TWI316095B - Plated substrate - Google Patents

Plated substrate

Info

Publication number
TWI316095B
TWI316095B TW095111454A TW95111454A TWI316095B TW I316095 B TWI316095 B TW I316095B TW 095111454 A TW095111454 A TW 095111454A TW 95111454 A TW95111454 A TW 95111454A TW I316095 B TWI316095 B TW I316095B
Authority
TW
Taiwan
Prior art keywords
plated substrate
plated
substrate
Prior art date
Application number
TW095111454A
Other languages
Chinese (zh)
Other versions
TW200643215A (en
Inventor
Akihiro Aiba
Kazumi Kawamura
Hirofumi Takahashi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW200643215A publication Critical patent/TW200643215A/en
Application granted granted Critical
Publication of TWI316095B publication Critical patent/TWI316095B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
TW095111454A 2005-04-01 2006-03-31 Plated substrate TWI316095B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005105625 2005-04-01

Publications (2)

Publication Number Publication Date
TW200643215A TW200643215A (en) 2006-12-16
TWI316095B true TWI316095B (en) 2009-10-21

Family

ID=37114947

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095111454A TWI316095B (en) 2005-04-01 2006-03-31 Plated substrate

Country Status (6)

Country Link
JP (1) JP4926053B2 (en)
KR (1) KR20070114391A (en)
CN (2) CN101151399B (en)
HK (1) HK1116838A1 (en)
TW (1) TWI316095B (en)
WO (1) WO2006112215A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007031740A (en) * 2005-07-22 2007-02-08 Shinko Electric Ind Co Ltd Electronic component, and its manufacturing method
JP5288362B2 (en) * 2007-01-17 2013-09-11 奥野製薬工業株式会社 Multilayer plating film and printed wiring board
JP5013077B2 (en) 2007-04-16 2012-08-29 上村工業株式会社 Electroless gold plating method and electronic component
EP2177646B1 (en) * 2008-10-17 2011-03-23 ATOTECH Deutschland GmbH Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces
JP5680342B2 (en) * 2009-09-02 2015-03-04 Tdk株式会社 Plating film, printed wiring board and module substrate
JPWO2011099597A1 (en) * 2010-02-15 2013-06-17 株式会社Ｊｃｕ Method for manufacturing printed wiring board
CN102802364B (en) * 2012-09-11 2014-11-05 深圳市和美精艺科技有限公司 Method for arranging metal palladium layer in conducting layer of printed circuit board and layered structure thereof
JP6466521B2 (en) * 2017-06-28 2019-02-06 小島化学薬品株式会社 Electroless plating process
US11114399B2 (en) * 2017-12-19 2021-09-07 Jx Nippon Mining & Metals Coproration Semiconductor wafer with void suppression and method for producing same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04307736A (en) * 1991-04-04 1992-10-29 Canon Inc Interconnection method of fine multilayer-structure semiconductor element
JPH081980B2 (en) * 1993-11-25 1996-01-10 大日工業株式会社 Printed wiring board and manufacturing method thereof
JP2785102B2 (en) * 1994-03-31 1998-08-13 株式会社ジャパンエナジー Electroless gold plating method
JP3345529B2 (en) * 1995-06-20 2002-11-18 日立化成工業株式会社 Wire bonding terminal, method of manufacturing the same, and method of manufacturing semiconductor mounting substrate using the wire bonding terminal
JPH09172236A (en) * 1995-12-20 1997-06-30 Seiichi Serizawa Printed-wiring board
JPH10287994A (en) * 1997-04-14 1998-10-27 World Metal:Kk Plating structure of bonding part
JP2001358164A (en) * 2000-06-13 2001-12-26 Ne Chemcat Corp Electrode formed with electroless multilayer plating film thereon, and its manufacturing method
CN1143656C (en) * 2001-01-10 2004-03-31 中国科学院上海原子核研究所 Radioactive 32P blood vessel support and its manufacture
JP2003226993A (en) * 2002-02-01 2003-08-15 Electroplating Eng Of Japan Co Gold plating solution and gold plating treatment method

Also Published As

Publication number Publication date
CN101151399B (en) 2010-12-29
JPWO2006112215A1 (en) 2008-12-04
KR20070114391A (en) 2007-12-03
CN101151399A (en) 2008-03-26
TW200643215A (en) 2006-12-16
WO2006112215A1 (en) 2006-10-26
HK1116838A1 (en) 2009-01-02
JP4926053B2 (en) 2012-05-09
CN101942652B (en) 2012-06-27
CN101942652A (en) 2011-01-12

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