-A-9-32790
No. 7791 discloses a lead-free solder alloy to which P or Ga is added.
【０００３】[0003]
【発明が解決しようとする課題】上述の特開平９−１５
５５８６号公報及び特開平９−３２７７９０号、特開平
９−３２７７９１号公報では、ＰまたはＧａを添加し、
酸化を防止する無鉛半田合金が示されているが、Ｐおよ
びＧａを添加した無鉛半田合金は示されていなかった。
また、一般的な無鉛半田合金であるＳｎ−Ｃｕ合金、Ｓ
ｎ−Ａｇ−Ｃｕ合金に関しても示されていなかった。更
に、無鉛半田合金を使用中に無鉛半田合金に含有される
ＰまたはＧａ使用中に酸化物と反応して消費されてしま
い、その効果を発揮しなくなるが、その対応策が示され
ていなかった。そこで、本発明は、一般的な無鉛半田合
金であるＳｎ−Ｃｕ合金、Ｓｎ−Ａｇ−Ｃｕ合金で、酸
化を防止することができる無鉛半田合金を提供すること
を目的とする。さらに、本発明は、無鉛半田合金に含有
されるＰまたはＧａ使用中に酸化物と反応して消費され
た場合にも、ＰおよびＧａを補充して、酸化を防止する
ことができる無鉛半田合金を提供することを目的とす
る。SUMMARY OF THE INVENTION The above-mentioned Japanese Patent Application Laid-Open No. 9-15 / 1997
No. 5,586, JP-A-9-327790, and JP-A-9-327791, adding P or Ga,
A lead-free solder alloy for preventing oxidation is shown, but a lead-free solder alloy containing P and Ga is not shown.
In addition, Sn—Cu alloy, which is a general lead-free solder alloy, S
It was not shown for the n-Ag-Cu alloy. Furthermore, while using the lead-free solder alloy, P or Ga contained in the lead-free solder alloy is consumed by reacting with the oxide during use, and the effect is not exhibited, but no countermeasure has been shown. . Therefore, an object of the present invention is to provide a lead-free solder alloy that can prevent oxidation by using a Sn—Cu alloy or a Sn—Ag—Cu alloy that is a general lead-free solder alloy. Further, the present invention provides a lead-free solder alloy that can prevent oxidation by supplementing P and Ga even when consumed by reacting with an oxide during use of P or Ga contained in the lead-free solder alloy. The purpose is to provide.
【０００４】[0004]
【課題を解決するための手段】請求項１の本発明は、Ｃ
ｕが０．１〜７．０重量％、Ｐ及びＧａの合計が０．０
０１〜１重量％、残部がＳｎより成ることを特徴とする
無鉛半田合金である。請求項２の本発明は、Ａｇが２．
０〜５．０重量％、Ｃｕが０．１〜１．０重量％、Ｐ及
びＧａの合計が０．００１〜１重量％、残部がＳｎより
成ることを特徴とする無鉛半田合金である。請求項３の
本発明は、Ｐ及びＧａの合計が０．０１〜５重量％、残
部がＳｎより成り、請求項１あるいは請求項２記載の無
鉛半田合金の使用中に、請求項１あるいは請求項２記載
の無鉛半田合金に含有される前記Ｐ及びＧａが消費され
た場合に前記Ｐ及びＧａを補充するために使用されるこ
とを特徴とする無鉛半田合金である。According to the first aspect of the present invention, there is provided:
u is 0.1 to 7.0% by weight, and the total of P and Ga is 0.0
It is a lead-free solder alloy characterized in that the content is from 01 to 1% by weight and the balance is Sn. In the present invention according to claim 2, Ag is 2.
This lead-free solder alloy is characterized in that 0 to 5.0% by weight, 0.1 to 1.0% by weight of Cu, 0.001 to 1% by weight of the sum of P and Ga, and the balance of Sn. According to a third aspect of the present invention, the total of P and Ga is 0.01 to 5% by weight, and the balance is made of Sn, wherein the lead-free solder alloy according to the first or second aspect is used. Item 3. A lead-free solder alloy used for replenishing the P and Ga when the P and Ga contained in the lead-free solder alloy according to Item 2 are consumed.
【０００５】請求項１の本発明によれば、Ｓｎ−Ｃｕ半
田合金が、ＰおよびＧａを含有することによって、溶融
時に発生する半田合金の酸化を防止し、ドロスの発生を
抑え、良好な半田付性を与える。請求項２の本発明によ
れば、Ｓｎ−Ａｇ−Ｃｕ半田合金が、ＰおよびＧａを含
有することによって、溶融時に発生する半田合金の酸化
を防止し、ドロスの発生を抑え、良好な半田付性を与え
る。According to the first aspect of the present invention, since the Sn—Cu solder alloy contains P and Ga, it prevents oxidation of the solder alloy generated at the time of melting, suppresses the generation of dross, and provides a good solder. Gives stickiness. According to the second aspect of the present invention, since the Sn-Ag-Cu solder alloy contains P and Ga, oxidation of the solder alloy generated at the time of melting is prevented, dross generation is suppressed, and good soldering is performed. Give sex.
【０００６】請求項３の本発明によれば、請求項１ある
いは請求項２記載の無鉛半田合金の使用中に、請求項１
あるいは請求項２記載の無鉛半田合金に含有される前記
Ｐ及びＧａが消費された場合に前記Ｐ及びＧａを補充す
るために使用される。このため、請求項１または請求項
２記載の無鉛半田合金を用いている最中に酸化を防止す
る効果が無くなっても、適量を追加補充する事によっ
て、その効果を再度発揮できる。According to a third aspect of the present invention, during the use of the lead-free solder alloy according to the first or second aspect, the first aspect of the invention is applied.
Alternatively, it is used for replenishing the P and Ga when the P and Ga contained in the lead-free solder alloy according to claim 2 are consumed. For this reason, even if the effect of preventing oxidation is lost during the use of the lead-free solder alloy according to claim 1 or 2, the effect can be exhibited again by additionally replenishing an appropriate amount.
【０００７】[0007]
【発明の実施の形態】以下、本発明を、その実施例に基
づいて説明する。表１には３時間噴流させたドロス量と
１時間当たりのドロス量を示した。表１に示されるよう
に、実施例１として、Ｃｕが０．７重量％、Ｐが０．０
１重量％、残部のＳｎが９９．２９重量％より成る無鉛
半田合金で、その試験温度は２５０℃であった。実施例
２としてＣｕが０．７重量％、Ｐが０．００８重量％、
Ｇａが０．０１５重量％、残部のＳｎが９９．２７７重
量％より成る無鉛半田合金で、その試験温度は３５０℃
であった。実施例３としてＣｕが７．０重量％、Ｐが
０．００８重量％、Ｇａが０．０１５重量％、残部のＳ
ｎが９２．９７７重量％より成る無鉛半田合金で、その
試験温度は４２０℃であった。実施例４としてＡｇが
３．５重量％、Ｃｕが０．７重量％、Ｐが０．００５重
量％、残部のＳｎが９５．７５重量％より成る無鉛半田
合金で、その試験温度は２５０℃であった。実施例５と
してＡｇが３．５重量％、Ｃｕが０．７重量％、Ｐが
０．０７重量％、Ｇａが０．０３重量％、残部のＳｎが
９５．７重量％より成る無鉛半田合金で、その試験温度
は３５０℃であった。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described based on its embodiments. Table 1 shows the amount of dross jetted for 3 hours and the amount of dross per hour. As shown in Table 1, as Example 1, 0.7% by weight of Cu and 0.0% of P
The test temperature was 250 ° C. for a lead-free solder alloy comprising 1% by weight and the balance of Sn being 99.29% by weight. As Example 2, Cu was 0.7% by weight, P was 0.008% by weight,
A lead-free solder alloy containing 0.015% by weight of Ga and 99.277% by weight of Sn at the test temperature of 350 ° C.
Met. In Example 3, 7.0% by weight of Cu, 0.008% by weight of P, 0.015% by weight of Ga, and the balance of S
A lead-free solder alloy having n of 92.977% by weight, and the test temperature was 420 ° C. Example 4 is a lead-free solder alloy containing 3.5% by weight of Ag, 0.7% by weight of Cu, 0.005% by weight of P, and the remaining Sn of 95.75% by weight. Met. Example 5 A lead-free solder alloy comprising 3.5% by weight of Ag, 0.7% by weight of Cu, 0.07% by weight of P, 0.03% by weight of Ga, and 95.7% by weight of Sn as the balance. The test temperature was 350 ° C.
【０００８】比較例１として、Ｃｕが０．７重量％、残
部のＳｎが９９．３重量％より成る無鉛半田合金で、そ
の試験温度は２５０℃であった。比較例２として、Ｃｕ
が０．７重量％、残部のＳｎが９９．３重量％より成る
無鉛半田合金で、その試験温度は３５０℃であった。比
較例３としてＣｕが７．０重量％、残部のＳｎが９３．
０重量％より成る無鉛半田合金で、その試験温度は４２
０℃であった。比較例４としてＡｇが３．５重量％、Ｃ
ｕが０．７重量％、残部のＳｎが９５．８重量％より成
る無鉛半田合金で、その試験温度は２５０℃であった。
比較例５としてＡｇが３．５重量％、Ｃｕが０．７重量
％、残部のＳｎが９５．８重量％より成る無鉛半田合金
で、その試験温度は３５０℃であった。As Comparative Example 1, a lead-free solder alloy containing 0.7% by weight of Cu and 99.3% by weight of Sn was used, and the test temperature was 250 ° C. As Comparative Example 2, Cu
Is a lead-free solder alloy containing 0.7% by weight and the balance of Sn being 99.3% by weight, and the test temperature was 350 ° C. As Comparative Example 3, Cu was 7.0% by weight, and the remaining Sn was 93.
0% by weight of a lead-free solder alloy with a test temperature of 42
It was 0 ° C. As Comparative Example 4, 3.5% by weight of Ag and C
The test temperature of the lead-free solder alloy was 0.7% by weight of u and 95.8% by weight of Sn.
Comparative Example 5 was a lead-free solder alloy containing 3.5% by weight of Ag, 0.7% by weight of Cu, and 95.8% by weight of Sn, and the test temperature was 350 ° C.
【０００９】[0009]
【表１】 [Table 1]
【００１０】[0010]
【発明の効果】本発明は、以上、説明したように、一般
的な無鉛半田合金であるＳｎ−Ｃｕ合金、Ｓｎ−Ａｇ−
Ｃｕ合金で、酸化を防止することができる。 さらに、無鉛半田合金に含有されるＰまたはＧａ使用中
に酸化物と反応して消費された場合にも、ＰおよびＧａ
を補充して、酸化を防止することができるという効果を
奏する。According to the present invention, as described above, Sn-Cu alloy, Sn-Ag-
Oxidation can be prevented with a Cu alloy. Further, even when P or Ga contained in the lead-free solder alloy is consumed by reacting with the oxide during use of P or Ga,
To prevent oxidation.
Claims (3)
ａの合計が０．００１〜１重量％、残部がＳｎより成る
ことを特徴とする無鉛半田合金。1. Cu is 0.1 to 7.0% by weight, P and G
A lead-free solder alloy, wherein the sum of a is 0.001 to 1% by weight and the balance is Sn.
０．１〜１．０重量％、Ｐ及びＧａの合計が０．００１
〜１重量％、残部がＳｎより成ることを特徴とする無鉛
半田合金。2. Ag is 2.0-5.0% by weight, Cu is 0.1-1.0% by weight, and the total of P and Ga is 0.001%.
1% by weight, with the balance being Sn.
残部がＳｎより成り、請求項１あるいは請求項２記載の
無鉛半田合金の使用中に、請求項１あるいは請求項２記
載の無鉛半田合金に含有される前記Ｐ及びＧａが消費さ
れた場合に前記Ｐ及びＧａを補充するために使用される
ことを特徴とする無鉛半田合金。3. The total of P and Ga is 0.01 to 5% by weight,
The balance is made of Sn, and when the P and Ga contained in the lead-free solder alloy according to claim 1 or 2 are consumed during use of the lead-free solder alloy according to claim 1 or 2, A lead-free solder alloy used to supplement P and Ga.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001145474A JP2002336988A (en) | 2001-05-15 | 2001-05-15 | Lead-free solder alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001145474A JP2002336988A (en) | 2001-05-15 | 2001-05-15 | Lead-free solder alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002336988A true JP2002336988A (en) | 2002-11-26 |
Family
ID=18991282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001145474A Pending JP2002336988A (en) | 2001-05-15 | 2001-05-15 | Lead-free solder alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002336988A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005001000A (en) * | 2003-06-13 | 2005-01-06 | Senju Metal Ind Co Ltd | Method for increasing effectiveness of material component |
| JPWO2006131979A1 (en) * | 2005-06-10 | 2009-01-08 | 千住金属工業株式会社 | Soldering method for electroless Ni plating part |
| WO2009011341A1 (en) * | 2007-07-13 | 2009-01-22 | Senju Metal Industry Co., Ltd. | Lead-free solder for vehicle, and in-vehicle electronic circuit |
| WO2009011392A1 (en) * | 2007-07-18 | 2009-01-22 | Senju Metal Industry Co., Ltd. | In-containing lead-free solder for on-vehicle electronic circuit |
| JP2009131903A (en) * | 2001-06-28 | 2009-06-18 | Senju Metal Ind Co Ltd | Lead-free solder alloy for molten solder |
| US7628308B2 (en) * | 2002-01-10 | 2009-12-08 | Senju Metal Industry Co., Ltd. | Method of replenishing an oxidation suppressing element in a solder bath |
| JP2012509992A (en) * | 2008-11-28 | 2012-04-26 | ▲広▼州▲瀚▼源▲電▼子科技有限公司 | Lead-free solder dross reduction method |
-
2001
- 2001-05-15 JP JP2001145474A patent/JP2002336988A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009131903A (en) * | 2001-06-28 | 2009-06-18 | Senju Metal Ind Co Ltd | Lead-free solder alloy for molten solder |
| US7628308B2 (en) * | 2002-01-10 | 2009-12-08 | Senju Metal Industry Co., Ltd. | Method of replenishing an oxidation suppressing element in a solder bath |
| JP2005001000A (en) * | 2003-06-13 | 2005-01-06 | Senju Metal Ind Co Ltd | Method for increasing effectiveness of material component |
| JP4525192B2 (en) * | 2003-06-13 | 2010-08-18 | 千住金属工業株式会社 | How to increase the effectiveness of material components |
| JPWO2006131979A1 (en) * | 2005-06-10 | 2009-01-08 | 千住金属工業株式会社 | Soldering method for electroless Ni plating part |
| JP4811403B2 (en) * | 2005-06-10 | 2011-11-09 | 千住金属工業株式会社 | Soldering method for electroless Ni plating part |
| US8887980B2 (en) | 2005-06-10 | 2014-11-18 | Senju Metal Industry Co., Ltd. | Method of soldering portions plated by electroless Ni plating |
| JP5024380B2 (en) * | 2007-07-13 | 2012-09-12 | 千住金属工業株式会社 | Lead-free solder for in-vehicle mounting and in-vehicle electronic circuit |
| WO2009011341A1 (en) * | 2007-07-13 | 2009-01-22 | Senju Metal Industry Co., Ltd. | Lead-free solder for vehicle, and in-vehicle electronic circuit |
| US8845826B2 (en) | 2007-07-13 | 2014-09-30 | Senju Metal Industry Co., Ltd. | Lead-free solder for vehicles and a vehicle-mounted electronic circuit using the solder |
| WO2009011392A1 (en) * | 2007-07-18 | 2009-01-22 | Senju Metal Industry Co., Ltd. | In-containing lead-free solder for on-vehicle electronic circuit |
| CN101801589B (en) * | 2007-07-18 | 2013-05-15 | 千住金属工业株式会社 | In-containing lead-free solder for on-vehicle electronic circuit |
| JP4962570B2 (en) * | 2007-07-18 | 2012-06-27 | 千住金属工業株式会社 | In-containing lead-free solder for automotive electronic circuits |
| US8888932B2 (en) | 2007-07-18 | 2014-11-18 | Senju Metal Industry Co., Ltd. | Indium-containing lead-free solder for vehicle-mounted electronic circuits |
| JP2012509992A (en) * | 2008-11-28 | 2012-04-26 | ▲広▼州▲瀚▼源▲電▼子科技有限公司 | Lead-free solder dross reduction method |
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