TW201341335A - 用於led螢光體的硼酸鉍玻璃封裝材料 - Google Patents
用於led螢光體的硼酸鉍玻璃封裝材料 Download PDFInfo
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- TW201341335A TW201341335A TW102110927A TW102110927A TW201341335A TW 201341335 A TW201341335 A TW 201341335A TW 102110927 A TW102110927 A TW 102110927A TW 102110927 A TW102110927 A TW 102110927A TW 201341335 A TW201341335 A TW 201341335A
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- 239000005385 borate glass Substances 0.000 title description 2
- YISOXLVRWFDIKD-UHFFFAOYSA-N bismuth;borate Chemical compound [Bi+3].[O-]B([O-])[O-] YISOXLVRWFDIKD-UHFFFAOYSA-N 0.000 title 1
- 239000008393 encapsulating agent Substances 0.000 title 1
- 239000011521 glass Substances 0.000 claims abstract description 229
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 116
- 238000000034 method Methods 0.000 claims abstract description 20
- 239000000203 mixture Substances 0.000 claims description 85
- 239000000463 material Substances 0.000 claims description 41
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- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 27
- 229910052708 sodium Inorganic materials 0.000 claims description 19
- 238000010304 firing Methods 0.000 claims description 17
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 15
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- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- 229910052788 barium Inorganic materials 0.000 claims description 2
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- 238000007639 printing Methods 0.000 claims description 2
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- UYAAVKFHBMJOJZ-UHFFFAOYSA-N diimidazo[1,3-b:1',3'-e]pyrazine-5,10-dione Chemical compound O=C1C2=CN=CN2C(=O)C2=CN=CN12 UYAAVKFHBMJOJZ-UHFFFAOYSA-N 0.000 description 6
- IEJIGPNLZYLLBP-UHFFFAOYSA-N dimethyl carbonate Chemical compound COC(=O)OC IEJIGPNLZYLLBP-UHFFFAOYSA-N 0.000 description 6
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- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 description 5
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
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- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 229910017502 Nd:YVO4 Inorganic materials 0.000 description 1
- CQBLUJRVOKGWCF-UHFFFAOYSA-N [O].[AlH3] Chemical compound [O].[AlH3] CQBLUJRVOKGWCF-UHFFFAOYSA-N 0.000 description 1
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- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
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- YLQWCDOCJODRMT-UHFFFAOYSA-N fluoren-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C2=C1 YLQWCDOCJODRMT-UHFFFAOYSA-N 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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- 238000012545 processing Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- 239000011856 silicon-based particle Substances 0.000 description 1
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- 238000000935 solvent evaporation Methods 0.000 description 1
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- 229940116411 terpineol Drugs 0.000 description 1
Classifications
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/006—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of microcrystallites, e.g. of optically or electrically active material
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
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- C03C3/14—Silica-free oxide glass compositions containing boron
- C03C3/15—Silica-free oxide glass compositions containing boron containing rare earths
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- C—CHEMISTRY; METALLURGY
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- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/02—Other methods of shaping glass by casting molten glass, e.g. injection moulding
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- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/06—Other methods of shaping glass by sintering, e.g. by cold isostatic pressing of powders and subsequent sintering, by hot pressing of powders, by sintering slurries or dispersions not undergoing a liquid phase reaction
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
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- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/007—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character containing a dispersed phase, e.g. particles, fibres or flakes, in a continuous phase
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- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
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- C03C3/00—Glass compositions
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- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
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- C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
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- C03—GLASS; MINERAL OR SLAG WOOL
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- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
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- C03C3/00—Glass compositions
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- C03C3/14—Silica-free oxide glass compositions containing boron
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- C03C3/00—Glass compositions
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- C03C3/145—Silica-free oxide glass compositions containing boron containing aluminium or beryllium
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- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/16—Silica-free oxide glass compositions containing phosphorus
- C03C3/19—Silica-free oxide glass compositions containing phosphorus containing boron
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- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/23—Silica-free oxide glass compositions containing halogen and at least one oxide, e.g. oxide of boron
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/23—Silica-free oxide glass compositions containing halogen and at least one oxide, e.g. oxide of boron
- C03C3/247—Silica-free oxide glass compositions containing halogen and at least one oxide, e.g. oxide of boron containing fluorine and phosphorus
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/12—Compositions for glass with special properties for luminescent glass; for fluorescent glass
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- C—CHEMISTRY; METALLURGY
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B2201/00—Type of glass produced
- C03B2201/60—Silica-free oxide glasses
- C03B2201/62—Silica-free oxide glasses containing boron
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2201/00—Glass compositions
- C03C2201/06—Doped silica-based glasses
- C03C2201/08—Doped silica-based glasses containing boron or halide
- C03C2201/10—Doped silica-based glasses containing boron or halide containing boron
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2201/00—Glass compositions
- C03C2201/06—Doped silica-based glasses
- C03C2201/08—Doped silica-based glasses containing boron or halide
- C03C2201/14—Doped silica-based glasses containing boron or halide containing boron and fluorine
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2201/00—Glass compositions
- C03C2201/06—Doped silica-based glasses
- C03C2201/20—Doped silica-based glasses containing non-metals other than boron or halide
- C03C2201/28—Doped silica-based glasses containing non-metals other than boron or halide containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2201/00—Glass compositions
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- C03C2201/30—Doped silica-based glasses containing metals
- C03C2201/32—Doped silica-based glasses containing metals containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2201/00—Glass compositions
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- C03C2201/30—Doped silica-based glasses containing metals
- C03C2201/34—Doped silica-based glasses containing metals containing rare earth metals
- C03C2201/3447—Europium
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Abstract
本發明的實施例係針對含有螢光體之玻璃粉,及含有螢光體之玻璃粉在玻璃製品(例如LED裝置)中之用途,該等螢光體可用於LED照明裝置中及用於與該等LED照明裝置相關聯的製造含有螢光體之玻璃粉之方法。
Description
本申請案根據專利法主張申請於2012年3月30日之美國臨時申請案第61/618194號之優先權的權益,本申請案依賴於該案之內容且該案以全文引用之方式併入本文中。
本揭示案係針對含有螢光體之玻璃粉,及含有螢光體之玻璃粉在玻璃製品(例如LED裝置)中之用途,該等螢光體可用於LED照明裝置中及用於與LED照明裝置相關聯之製造含有螢光體之玻璃粉之方法。
黃色及紅色螢光體可用於生產發白光的基於GaN之LED。通常藉由矽酮封裝該等螢光體。矽酮材料易於隨時間變黃或變暗。此外,由於矽酮之折射率相對於螢光體之折射率較低,生成之後向散射降低LED效率。前人之工作已論證具有低特性溫度之玻璃封裝材料之功效,尤其是與如在2011年10月26日申請的共同讓與之美國專利申請案第13/281671號中描述之螢光體指數匹配的封裝材料,該申請案以全文引用
之方式併入本文中。然而,迄今為止為此應用開發之指數匹配玻璃通常含有Pb,Pb一直以來被視為不可容組份。
因此,存在對可比的不含Pb之封裝材料玻璃的需要,該等不含Pb之封裝材料玻璃可與LED螢光體指數匹配且可在低於螢光體之使用上限之溫度下起密封玻璃料之作用。
本揭示案係針對玻璃材料中之螢光體封裝,該玻璃材料並不隨著時間而降解或變得易碎,該玻璃材料熱堅固並具有與螢光體匹配之更好折射率,減少返回至LED中的藍光之效率降低之後向散射。
一個實施例為包含玻璃層之製品,其中該層包含玻璃及至少一個螢光體,該玻璃包含Bi2O3及至少30莫耳%之B2O3,其中該層為包含Bi2O3及B2O3之玻璃料與至少一個螢光體的燒制混合物,且其中該層不含Pb。
另一實施例為一種用於製造玻璃製品之方法,該方法包含以下步驟:提供包含Bi2O3及B2O3之玻璃組成物;熔融該組成物並將該熔融組成物形成為玻璃;將玻璃研磨為顆粒以形成具有該組成物之燒結玻璃;將該燒結玻璃與一個或更多個螢光體摻混以形成螢光體-燒結玻璃混合物;藉由添加至少一種有機液體至該混合物,將該螢光體-燒結玻璃混合物轉化為膏狀物;
將該膏狀物塗覆至表面上;及燒制該塗覆的膏狀物來燒盡有機物質以形成螢光體-燒結玻璃。
另一實施例為玻璃組成物,該玻璃組成物包含莫耳百分數之以下物質:10%-30%之Bi2O3;大於0%之Na2O;15%-50%之ZnO、ZnF2,或以上各者之組合;30%-55%之B2O3;0%-3%之SiO2;0%-1%之WO3;0%-12%之BaO、CaO、SrO,或以上各者之組合。
實施例可具有一個或更多個以下優點:與將矽酮用作封裝材料時相比,固結的含有螢光體之玻璃層及包含含有螢光體之玻璃層之裝置更熱堅固;固結的含有螢光體之玻璃層具有更好的化學與環境穩定性;在固結的含有螢光體之層與含有LED之層之間有更好的折射率匹配,該更好的折射率匹配減少後向散射;維持玻璃中螢光體之量子效率大於90%(例如,大於95%)之能力;製造具有如100 μm小之厚度之複合物之能力;維持低於約520℃之處理溫度以便不熱降解螢光體之能力;將不同螢光體組合至單個層中之能力;在基板上製造螢光體之幾何圖案之能力;控制封裝的LED顏色或白點之能力;及/或由於螢光體平板制為單獨件,所以可在組裝前量測光學厚度及發光顏色,因此減少了不良LED之數目。
進一步地,不含Pb之封裝材料玻璃可與LED螢光體指數匹配且可在低於螢光體之使用上限之溫度下起密封玻璃料之作用。
在相關實施例中,固體玻璃層包含玻璃基質及遍及該基質分散之至少一個螢光體,其中該玻璃包含Bi2O3及至少30%之B2O3。
將在以下詳細描述中闡述額外的特徵及優點,且該等特徵及優點將部分地易於由熟習此項技術者根據彼描述顯而易見,或藉由實踐本文所述之實施例而瞭解,本文所述之實施例包括以下實施方式、申請專利範圍及隨附圖式。
應瞭解,前述總體描述及以下詳細描述兩者僅為示例性的,且意欲提供概述或框架以瞭解申請專利範圍之本質及特徵。包括隨附圖式以提供進一步瞭解,且隨附圖式併入本說明書中且構成本說明書之一部分。圖式說明一個或更多個實施例,並與描述一起用以解釋各種實施例之原理及操作。
10‧‧‧LED
12‧‧‧線接合
14‧‧‧螢光體顆粒
16‧‧‧矽酮材料
18‧‧‧基板
20‧‧‧封裝
22‧‧‧容器或杯
24‧‧‧環氧樹脂透鏡
26‧‧‧曲線
28‧‧‧曲線
30‧‧‧曲線
32‧‧‧量子效率與厚度正規化吸光度峰高
34‧‧‧量子效率與A/t中局部最小值
110‧‧‧LED
112‧‧‧線接合
114‧‧‧螢光體/燒結玻璃混合物材料
116‧‧‧玻璃粉/燒結玻璃混合物材料
118‧‧‧封裝基板
120‧‧‧封裝
122‧‧‧容器或杯
第1圖為一種裝置的特徵之圖解,其中封裝於矽酮材料中之螢光體塗覆於LED裝置並將LED裝置封裝於容器中;第2圖為根據本發明的實施例之裝置的特徵之圖解,其中藉由將與一個或複數個螢光體混合的玻璃粉材料流延成型並燒製成型的螢光體-燒結玻璃層來形成固結的含有螢光體之玻璃層;第3圖為比較由相同玻璃組成物製成的具有不同細
微性的流延成型玻璃-螢光體薄膜之總透射光譜之圖表;第4圖為圖示厚度正規化吸光度作為在不同溫度下燒制的不同玻璃粉-螢光體摻合物的波長函數的圖表;第5圖為量子效率對厚度正規化吸光度峰高之曲線圖;及第6圖為量子效率對波長之曲線圖。
現將詳細參考螢光體/燒結玻璃材料及螢光體/燒結玻璃材料在LED製品中之用途的各種實施例,該各種實施例之實例在隨附圖式中加以說明。在任何可能的情況下,相同元件符號將用以貫穿諸圖指代相同或相似之部分。
一個實施例為包含玻璃層之製品,其中該層包含玻璃及至少一個螢光體,該玻璃包含Bi2O3及至少30莫耳%之B2O3,其中該層為包含Bi2O3及B2O3之玻璃料與至少一個螢光體的燒制混合物,且其中該層不含Pb。
另一實施例為一種用於製造玻璃製品之方法,該方法包含以下步驟:提供包含Bi2O3及至少30莫耳%的B2O3之玻璃組成物;熔融該組成物並將熔合組成物形成為玻璃;將玻璃研磨為顆粒以形成具有該組成物之燒結玻璃;將該燒結玻璃與一個或更多個螢光體摻混以形成螢光體-燒結玻璃混合物;藉由添加至少一種有機液體至該混合物將該螢光體-燒結玻璃混合物轉化為膏狀物;
將該膏狀物塗覆至表面上;及燒制該塗覆的膏狀物來燒盡有機物質以形成螢光體-燒結玻璃。
另一實施例為一種用於製作玻璃製品之方法,該方法包含以下步驟:提供包含Bi2O3及至少30莫耳%的B2O3之玻璃組成物;熔融該組成物並將熔融組成物形成為玻璃;將玻璃研磨為顆粒以形成具有該組成物之燒結玻璃;將該燒結玻璃與一個或更多個螢光體摻混以形成螢光體-燒結玻璃混合物;研磨該螢光體-燒結玻璃混合物;篩分研磨的螢光體-燒結玻璃混合物;藉由添加至少一種有機液體至該混合物將該研磨並篩分的螢光體-燒結玻璃混合物轉化為膏狀物;將該膏狀物塗覆至表面上;及燒制該膏狀物以燒盡有機物質。
在各種實施例中,該層不含Pb。
另一實施例為一種玻璃組成物,該玻璃組成物包含莫耳百分數之以下物質:10%-30%之Bi2O3;大於0%之Na2O;15%-50%之ZnO、ZnF2,或以上各者之組合;30%-55%之B2O3;0%-3%之SiO2;
0%-1%之WO3;0%-12%之BaO、CaO、SrO,或以上各者之組合。
根據一些實施例,玻璃組成物包含至少1%之Na2O。
根據一些實施例,玻璃組成物包含15%-50%之ZnO。
根據一些實施例,玻璃組成物包含:12%-20%之Bi2O3;5%-12%之Na2O;20%-30%之ZnO;38%-52%之B2O3;0%-3%之SiO2;0%-1%之WO3;1%-12%之BaO、CaO、SrO,或以上各者之組合。
根據一些實施例,玻璃組成物包含:14%-16%之Bi2O3;5%-11%之Na2O;22%-27%之ZnO;40%-51%之B2O3;0%-3%之SiO2;0%-1%之WO3;1%-11%之BaO、CaO、SrO,或以上各者之組合。
根據一些實施例,玻璃組成物具有473 nm下之1.81至1.83之折射率及460℃或低於460℃之玻璃轉變溫度。
根據一些實施例,製品包含玻璃,該玻璃包含莫耳百分數之以下物質:
10%-30%之Bi2O3;0%-20%之M2O,其中M為Li、Na、K、Cs,或以上各者之組合;0%-20%之RO,其中R為Mg、Ca、Sr、Ba,或以上各者之組合;15%-50%之ZnO、ZnF2,或以上各者之組合;0%-5%之Al2O3;0%-5%之P2O5;及30%-55%之B2O3。
根據一些實施例,製品包含玻璃,該玻璃包含:0-6之Li2O;0-20之Na2O;0-10之K2O;及0-3之Cs2O。
根據一些實施例,製品包含玻璃,該玻璃包含:0-3之MgO;0-3之CaO;0-20之BaO;及0-3之SrO。
根據一些實施例,製品包含玻璃,該玻璃進一步包含0%-5%之TiO2、ZrO2、Ta2O5、MoO3、WO3,或以上各者之組合。
根據一些實施例,製品包含玻璃,該玻璃進一步包含0%-15%之SiO2。
根據一些實施例,製品包含玻璃,該玻璃進一步包含0%-5%之一種或更多種稀土摻雜劑。
根據一些實施例,製品包含玻璃,該玻璃包含0%-5%之Eu2O3。
根據一些實施例,製品包含玻璃,該玻璃包含莫耳百分數之以下物質:10%-30%之Bi2O3;大於0%之Na2O;15%-50%之ZnO、ZnF2,或以上各者之組合;30%-55%之B2O3;0%-3%之SiO2;0%-1%之WO3;0%-12%之BaO、CaO、SrO,或以上各者之組合。
根據一些實施例,製品包含玻璃,該玻璃包含至少1%之Na2O。
根據一些實施例,製品包含玻璃,該玻璃包含15%-50%之ZnO。
根據一些實施例,製品包含玻璃,該玻璃包含:12%-20%之Bi2O3;5%-12%之Na2O;20%-30%之ZnO;38%-52%之B2O3;0%-3%之SiO2;0%-1%之WO3;
1%-12%之BaO、CaO、SrO,或以上各者之組合。
根據一些實施例,製品包含玻璃,該玻璃包含:14%-16%之Bi2O3;5%-11%之Na2O;22%-27%之ZnO;40%-51%之B2O3;0%-3%之SiO2;0%-1%之WO3;1%-11%之BaO、CaO、SrO,或以上各者之組合。
玻璃可進一步包含0%-5%之TiO2、ZrO2、Ta2O5、MoO3、WO3,或以上各者之組合。玻璃可進一步包含0%-5%之一種或更多種鹼土金屬。玻璃亦可進一步包含0%-25%之SiO2。
在一些實施例中,玻璃具有在自1.8至1.9之範圍中之折射率。玻璃可具有460℃或低於460℃之玻璃轉變溫度。在一些實施例中,玻璃料與至少一個螢光體之間的折射率差可小於或等於0.20(例如,小於0.2或小於0.1)。
在一個實施例中,表面可為基板表面或載體基板表面之任一者,例如,分別為玻璃或帶。製品可進一步包含具有玻璃層之基板,該玻璃層安置於該基板上。玻璃層與基板每一者之CTE可在±2×10-6之內。
在一個實施例中,基板可為玻璃基板。玻璃基板可具有5 mm或少於5 mm之厚度,例如4 mm或少於4 mm、例如3 mm或少於3 mm、例如2 mm或少於2 mm、例如1 mm
或少於1 mm、例如0.5 mm或少於0.5 mm。玻璃基板可為薄的可撓性玻璃基板。
在一個實施例中,載體基板可為帶或基板,其中在帶或基板製成後,可自帶或基板移除玻璃層。在製造後,可自載體移除玻璃層並隨後將玻璃層附著至另一表面,且亦可獨立燒制玻璃層。玻璃層可具有5 mm或少於5 mm之厚度,例如4 mm或少於4 mm、例如3 mm或少於3 mm、例如2 mm或少於2 mm、例如1 mm或少於1 mm、例如0.5 mm或少於0.5 mm、例如0.4 mm或少於0.4 mm、例如0.3 mm或少於0.3 mm、例如0.2 mm或少於0.2 mm、例如0.1 mm或少於0.1 mm、例如0.09 mm或少於0.09 mm、例如0.08 mm或少於0.08 mm、例如0.07 mm或少於0.07 mm、例如0.06 mm或少於0.06 mm、例如0.05 mm或少於0.05 mm。在一些實施例中,玻璃層具有自0.01 mm至1 mm之厚度,例如,自0.01 mm至0.2 mm。
在基板上的玻璃層或單獨的玻璃層可用於在例如製造製程(諸如晶圓尺寸(例如,6吋乘以6吋或甚至更大)製程)中製造LED燈。可在玻璃層上製造多個LED並在製造後將多個LED分隔為單個LED。
在實施例中,將一個或更多個螢光體與玻璃粉材料(封裝材料)混合以形成螢光體-燒結玻璃混合物,並隨後將螢光體-燒結玻璃混合物塗覆至容器內之LED,例如GaN或InGaN LED。在與第1圖相似之第2圖中,已將螢光體114(圖示為圓形點)與玻璃粉材料116混合以形成螢光體-燒結玻璃混合物,該螢光體-燒結玻璃混合物經燒制以產生具有螢光體
嵌埋於其中的玻璃片。此外,第2圖中所示之封裝120圖示LED 110、線接合112及封裝基板118及容器或杯122。亦可使用標準膏狀物製程,藉由網板印染或藉由噴塗,將含有螢光體的燒結玻璃混合物(114、116)塗覆至基板,隨後藉由燒制來生產覆蓋上述基板的緻密玻璃層、螢光體/玻璃料層。因為燒制的含有螢光體的玻璃料混合物為玻璃,所以可不需要蓋板玻璃。本揭示案係針對呈第2圖所示形式的混合玻璃料/螢光體材料之製備、塗覆及熱處理。本揭示案進一步包括選擇燒結玻璃組成物,該燒結玻璃組成物可用以在與螢光體之添加一致及塗覆至適當玻璃基板時提供正確熱特性。
在各種實施例中,設想將含有Bi的硼酸鹽玻璃在兩種方法之任一者中用作封裝玻璃料。在一種情況下,將粉末狀玻璃與螢光體之混合物網板印染至薄的高熱膨脹係數玻璃基板上,該粉末狀玻璃與螢光體之混合物摻混有合適有機黏合劑、分散劑及溶劑。基板之實例包括Corning經由熔融法製造之任何高Na含量鋁矽酸鹽玻璃。網板印染通常涉及沉積多個層以便建立具有足夠厚度之螢光體-玻璃料層。隨後在約350℃下燒制基板/玻璃料總成以便燒盡膏狀物之有機組分,並隨後加熱至500℃-550℃以燒結玻璃料至足夠透明之狀態。在實施例中,在燒結前可自玻璃組成物完全移除或實質上移除黏合劑。就此而言,發生黏合劑燒盡之溫度可低於燒結溫度。在進一步實施例中,燒結的玻璃中螢光體之載入可在自約1體積%至30體積%之範圍中,例如,1體積%、2體積%、5體積%、10體積%、15體積%、20體積%或30體積%。為了
避免Bi之還原反應,可在富含O2之氛圍而非空氣中進行燒結。已以此方式處理來自諸表格之示例性玻璃15、10、29、31、71、84及97以產出具有足夠透明度(例如,至少60%或至少70%)之封裝的螢光體層。
在另一實施例中,藉由流延成型工序製造獨立的玻璃料/螢光體薄膜。將示例性玻璃樣品29及Ce:YAG螢光體粉末噴射研磨至小於5 μm之d50。藉由將與85體積%的示例性玻璃29及68(來自以下表格)與15體積%的Ce:YAG成比例之粉末於乙酸乙酯溶劑中與Emphos PS-236分散劑及聚碳酸亞丙酯黏合劑混合來製備流延成型鑄漿。使用22密耳刮漿刀將鑄漿澆鑄於鐵氟龍載體薄膜上。將帶乾燥、釋放並於空氣中在550℃下燒結。在此處理之後,樣品保持實質上玻璃狀。選擇聚碳酸亞丙酯作為黏合劑,因為吾人發現,聚碳酸亞丙酯對於使用在低於300℃下燒盡之黏合劑以防止在燒結的玻璃基質中截留有機物係重要的。在具有鋁氧氈作為覆蓋物之纖維狀鋁氧托架板上燒結帶。在燒制期間,纖維板限制玻璃黏合至托架。使用燒蝕鐳射切割系統以355 nm下的Nd:YVO4鐳射自燒結的帶切割精確尺寸的部件。儘管預期50微米至250微米之範圍中之厚度,玻璃樣品中之Ce:YAG之最終厚度為100 μm。
使用溶劑系統以聚碳酸亞丙酯(PPC)改良澆鑄均勻性,該溶劑系統包含二甲基碳酸酯(DMC)及丙二醇二乙酸酯(PGD)。熟知為增溶PPC、DMC及PGD之相對有限的溶劑組之優勢在於:該等溶劑組相對無毒、易溶解PPC且可
藉由調節PGD(低揮發性)與DMC(高揮發性)之比例來調諧溶劑蒸發速率。
平滑托架板有益於改良燒制的複合物之表面光潔度。在約600℃或低於600℃之相對較低的溫度下燒制本文所述之玻璃組成物。在此溫度下,可使用具有平滑表面之不銹鋼托架板。較低燒制溫度可消除或實質上最小化玻璃與螢光體顆粒反應之問題。
玻璃粉之細微性分佈可有助於達成良好光學效能,尤其是高量子效率。若玻璃粉末平均細微性大於約10 μm,則發現諸多改良效能。據信,在玻璃/螢光體複合物燒結期間,較大玻璃細微性緩和玻璃中所含的Bi2O3之還原反應。由具有低於1 μm之細微性分佈d50之玻璃製成之複合物不如由超過1 μm(例如,超過10 μm)的d50下之相同玻璃製成之複合物透明。亦預見,在具有與本文所述之玻璃組成物相似的密度之基於YAG之螢光體情況下,細微性類似於在乾燥生坯帶期間的玻璃及螢光體顆粒之還原偏析。
第3圖為比較由相同玻璃組成物製成但具有不同細微性的流延成型玻璃-螢光體薄膜之總透射光譜之圖表。玻璃組成物與Ce:YAG螢光體顆粒一起總結為實例76(來自以下表格)。在相同條件下燒制薄膜,並產生~100 μm厚之緻密自支撐薄膜。藉由習知「d50」量測指示細微性,該習知「d50」量測指示50體積%之顆粒的體積小於所指示尺寸。資料清楚展示,由次微米玻璃粉末製成之薄膜展示減少透射率之玻璃變黑,尤其在近400 nm之區域中,該薄膜干擾集中於近450 nm
之Ce:YAG螢光體吸收峰。曲線26、28及30分別展示d50=0.81 μm、d50=3.55 μm,及d50=15.85 μm。由d50=15.85 μm下之玻璃製造之薄膜經量測有97%之量子效率。需要達成超過90%之量子效率,較佳地為95%或更高。
可獲得具有在1%至30%範圍中(例如,在5%至30%範圍中)之螢光體體積分率之高效能薄膜。較高螢光體含量允許較高燒結溫度,但為了最佳變色點需要較薄之薄膜。薄膜厚度可在30 μm至1000 μm之範圍中,例如50 μm至300 μm,例如75 μm至200 μm。
在Ce:YAG螢光體轉換藍色LED光為白色光之情況下,為了達成用於轉換藍色LED為白色光之合乎需要的變色點,所需螢光體體積分率與薄膜厚度成反比且可由以下等式描述:Vf=a/t,其中以%表示Vf且以μm表示t,常數a以μm-%為單位。Vf可在1000至2000之範圍內。舉例而言,對於100 μm之薄膜厚度,螢光體體積分率可在1000/100的百分比至2000/100的百分比或10%至20%之範圍中。
在各種實施例中,可控制薄膜厚度與螢光體載入量中之一者或兩者以便影響玻璃層之變色點。
如下產生獨立的玻璃-螢光體複合物:將淬冷的示例性玻璃76(來自以下表格)乾式球磨並以-400目篩分來達成具有d50=15.85 μm之細微性分佈。以85體積%玻璃/15體積%螢光體之比率將市售之具有d50=14 μm之Ce:YAG螢光體粉末添加至玻璃粉末。按照以下表格中所示之重量分率添
加PPC黏合劑及DMC與PGD之50/50混合溶劑。使用BYK公司製造之商業分散劑Dispersbyk-142。在行星混合器中混合諸成份來達成均勻的流延成型鑄漿。使用習知18密耳間隙刮漿刀將鑄漿澆鑄於塗佈有鐵氟龍之麥拉(Mylar)載體薄膜上。在乾燥後將澆鑄的生坯帶釋放、按尺寸切割,並在不銹鋼托架板上在510℃下燒結2小時。在此溫度下,達成可接受的密度及光學品質同時最小化部件過多黏著至托架板或貫穿過多玻璃流動的尺寸公差損失之任一者之可能性,尺寸公差損失可發生在僅高出10℃之燒結溫度下。因為玻璃黏度隨著溫度升高呈指數下降,所以熔爐均勻性係重要的。需要在熔爐中燒制部件,該部件上之熱梯度低於20℃,更較佳地低於10℃,最較佳地低於5℃。在燒制之後,自燒制的鑄件鐳射切割具有精確尺寸之部件以生產具有100 +/- 2 μm均勻厚度之10 cm×10 cm部件。量子效率經量測為97%。表1展示示例性組份及重量分率。
第4圖為圖示複合玻璃/螢光體薄膜之吸光度正規化為厚度(A/t)作為波長函數的圖表。複合玻璃/螢光體薄膜之量子效率(QE)係與量測的透射光譜有關。特定言之,需要
產生玻璃-螢光體複合物,其中螢光體為例如摻雜Ce之YAG,其中玻璃組份之透射率在藍色範圍(亦即,400 nm至500 nm範圍)中儘可能高。以此方式,可達成最大量子效率,因為螢光體實質上吸收能在螢光體中激發螢光之所有可用光子。特定言之,第5圖中圖示量子效率與厚度正規化吸光度峰高32(第4圖中)之相關性,且第6圖圖示量子效率與A/t34(第4圖中)中局部最小值之波長之相關性,第5圖與第6圖兩者展示吸光度資料與QE之良好相關性。在實施例中,A/t最小值之波長可低於約416 nm以達成高於90%之量子效率。相似地,所示之A/t峰高大體上超過1以達成高於90%之量子效率。
表2至表14中展示示例性玻璃,其中以莫耳%為單位給出組成物。Tg、Tx、α300分別指代玻璃轉變溫度(在25℃至300℃之範圍上)、開始結晶溫度、300℃下之熱膨脹係數。軟化點指代在玻璃黏度為對數107.6之溫度。n473、n532、n633分別指代在473 nm、532 nm及633 nm下量測之折射率。
本揭示案係針對含有至少一個螢光體之玻璃,及針對一個製程,藉由該製程將螢光體粉末或複數個不同螢光體粉末與合適的燒結玻璃材料、「燒結玻璃」及液體有機載體(例如但不限於,萜品醇、乙基纖維素與分散劑及介面活性劑)結合來形成燒結膏狀物。隨後將膏狀物沉積於相容基板(CTE與在2×10-6/℃內之燒結玻璃匹配的基板)上,例如但不限於,藉由網板印染或噴塗(網板印染,或噴塗)並隨後將膏狀物加熱至合適的第一溫度以祛除有機載體,且隨後將膏狀物加熱至較高的第二溫度以將螢光體/燒結玻璃混合物固結為緻密的含有螢光體之玻璃。螢光體可包含量子點,例如,具有細微性範圍自1 nm至10 nm之量子點。
第一溫度係用於祛除有機載體,且該第一溫度係藉由例如有機載體之沸點或使用蒸氣壓資料決定,且該第一溫
度可在大氣壓力下或在真空下進行。藉由玻璃料材料來決定用以將螢光體/燒結玻璃混合物固結或燒制為緻密玻璃之第二較高溫度,條件是:塗覆螢光體/燒結玻璃混合物至基板之軟化溫度必須高於螢光體/燒結玻璃混合物之固結或燒制溫度至少100℃。可塗覆此螢光體/燒結玻璃混合物作為LED裝置之有源平面上或鄰接有源平面之層。螢光體/燒結玻璃混合物中之螢光體粉末之量可改變至所要量。可藉由螢光體/燒結玻璃混合物之複數個沉積來增加固結的含有螢光體之玻璃料層之極限厚度。
在各種實施例中,螢光體粉末可遍及玻璃均勻分佈。在進一步實施例中,螢光體粉末之分佈可局域化在玻璃內,亦即,在玻璃層之自由表面之一個表面或兩個表面處。
含有螢光體之燒結玻璃材料不同於不含螢光體之相同玻璃料材料。特定言之,將特定螢光體相添加至玻璃料材料改變所得螢光體-燒結玻璃膏狀物之流變性質及後續固結熱處理。固結熱處理必須如此以使固結熱處理不使螢光體之螢光性質退化。固結熱處理為燒結玻璃及後續處理選擇中之重要因素。適當發現了此性質組合,亦即,構成本揭示案各種實施例之燒結玻璃組成物、特定螢光體材料,及玻璃基板的性質組合。由於對螢光體-燒結玻璃材料之溫度限制及某些螢光體材料(例如,Ce/YAG)之降解或燒結玻璃與螢光體材料之間發生反應之可能性,實施例係關於玻璃料材料之使用,該玻璃料材料之燒結溫度或流動溫度足夠低以便存在於螢光體-玻璃料混合物中之螢光體未降解。此限制之結果在於:通
常使用較高CTE玻璃料材料,該等較高CTE玻璃料材料又可影響玻璃基板的選擇,以便藉由燒制螢光體-燒結玻璃混合物形成之含有螢光體的燒結玻璃之CTE將匹配基板CTE。
可自Beijing Yugi Science & Technology Co.Ltd.(中國,北京)、Shanghai Keyan Phosphor Technology Co.Ltd(中國,上海),及Litec-LLL GmbH(德國,格賴夫斯瓦爾德)購得螢光體材料;亦在以下專利及技術文獻中描述了螢光體材料,例如,美國專利案第6,572,785號與第7,442,326號;及W.J. Park等人之「Enhanced Luminescence Efficiency for Bi,Eu doped Y2O3 Red Phosphors for White LEDs」(Solid State Phenomena,第124-126(2007)卷,第379-382頁);以及Rong Jun Xie等人之「Silicon-based oxynitride and nitride phosphors for white LEDs-A review」(Science and Technology of Advanced Materials 8(2007),第588-600頁)。
如上文所指示,第1圖為典型表面黏著封裝中之白光LED之圖式;第1圖圖示LED 10、線接合12、環繞螢光體顆粒14的矽酮材料16中之螢光體顆粒14(圖示為圓形點)、基板18及用於LED(例如,Marubeni SMTW47 InGaN LED(http://tech-led.com/data/L850-66-60-130.pdf))之封裝20。封裝20包含基板18、環氧樹脂透鏡24,及容器或杯22,該容器或杯22由白色塑膠或陶瓷製成以容納矽酮-螢光體混合物、保護LED,及反射來自封裝之光。在第2圖中,螢光體114(圖示為圓形點)已與玻璃粉116混合形成螢光體/燒結玻璃混合物,且燒制該螢光體/燒結玻璃混合物以產生玻璃
片。此外,第2圖圖示封裝120,該封裝120包含LED 110、線接合112及封裝基板118及容器或杯122。亦可使用標準膏狀物製程藉由網板印染或藉由噴塗將螢光體/燒結玻璃混合物材料(114、116)塗覆至基板,隨後藉由燒制來生產覆蓋基板之緻密螢光體/燒結玻璃層。由於將螢光體併入至玻璃層中,在將螢光體混合至矽酮或環氧材料中之實踐中獲得了許多優點。
特定言之,與將矽酮用作封裝材料時相比,螢光體/燒結玻璃層及所得裝置總體上更熱堅固,且螢光體/燒結玻璃層具有更好的化學與環境穩定性。舉例而言,可將紅色及黃色螢光體併入至單個燒結玻璃摻合物中。由於螢光體/燒結玻璃摻合物可形成為具有變化流動性之「膏狀物」,所以摻合物適用於厚薄膜塗覆至有源平面。用以形成摻合物之示例性液體包括各種溶劑混合物,各種溶劑混合物包括丙二醇二乙酸酯及碳酸二甲酯之混合物。其他優點包括:(1)後向散射減少,因為可選擇燒結玻璃材料以便螢光體/燒結玻璃材料達成在螢光體及燒結玻璃與含有pn接面(LED)的層之間更好的折射率匹配;及(2)在基板上製造螢光體之幾何圖案之能力。最後,螢光體/燒結玻璃摻合物之使用賦予控制封裝的LED顏色或白點之能力。由於含有螢光體之平板制為單獨件,所以可在組裝前量測光學厚度及發光顏色,因此減少了不良LED之數目。
熟習此項技術者將顯而易見,可在不背離所主張標的物之精神及範疇的情況下,對本文所描述之實施例做出各
種修改及變更。因此,若本文所描述之各種實施例的修改及變更在隨附申請專利範圍及申請專利範圍之等效物的範疇內,意欲本說明書涵蓋此類修改及變更。
10‧‧‧LED
12‧‧‧線接合
14‧‧‧螢光體顆粒
16‧‧‧矽酮材料
18‧‧‧基板
20‧‧‧封裝
22‧‧‧容器或杯
24‧‧‧環氧樹脂透鏡
Claims (25)
- 一種包含一玻璃層之製品,其中該層包含一玻璃及至少一個螢光體,該玻璃包含Bi2O3及B2O3,其中該層為包含該Bi2O3及B2O3之一玻璃料與該至少一個螢光體之一燒制混合物。
- 如請求項1所述之製品,其中該層不含Pb。
- 如請求項1所述之製品,其中該玻璃包含莫耳百分數之以下物質:10%-30%之Bi2O3;0%-20%之M2O,其中M為Li、Na、K、Cs,或以上各者之組合;0%-20%之RO,其中R為Mg、Ca、Sr、Ba,或以上各者之組合;15%-50%之ZnO、ZnF2,或以上各者之組合;0%-5%之Al2O3;0%-5%之P2O5;及30%-55%之B2O3。
- 如請求項3所述之製品,該製品包含莫耳百分數之以下物質:10%-30%之Bi2O3;大於0%之Na2O; 15%-50%之ZnO、ZnF2,或以上各者之組合;30%-55%之B2O3;0%-3%之SiO2;0%-1%之WO3;0%-12%之BaO、CaO、SrO,或以上各者之組合。
- 如請求項4所述之製品,該製品包含至少1%之Na2O。
- 如請求項4所述之製品,該製品包含15%-50%之ZnO。
- 如請求項4所述之製品,該製品包含以下物質:12%-20%之Bi2O3;5%-12%之Na2O;20%-30%之ZnO;38%-52%之B2O3;0%-3%之SiO2;0%-1%之WO3;1%-12%之BaO、CaO、SrO,或以上各者之組合。
- 如請求項7所述之製品,該製品包含以下物質:14%-16%之Bi2O3; 5%-11%之Na2O;22%-27%之ZnO;40%-51%之B2O3;0%-3%之SiO2;0%-1%之WO3;1%-11%之BaO、CaO、SrO,或以上各者之組合。
- 如請求項8所述之製品,其中該玻璃具有在473 nm下之1.81至1.83之一折射率及460℃或低於460℃之一玻璃轉變溫度。
- 如請求項1所述之製品,其中該玻璃具有在自1.8至1.9之範圍中之一折射率。
- 如請求項1所述之製品,其中該玻璃具有460℃或低於460℃之一玻璃轉變溫度。
- 如請求項1所述之製品,其中該玻璃料與該至少一個螢光體之間之折射率中之差值小於或等於0.20。
- 如請求項1所述之製品,該製品進一步包含具有該玻璃層之一基板,該玻璃層安置於該基板上。
- 如請求項13所述之製品,其中該玻璃層與該基板每一者之CTE在±5×10-7之內。
- 一種用於製造一玻璃製品之方法,該方法包含以下步驟:提供包含Bi2O3及B2O3之一玻璃組成物;熔融該組成物並將該熔融組成物形成為一玻璃;將該熔融玻璃研磨為顆粒以形成具有該組成物之一燒結玻璃;將該燒結玻璃與一個或更多個螢光體摻混以形成一螢光體-燒結玻璃混合物;藉由添加至少一種有機液體至該混合物將該螢光體-燒結玻璃混合物轉化為一膏狀物;將該膏狀物塗覆至一表面上;及燒制該塗覆的膏狀物來燒盡有機物質以形成一螢光體-燒結玻璃。
- 如請求項15所述之方法,該方法進一步包含以下步驟:在該燒制步驟之後將該燒制的螢光體-燒結玻璃冷卻至室溫。
- 如請求項15所述之方法,其中該燒制步驟包含以下步驟:在空氣中以2℃/分鐘之一溫度斜率將該塗覆的膏狀物燒制至大約350℃之一溫度,並在大約350℃下保持該膏狀物1小時以燒盡該有機物質。
- 如請求項15所述之方法,其中該燒制步驟包含以下步驟:在空氣中以2℃/分鐘之一溫度斜率將該塗覆的膏狀物燒制至575℃-650℃範圍內之一選定溫度,並在該選定溫度下保持該塗覆的膏狀物2小時。
- 如請求項15所述之方法,其中該塗覆步驟包含以下步驟:將該膏狀物網板印染或流延成型至該表面上。
- 一種玻璃組成物,該玻璃組成物包含莫耳百分數之以下物質:10%-30%之Bi2O3;大於0%之Na2O;15%-50%之ZnO、ZnF2,或以上各者之組合;30%-55%之B2O3;0%-3%之SiO2;0%-1%之WO3;0%-12%之BaO、CaO、SrO,或以上各者之組合。
- 如請求項20所述之玻璃組成物,該玻璃組成物包含至少1%之Na2O。
- 如請求項20所述之玻璃組成物,該玻璃組成物包含15%-50%之ZnO。
- 如請求項20所述之玻璃組成物,該玻璃組成物包含以下物質:12%-20%之Bi2O3;5%-12%之Na2O;20%-30%之ZnO;38%-52%之B2O3;0%-3%之SiO2;0%-1%之WO3;1%-12%之BaO、CaO、SrO,或以上各者之組合。
- 如請求項23所述之玻璃組成物,該玻璃組成物包含以下物質:14%-16%之Bi2O3;5%-11%之Na2O;22%-27%之ZnO;40%-51%之B2O3;0%-3%之SiO2;0%-1%之WO3;1%-11%之BaO、CaO、SrO,或以上各者之組合。
- 如請求項24所述之玻璃組成物,該玻璃組成物具有在473 nm下之1.81至1.83之一折射率及460℃或低於460℃之一玻璃轉變溫度。
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- 2013-03-27 EP EP13714513.2A patent/EP2831009B1/en active Active
- 2013-03-27 TW TW102110927A patent/TW201341335A/zh unknown
- 2013-03-27 KR KR1020147030289A patent/KR101612216B1/ko active IP Right Grant
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Cited By (2)
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TWI622560B (zh) * | 2016-01-28 | 2018-05-01 | 中原大學 | 硼酸鹽玻璃及其製備方法與應用 |
TWI585055B (zh) * | 2016-03-29 | 2017-06-01 | 中國製釉股份有限公司 | 玻璃材料、螢光複合材料、與發光裝置 |
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KR20150003225A (ko) | 2015-01-08 |
KR101612216B1 (ko) | 2016-04-12 |
US20130256598A1 (en) | 2013-10-03 |
EP2831009A1 (en) | 2015-02-04 |
US20150197445A1 (en) | 2015-07-16 |
US9011720B2 (en) | 2015-04-21 |
JP2015519276A (ja) | 2015-07-09 |
CN104428265A (zh) | 2015-03-18 |
WO2013148783A1 (en) | 2013-10-03 |
JP6149309B2 (ja) | 2017-06-21 |
US20170190609A1 (en) | 2017-07-06 |
CN104428265B (zh) | 2018-01-09 |
US10023492B2 (en) | 2018-07-17 |
EP2831009B1 (en) | 2017-05-03 |
US9624124B2 (en) | 2017-04-18 |
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