JP2006320912A - High temperature solder alloy - Google Patents
High temperature solder alloy Download PDFInfo
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- JP2006320912A JP2006320912A JP2005143982A JP2005143982A JP2006320912A JP 2006320912 A JP2006320912 A JP 2006320912A JP 2005143982 A JP2005143982 A JP 2005143982A JP 2005143982 A JP2005143982 A JP 2005143982A JP 2006320912 A JP2006320912 A JP 2006320912A
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- solder alloy
- temperature solder
- brazing material
- high temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Abstract
Description
本発明は、電子部品や機械部品の組立てなどにおけるろう材として用いる高温はんだ合金に関し、特に、Ｚｎ系はんだ合金に関する。 The present invention relates to a high-temperature solder alloy used as a brazing material in the assembly of electronic parts and mechanical parts, and more particularly to a Zn-based solder alloy.
パワートランジスタ素子のダイボンディングを始めとする各種電子部品の組立て工程におけるはんだ付けでは、高温はんだ付けが行われ、比較的高温の３００℃前後の融点を有するはんだ合金が、ろう材として用いられている。かかるろう材として、Ｐｂ−５質量％Ｓｎ合金に代表されるＰｂ合金（Ｐｂ系はんだ合金）が、従来より用いられている。 In soldering in the assembly process of various electronic components such as die bonding of power transistor elements, high temperature soldering is performed, and a solder alloy having a relatively high melting point of about 300 ° C. is used as a brazing material. . As such a brazing material, a Pb alloy (Pb solder alloy) represented by a Pb-5 mass% Sn alloy has been used conventionally.
しかし、近年、環境汚染に対する配慮から、Ｐｂの使用を制限する動きが強くなってきている。こうした動きに対応して電子組立の分野においても、Ｐｂを含まない高温はんだ合金によるろう材が求められている。 However, in recent years, there has been a strong movement to limit the use of Pb due to consideration for environmental pollution. Corresponding to such a movement, a brazing material made of a high-temperature solder alloy not containing Pb is also required in the field of electronic assembly.
Ｐｂを含まないろう材として、Ｚｎ−Ａｌ−Ｍｇ−Ｇａ合金が、特開平１１−１７２３５２号に記載されている。かかる合金は、Ｐｂ合金と同様の高い融点（固相線温度が２６５〜３２０℃程度）を有している。しかし、Ａｇめっきに対する濡れ性は得られるものの、ＣｕやＮｉに対しては濡れ性が不足して接合することができないという問題があった。 As a brazing material not containing Pb, a Zn—Al—Mg—Ga alloy is described in JP-A-11-172352. Such an alloy has the same high melting point as the Pb alloy (solidus temperature is about 265 to 320 ° C.). However, although wettability with respect to Ag plating can be obtained, there is a problem that Cu and Ni cannot be bonded due to insufficient wettability.
本発明の目的は、前記事情に鑑み、ＣｕやＮｉに対する濡れ性を向上させ、Ｐｂを含まない高温はんだ合金によるろう材を提供することにある。 In view of the above circumstances, an object of the present invention is to provide a brazing material made of a high-temperature solder alloy that improves wettability to Cu and Ni and does not contain Pb.
本発明の高温はんだ合金は、Ａｌを１〜７質量％、Ｍｇを０．５〜６質量％、Ｇａを０．１〜２０質量％、およびＶを０．００１〜１．０質量％含み、残部がＺｎおよび不可避不純物からなる。 The high-temperature solder alloy of the present invention contains 1 to 7% by mass of Al, 0.5 to 6% by mass of Mg, 0.1 to 20% by mass of Ga, and 0.001 to 1.0% by mass of V, The balance consists of Zn and inevitable impurities.
本発明の半導体装置は、前記の高温はんだ合金をろう材として用いて組み立てられる。 The semiconductor device of the present invention is assembled using the high temperature solder alloy as a brazing material.
本発明の高温はんだ合金は、Ｐｂを含まないＺｎ系合金からなり、かつ、従来のＺｎ系合金に比べてＣｕやＮｉに対する濡れ性が向上するため、ろう材として、半導体装置の組立に、広範囲に適用できる。その結果、Ｐｂを含まない環境に配慮した半導体装置を提供できる。 The high-temperature solder alloy of the present invention is made of a Zn-based alloy containing no Pb, and has improved wettability with respect to Cu and Ni as compared with conventional Zn-based alloys. Applicable to. As a result, an environment-friendly semiconductor device that does not contain Pb can be provided.
本発明の高温はんだ合金は、Ａｌを１〜７質量％、Ｍｇを０．５〜６質量％、Ｇａを０．１〜２０質量％、およびＶを０．００１〜１．０質量％含み、残部がＺｎおよび不可避不純物からなる。ＡｌおよびＭｇの含有量が、これらの組成範囲を外れると、融点が高くなりすぎてしまう。さらに、Ａｌを３〜４質量％、Ｍｇを２．５〜３質量％含むことが好ましい。その理由は、Ｚｎ−Ａｌ−Ｍｇ系３元共晶組成、あるいは、それに近い組成となるからである。 The high-temperature solder alloy of the present invention contains 1 to 7% by mass of Al, 0.5 to 6% by mass of Mg, 0.1 to 20% by mass of Ga, and 0.001 to 1.0% by mass of V, The balance consists of Zn and inevitable impurities. If the content of Al and Mg is out of these composition ranges, the melting point becomes too high. Furthermore, it is preferable to contain Al 3-4 mass% and Mg 2.5-3 mass%. This is because the Zn—Al—Mg ternary eutectic composition or a composition close thereto is obtained.
Ｇａは、Ｚｎ−Ａｌ−Ｍｇ系３元合金の融点を下げる元素である。Ｇａが０．１質量％未満では、融点の低下効果が小さすぎる。２０質量％を超えると、融点が低くなりすぎて、高温はんだ合金として不適当になる。好ましくは、２〜１３質量％とする。 Ga is an element that lowers the melting point of the Zn—Al—Mg ternary alloy. If Ga is less than 0.1% by mass, the melting point lowering effect is too small. If it exceeds 20% by mass, the melting point becomes too low and it becomes unsuitable as a high-temperature solder alloy. Preferably, the content is 2 to 13% by mass.
Ｖは、濡れ性を改善する元素であり、Ｖの添加により、Ｚｎ−Ａｌ−Ｍｇ−Ｇａ合金のＣｕやＮｉに対する濡れ性を向上させることができる。これは、ろう材の溶解時に、酸素がＶと優先的に反応し、溶解体表面に酸化膜が発生するのを防止し、濡れ性がより改善されるためと推定している。Ｖは、０．０１〜１．０質量％、含有する。０．０１質量％未満では、前記濡れ性を向上させる効果が低すぎてしまう。また、１．０質量％を超えると、Ｖの酸化物により濡れ性が低下してしまう。 V is an element that improves wettability. By adding V, the wettability of a Zn—Al—Mg—Ga alloy with respect to Cu or Ni can be improved. This is presumed to be because oxygen preferentially reacts with V when the brazing material is melted to prevent an oxide film from being generated on the surface of the melt and wettability is further improved. V contains 0.01-1.0 mass%. If it is less than 0.01% by mass, the effect of improving the wettability is too low. Moreover, when it exceeds 1.0 mass%, wettability will fall with the oxide of V.
なお、本発明のろう材は、ビッカース硬度１００程度の高い硬度を有するため、加工性に劣っている。したがって、２００℃程度で熱間成形するか、粉末とした後で、ペースト状にするとよい。 Since the brazing material of the present invention has a high hardness of about 100 Vickers hardness, it is inferior in workability. Therefore, it may be hot-formed at about 200 ° C. or made into a paste after being powdered.
［実施例１〜７、比較例１〜２］
Ｚｎ地金、Ａｌ地金、Ｍｇ地金、金属Ｇａおよび金属Ｖ（以上の原料は、いずれも純度９９．９質量％）を用い、大気溶解炉により、各組成が異なる９種類のろう材を溶製した。得られたろう材を化学分析した。その結果を表１に示す。
[Examples 1-7, Comparative Examples 1-2]
Nine kinds of brazing materials having different compositions are prepared by using an air melting furnace using Zn ingot, Al ingot, Mg ingot, metal Ga and metal V (all of the above materials are 99.9% by mass in purity). Melted. The obtained brazing material was chemically analyzed. The results are shown in Table 1.
前記溶製したろう材について、濡れ性の評価を次のように行った。 With respect to the melted brazing material, the wettability was evaluated as follows.
（１）４００℃窒素気流中で保持するろう材浴を調製する。 (1) A brazing material bath that is maintained in a 400 ° C. nitrogen stream is prepared.
（２）片面にＮｉめっきを施した銅片を、前記ろう材浴中に５秒間浸漬した後、取り出して、観察する。 (2) A copper piece with Ni plating on one side is immersed in the brazing material bath for 5 seconds, then taken out and observed.
（３）Ｎｉめっき面および銅面にろう材が濡れ広がった場合に「良」と評価し、濡れ広がらなかった場合に「不良」と評価する。その評価の結果を表１に示す。 (3) When the brazing material spreads wet on the Ni plating surface and the copper surface, it is evaluated as “good”, and when it does not spread out, it is evaluated as “bad”. The evaluation results are shown in Table 1.
表１より、実施例１〜７のろう材を使用した場合は、ＣｕやＮｉに対しても良好な濡れ性が得られ、電子部品や機械部品の組立における高温はんだ付用に好適であり、かつ、広範囲に適用できることがわかる。 From Table 1, when the brazing materials of Examples 1 to 7 are used, good wettability is obtained for Cu and Ni, which is suitable for high-temperature soldering in the assembly of electronic parts and mechanical parts, And it turns out that it is applicable to a wide range.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005143982A JP2006320912A (en) | 2005-05-17 | 2005-05-17 | High temperature solder alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005143982A JP2006320912A (en) | 2005-05-17 | 2005-05-17 | High temperature solder alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2006320912A true JP2006320912A (en) | 2006-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005143982A Pending JP2006320912A (en) | 2005-05-17 | 2005-05-17 | High temperature solder alloy |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010051994A (en) * | 2008-08-27 | 2010-03-11 | Toyota Motor Corp | Solder feeding device and solder feeding method |
| CN101653878B (en) * | 2009-09-11 | 2011-07-27 | 北京工业大学 | Zn-Mg magnesium alloy solder |
| US8283783B2 (en) | 2007-11-20 | 2012-10-09 | Toyota Jidosha Kabushiki Kaisha | Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same |
-
2005
- 2005-05-17 JP JP2005143982A patent/JP2006320912A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8283783B2 (en) | 2007-11-20 | 2012-10-09 | Toyota Jidosha Kabushiki Kaisha | Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same |
| JP2010051994A (en) * | 2008-08-27 | 2010-03-11 | Toyota Motor Corp | Solder feeding device and solder feeding method |
| CN101653878B (en) * | 2009-09-11 | 2011-07-27 | 北京工业大学 | Zn-Mg magnesium alloy solder |
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